UC1834 UC2834 UC3834 High Efficiency Linear Regulator FEATURES DESCRIPTION * Minimum VIN - VOUT Less Than 0.5V At 5A Load With External Pass Device * Equally Usable For Either Positive or Negative Regulator Design * Adjustable Low Threshold Current Sense Amplifier The UC1834 family of integrated circuits is optimized for the design of low input-output differential linear regulators. A high gain amplifier and 200mA sink or source drive outputs facilitate high output current designs which use an external pass device. With both positive and negative precision references, either polarity of regulator can be implemented. A current sense amplifier with a low, adjustable, threshold can be used to sense and limit currents in either the positive or negative supply lines. * Under And Over-Voltage Fault Alert With Programmable Delay * Over-Voltage Fault Latch With 100mA Crowbar Drive Output BLOCK DIAGRAM 6/94 In addition, this series of parts has a fault monitoring circuit which senses both under and over-voltage fault conditions. After a user defined delay for transient rejection, this circuitry provides a fault alert output for either fault condition. In the over-voltage case, a 100mA crowbar output is activated. An over-voltage latch will maintain the crowbar output and can be used to shutdown the driver outputs. System control to the device can be accommodated at a single input which will act as both a supply reset and remote shutdown terminal. These die are protected against excessive power dissipation by an internal thermal shutdown function. UC1834 UC2834 UC3834 ABSOLUTE MAXIMUM RATINGS (Note 1) Power Dissipation at TA = 25C . . . . . . . . . . . . . . . . . . 1000mW Power Dissipation at TC = 25C. . . . . . . . . . . . . . . . . . 2000mW Operating Junction Temperature . . . . . . . . . . -55C to +150C Storage Temperature . . . . . . . . . . . . . . . . . . . -65C to +150C Lead Temperature (soldering, 10 seconds). . . . . . . . . . . 300C Note 1: Voltages are reference to VIN-, Pin 5. Currents are positive into, negative out of the specified terminals. Consult Packaging section of Databook for thermal limitations and considerations of package. Input Supply Voltage, VIN + . . . . . . . . . . . . . . . . . . . . . . . . . 40V Driver Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400mA Driver Source to Sink Voltage . . . . . . . . . . . . . . . . . . . . . . . 40V Crowbar Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -200mA +1.5V Reference Output Current . . . . . . . . . . . . . . . . . . -10mA Fault Alert Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V Fault Alert Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA Error Amplifier Inputs . . . . . . . . . . . . . . . . . . . . . . -0.5V to 35V Current Sense Inputs . . . . . . . . . . . . . . . . . . . . . . -0.5V to 40V O.V. Latch Output Voltage . . . . . . . . . . . . . . . . . . -0.5V to 40V O.V. Latch Output Current . . . . . . . . . . . . . . . . . . . . . . . . 15mA CONNECTION DIAGRAMS DIL-16, SOIC-16 (TOP VIEW) J or N Package, DW Package PLCC-20, LCC-20 (TOP VIEW) Q, L Packages PACKAGE PIN FUNCTION FUNCTION PIN N/C VIN + -2.0V REF +1.5V REF Threshold Adjust N/C VIN- Sense- Sense+ N.Inv. Input N/C Inv. Input Fault Alert Fault Delay Driver Sink N/C Driver Source Compensation/ Shutdown O.V. Latch Output/Reset Crowbar Gate 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 UC1834 UC2834 UC3834 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA=-55C to +125C for the UC1834, -40C to +85C for the UC2834, and 0C to +70C for the UC3834. VIN+ = 15V, VIN- = 0V, TA = TJ. PARAMETER Turn-on Characteristics Standby Supply Current +1.5 Volt Reference Output Voltage Line Regulation Load Regulation -2.0 Volt Reference (Note 2) Output Voltage (Referenced to VIN+) Line Regulation Output Impedance Error Amplifier Section Input Offset Voltage Input Bias Current Input Offset Current Small Signal Open Loop Gain TEST CONDITIONS UC1834 UC2834 MIN TYP MAX 5.5 TJ = 25C TJ(MIN) TJ TJ(MAX) VIN+ = 5 to 35V IOUT = 0 to 2mA 1.485 1.47 TJ = 25C TJ(MIN) TJ TJ(MAX) VIN+ = 5 to 35V -2.04 -2.06 1.5 1 1 -2 1.5 2.3 VCM = 1.5V VCM = 1.5V VCM = 1.5V Output @ Pin 14, Pin 12 = VIN+ Pin 13, 20 to VIN- VCM = 0.5 to 33V, VIN+ = 35V VIN+ = 5 to 35V, VCM = 1.5V 50 1 -1 0.1 65 UC3834 MIN UNITS TYP MAX 5.5 10 mA 1.515 1.47 1.53 1.455 10 10 1.5 1.53 1.545 15 15 V -1.96 -2.06 -1.94 -2.08 15 -2 7 6 -4 1 50 1 1 1.5 2.3 1 -1 0.1 65 -1.94 -1.92 20 10 -8 2 mV mV V mV k mV A A dB 60 80 60 80 dB CMRR PSRR 70 100 70 100 dB Driver Section Maximum Output Current 200 350 200 350 mA Saturation Voltage IOUT = 100mA 0.5 1.2 0.5 1.5 V Output Leakage Current Pin 12 = 35V, Pin 13 = VIN-, Pin 14 = VIN- 0.1 50 0.1 50 A Shutdown Input Voltage IOUT 100A, Pin 13 = VIN-, Pin 12 = 0.4 1 0.4 1 V at Pin 14 VIN+ -100 -150 -100 -150 A Shutdown Input Current Pin 14 = VIN-, Pin 12 = VIN+ IOUT 100A, Pin 13 = VIN- at Pin 14 Thermal Shutdown (Note 3) 165 165 C Fault Amplifier Section 120 150 180 110 150 190 mV Under- and Over-Voltage VCM = 1.5V, @ E/A Inputs Fault Threshold -0.4 -0.8 -0.4 -1.0 %/v Common Mode Sensitivity VIN+ = 35V, VCM = 1.5 to 33V Supply Sensitivity VCM = 1.5V, VIN+ = 5 to 35V -0.5 -1.0 -0.5 -1.2 %/V Fault Delay 30 45 60 30 45 60 ms/F Fault Alert Output Current 2 5 2 5 mA Fault Alert Saturation Voltage IOUT = 1mA 0.2 0.5 0.2 0.5 V O.V. Latch Output Current 2 4 2 4 mA O.V. Latch Saturation Voltage IOUT = 1mA 1.0 1.3 1.0 1.3 V O.V. Latch Output Reset 0.3 0.4 0.6 0.3 0.4 0.6 V Voltage Crowbar Gate Current -100 -175 -100 -175 mA Crowbar Gate Leakage VIN+ = 35V, Pin 16 = VIN- -0.5 -50 -0.5 -50 A Current Note 2: When using both the 1.5V and -2.0V references the current out of pin 3 should be balanced by an equivalent current into Pin 2. The -2.0V output will change -2.3mV per A of imbalance. Note 3: Thermal shutdown turns off the driver. If Pin 15 (O.V. Latch Output) is tied to Pin 14 (Compensation/Shutdown) the O.V. Latch will be reset. 3 UC1834 UC2834 UC3834 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA=-55C to +125C for the UC1834, -40C to +85C for the UC2834, and 0C to +70C for the UC3834. VIN+ = 15V, VIN- = 0V. TA = TJ PARAMETER TEST CONDITIONS Current Sense Amplifier Section Threshold Voltage Pin 4 Open, VCM = VIN+ or VIN- Pin 4 = 0.5V, VCM = VIN+ or VIN- Threshold Supply Sensitivity Pin 4 Open, VCM = VIN-, VIN+ = 5 to 35V Adj. Input Current Pin 4 = 0.5V Sense Input Bias Current VCM = VIN+ VCM = VIN- Current Sense Threshold Adjustment UC1834 UC2834 MIN TYP MAX MIN TYP MAX 130 40 120 30 150 50 -0.1 -2 100 -100 180 70 -0.5 -10 200 -200 150 50 -0.1 -2 100 -100 170 60 -0.3 -10 200 -200 UC3834 UNITS Current Limiting Knee Characteristics Differential Voltage at Current Sense Inputs - mV (reference to sense - input) Error Amplifier Gain and Phase Frequency Response Current Sense Amplifier Gain and Phase Frequency Response 4 mV %/V A A UC1834 UC2834 UC3834 APPLICATION INFORMATION Foldback Current Limiting The crowbar output on the UC1834 is activated following a sustained over-voltage condition. The crowbar output remains high as long as the fault condition persists, or, as long as the over-voltage latch is set. The latch is set with an over-voltage fault if the voltage at Pin 15 is above the latch reset threshold, typically 0.4V. When the latch is set, its Q- output will pull Pin 15 low through a series diode. As long as a nominal pull-up load exists, the series diode prevents Q- from pulling