TF915..B TF915..B Fast Switching Thyristor Replaces December 1998 version, DS4279-3.0 DS4279-4.0 January 2000 APPLICATIONS KEY PARAMETERS VDRM 1400V IT(RMS) 1700A ITSM 20000A dV/dt 300V/s dI/dt 500A/s tq 40s High Power Inverters And Choppers UPS Railway Traction Induction Heating AC Motor Drives Cycloconverters FEATURES Double Side Cooling High Surge Capability High Voltage VOLTAGE RATINGS Type Number Repetitive Peak Voltages VDRM VRRM Conditions 1400 1200 1000 800 600 VRSM = VRRM + 100V TF915 14B TF915 12B TF915 10B TF915 08B TF915 06B IDRM = IRRM = 60mA at VRRM or VDRM & Tvj Lower voltage grades available. Outline type code: MU169. See Package Details for further information. CURRENT RATINGS Parameter Symbol Conditions Max. Units IT(AV) Mean on-state current Half sinewave, 50Hz, Tcase = 80oC 1080 A IT(RMS) RMS value Half sinewave, 50Hz, Tcase = 80oC 1700 A 1/13 TF915..B SURGE RATINGS Symbol Parameter Conditions Max. Units ITSM Surge (non-repetitive) on-state current 10ms half sine; VR = 0% VRRM, Tj = 125C 20.0 kA I2t I2t for fusing 10ms half sine; VR = 0% VRRM, Tj = 125C 2000 x 103 A2s THERMAL AND MECHANICAL DATA Conditions Min. Max. Units dc - 0.020 o Anode dc - - o Cathode dc - - o Double side - 0.006 o Single side - 0.012 o On-state (conducting) - 125 o Reverse (blocking) - 125 o Storage temperature range -40 150 o Clamping force 22.3 24.6 Parameter Symbol Double side cooled Rth(j-c) Thermal resistance - junction to case C/W C/W Single side cooled Rth(c-h) Tvj Tstg - Thermal resistance - case to heatsink Clamping force 23.5kN with mounting compound C/W C/W C Virtual junction temperature MEASUREMENT OF RECOVERED CHARGE - QRA1 Measurement of QRA1 : QRA1 = IRR x tRR 2 ITM QRA1 tp = 1ms dIR/dt 0.5x IRR IRR 2/13 C/W C C kN TF915..B DYNAMIC CHARACTERISTICS Symbol Parameter Conditions Min. Max. Units Maximum on-state voltage At 2000A peak, Tcase = 25oC - 1.75 V Peak reverse and off-state current At VRRM/VDRM, Tcase = 125oC - 60 mA dV/dt Maximum linear rate of rise of off-state voltage Linear to 60% VDRM Tj = 125oC, Gate open circuit - 300 V/s Gate source 20V, 20 Repetitive 50Hz - 500 A/s dI/dt Rate of rise of on-state current tr 0.5s, Tj = 125C Non-repetitive - 800 A/s VTM IRRM/IDRM Threshold voltage At Tvj = 125oC - 1.25 V rT On-state slope resistance At Tvj = 125oC - 0.25 m tgd Delay time 1.5* - s Total turn-on time Tj = 25C, IT = 50A, VD = 300V, IG = 1A, dI/dt = 50A/s, dIG/dt = 1A/s 3.0* - s IH Holding current Tj = 25oC, ITM = 1A, VD = 12V 100* - mA IL Latching current Tj = 25oC, IG = 0.5A, VD = 12V 300* - mA 40 s Turn-off time Tj = 125C, IT = 250A, VR = 50V, tq code: B dV/dt = 20V/s (Linear to 60% VDRM), dIR/dt = 50A/s, Gate open circuit - tq Typ. Max. Units VT(TO) t(ON)TOT *Typical value. GATE TRIGGER CHARACTERISTICS AND RATINGS Symbol Parameter Conditions VGT Gate trigger voltage VDRM = 12V, Tcase = 25oC, RL = 6 - 3.0 V IGT Gate trigger current VDRM = 12V, Tcase = 25oC, RL = 6 - 200 mA VGD Gate non-trigger voltage At VDRM Tcase = 125oC, RL = 1k - 0.2 V - 5.0 V - 10 A VRGM Peak reverse gate voltage IFGM Peak forward gate current PGM Peak gate power - 50 W PG(AV) Mean gate power - 3 W Anode positive with respect to cathode 3/13 TF915..B CURVES 4/13 TF915..B 5/13 TF915..B NOTES: 1. VD 600V. 2. VR 10V. 3. R.C Snubber, C = 0.22F, R = 4.7 NOTES: 1. VD 600V. 2. VR 10V. 3. R.C Snubber, C = 0.22F, R = 4.7 6/13 TF915..B NOTES: 1. VD 600V. 2. VR 10V. 3. R.C Snubber, C = 0.22F, R = 4.7 NOTES: 1. dI/dt = 25A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7 7/13 TF915..B NOTES: 1. dI/dt = 25A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7 NOTES: 1. dI/dt = 25A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7 8/13 TF915..B NOTES: 1. dI/dt = 50A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7 NOTES: 1. dI/dt = 50A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7 9/13 TF915..B NOTES: 1. dI/dt = 50A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7 NOTES: 1. dI/dt = 100A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7 10/13 TF915..B NOTES: 1. dI/dt = 100A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7 NOTES: 1. dI/dt = 100A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7 11/13 TF915..B PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 2 holes O3.6 x 2.1 approx (one in each electrode) Cathode tab O74 max Cathode O46 min 26 1 O1.5 Gate O46 min Anode O68 max Nominal weight: 500g Clamping force: 23.5kN 10% Lead length: 250mm Package outine type code: MU169 ASSOCIATED PUBLICATIONS Title Application Note Number Calculating the junction temperature or power semiconductors AN4506 Gate triggering and the use of gate characteristics AN4840 Recommendations for clamping power semiconductors AN4839 The effect of temperature on thyristor performance AN4870 Thyristor and diode measurement with a multi-meter AN4853 Turn-on performance of thyristors in parallel Use of V , r on-state characteristic AN4999 AN5001 TO 12/13 T TF915..B POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of `T' 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS Power Assembly has it's own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DSxxxx-y Issue No. x.x January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 13/13