Hi-Flow 300G (R) Fiberglass-Reinforced, Phase Change Thermal Interface Material Features and Benefits * Thermal impedance: 0.20C-in2/W (@25 psi) * Will not drip or run like grease * Phase change compound coated on a fiberglass carrier TYPICAL PROPERTIES OF HI-FLOW 300G PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Green Green Visual Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.005 0.127 ASTM D374 Elongation (%45 to Warp and Fill) 40 40 ASTM D882A Tensile Strength (psi) / (MPa) 400 3 ASTM D882A Continuous Use Temp (F) / (C) 212 100 -- Phase Change Temp (F) / (C) 131 55 ASTM 3418 Dielectric Breakdown Voltage (Vac) 300 300 ASTM D149 Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150 Volume Resistivity (Ohm-meter) 108 108 ASTM D257 Flame Rating V-O V-O U.L. 94 1.6 1.6 ASTM D5470 Color ELECTRICAL THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) Hi-Flow 300G consists of a thermally conductive 55C phase change compound coated on a fiberglass web. Hi-Flow 300G is designed as a thermal interface material between a computer processor and a heat sink. Above the phase change temperature, Hi-Flow 300G wets-out the thermal interface surfaces and flows to produce low thermal impedance.The material requires pressure of the assembly to cause flow. Hi-Flow 300G will not drip or run like grease. 10 25 50 100 200 TO-220 Thermal Performance (C/W) 0.96 0.92 0.88 0.85 0.84 Thermal Impedance (C-in2/W) (2) 0.27 0.20 0.16 0.15 0.14 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Computer and peripherals * As a thermal interface where bare die is exposed and needs to be heat sinked Application Methods Configurations Available: * Sheet form, die-cut parts, and roll form * With or without pressure sensitive adhesive Building a Part Number The Bergquist Company - Europe Bramenberg 9a, 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 NA Section E - 1012 - Standard Options NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.005" HF300G = Hi-Flow 300G Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patent 6,197,859 and others www.bergquistcompany.com The Bergquist Company North American Headquarters 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-0430 - 00 Section D 0.005 Section C - Section B HF300G Section A 1. Hand-apply to 40- 50C heat sink.The heat sink is heated in an oven or by a heat gun to between 40- 50C allowing the Hi-Flow 300G pad to be applied like an adhesive pad.The heat sink is then cooled to room temperature and packaged. 2. Hand-apply to 20- 35C heat sink. Hi-Flow 300G can be applied to a room temperature heat sink with the assistance of a foam roller.The pad is positioned on the heat sink and a hand roller is used to apply pressure of 30 psi. 3. Automated equipment with 30 psi pressure. A pick-and-place automated dispensing unit can be used to apply Hi-Flow 300G to a room temperature heat sink.The placement head should have a soft silicone rubber pad, and apply 30 psi pressure to the pad on transfer to the 20- 35C heat sink. The Bergquist Company - China Rm. 7C, Aihe Mansion No. 629 Ling Ling Road Shanghai, China 200030 Ph: 86-21-6464-2206 Fax: 86-21-6464-2209 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers' and manufacturers' only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer. PDS_10092_HF_300G_0305