This document is a general product descript ion and is subject to change without notice. Hynix does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev 0.2 / Jan. 2008 1
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
2Gb NAND FLASH
HY27UF(08/16)2G2B
Rev 0.2 / Jan. 2008 2
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Document Title
2Gbit (256Mx8bit) NAND Flash Memory
Revision History
Revision No. History Draft Date Remark
0.0 Initial Draft. Jul. 03. 2007 Preliminary
0.1
1) Add ULGA Package.
- Figures & texts are added.
2) Change tRCBSY to tRBSY
3) Change figure 13
Sep. 11. 2007 Preliminary
0.2 1) Delete Preliminary Jan. 09. 2008
Rev 0.2 / Jan. 2008 3
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
FEATURES SUMMARY
HIGH DENSITY NAND FLASH MEMORIES
- Cost effective solutions for mass storage applications
MULTIPLANE ARCHITECTURE
- Array is split into two independent planes. Parallel
Operations on both planes are available, halving
Program and erase time.
NAND INTERFACE
- x8/x16 bus width.
- Address/ Data Multiplexing
- Pinout compatiblity for all densities
SUPPLY VOLTAGE
- 3.3V device : Vcc = 2.7 V ~3.6 V
MEMORY CELL ARRAY
- x8 : (2K + 64) bytes x 64 pages x 2048 blocks
- x16 : (1K + 32) words x 64 pages x 2048 blocks
PAGE SIZE
- (2K + 64 spare) Bytes
- (1K + 32 spare) Words
BLOCK SIZE
- (128K + 4Kspare) Bytes
- (64K + 2Kspare) Words
PAGE READ / PROGRAM
- Random access : 25us (max.)
- Sequential access : 25ns (min.)
- Page program time : 200us (typ.)
- Multi-page program time (2 pages) : 200us (typ.)
COPY BACK PROGRAM
- Automatic block download without latency time
FAST BLOCK ERASE
- Block erase time: 1.5ms (typ.)
- Multi-block erase time (2 blocks) : 1.5ms (typ.)
CACHE READ
- Internal (2048 + 64) Byte buffer to improve the read
throughtput.
STATUS REGISTER
- Normal Status Register (Read/Program/Erase)
- Extended Status Register (EDC)
ELECTRONIC SIGNATURE
- 1st cycle : Manufacturer Code
- 2nd cycle : Device Code
- 3rd cycle : Internal chip number, Cell Type, Number of
Simultaneously Programmed Pages.
- 4th cycle : Page size, Block size, Organization, Spare
size
- 5th cycle : Multiplane information
CHIP ENABLE DON’T CARE
- Simple interface with microcontroller
HARDWARE DATA PROTECTION
- Program/Erase locked during Power transitions.
DATA RETENTION
- 100,000 Program/Erase cycles (with 1bit/528byte ECC)
- 10 years Data Retention
PACKAGE
- HY27UF(08/16)2G2B-T(P)
: 48-Pin TSOP1 (12 x 20 x 1.2 mm)
- HY27UF(08/16)2G2B-T (Lead)
- HY27UF(08/16)2G2B-TP (Lead Free)
- HY27UF082G2B-F(P)
: 63-Ball FBGA (9 x 11 x 1.0 mm)
- HY27UF082G2B-F (Lead)
- HY27UF082G2B-FP (Lead Free)
- HY27UF082G2B-UP
: 52-ULGA (12 x 17 x 0.65 mm)
- HY27UF082G2B-UP (Lead Free)
Rev 0.2 / Jan. 2008 4
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
1.SUMMARY DESCRIPTION
Hynix NAND HY27UF(08/16)2G2B Series have 256Mx8bit with spare 8Mx8 bit capacity. The device is offered in 3.3V Vcc
Power Supply, and with x8 and x16 I/O interf a ce Its NAND cell pro vides the most cost -eff ectiv e solution f or the solid state
mass storage market. The memory is divided into blocks that can be erased independently so it is possible to preserve
valid data while old data is erased.
The device contains 2048 blocks, composed by 64 pages. A prog ram operation allows to write the 2112-byte page in typi-
cal 200us and an erase operation can be performed in typical 1.5ms on a 128K-byte block.
Data in the page can be read out at 25ns cycle time per byte(x8). The I/O pins serve as the ports for address and data
input/output as well as command input.