Pin 15 below the reset threshold. However, Pin 15 is pulled low enough to disable the driver outputs if Pins 15 and 14 are tied together. With Pin 15 and 14 common, the regulator will latch off in response to an over-voltage fault. If the fault condition is cleared and Pins 14 and 15 are momentarily pulled below the latch reset threshold, the driver outputs are re-enabled. Both the current sense and error amplifiers on the UC1834 are transconductance type amplifiers. As a result, their voltage gain is a direct function of the load impedance at their shared output pin, Pin 14. Their small signal voltage gain as a function of load and frequency is nominally given by; ZL (f) ZL (f) and AV C. S. A = 70 700 for: f 500kHz and |ZL(f)| 1 M Where: AV=Small Signal Voltage Gain to pin 14. ZL(f) = Load Impedance at Pin 14. AV EA = The UC1834 fault delay circuitry prevents the fault outputs from responding to transient fault conditions. The delay reset latch insures that the full, user defined, delay passes before an over-voltage fault response occurs. This prevents unnecessary crowbar, or latched-off conditions, from occurring following sharp under-voltage to over-voltage transients. Setting the Threshold Adjust Voltage (VADJ) 5 UC1834 UC2834 UC3834 TYPICAL APPLICATIONS 5-10 Amp Positive Regulator 5-10 Amp Negative Regulator UNITRODE CORPORATION 7 CONTINENTAL BLVD. * MERRIMACK, NH 03054 TEL. (603) 424-2410 * FAX (603) 424-3460 6 PACKAGE OPTION ADDENDUM www.ti.com 10-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 5962-87742012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287742012A UC1834L/ 883B 5962-8774201EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8774201EA UC1834J/883B UC1834J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1834J UC1834J/81025 OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1834J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8774201EA UC1834J/883B UC1834L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1834L UC1834L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287742012A UC1834L/ 883B UC2834DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2834DW UC2834DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2834DW UC2834DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2834DW UC2834DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2834DW UC2834J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -40 to 85 UC2834J UC2834N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2834N UC2834NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2834N UC2834Q ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2834Q UC2834QG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2834Q UC2834QTR OBSOLETE PLCC FN 20 TBD Call TI Call TI -40 to 85 UC2834Q Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) UC2834QTRG3 OBSOLETE PLCC FN 20 TBD Call TI Call TI -40 to 85 UC3834DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC2834Q UC3834DW UC3834DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3834DW UC3834N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3834N UC3834NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3834N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Oct-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1834, UC2834, UC2834M, UC3834 : * Catalog: UC3834, UC2834 * Military: UC2834M, UC1834 * Space: UC1834-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device UC2834DWTR Package Package Pins Type Drawing SOIC DW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 10.75 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.7 2.7 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC2834DWTR SOIC DW 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated