WD2RE01GX809-667G-PF - Wintec Industries

RDIMM UDIMM SODIMM mini DIMM

DRAM DDR2

RDIMM

DDR2 has been the standard memory solutions for

applications in virtually all market segments from

Servers, PCs and Notebooks to Printers, Networking

and Storage systems and many more for several years

providing superior cost and performance criteria. DDR2

has started to relinquish its role as the memory

industry’s mainstream technology to DD R3 and is

forecasted to become a legacy product by early 2011

Available in power supply voltages of 1.8V (and 1.55V

for FBDIMMs) and with transfer data rates from

400Mb/s to 800Mb/s and beyond, DDR2 has been

designed in a wide range of applications providing

designers with numerous module options to choose

from. Wintec offers a wide range of DDR2 Module

solutions. Please click on the link to find out more about

our solutions.

DDR2 - 240-Pin DIMM - Registered ECC

Standard Prof ile (1.181”) with Nom inal Voltage (1.8 V)

Density Part Number Rank DIMM

Config Compon e nt

Config Voltage

1GB WD2RE01GX809-xxxx-yyz 1 rank 128x72 128Mx8 1.8V

WD2RE01GX418-xxxx-yyz 1 rank 128x72 128Mx4 1.8V

2GB WD2RE02GX818-xxxx-yyz 2 rank 256x72 128Mx8 1.8V

4GB

WD2RE04GX418-xxxx-yyz 1 rank 512x72 512Mx4 1.8V

WD2RE04GX436-xxxx-yyz 2 rank 512x72 256Mx4 1.8V

WD2RE04GX836-xxxx-yyz 4 rank 512x72 128Mx8 1.8V

8GB WD2RE08GX436-xxxx-yyz 2 rank 1024x72 512Mx4 1.8V

WD2RE08GX836-xxxx-yyz 4 rank 1024x72 256Mx8 1.8V

Very Low Profile (0.72”) with Nominal Voltage (1.8V)

Density Part Number Rank DIMM

Config Component

Config Voltage

1GB WD2RE01GX809V-xxxx-yyz 1 rank 128x72 128Mx8 1.8V

WD2RE01GX418V-xxxx-yyz 1 rank 128x72 128Mx4 1.8V

2GB WD2RE02GX818V-xxxx-yyz 2 rank 256x72 128Mx8 1.8V

4GB WD2RE04GX418V-xxxx-yyz 1 rank 512x72 512Mx4 1.8V

WD2RE04GX818V-xxxx-yyz 2 rank 512x72 256Mx8 1.8V

8GB WD2RE08GX818V-xxxxx-yyz 2 rank 1024x72 512Mx8 1.8V

(xxxxx)

(yy) =

(z) =

Modules Speed (MHz) and CAS Latency

800I: 800MHz CL6

800G : 800MHz CL5

667G : 667MHz CL5

533E : 533MHz CL4

DRAM Manufacturer and Die Revision

P: Samsung

H: Micron

C: Hynix

A: A-Die

B: B-Die

C: C-Die

Buffer / Register set (Only applies to Registered/Buffered modules)

I: Inphi

e 1 of 2Wintec Industries – OEM Embedded Desi

n Cente

5/31/2012