This interface allows a reduced pin count and easy migration towards different densities, without any rearrangement of
footprint. Commands, Data and Addresses are synchronously introduced using CE, WE, RE, ALE and CLE input pin. The
on-chip Program/Erase Controller automates all read, program and erase functions including pulse repetition, where
required, and internal verification and margining of data. The modify operations can be locked using the WP input. The
output pin R/B (open drain buffer) signals the status of the device during each operation. In a system with multiple mem-
ories the R/B pins can be connected all together to provide a global status signal.
The copy back function allows the optimization of defective blocks management. When a page program operation fails
the data can be directly programmed in another page inside the same array section without the time consuming serial
data insertion phase. Co py back operation automatically executes embedded error detection operation: 1 bit error
every 528byte (x8) or 1bit error out of every 264 -word (x1 6) can be detecte d. Due to this fe ature, it is no more n or neces-
sary nor recommended to use external 2-bit ECC to detect copy back oper ation err ors. Data rea d out after copy back read
(both for single and multiplane cases) is allowed.
Even the write-intensive systems can take advantage of the HY27UF(08/16)2G2B Series extended reliability of 100K pro-
gram/e r ase cy cles b y supp orting ECC (Err or Corr ecting Code ) with real time mapping-out algorithm. T he chip supports CE
don’t care function. This function allows the direct download of the code from the NAND Flash memory device by a micro-
controller, since the CE transitions do not stop the read operation.
This device includes also extra features like OTP/Unique ID area, Read ID2 extension.
The HY27UF(08/16)2G2B Series are available in 48-TSOP1 12 x 20 mm, 63-FBGA 9 x 11mm, 52-ULGA 12 x 17 mm.
1.1 Product List
PART NUMBER ORGANIZATION Vcc RANGE PACKAGE
HY27UF082G2B x8 2.7V ~ 3.6V 48-TSOP1, 63-FBGA, 52-ULGA
HY27UF162G2B x16 48-TSOP1
Rev 0.2 / Jan. 2008 5
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure1: Logic Diagram
9&&
966
:3
&/(
$/(
5(
:(
&( ,2a,2
,2a,2[2QO\
5%
IO15 - IO8 Data Input / Outputs (x16 only)
IO7 - IO0 Data Input / Outputs
CLE Command latch enable
ALE Address latch enable
CE Chip Enable
RE Read Enable
WE Write Enable
WP Write Protect
R/B Ready / B usy
Vcc Power Supply
Vss Ground
NC No Connection
Table 1: Signal Names
Rev 0.2 / Jan. 2008 6
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
1&
1&
1&
1&
1&
1&
5%
5(
&(
1&
1&
9FF
9VV
1&
1&
&/(
$/(
:(
:3
1&
1&
1&
1&
1&
9VV
,2
,2
,2
,2
,2
,2
,2
,2
1&
1&
9FF
1&
1&
1&
,2
,2
,2
,2
,2
,2
,2
,2
9VV
1$1')ODVK
7623
[
1&
1&
1&
1&
1&
1&
5%
5(
&(
1&
1&
9FF
9VV
1&
1&
&/(
$/(
:(
:3
1&
1&
1&
1&
1&
1&
1&
1&
1&
,2
,2
,2
,2
1&
1&
1&
9FF
9VV
1&
1&
1&
,2
,2
,2
,2
1&
1&
1&
1&
1$1')ODVK
7623
[
Figure 2: 48TSOP1 Contact, x8 and x16 Device
1&
1&
1& 1&1&
1& 1&
1&
&/(
$/( 9VV
9VV
9VV
9FF
9FF
1&
1&
1&
:3
5(
&( :( 5%
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
,2
,2
,2 ,2 ,2
,2
,2
,2
1& 1&
1&
1& 1& 1&
1&
35(
1&
1&
1&
1&1&
1& 1&
$
%
&
'
(
)
*
+
-
.
/
0
Figure 3: 63FBGA Contactions, x8 Device (Top view through package)
Rev 0.2 / Jan. 2008 7
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
:(
:3 966
,2
,2
,2 ,2
,2
,2
,2
966
,2
5%
1&
1& 1&
1&
1&
1&
1& 1&
1&
966
966
9&&
9&&
1& &/(
$/(
&(
5(
1&
1& 1&
1&
1&
1&
1&
1&
1&
$
%
&
'
(
)
*
+
-
.
