B220/A - B260/A 2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER SPICE MODELS: B220 B230 B240 B250 B260 B220A B230A B240A B250A B260A Features * * * * * * * * Schottky Barrier Chip Guard Ring Die Construction for Transient Protection Ideally Suited for Automatic Assembly Low Power Loss, High Efficiency Surge Overload Rating to 50A Peak For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application High Temperature Soldering: 260C/10 Second at Terminal Plastic Material - UL Flammability Classification 94V-0 SMA B A Dim Min Max Min Max A 2.29 2.92 3.30 3.94 B 4.00 4.60 4.06 4.57 C 1.27 1.63 1.96 2.21 D 0.15 0.31 0.15 0.31 C D J E 4.80 5.59 5.00 5.59 G 0.10 0.20 0.10 0.20 H 0.76 1.52 0.76 1.52 2.01 2.62 2.00 2.62 J G E H SMB All Dimensions in mm Mechanical Data * * * * * * No Suffix Designates SMB Package "A" Suffix Designates SMA Package Case: Molded Plastic Terminals: Solder Plated Terminal - Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch Approx. Weight: SMA 0.064 grams SMB 0.093 grams Mounting Position: Any Marking: Type Number Maximum Ratings and Electrical Characteristics @ TA = 25C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current @ TT = 100C Symbol B220/A B230/A B240/A B250/A B260/A Unit VRRM VRWM VR 20 30 40 50 60 V VR(RMS) 14 21 28 35 42 V IO 2.0 A Non-Repetitive Peak Forward Surge Current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 50 A Forward Voltage VFM Peak Reverse Current at Rated DC Blocking Voltage @ IF = 2.0A @ TA = 25C @ TA = 100C Typical Junction Capacitance (Note 2) Typical Thermal Resistance, Junction to Terminal Typical Thermal Resistance, Junction to Ambient (Note 1) Operating and Storage Temperature Range Notes: 0.50 0.70 V IRM 0.5 20 Cj 200 pF RqJT 20 K/W RqJA 25 K/W Tj, TSTG -65 to +150 C mA 1. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink. 2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC. DS13004 Rev. E-2 1 of 2 www.diodes.com B220/A-B260/A a Diodes Incorporated IF, INSTANTANEOUS FORWARD CURRENT (A) IO, AVERAGE FORWARD CURRENT (A) 2.5 2.0 1.5 1.0 0.5 0 25 50 75 100 125 150 10 B220 thru B240 B250 thru B260 1.0 0.1 TJ - 25C IF Pulse Width = 300 ms 0.01 0 0.2 0.4 0.6 0.8 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics TT, TERMINAL TEMPERATURE (C) Fig. 1 Forward Current Derating Curve 1000 50 Tj = 25C f = 1MHz Cj, JUNCTION CAPACITANCE (pF) Single Half-Sine-Wave (JEDEC Method) IFSM, PEAK FWD SURGE CURRENT (A) 1.0 40 30 20 10 100 10 0 1 10 0.1 100 10 100 VR, REVERSE VOLTAGE (V) Fig. 4 Typical Junction Capacitance NUMBER OF CYCLES AT 60 Hz Fig. 3 Max Non-Repetitive Peak Fwd Surge Current IR, INSTANTANEOUS REVERSE CURRENT (mA) 1 100 10 Tj = 100C 1.0 Tj = 75C 0.1 0.01 Tj = 25C 0.001 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 5 Typical Reverse Characteristics DS13004 Rev. E-2 2 of 2 www.diodes.com B220/A-B260/A