INMP510
RF-Hardened, Ultra-Low Noise Microphone with Bottom Port and Analog Output
GENERAL DESCRIPTION
The INMP510* is an RF-hardened, analog output, bottom-ported,
omnidirectional MEMS microphone with high performance,
ultra-low noise, and low power. The INMP510 consists of a
MEMS microphone element, an impedance converter, and an
output amplifier. The INMP510 sensitivity specification makes
it an excellent choice for both near-field and far-field
applications. The INMP510 is pin compatible with the INMP504
microphone. The INMP510 has a very high signal-to-noise
ratio (SNR) and extended wideband frequency response,
resulting in natural sound with high intelligibility. Low current
consumption enables long battery life for portable
applications.
The INMP510 is available in a miniature 3.35 × 2.5 × 0.98 mm
surface-mount package. It is reflow solder compatible with no
sensitivity degradation.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
APPLICATIONS
• Smartphones and Feature Phones
• Tablet Computers
• Teleconferencing Systems
• Digital Still and Video Cameras
• Bluetooth Headsets
• Notebook PCs
• Security and Surveillance
FEATURES
• Tiny, 3.35 × 2.5 × 0.98 mm Surface-Mount Package
• High SNR of 65 dBA
• Acoustic Overload Point of 124 dB SPL
• Extended Frequency Response from 60 Hz to 20 kHz
• Omnidirectional Response
• Sensitivity of −38 dBV
• Sensitivity Tolerance of ±2 dB
• Enhanced Radio Frequency (RF) Performance
• Low Current Consumption of 180 µA
• Single-Ended Analog Output
• High PSR of −78 dBV
• Compatible with Sn/Pb and Pb-Free Solder Processes
• RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
TEMP RANGE
INMP510ACEZ-R0*
−40°C to +85°C
INMP510ACEZ-R7†
−40°C to +85°C
EV_INMP510-FX
—
* – 13” Tape and Reel
† – 7” Tape and reel is to be discontinued.
Contact sales@invensense.com for availability.
OUTPUT
AMPLIFIER
INMP504POWER
VDD GND
OUTPUT
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-INMP510-00
Revision: 1.0.
Rev Date: 02/06/2014
INMP510
TABLE OF CONTENTS
General Description ................................................................................................................................................. 1
Applications ............................................................................................................................................................. 1
Features ................................................................................................................................................................... 1
Functional Block Diagram ........................................................................................................................................ 1
Ordering Information ............................................................................................................................................... 1
Table of Contents ..................................................................................................................................................... 2
Specifications .................................................................................................................................................................. 3
Table 1. Electrical Characteristics ............................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings ....................................................................................................................... 4
ESD Caution ............................................................................................................................................................. 4
Soldering Profile....................................................................................................................................................... 5
Table 3. Recommended Soldering Profile* .............................................................................................................. 5
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions ........................................................................................................................... 6
Typical Performance Characteristics ............................................................................................................................... 7
Applications Information ................................................................................................................................................ 8
Connecting to Audio Codecs .................................................................................................................................... 8
Supporting Documents ................................................................................................................................................... 9
Evaluation Board User Guide ................................................................................................................................... 9
Application Notes (General) .................................................................................................................................... 9
Application Notes (Product Specific) ....................................................................................................................... 9
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Handling Instructions .................................................................................................................................................... 11
Pick And Place Equipment ..................................................................................................................................... 11
Reflow Solder ......................................................................................................................................................... 11
Board Wash............................................................................................................................................................ 11
Outline Dimensions ....................................................................................................................................................... 12
Ordering Guide ............................................................................................................................................................. 12
Revision History ..................................................................................................................................................... 12
Compliance Declaration Disclaimer: ............................................................................................................................. 13
Environmental Declaration Disclaimer: ........................................................................................................................ 13
Page 2 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = −40 to 85°C, VDD = 1.5 to 3.63 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
PERFORMANCE
Omni
Sensitivity 1 kHz, 94 dB SPL
−40
−38
−36
dBV
65
dBA
29
dBA SPL
Dynamic Range
Derived from EIN and maximum
acoustic input
91 dB
Frequency Response
Low frequency −3 dB point
60
Hz
1
High frequency −3 dB point
>20
kHz
105 dB SPL
0.2
1
%
Power-Supply Rejection (PSR)
217 Hz, 100 mVp-p square wave
superimposed on VDD = 1.8 V (A-
weighted)
−78 dBV
Power-Supply Rejection Ratio (PSRR)
1 kHz, 100 mV p-p sine wave
superimposed on VDD = 1.8 V
−55 dB
10% THD
124
dB SPL
POWER SUPPLY
1.5
3.63
V
VDD = 1.8 V
180
220
µA
VDD = 3.3 V
210
250
µA
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT ) 350 Ω
Output DC Offset 0.7 V
Maximum Output Voltage
131 dB SPL input 0.398
V rms
Noise Floor
20 Hz to 20 kHz, A-weighted, rms −103
dBV
Note 1: See Figures 3 and 4.