/
0
1
Figure 4. 52-ULGA Contactions, x8 Device (Top view through package)
Rev 0.2 / Jan. 2008 8
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
1.2 PIN DESCRIPTION
Pin Name Description
IO0-IO7
IO8-IO15(1)
DATA INPUTS/OUTPUTS
The IO pins allow to input command, address and data and to output data during read / program
operations. The inputs are latched on the rising edge of Write Enable (WE). The I/O buffer float to
High-Z when the device is deselected or the outputs are disabled.
CLE COMMAND LATCH ENABLE
This input activates the latching of the IO inputs inside the Command Register on the Rising edge of
Write Enable (WE).
ALE ADDRESS LATCH ENABLE
This input activates the latching of the IO inputs inside the Address Register on the Rising edge of
Write Enable (WE).
CE CHIP ENABLE
This input controls the selection of the device.
WE WRITE ENABLE
This input acts as clock to latch Command, Address and Data. The IO inputs are latched on the rise
edge of WE.
RE
READ ENABLE
The RE input is the serial data-out control, and when active drives the data onto the I/O bus. Data is
valid tREA after the falling edge of RE which also increments the internal column address counter by
one.
WP WRITE PROTECT
The WP pin, when Low, provides an Hardware protection against undesired modify (program / erase)
operations.
R/B READY BUSY
The Ready/Busy output is an Open Drain pin that signals the state of the memory.
Vcc SUPPLY VOLTAGE
The Vcc supplies the power for all the op erations (Read, Write, Erase).
Vss GROUND
NC NO CONNECTION
Table 2: Pin Description
NOTE:
1. For x16 version only
2. A 0.1uF capacitor should be connected between the Vcc Supply Voltage pin and the Vss Ground pin to decouple
the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required
during program and erase operations.
3. An internal voltage detector disa bles all functions whenev er VCC is below 1.8V (3.3V version) to protect the device
from any involuntary program/erase during power transitions.
Rev 0.2 / Jan. 2008 9
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7
1st Cycle A0 A1 A2 A3 A4 A5 A6 A7
2nd Cycle A8 A9 A10 A11 L(1) L(1) L(1) L(1)
3rd Cycle A12 A13 A14 A15 A16 A17 A18 A19
4th Cycle A20 A21 A22 A23 A24 A25 A26 A27
5th Cycle A28 L(1) L(1) L(1) L(1) L(1) L(1) L(1)
Table 3: Address Cycle Map(x8)
NOTE:
1. L must be set to Low.
FUNCTION 1st CYCLE 2nd CYCLE 3rd CYCLE 4th CYCLE Acceptable command
during busy
READ1 00h 30h - -
READ FOR COPY-BACK 00h 35h - -
READ ID 90h - - -
RESET FFh - - - Yes
PAGE PROGRAM 80h 10h - -
COPY BACK PGM 85h 10h - -
MULTI PLANE PROGRAM 80h 11h 81h 10h
MULTI PLANE COPYBACK
PROGRAM 85h 11h 81h 10h
BLOCK ERASE 60h D0h - -
MULTI PLANE
BLOCK ERASE 60h 60h D0h -
READ STATUS REGISTER 70h - - - Yes
RANDOM DATA INPUT 85h - - -
RANDOM DATA OUTPUT 05h E0h - -
READ CACHE (RANDOM) 00h 31h - -
READ CACHE (SEQUENTIAL) 31h - - -
READ CACHE END 3Fh - - -
READ EDC STATUS REGISTER 7Bh - - -
Table 5: Command Set
Note:
1. READ EDC STATUS REGISTER is only available on Copy Back operation.
IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 I/O8-
IO15
1st Cycle A0 A1 A2 A3 A4 A5 A6 A7 L(1)
2nd Cycle A8 A9 A10 L(1) L(1) L(1) L(1) L(1) L(1)
3rd Cycle A11 A12 A13 A14 A15 A16 A17 A18 L(1)
4th Cycle A19 A20 A21 A22 A23 A24 A25 A26 L(1)
5th Cycle A27 L(1) L(1) L(1) L(1) L(1) L(1) L(1) L(1)
Table 4: Address Cycle Map(x16)
NOTE:
