Product Description
The TeleLink® Surface Mount (SM) surge resistant time
lag fuse has been designed to offer the ultimate in circuit
protection while meeting the necessary surge
requirements of the telecommunications industry. When
used in conjunction with the SIDACtor® Transient Voltage
Suppressor (TVS), the TeleLink SM fuse (F0500T 500mA
and F1250T 1.25A) and the SIDACtor TVS provide a
complete regulatory compliant solution for standards such
as GR 1089, FCC Part 68, UL 1950, and ITU K.20 & K.21.
Features
• Surface Mount Technology
• 100A, 10x1000µs & 500A, 2x10µs surge current ratings
• Eliminates the need for costly power resistors and PTC’s
• Designed specifically for telecommunications equipment
TeleLink® SM Fuse
TeleLink® SM Fuse
CSA Approved
File No. LR702828
UL Recognized
E-191008
Patent Pending
TeleLink SM Fuse Advantages TeleLink® SM Fuse
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TeleLink SM Fuse Advantages
• The elimination of series line resistance enabling longer loop lengths
• Precise longitudinal balance allowing better transmission quality
• Robust surge performance which elimates costly down time due to nuisance blows
• Greater surge ratings than resettable devices ensuring regulatory compliance
• Non-degenerative performance
• Available in surface mount packaging which utilizes less PCB real estate, eliminates mixed technologies,
and reduces manufacturing costs
Selection Criteria
For circuits that do not require additional series resistance, the surge current rating (IPP) of the Tel eLi nk SM Fuse
should be greater than or equal to the surge currents associated with the lightning immunity tests of the applicable
regulatory requirement (IPK).
IPP ≥ IPK
For circuits that utilize additional series resistance, the surge current rating (IPP) of the TeleLink SM Fuse should
be greater than or equal to the available surge currents associated with the lightning immunity tests of the
applicable regulatory requirement (IPK (available)).
IPP ≥ IPK (available)
The maximum available surge current is calculated by dividing the peak surge voltage (VPK) by the total circuit
resistance (RTOTAL).
IPP ≥ IPK (available) = VPK/RTOTAL
For longitudinal surges (TIP-GND, RING-GND), RTOTAL is calculated for both TIP and RING.
RTOTAL = RTIP + RSOURCE
RTOTAL = RRING + RSOURCE
For metallic surges (TIP-RING):
RTOTAL = RTIP + RRING + RSOURCE
To select the most appropriate TeleLink SM Fuse / SIDACtor TVS combination, simply decide what regulatory
requirement your equipment will need to meet and refer to the following table. For applications that do not require
agency approval or multiple listings, please contact Teccor Electronics.
Regulatory Requirement TeleLink SM Fuse SIDACtor TVS
GR 1089 F1250T C Series
FCC Part 68, Type A F1250T B Series
FCC Part 68, Type B F0500T A Series
ITU K.20 F1250T A Series
ITU K.21 Basic/Enhanced F1250T A Series
UL 1950 All All
UL 1950 All All
TeleLink® SM Fuse Selection Criteria
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972-580-7777 Page: 3
TeleLink® SM Fuse
Surge Current Ratings
Interrupting Values
Notes:
• The TeleLink SM Fuse is designed to carry 100% of its’ rated current for four hours and 250% of its’ rated
current for one second minimum and 120 seconds maximum. Typical time is 4 to 10 seconds. For optimal
performance, an operating current of 80% or less is recommended.
• I2 t is a non-repetitive RMS surge current rating for a period of 16.7 msec.
• *Interrupt test characterized at 50° to 70° phase angle. Phase angles approximating 90° may result in
damage to the body of the fuse.
Resistance Ratings
Notes:
• Typical inductance ≅ 4µH up to 500MHz.
• Resistance changes .5% for every °C.
• Measured at 10% rated current.
Design Considerations
The PCB traces must be designed such that its I2t rating exceeds the I2t of the TeleLink fuse. A 1oz.
.025” width is recommended, but reference to the IPC D 275 standard may provide more precise
details.
For UL1950 compliance, design considerations must be given to the test conditions of Annex NAC. In
particular, test 3 and 3A are intended to produce the maximum heating effects. Therefore, PCB layout
design should compensate appropriately.
TeleLink SM Fuse 2x10µs10X160µs10X560µs10X1000µs
F0500T not rated 75A 45A 35A
F1250T 500A 160A 115A 100A
TeleLink
SM Fuse
Voltage
Rating
Current
Rating
I2t
Measured
@ DC Rated
Voltage
Interrupting
Rating Min. Typ. Max.
F0500T 250V 500mA 1.3A2s 600V, 40A 1 sec 2 sec 60 sec
F1250T 250V 1.25A 22.2A2s 600V, 60A* 1 sec 2 sec 60 sec
TeleLink SM Fuse Typical Voltage Drop
@ Rated Current
DC Cold Resistance
Min. Max.
