BY ttl FRB TS AMP AMP FH 0.6 mm Pitch Board-to-Board Connector 114-5255 22- NOV-01 Rev A 1 BASH 1. Scape Ll WA & ABS, 0.6 me y FRRRRI RTS FU- Nb PT PORRAEICMT SABRE TRIE T Oo 11 Contents This specification covers the requirements for mount of 0.6 mm Pitch Board-to-Board Connector Free Height Type. Rey. A 114-5255 Application Specification AMP FH 0. mm Pitch Board-te-Board Connector (Surface-Mount Technology) COBRA SHIC CURR ERENT, BHICRCRASHET. lof6 BA OME OIC RHARR RICE SHtcESL, Copyright 1998 by AMP Incorporated. Ali Right Reserved. steECT Revised Per EC FJ00-2726~01By (ital FRR AS AMP FH 0.6 mm Pitch Board-to-Board Connector ANP 1145255 22~ NOVO1 Rev A 2. Be i A AS 108-5468 Ae 501-5164 BrRRAS 2. Related Specifications 108-5468 Product Specification 01-5164 Tesi Report 3. ROAR 3. Product Features Plug connecter Plug contac TS o aia 4 Ia enlace cotact Par 2 oe cle FP breandg plate woot AY ee i . sIder tine ns Reeentacie coinedctor ee bop. aR a Fig. 1 COB St hVRRSBEN TAY, BELBCRESHET, 2of6 BROWSER EICAMSHe ESL, Copyright 1998 by AMP Incorporated. All Right Reserved. LRT Revised Per EC FJOC-2726-01Rte APR AMP FH 0.6 Pitch Board-to-Board Connector ANIP ms 1145255 22~ NOV-01 Rev A BR SIR 4. Requirments 41 Re (A BAIRD PYOMMAR. LYRA F-F. Fa DF, NOK + hE OST, DU RUS ETE @T ORM, Ts, REMA SH LDCMARBOERE, CBHAZSAMa<, ROR. HORM POMBE HIRLEDT. (Hi, Mie > 5~35C, 45~75% Ri) (B) (PSP CRE SSRI. ANE TRL LORRY LET, (C} BARORMRE EI, 37 AUAORH ERLE. 4.1 Storage (A) This connector is packaged and shipped in an emboss tape, tube or hard tray. We recommend that the connector remain in the container to prevent contamination or dust, and that it is stored, keeping at normal temperatures, normal humidity and no poisonous gas. (Normal Lemperatures and humidity : 5~35C, 45~75% RH (B) If this connector is stored in the middle of operating, it should not remain naked. (C}We recommend that this connector isnt stored for a long time after opening a package and that it is used within three months. 42 RRR MRIS A+ RS Lae CPR ED, MZERe CRA ORICIL, ROEWILT OA, IRV IRARKERMSObR-bLTFSE, 4.2 Printed Circuit Board The pe board shall be glass epoxy. If you use a thin board, we recommend you to give support to it from reverse side in order to prevent a bow of board when mating. 43 Biglbatrok AAKVY-RMeSie Fata, 4.3 PC Board Layout Please refer to customer drawing COPS SHI CURR BRAN CA. HEC ESSHET. 3 of 6 ROWE IOUT SAAR EIEMU abe SL, Copyright 1998 by AMP Incorporated. All Right Reserved. SRL Revised Per EC FJ00-2726-01ANIP 440 AR ftir AMP FH 0.6 mm Pitch Board-to-Board Connector (A) HEBEL AAA b lL. eee Whh638n/37Pb M6080 /40P De ET, 2. 7oayvV Agito Y > 7322 (RMA TYPE) EAL TPE, (BB) VA 1. HER VA )B: 0. 1o~0. 18mm 2. HRA RU a-SROROR TEA ONY F149) RE AAS 114-95255 22- NOV-01 Rev A Height | tARARU ad fe OBB Tie Alam m) (min) (mm?) VA7BO15t AH JB 0.18 4 . 0.25W XK 2.35L . x1. FSH IVER 0.088 35 0.25W x 1.96L 5~12 0.045 0.25W X1.19L 0.18W X0.99L 4 0.049 0.25W X 1.31L 0.25W X 1.09L Veavyah 8.12 0.044 0.25W X1.16L 0.25W X0.97L VIF HAF 0.584 3.2W X1.22L 3.2W X 1.01L () Uzo-Be ape: 100~ 150 9=fORD ELE OFA 2INCEE SEED FE 7 Be: 240C EF (D) FRO APU ARVIDGARS ( VRERBACT ALT. BRE CRRICRORI SENSEI APRRROME M BARS TYAN FORINCS SLIBASHECPSL, #2BAURLEV. E) UAT MARIOS Se OP RICRORBKId, PTD RICI PRONE ESICEBLTFE}, ITF ARE + 300TH F (ESSERE): SDE E COBMSSHICLY ESSENCE, BBICHCBRENET, BROMECOMNILBHAPREILSALAPECESAL, Cepyright 1998 by AMP Incorporated, All Right Reserved. <eRoe 4 of 6 Revised Per EG FJ00-2726-01By sta FARR AMP FH 0.6 mm Pitch Board-to-Board Connector ANP 1145255 22- NOV-01 Rev A 4.4 Solder Techniques (A)Recommend Solder Paste 1. Alloy type shall be either 635n/37Pb or 605n/40Pb. 2. Flux shall be RMA type. (B) Solder Mask l. Recommended mask thickness : 0. 15~0. 18mm 2. Recommended solder volume and an example of aperture pad DIM (per pad) Height | Solder volume An example of aperture pad DIM.(mm) (mm) (mm) Mask thickness : 0.15t | Mask thickness ; 0.18t 4 0.088 0.25W X2.35L 0.25W X1.96L Plug contact a~12 0.045 O.25W * 1.19L 0.18W X0.99L 4 0.049 0.25W x 1.31L 0.25W X1.09L Receptacle contact 8.12 0,044 O.25W *1.16L 0.25W X0.97L Solder peg 0.584 3.2W X 1.225, 3.2W X1L.01L (C) Reflow Condition Preheat: 100~150T 60 Sec. Min Heat: 210 Min 30 Sec. Max Heat peak : 240C Max (D) Connector Placement Piease adjust the automatic mounter in such a way that it is set up at a surface level, keeping without deformation of the solder tine. Optimally, the connector solder tine should be aligned as centered on the PC board pads. (E) Repair If a soldering iron is used, full care must be taken not to contact the solder tine by tip of a soldering iron. Recommended tempeature of soldering iron : 300C MAX Operating time : 3sec. Max. per pad CORR RHIC kU SRST HY, BRIER SSRET, 5 of 6 BROMEIIOYTSHHAREICEMEhtceSL, Copyright 1998 by AMP Incorporated. All Right Reserved. LaRCS Revised Per EC FUQ0-2726-01ANP AMP FH 0.6 mm Pitch Board-to-Board Connector AR {tal FARTS 114-5255 22- NOV-01 Rev A 4.6 ReaAR mo tEeld, 2. 6 CANIS Tito TRA, 4.6 Mating angle Please do mating work within 2.6 degrees. sz. a Fulcrum [ey An SSNs SXSSSc RSSSSSSSS SSS qT Fpl LTR | REVISION RECORD DR CHK 0 FIG0-1319-98 J. Tsuji . Lamamo to A ~ ~ .Tsuii APVD Y. Yamamoto COBMS SH LURE SRSN TAY, BELMCRESHET, RAO EILOITERH ERIKA A DECESL, Copyright 1998 by AMP Incorporated. All Right Reserved. Le CT 6 of 6 Revised Per EC FJ00-2726-01