1. L must be set to Low.
Rev 0.2 / Jan. 2008 10
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
CLE ALE CE WE RE WP MODE
H L L Rising H X Read M od e Command Input
L H L Rising H X Address Input(5 cycles)
H L L Rising H H Wri te Mode Command Input
L H L Rising H H Address Input(5 cycles)
LLLRisingHHData Input
LL
L(1) H Falling X Sequential Read and Data Output
L L L H H X During Read (Busy)
XXXXXHDuring Program (Busy)
XXXXXHDuring Erase (Busy)
XXXXXLWrite Protect
XXHXX0V/VccStand By
Table 6: Mode Selection
NOTE:
1. With the CE high during latency time does not stop the read operation
Rev 0.2 / Jan. 2008 11
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
2. BUS OPERATION
There are six standard bus operations that control the device. These are Command Input, Address Input, Data Input,
Data Output, Write Protect, and Standby.
Typically glitches less than 3ns on Chip Enable, Write Enable and Read Enable are ignored by the memory and do not
affect bus operations.
2.1 Command Input
Command Input bus operation is used to give a command to the memory device. Command are accepted with Chip
Enable low, Command Latch Enable High, Address Latch Enable low and Read Enable High and latched on the rising
edge of Write Enable. Moreover for commands that starts a modify operation (write/erase) the Write Protect pin must be
high. See Figure 6 and Table 13 for details of the timings requirements. Command codes are always applied on IO7:0
regardless of the bus configuration. (x8 or x16)
2.2 Address Input
Address Input bus operation allows the insertion of the memory address. Five cycles are required to input the addresses
for the 4Gbit devices. Addresses are accepted with Chip Enable low, Address Latch Enable High, Command Latch Enable
low and Read Enable High and latched on the rising edge of Write Enable. Moreover for commands that starts a modify-
ing operation (write/erase) the Write Protect pin must be high. See Figure 7 and Table 13 for details of the timings
requirements. Addresses are always applied on IO7:0 regardless of the bus configuration (x8 or x16).
2.3 Data Input
Data Input bus operation allows to feed to the device the data to be programmed. The data insertion is serial and timed
by the Write Enable cycles. Data are accepted only with Chip Enable low, Address Latch Enable low, Command Latch
Enable low, Read Enable High, and Write Protect High and latched on the rising edge of Write Enable. See Figure 8 and
Table 13 fo r details of the timings requirements.
2.4 Data Output
Data Output bus oper ation a llows to r ead data fr om the memory array and to check the status register content, the EDC
register content and the ID data. Data can be serially shifted out by toggling the Read Enable pin with Chip Enable low,
Write Enable High, Address Latch Enable low, and Command Latch Enable low. See Figure 9,10,12,13,14 and Table 13
for details of the timings requirements.
2.5 Write Protect
Hardware Write Protection is activated when the W r ite Protect pin is low. In this condition modifying operation does not
start and the content of the memory is not alter ed. W rite Pr otect pin is not latched by Write Enable to ensure the protec-
tion even during the power up.
2.6 Standby
In Standby mode the device is deselected, outputs are disabled and Power Consumption is reduced.
Rev 0.2 / Jan. 2008 12
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3. DEVICE OPERATION
3.1 Page Read
This operation is operated by writing 00h and 30h to the command register along with five address cycles.
Two types of operations are available: random read, serial page read. The random read mode is enabled when the
page address is ch anged. The 2112 bytes (x8) or 1056 words (x16) of data within the se lected page ar e tran sferred to
the data registers in le ss tha n 25us(tR). The sys tem contr oller m a y de tect the completion of this data transfer (tR) by
analyzing the output of R/B pin. Once the data in a page is loaded into the data registers, they may be read out in
25ns cycle time by sequentially pulsing RE. The repetitive high to low transitions of the RE cl ock make the device out-
put the data starting from the selected column address up to the last column address.
The device may output random data in a page instead of the sequential data by writing random data output command.
The column address of next data, which is going to be out, may be cha nged to the address which follows r andom data
output command. Random data output can be operated multiple times regardless of how many times it is done in a
page.
3.2 Page Program
The device is programmed by page. The number of consecutive partial page programming operation within the same
page without an intervening erase operation must not exceed 8 times. The addressing should be done on each pages
in a block. A page program cycle consists of a serial data loading period in which up to 2112bytes of data may be
loaded into the data register, followed by a non-volatile programming period where the loaded data is programmed
into the appropriate cell. The serial data loading period begins by inputting the Serial Data Input command (80h), fol-
lowed by the five cy cle address inputs a nd then serial data. The bytes other than those to be progr ammed do not need
to be loaded. The device supports random data input in a page.
