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of Qualcomm Incorporated, registered in the United States and other countries. Krait is a trademark of Qualcomm Incorporated. All
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Features
£
Quad-core Krait 300 CPU at up to 1.5GHz
for advanced multi-tasking and multi-
threaded application support
£
Performance-enhanced oating-point and
SIMD functional unit with 128-bit data path,
designed to use the ARM instruction set
architecture (ISA), software and ecosystem
£
Optimized computational units, including
double-precision calculations for fast speed
on demanding applications
£
Asynchronous SMP (aSMP) technology
with dedicated power management
processor for optimal battery life
£
Adreno 320 Graphics with support for
multiple APIs and console-quality 3D
graphics with low power consumption
£
Qualcomm® Hexagon
™
QDSP6 V4 (up to
500MHz) for dierentiated signal processing
£
1080p video encode/decode with multi-
screen HD support and integrated HDMI
£
Support for up to 3 simultaneous cameras
via 4-lane primary MIPI-CSI, 2-lane
secondary MIPI-CSI & 1-lane 3D MIPI-CSI
£
Worldwide ecosystem of Snapdragon
vendors, customers, developers and
embedded device OEMs
To learn more visit:
snapdragon.com/embedded
or developer.qualcomm.com
Block Diagram
Snapdragon 600E Specifications
Package
23mm x 23mm (784 BGA, 0.8mm pitch)
CPU Quad-core Krait 300 CPU @ up to 1.5GHz per core
Memory and Storage
DDR3/DDR3L dual-channel 533MHz
eMMC 4.51, SDIO 3.0 (UHS-I)
Connectivity 802.11 a/b/g/n/ac 2x2 dual-band 2.4GHz/5GHz Wi-Fi,
Bluetooth 4.0LE/3.x, GPS
GPU Adreno 320 GPU 400+ MHz
DSP Hexagon QDSP6 V4 core @ up to 500MHz
Display Support
Up to 2048x1536 display via 4-lane DSI
1080p external display and integrated HDMI
Camera Support Integrated ISP supports up to 20MP & stereoscopic 3D
Multimedia 1080p HD (MPEG-4, MPEG-2, H.264, DivX, VC-1, WMV-9)
H.264 playback & capture
Interfaces PCIe 2.0, HDMI, LVDS, HSIC, 3x USB2.0, 3x MIPI-CSI,
2x MIPI-DSI, SD3.0 & eMMC v4.5 with DDR support
Security Secure Boot, Secure code signing service
Longevity Product availability and support extended for a minimum of
10 years from initial commercial release (to 2025)
Embedded Computing Applications
Industrial Automation Digital Media & TV Dongles Medical Devices Smart Home Devices HD VideoIoT
Product Part Number
Snapdragon 600E SoC APQ-8064E-0-784FCBGA
Power Management Module PMM-8920AU-0-255FBGA
Audio Codec WCD9311-0-86CSP
Wi-Fi & BT Connectivity QCA6234XH-AM2D-R
GPS and Glonass RF Receiver RGR-7640AU-0-24FBGA
Ethernet AR8151-BL1A-R
Qualcomm Hexagon is a product of Qualcomm Technologies, Inc.