F0500T .471V .420Ω.640Ω
F1250T .205V .107Ω.150Ω
Qualification Data TeleLink® SM Fuse
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Qualification Data
The F1250T has been designed to meet the following test conditions per GR 1089 without any additional series
resistance, however in-circuit test verification is required. Please note that considerable heating may occur during
Test 4 of the Second Level AC Power Fault Test.
First Level Lightning Surge Test
Second Level Lightning Surge Test
First Level AC Power Fault Test
Test Surge
Voltage Wave-form Surge Current Repetitions Each
Polarity
1 ±600V 10x1000µs 100A 25
2 ±1000V 10x360µs 100A 25
3 ±1000V 10x1000µs 100A 25
4 ±2500V 2x10µs 500A 10
5 ±1000V 10x360µs 25A 5
Test Surge
Voltage Wave-form Surge Current Repetitions Each
Polarity
1 ± 5000V 2x10µs 500A 1
Test Applied Voltage, 60Hz Short Circuit Current Duration
150VRMS .33A 15 minutes
2100VRMS .17A 15 minutes
3200VRMS, 400VRMS,
600VRMS
1A at 600V 60 Applications,
1 second each
41000VRMS 1A 60 Applications,
1 second each
5 Diagram Diagram 60 Applications,
5 seconds each
6600VRMS 0.5A 30 seconds each
7600VRMS 2.2A 2 seconds each
8600VRMS 3A 1 second each
91000VRMS 5A 0.5 second each
TeleLink® SM Fuse Qualification Data
Teccor Electronics http://www.teccor.com
972-580-7777 Page: 5
TeleLink® SM Fuse
Second Level AC Power Fault Test for Non-Customer Premises Equipment
Notes:
• Power fault tests equal or exceed the requirements of UL1950 3rd edition.
• Test 4 is intended to produce a maximum heating effect. Temperature readings can exceed 150°C.
• Test 2 may be dependent on the closing angle of the voltage source. Fuse is characterized at 50° to 70°.
Closing angles approximating 90° may result in damage to the body of the fuse.
• Caution should be used when routing internal traces adjacent to the F1250T.
Test Applied Voltage, 60Hz Short Circuit Current Duration
1120VRMS, 277VRMS 30A 30 minutes
2600VRMS 60A 5 seconds
3600VRMS 7A 5 seconds
4 100VRMS - 600VRMS 2.2A at 600V 30 minutes
Time Current Curve TeleLink® SM Fuse
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Time Current Curve
Time in seconds
Current in Amperes
.01
.02
.03
.04
.05
.06
.07
.08
.09
.1
.2
.3
.4
.5
.6
.7
.8
.9
1
2
3
4
5
6
7
8
9
10
20
30
40
50
60
70
80
90
100
200
300
400
500
600
700
800
1000
.1
.2
.3
.4
.5
.6
.7
.8
.9
1
2
3
4
5
6
7
8
9
10
20
30
40
50
60
70
80
90
100
200
300
400
500
700
600
900
800
1000
.1
.2
.3
.4
.5
.6
.7
.8
.9
1
2
3
4
5
6
7
8
9
10
20
30
40
50
60
70
80
90
100
200
300
400
500
700
600
900
800
1000
.01
.02
.03
.04
.05
.06
.07
.08
.09
.1
.2
.3
.4
.5
.6
.7
.8
.9
1
2
3
4
5
6
7
8
9
10
20
30
40
50
60
70
80
90
100
200
300
400
500
600
700
800
1000
F0500T
F1250T
TeleLink® SM Fuse SM Mechanical Data
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972-580-7777 Page: 7
TeleLink® SM Fuse
SM Mechanical Data
Construction
1. End plate
2. High temperature solder preform
3. Metallization of ceramic body
4. Ceramic body
5. Fuse element
6. End termination overcoat on both ends (Nickel flash, Tin/Lead overcoat)
Dimensions
End View in mm (inches)
Top View in mm (inches)
12 3 4 5 6
2.77± 0.15
(0.109± 0.006)
2.77± 0.15
(0.109± 0.006)
1.40± 0.25 1.40± 0.25
(0.055± 0.010) (0.055± 0.010)
2.77± 0.15
(0.109± 0.006)
10.29± 0.20
(0.405± 0.008)
SM Mechanical Data TeleLink® SM Fuse
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Dimensions
Side View mm (inches)
Footprint mm(inches)
Soldering Recommendations
Wave Soldering:
Reservoir Temperature: 260°C (500 °F)
Time in Reservoir: 3 seconds maximum
Infrared:
Temperature: 240°C (464°F)
Time: 30 seconds maximum
Hand Soldering:
Hand soldering is not recommended for this fuse because excessive heat can affect the fuse performance. Hand
soldering should be used only for rework and low volume samples.
