PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-87621012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87621012A
SNJ54LS
592FK
5962-8762101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101EA
SNJ54LS592J
5962-8762101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101EA
SNJ54LS592J
5962-8762101FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA
SNJ54LS592W
5962-8762101FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA
SNJ54LS592W
SN54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS592J
SN54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS592J
SN54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS593J
SN54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS593J
SN74LS592D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592
SN74LS592D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592
SN74LS592DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592
SN74LS592DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592
SN74LS592DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592
SN74LS592DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592
SN74LS592DR OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 LS592
SN74LS592DR OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 LS592
SN74LS592DRE4 OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LS592DRE4 OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70
SN74LS592DRG4 OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70
SN74LS592DRG4 OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70
SN74LS592N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N
SN74LS592N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N
SN74LS592N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
SN74LS592N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
SN74LS592NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N
SN74LS592NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N
SN74LS592NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592
SN74LS592NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592
SN74LS592NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592
SN74LS592NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592
SN74LS592NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592
SN74LS592NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592
SN74LS593DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LS593DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593
SN74LS593N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS593N
SN74LS593N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS593N
SN74LS593N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70
SN74LS593N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70
SN74LS593NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS593N
SN74LS593NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS593N
SNJ54LS592FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87621012A
SNJ54LS
592FK
SNJ54LS592FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87621012A
SNJ54LS
592FK
SNJ54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101EA
SNJ54LS592J
SNJ54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101EA
SNJ54LS592J
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54LS592W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA
SNJ54LS592W
SNJ54LS592W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA
SNJ54LS592W
SNJ54LS593FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS
593FK
SNJ54LS593FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS
593FK
SNJ54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS593J
SNJ54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS593J
SNJ54LS593W OBSOLETE 20 TBD Call TI Call TI -55 to 125
SNJ54LS593W OBSOLETE 20 TBD Call TI Call TI -55 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 5
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS592, SN54LS593, SN74LS592, SN74LS593 :
•Catalog: SN74LS592, SN74LS593
•Military: SN54LS592, SN54LS593
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS592NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74LS593DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS592NSR SO NS 16 2000 367.0 367.0 38.0
SN74LS593DWR SOIC DW 20 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 2
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