The column address of next data, which will be entered, may be changed to the address which follows random data
input command (85h). Random data input may be operated multiple times regardless of how many ti mes it is done in
a page. The P a ge Program confirm command (10h) initiates the programming process. W riting 10h al one w ithou t pre-
viously entering the serial data will not initiate the programming process. The internal write state controller automati-
cally executes the algorithms and timings necessary for program and verify, thereby freeing the system controller for
other tasks. Once the program process starts, the Read Status Register command may be entered to read the status
register. The system controller can detect the completion of a progr am cycle by monitoring the R/B output, or the Sta-
tus bit (I/O 6) of the Status R egister. Only the Read Status command and R eset command are valid while p rogr amming
is in progress. When the Page Program is complete, the Write Status Bit (I/O 0) may be checked. The internal write
verify detects only errors for "1"s that are not successfully programmed to "0"s.
The command register remains in Read Status command mode until another va lid command is written to the com-
mand register. Figure 16 details the sequence.
Rev 0.2 / Jan. 2008 13
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3.3 Multi Plane Program
Device supports multiple plane program: it is possible to program in parallel 2 pages, one per each plane.
A multiple plane progr am cycle consists of a double ser ial data loading period in which up to 4 224bytes of data may b e
loaded into the data register, followed by a non-volatile programming period where the loaded data is programmed
into the appropriate cell. The serial data loading period begins by inputting the Serial Data Input command (80h), fol-
lowed by the five cycle address inputs and then serial data for the 1st page. Address for this page must be within 1s t
plane (A<18>=0). The data of 1st page other than those to be programmed do not need to be loaded. The device
supports random data input exactly like page program operation. The Dummy Page Program Confirm command (11 h)
stops 1st page data input and the device becomes busy for a short time (tDBSY). Once it has b ecome ready ag ain, 81h
command must be issued, followed by 2nd page address (5 cycles) and its serial data input. Address for this page
must be within 2nd plane (A<18>=1). The data of 2nd page other than those to be programmed do not need to be
loaded. Program Confirm command (10h) makes parallel programming of both pages start. User can check operation
status by R/B pin or read status register command, as if it were a normal page program; status register command is
also available during Dummy Busy time (tDBSY). In case of fail in 1st or 2nd page program, fail bit of status register
will be set: Device supports pass/fail status of each plane. Figure 21 details the sequence.
3.4 Block Erase
The Erase operation is done on a block basis. Block address loading is accomplished in there cycles initiated by an
Erase Setup command (60h). Only address A18 to A28 is valid while A12 to A17 is ignored (x8). The Erase Confirm
command (D0h) following the block address loading initiates the internal erasing process. This two step sequence of
setup followed by execution command ensures that memory contents are not accidentally erased due to external noise
conditions. A t the rising edge of WE af ter the erase confirm command input, the internal write controller handles er ase
and erase verify.
Once the erase process starts, the Read Status Register command may be entered to read the status register.
The system controller can detect the completion of an erase by monitoring the R/B output, or the Status bit (I/O 6) of
the Status Register. Only the Read Status command and Reset command are valid while erasing is in progress. When
the erase operation is completed, the Write Status Bit (I/O 0) may be checked.
Figure 20 details the sequence.
3.5 Multi Plane Erase
Multiple plane erase, allows parallel erase of two blocks, one per each memory plane.
Block erase setup command (6 0h) must be repeated two times , each time followed b y 1st block and 2nd block address
respectively (3 cycles each). As for block erase, D0h command makes embedded operation start. Multiplane erase
does not need any Dummy Busy Time between 1st and 2nd block address insertion. Address limitation required for
multiple plane program applie s also to mu ltiple plane erase, as well as operation progress can be check ed lik e f or mul-
tiple plane program. Figure 22 details the sequence
Rev 0.2 / Jan. 2008 14
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3.6 Copy-back Program
Copy-Back program with Read for Copy-Back is configured to quickly and efficiently rewrite data stored in one page
without data reloading when the bit error is not in data stored. Since the time-consuming re-loading cycles are
removed, the system performance is improv ed. The benef it is especially obvious when a portion of a block is updated
and the rest of the block also needs to be copied to the newly assigned free block. Copy-Back operation is a sequen-
tial execution of Read for Copy-Back and of copy-back program with the destination page address. A read operation
with "35h" command and the address of the source page moves the whole 2112byte data into the internal data buffer.