Maximum tip temperature: 240°C (464°F)
Minimize the soldering time at temperature to achieve the solder joint. Measure the fuse resistance before and
after soldering. Any fuse that shifts more than ±3% should be replaced. An increase in resistance above this
amount increases the possibility of a surge failure and a decrease in resistance may cause low overloads to
exceed the maximum opening times.
Inspect the solder joint to ensure an adequate solder fillet has been produced without any cracks or visible
defects.
1.40 ±0.25
1.40 ±0.25
(0.055 ±0.010)
(0.055 ±0.010)
2.77 ±0.15
(0.109 ±0.006)
10.29 ±0.20
(0.405 ±0.008)
5.2 3.7
(0.204) (0.145)
4.0
(0.157)
12.6
(0.496)
TeleLink® SM Fuse Temperature Derating Curve
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TeleLink® SM Fuse
Temperature Derating Curve
Operating Temperature: -55°C to +125°C with proper correction factor applied
Chart of correction factor
Maximum Temperature Rise
Notes:
• Measured at rated current after temperature stabilizes.
• *Higher currents and PCB layout designs can effect this parameter.
• The F1250T meets the requirements of UL 248-14. However, board layout, board trace widths, and ambi-
ent temperature values can cause higher than expected rises in temperature. During UL testing, the typi-
cal recorded heat rise for the F1250T at 2.2A was 120°C.
Fuse Temperature Reading
F0500T ≤ 75°C* (167°F)
F1250T ≤ 75°C* (167°F)
30
40
50
60
70
80
90
100
110
120
130
140
150
-55 -60 -40 -20 0 20 40 60 80 100 125
Ambient °C
Percent of Rating
Effect on Current
Rating
Packaging TeleLink® SM Fuse
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Packaging
Carrier Tape
Material
•24mm black anti-static tape
Package Symbolization
Marking F0500T F1250T Manufactured in
USA
Manufactured in
Taiwan
FU F U
FT F T
JU J U
JT J T
4˚ Max.
Section 'A'-'A'
.343±.013
.0135±.0005
+.30
-.10
+.012
-.004
24.00
.945
8˚ Max.
11.07±.10
.436±.004
11.50±.10
.453±.004
1.75±.10
.124±.004
3.15±.10
.436±.004 4.00±.10
.157±.004
1.50±.25
.059±.010
2.00±.10
.079±.004
1.50±.10
.059±.004
'A'
'B'
'A'
'B'
Dia.
8.00±.10
.315±.004 Dia.
3.28±.10
.129±.004
TeleLink® SM Fuse Packaging
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972-580-7777 Page: 11
TeleLink® SM Fuse
Packaging
13 Inch Reel (330mm)
Material
•Injection molded, high impact anti-static, white plastic reel
•Conforms to EIA-481-1
•Surface resistivity 1011 OHMS/Square
•Per ASTM D-257
Packing Information
Description Packing Quantity Suffix
Embossed Carrier Reel Pack 2500 RP
Bulk Pack 1000 BP
Access Hole
greater than
40.00 at slot
1.575 location
13.00±.20
.512±.008
Arbor Hole
60.00±1.00
2.362±.039
hub dia.
2.00
.079
(Drive Spokes)
min.
20.20
.795 min.
Tape Slot Depth
greater than 10.00
.394
330.00
12.992
max dia.
30.40
1.19
(measured
at hub)
25.65±1.75
1.00±.069
(measured at
outer edge)
5.00±.51
.197±.020
(tape starter slot)
24.40
.960 +.079
-.00
(measured
at hub)
+2.00
-.00
An Invensys company
TECCOR ELECTRONICS
1800 Hurd Drive
Irving, Texas 75038-4385
United States of America
Phone: +1 972-580-7777
Fax: +1 972-550-1309
http://www.teccor.com
sidactor.techsales@teccor.com
Teccor Electronics reserves the right to make changes at any time in order to improve designs
and to supply the best products possible. The information in this datasheet has been carefully
checked and is believed to be accurate and reliable. However, no liability of any type shall be
incurred by Teccor for the use of the circuits or devices described herein. Furthermore, no li-
cense of any patent rights is implied or given to any purchaser.
Please contact the factory for further information.
Ref: TeleLink_1250T_011012
Teccor Electronics is the proprietor of the trademarks
SIDACtor®, Battrax®, and TeleLink®.
Teccor Electronics SIDACtor® TVS product is covered
by these and other U.S. Patents: 4,685,120 - 4,827,497
- 4,905,119 - 5,479,031 - 5,516,705
An Invensys company
