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Specifications:
Contact rating : Dependent upon content material.
Mechanical life : 30,000 make and break cycles.
Maximum contact resistance : 20 mΩ initial at 2-4 V dc 100 mA for
both silver and gold plated contacts.
Minimum insulation resistance : 1,000 MΩ.
Dielectric strength : 1,000 V rms at sea level.
Operating temperature : -30°C to 85°C.
Materials:
Case : Diallyl phthalate (DAP).
Actuator : Brass, chrome plated.
Bushing : Brass, nickel plated.
Housing : Stainless steel.
Switch support : Brass, tin plated.
Terminal / contact : Silver or gold plated.
Bushing
B2 5.59 high, flat (NON-THD)
B5 7.87 high, flat (THD)
2
Model No Actuator Bushing Terminations Contact
MaterialSeal
M S 1 T 1 B 2 M 2 R E
Model No
2MS1 SP On-None-On
2MS2 SP On-None-Mom.
2MS3 SP On-Off-On
2MD1 DP On-None-On
2MD3 DP On-Off-On
Actuator
T1 9.40 high
T2 5.33 high
Contact Material
R Gold
Seal
E Epoxy (std)
Terminations
M2 PC thru-hole
M6 Right angle, PC thru-hole
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Switch Function
Number
of Poles
UL / CSA
Model
Number
Model
Number
Switch Function Connected Terminals / Schematic
Position 1 Position 2 Position 3 Position 1 Position 2 Position 3
SP
Q2211 2MS1
On None ON N/A
Q2212 2MS2 MOM
Q2213 2MS3 Off
ON
Open
DP
Q2221 2MD1
On
None N/A
Q2223 2MD3 Off Open
SPDT
Pole Options
MOM = Momentary
2MS6 Models : Omit 2nd terminal
DPDT
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Actuator Options
T1 T2
T1, T2, Actuator shown with B2 bushing, subtract 0.09 (2.29) for B5 bushing, subtract 0.04 (1.02) for B5 bushing, add 0.09 (2.29)
Std for M2 terminal sub 0.016 (0.04) for M2 terminals sub. 016 (0.04) for M6.
Bushing Options
B2 NON-THD B5 THD
Termination Options
M2
Double Pole
M6, SPDT
P. C. Mounting
SPDT
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M6, DPDT
P. C. Mounting
DPDT
Panel Mounting
10-48 Bushing 1/4 In. Bushing
Without Locking Ring Without Std. Locking Ring Without Locking Ring Without Std. Locking Ring
Hardware
Locking Ring
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Soldering Process:
Manual soldering : Use soldering iron of 30 watts, controlled at 350°C approximately 5 s while applying solder.
Wave soldering : Recommended soldering temperature : 260 ±5°C.
: Duration of solder immersion : Maximum 5 s (PCB is 1.6 mm in thickness).
Contact Plating Terminal Plating Ratings
R Gold R = Gold 0.4 Volt - Amperes (VA) maximum at 20 V maximum (AC or DC)
Contact Material Options
Soldering : Vapour phase
Important Notice : This data sheet and its contents (the "Information") belong to the members of the Premier Farnell group of companies (the "Group") or are licensed to it. No licence is granted for the use of
it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces
all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use
made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted.
Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising)
is excluded. This will not operate to limit or restrict the Group's liability for death or personal injury resulting from its negligence. Multicomp is the registered trademark of the Group. © Premier Farnell plc 2011.