A bit error is checked by sequential reading the data output. In the case where there is no bit error, the data do not
need to be reloaded. Therefore Copy-Back program operation is init iat ed by issuing P a ge- C op y Dat a-Input command
(85h) with destination page addr ess. Actual programming operation begins af ter Program Confirm command (10h) is
issued. Once the progr am process sta rts, the R ead Status Re gister command (70h) may be enter ed to read the status
register. The system controller can detect the completion of a program cycle by monitoring the R/B output, or the Sta-
tus bit(I/O 6) of the Status Register.
When the Copy-Back Program is complete, the Write Status Bit(I/O 0) may be checked(Figure 18 & Figure 18). The
command register remains in Read Status command mode until another valid command is written to the command
register. During copy-back progr am, da ta modification is possible using random data input command (85h) as s hown
in Figure19.
Copy-back program operation is allowed only within same plane.
3.7 Multi-Plane Copy-Back Program
The copy-back program is configured to quickly and efficiently rewrite data stored in one page without utilizing an
external memory. Since the time-consuming cycles of serial access and re-loading cycles are removed, the system
performance is greatly improv ed. The benefit is especially obviou s when a p ortion of a block needs to be updated and
the rest of the block also need to be copied to the newly assigned free block.
The operation for performing a copy-back program is a sequential execution of page-read without serial access and
copying-program with the address of destination page. A read operation with "35h" command and the address of the
source page moves the whole 2112byte data into the internal data buffer. As soon as the device returns to Ready
state, optional data read-out is allowed by toggling RE (See Figure 23), or Copy Back command (85h) with the
address cycles of destination pa ge may be written. The Pr ogram Confirm command (10h) is required to actually begin
the programming operation. Data input cy cle for modifying a portion or multiple distant portions of the source page is
allowed as shown in Figure 23.
Most NAND devices require 2 bit external ECC only due to copy back operation while 1 bit ECC can be enough for all
other operation. Reason is that during read for copy back + copy back program sequence a bit error due to charge
loss is not checked by external error detection/correction scheme. On the contrary, 2Gbit NAND includes automatic
Error Detection Code during copy back operation: thanks to this, 2 bit external ECC is no more required, with signifi-
cant advantage for customers that can always use single bit ECC. More details on EDC operation are available in sec-
tion 3.8.
Rev 0.2 / Jan. 2008 15
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3.8 EDC Operation
Error Detection Code check automatically starts immediately after device becomes busy for a copy back program oper-
ation (both single and multiple plane). In the x8 version EDC allows detection of 1 single bit error every 528 by tes,
where each 528byte group is composed by 512 bytes of main array and 16 bytes of spare area (see Table 20,21).
So described 528b yte area is called “EDC unit”. In the x16 version EDC allows detection of 1 single bit error every 264
words, where each 264 word group is composed by 256 words of main array and 8 words of spare area (see Table
20,21). So described 264 word area is called “ EDC unit”.
To Properly use EDC, some limitations apply:
- Random data input can be used only once in copy back program or page program or multiple page program, unless
user inputs data for a whole EDC unit (or more whole EDC units).
- Any page program operation must be done on whole page basis, or on whole EDC unit (s).
EDC result can be checked only during copy back progr am thr ough 7Bh (specific Read EDC register command, Table 22)
3.9 Read Status Register
The device contains a Status Register which may be read to find out whether, program or er ase operation is completed,
and whether the program or erase operation is completed successfully. After writing 70h command to the command
register, a read cycle outputs the content of the Status Register to the I/O pins on the falling edge of CE or RE, whi ch-
ever occurs last. This two line control allows the system to poll the progr ess of each device in multiple memory connec-
tions even when R/B pins are common-wired. RE or CE does not need to be toggled for updated status. Refer to table
14 for specific Status Register definitions. The command register remains in Status Read mode until further commands
are issued to it. Theref ore, if the status regis ter is read during a random data output, the read command (00 h) should
be given before starting read cycles.