Page 3 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (VDD)
−0.3 V to +3.63 V
Sound Pressure Level
160 dB
Mechanical Shock
10,000 g
Vibration
Per MIL-STD-883 Method 2007, Test Condition B
Operating Temperature Range
−40°C to +85°C
Storage Temperature Range
−55°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 4 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
SOLDERING PROFILE
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Pb-Free
Average Ramp Rate (T
L
to T
P
)
1.25°C/sec max
1.25°C/sec max
Preheat
Minimum Temperature
(TSMIN )
100°C 100°C
Minimum Temperature
(TSMIN )
150°C 200°C
Time (TSMIN to TSMAX ), tS 60 sec to 75 sec 60 sec to 75 sec
Ramp-Up Rate (TSMAX to TL) 1.25°C/sec 1.25°C/sec
Time Maintained Above Liquidous (tL)
45 sec to 75 sec
~50 sec
Liquidous Temperature (TL)
183°C
217°C
Peak Temperature (T
P
)
215°C +3°C/−3°C 260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec 20 sec to 30 sec
Ramp-Down Rate 3°C/sec max
3°C/sec max
Time +25°C (t
25°C
) to Peak
Temperature
5 min max 5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
tP
tL
t25°C
TO PEAK TEMPERATURE
tS
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
TIME
RAMP-DOWN
RAMP-UP
T
SMIN
T
SMAX
T
P
T
L
Page 5 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN NAME FUNCTION
1
VDD
Power Supply
2 OUTPUT Analog Output Signal
3 GND Ground
GND
OUTPUT
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
INMP510
2
VDD
1
3
Page 6 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 3. Frequency Response Mask
Figure 4. Typical Frequency Response (Measured)
Figure 5. PSR vs. Frequency, 100 mV p-p Swept Sine Wave
Figure 6. Total Harmonic Distortion + Noise (THD+N) vs. Input SPL
Figure 7. Linearity
Figure 8. Clipping Characteristics
20
–15
–10
–5
0
5
10
10
100
10k
FRE Q UE NCY ( Hz )
NORM ALIZED AM P LI TUDE ( dB)
1k
15
15
–15
–10
–5
0
5
10
10 100 10k
FREQUENCY ( Hz )
NORM ALIZED AM P LI TUDE ( dB)
1k
–50
–51
–52
–53
–54
–55
–56
–57
–58
–59
–60
100 10k
FRE Q UE NCY ( Hz )
PSRR (dB)
1k
0.1
10
1
90 130120110100
INPUT (dB SPL)
THD + N ( %)
-45
-40
-35
-30
-25
-20
-15
-10
-5
90 100 110 120 130
OUTPUT AMPLITUDE (dBV)
INPUT AMPLITUDE (dB SPL)
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
01.00.5
TIME (ms)
OUTPUT (V)
120dB S PL
124dB S PL
128dB S PL
132dB S PL
Page 7 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
APPLICATIONS INFORMATION
CONNECTING TO AUDIO CODECS
The output of the INMP510 can be connected to a dedicated codec microphone input (see Figure 9) or to a high input impedance
gain stage (see Figure 10). A 0.1 µF ceramic capacitor placed close to the INMP510 supply pin is used for testing and is
recommended to adequately decouple the microphone from noise on the power supply. A DC blocking capacitor is required at the
output of the microphone. This capacitor creates a high-pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 2.2 μF is recommended in Figure 9 because the input impedance of codecs can be as low as 2 kΩ at their
highest PGA gain setting, which results in a high-pass filter corner frequency at 37 Hz. Figure 10 shows the INMP510 connected to an
op amp configured as a noninverting preamplifier.
Figure 9. INMP510 Connected to a Codec
Figure 10. INMP510 Connected to an Op Amp
GAIN = (R1 + R2)/R1
INMP510
GND
OUTPUT
1µF
MINIMUM
0.1µF
10kΩ
R1 R2
VDD
V
REF
V
OUT
V
REF
AMP
1.8-3.3 V
ADC
OR
CODEC
IN
M
P
510
G
N
D
O
U
T
P
U
T
INPUT
M
I
CB
I
A
S
2
.
2
µ
F
M
I
N
I
M
U
M
0
.
1
µ
F
VDD
Page 8 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG-325 Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTES (GENERAL)
AN-1003 Recommendations for Mounting and Connecting the Invensense, Bottom-Ported MEMS Microphones
AN-1068 Reflow Soldering of the MEMS Microphone
AN-1112 Microphone Specifications Explained
AN-1124 Recommendations for Sealing Invensense, Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140 Microphone Array Beamforming
AN-1165 Op Amps for MEMS Microphone Preamp Circuits
AN-1181 Using a MEMS Microphone in a 2-Wire Microphone Circuit
APPLICATION NOTES (PRODUCT SPECIFIC)
AN-0207 High-Performance Analog MEMS Microphone Simple Interface-to-SigmaDSP Audio Codec
AN-0262 Low-Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating
Page 9 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the INMP504 should be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 8. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 9. The diameter of the sound hole in the PCB should be larger than the diameter of the
sound port of the microphone. A minimum diameter of 0.5 mm is recommended.
Dimensions shown in millimeters
Figure 11. PCB Land Pattern Layout
Dimensions shown in millimeters
Figure 12. Suggested Solder Paste Stencil Pattern Layout
Ø1.55
Ø0.95
1.52
0.90
1.90
1.22
0.68
0.61
0.61
1.22
2×0.8 × 0.6
0.2 × 45
TYP 1.52mm
1.55/ 1.05 DI A.
0.225 CUT WIDT H ( 2× )
Page 10 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
• Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
• Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
• Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in
Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 11 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
OUTLINE DIMENSIONS
Figure 13. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV]
3.35 × 2.50 × 0.98 mm Body
Dimensions shown in millimeters
Figure 14. Package Marking Specification (Top View)
ORDERING GUIDE
PART
TEMP RANGE
PACKAGE
QUANTITY
INMP510ACEZ-0L1*
−40°C to +85°C
3-Terminal LGA_CAV
10,000
INMP510ACEZ-R71†
−40°C to +85°C
3-Terminal LGA_CAV
1,000
EV_INMP510-FX
—
Flexible Evaluation Board
—
* – 13” Tape and Reel
† – 7” Tape and reel is discontinued. Contact sales@invensense.com for availability.
1Z = RoHS Compliant Part
REVISION HISTORY
REVISION DATE REVISION DESCRIPTION
02/06/14 1.0 Initial Release
2.575
2.500
2.425
3.425
3.350
3.275
TOP VIEW
SIDE VIEW
REFERENCE
CORNER
1.08
0.98
0.88
2.21
REF
3.06 REF
BOTTOM VIEW
1.08
0.95 DIA.
0.25 NOM
0.20 MIN DIA.
THRU HOLE
(SOUND PORT)
1.22 BSC 1.25
0.54
REF
0.64 REF
1.55 DIA.
1.52
BSC
1.07
REF
0.75 REF
2
1
3
0.90 × 0.68
(PINS 1, 3)
0.20 TYP
×45°
0.30 BSC
PIN 1
510
YYXXX
PIN 1 INDIC
A
TION
L
O
T TR
A
C
E
ABILITY
D
A
TE
C
ODE
P
A
R
T NUMBER
Page 12 of 13
Document Number: DS-INMP510-00
Revision: 1.0.
INMP510
Compliance Declaration Disclaimer:
InvenSense believes this compliance information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2014 InvenSense, Inc. All rights reserved.
Page 13 of 13
Document Number: DS-INMP510-00
Revision: 1.0.