SEMICONDUCTOR TECHNICAL DATA
2–69 REV 5
Motorola, Inc. 1996
3/93
The MC10H131 is a MECL 10H part which is a functional/pinout duplication
of the standard MECL 10K family part, with 100% improvement in clock speed
and propagation delay and no increase in power–supply current.
•Propagation Delay, 1.0 ns Typical
•Power Dissipation, 235 mW Typical
•Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•Voltage Compensated
•MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) VEE –8.0 to 0 Vdc
Input V oltage (VCC = 0) VI0 to VEE Vdc
Output Current — Continuous
— Surge Iout 50
100 mA
Operating Temperature Range TA0 to +75 °C
Storage Temperature Range — Plastic
— Ceramic Tstg –55 to +150
–55 to +165 °C
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0°25°75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current IE— 62 — 56 — 62 mA
Input Current High
Pins 6, 11
Pin 9
Pins 7, 10
Pins 4, 5, 12, 13
IinH —
—
—
—
530
660
485
790
—
—
—
—
310
390
285
465
—
—
—
—
310
390
285
465
µA
Input Current Low IinL 0.5 — 0.5 — 0.3 — µA
High Output V oltage VOH –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
Low Output Voltage VOL –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
High Input V oltage VIH –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
Low Input Voltage VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
AC PARAMETERS
Propagation Delay
Clock, CE
Set, Reset
tpd 0.8
0.6 1.6
1.6 0.8
0.7 1.7
1.7 0.8
0.7 1.8
1.8
ns
Rise T ime tr0.6 2.0 0.6 2.0 0.6 2.2 ns
Fall T ime tf0.6 2.0 0.6 2.0 0.6 2.2 ns
Set–up T ime tset 0.7 — 0.7 — 0.7 — ns
Hold T ime thold 0.8 — 0.8 — 0.8 — ns
Toggle Frequency ftog 250 — 250 — 250 — MHz
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.
LOGIC DIAGRAM
DIP
PIN ASSIGNMENT
VCC1
Q1
Q1
R1
S1
CE1
D1
VEE
VCC2
Q2
Q2
R2
S2
CE2
D2
CC
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
S1 5
D1 7
CE1 6
R1 4
CC 9
R2 13
CE2 11
D2 10
S2 12
Q1
Q1
Q2
Q2
2
3
14
15
CLOCKED TRUTH TABLE
N.D. = Not Defined
C = CE + CC
A clock H is a clock transition
from a low to a high state.
RS TRUTH TABLE
RSQ
n+1
L
LL
H
L
H
Qn
H
L
N.D.
H
H
CDQ
n+1
L
HX
L
H
Qn
L
HH
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–1 1 of the Motorola MECL Data
Book (DL122/D).
MC10H131
MOTOROLA MECL Data
DL122 — Rev 6
2–70
APPLICATION INFORMATION
The MC10H131 is a dual master–slave type D flip–flop.
Asynchronous Set (S) and Reset (R) override Clock (CC)
and Clock Enable (CE) inputs. Each flip–flop may be
clocked separately by holding the common clock in the
new low state and using the enable inputs for the clocking
function. If the common clock is to be used to clock the
flip–flop, the Clock Enable inputs must be in the low state.
In this case, the enable inputs perform the function of
controlling the common clock.
The output states of the flip–flop change on the positive
transition of the clock. A change in the information
present at the data (D) input will not affect the output
information at any other time due to master slave
construction.
MC10H131
2–71 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
MC10H131
MOTOROLA MECL Data
DL122 — Rev 6
2–72
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C––– 0.200 ––– 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
16 9
18
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Af firmative Action Employer.
How to reach us:
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MC10H131/D
*MC10H131/D*
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