www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_10092_HF_300G_0305
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company - Europe
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - China
Rm. 7C, Aihe Mansion
No. 629 Ling Ling Road
Shanghai, China 200030
Ph: 86-21-6464-2206
Fax: 86-21-6464-2209
Hi-Flow
®
300G
Features and Benefits
• Thermal impedance:
0.20°C-in2/W (@25 psi)
• Will not drip or run like grease
• Phase change compound coated on
a fiberglass carrier
Hi-Flow 300G consists of a thermally conductive
55°C phase change compound coated on a
fiberglass web. Hi-Flow 300G is designed as a
thermal interface material between a computer
processor and a heat sink.
Above the phase change temperature,
Hi-Flow 300G wets-out the thermal interface
surfaces and flows to produce low thermal
impedance.The material requires pressure of
the assembly to cause flow. Hi-Flow 300G will
not drip or run like grease.
Application Methods
1. Hand-apply to 40°- 50°C heat sink.The heat
sink is heated in an oven or by a heat gun
to between 40°- 50°C allowing the Hi-Flow
300G pad to be applied like an adhesive
pad.The heat sink is then cooled to room
temperature and packaged.
2. Hand-apply to 20°- 35°C heat sink.
Hi-Flow 300G can be applied to a room
temperature heat sink with the assistance
of a foam roller.The pad is positioned on
the heat sink and a hand roller is used to
apply pressure of 30 psi.
3. Automated equipment with 30 psi pressure.
A pick-and-place automated dispensing unit
can be used to apply Hi-Flow 300G to a
room temperature heat sink.The placement
head should have a soft silicone rubber
pad, and apply 30 psi pressure to the pad
on transfer to the 20°- 35°C heat sink.
Fiberglass-Reinforced, Phase Change Thermal Interface Material
Typical Applications Include:
• Computer and peripherals
• As a thermal interface where bare die is exposed and needs to be heat sinked
Configurations Available:
• Sheet form, die-cut parts, and roll form
• With or without pressure sensitive adhesive
Building a Part Number Standard Options
Hi- Flow®:U.S. Patent 6,197,859 and others
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
HF300G = Hi-Flow 300G Phase Change Material
HF300G 0.005 00––––1012 NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.005"
AC = Adhesive, one side
00 = No adhesive
_ _ _ = Standard configuration dash number,
1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or
00 = custom configuration
TYPICAL PROPERTIES OF HI-FLOW 300G
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (inch) / (mm) 0.005 0.127 ASTM D374
Elongation (%45° to Warp and Fill) 40 40 ASTM D882A
Tensile Strength (psi) / (MPa) 400 3 ASTM D882A
Continuous Use Temp (°F) / (°C) 212 100 —
Phase Change Temp (°F) / (°C) 131 55 ASTM 3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 300 300 ASTM D149
Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150
Volume Resistivity (Ohm-meter) 108108ASTM D257
Flame Rating V-O V-O U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1) 1.6 1.6 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.96 0.92 0.88 0.85 0.84
Thermal Impedance (°C-in2/W) (2) 0.27 0.20 0.16 0.15 0.14
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