3.10 Read EDC Status Register
The operation is a v ailable only in cop y back pr ogr am and it al lows the detection of errors occurred during read for copy
back. In case of multiple plane copy back, it is not possible to know which of the two read operation caused the error.
After writing 7Bh command to the command register, a read cycle outputs the content of the EDC Register to the I/O
pins on the falling edge of CE or RE, whichever occurs last.
Operation is same read status register command. Refer to below Table 22 for specific EDC Register definitions.
3.11 Read ID.
The device contains a produ ct identification mode, initiated by writing 90h to the command register, followed by an
address input of 00h. Five read cycles sequentially output the manufacturer code (ADh), and the device code and 3rd,
4th, 5th cycle ID, respectively. The command register remains in Read ID mode until further commands are issued to
it. Figure 24 shows the operation sequence, while tables 15 explain the byte meaning.
3.12 Reset
The device offers a reset feature, executed by writing FFh to the command register. When the device is in Busy state
during random read, program or erase mode, the reset operation will abort these operations. The contents of memory
cells being altered are no longer valid, as the data will be partially programmed or erased. The command register is
cleared to wait for the next command, and the Status Register is cleared to value C0h when WP is high. Refer to table
14 for device status after reset operation. If the device is already in reset state a new reset command will not be
accepted by the command register. The R/B pin goes low for tRST after the Reset command is written. Refer to Figure
27.
Rev 0.2 / Jan. 2008 16
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3.13 Cache Read
Cache read operation allows automatic download of consecutive pages. Immediately after 1st latency end, while user
can start reading out data, device internally starts reading following page.
Start address of 1st page is at page start (A<10:0>=00h), after 1st latency time (tr) , automatic data download will
be uninterrupted. In f act latency time is 2 5us, while download of a page require a t least 100us fo r x8 device. (50us for
x16device).
The Cache Read f unction may be issued after the R ead fu nction is complete (SR[6] is set to one). The host may enter
the address of the next page to be read from the Flash array. Data output always begins at column address 00h. If
the host does not enter an address to retrieve, the next sequential page is read. When the Cache Read function is
issued, SR[6] is cleared to zero (busy). After the operation is begun SR[6] is set to one (ready) and the host may
begin to read the data from the previous Read or Cache Read function. Issuing an additional Cache Read function
copies the data most recently read from the array into the page register. When no more pages are to be read, the
final page is copied into the page register by issuing the 3Fh command. The host may begin to read data from the
page register when SR[6]is set to one (ready). When the 31h and 3Fh commands are issued, SR[6] shall be cleared
to zero (busy) until the page has finished being copied from the Flash array.
The host shall not issue a sequential Read Cache (31h) command after the last page of the device is read.
Refer to Figure 15.
Cache Read operation must be done only block by block if system needs to avoid reading also reading from invalid
blocks.
Rev 0.2 / Jan. 2008 17
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
4. OTHER FEATURES
4.1 Data Protection & Power On/Off Sequence
The device is designed to offer protection from any involuntary program/erase during power-transitions. An internal
voltage detector disables all functions whene v er Vcc is below about 2.0V(3.3V device). WP pin pro vides ha rd ware pro-
tection and is recommended to be kept at VIL during powe r-up an d power- down. A recove ry time of minimum 10us is
required before internal circuit gets ready for any command sequences as shown in Figure 28. The two-step command
sequence for program/erase provides additional software protection.
4.2 Ready/Busy.
The device has a Ready/Busy output that provides method of indicating the completion of a page program, erase,
copy-back and random read completion. The R/B pin is normally high and goes to low when the device is busy (after a
reset, read, program, erase operation). It returns to high when the internal controller has finished the operation. The
pin is an open-drain driver thereby allowing two or more R/B outputs to be Or-tied.
Because pull-up resistor v alue is related to tR(R/B ) and current dr ain during busy (Ibusy ), an appropriate v alue can be
obtained with the following reference chart (Fig 28). Its value can be determined by the following guidance.
Rev 0.2 / Jan. 2008 18
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Table 7 : Valid Blocks Numbers
NOTE:
1. The 1st block is guaranteed to be a valid block at the time of shipment.
Parameter Symbol Min Typ Max Unit
Valid Block
Number NVB 2008 - 2048 Blocks
Symbol Parameter Value Unit
TAAmbient Operating Temperature (Commercial Temperature Range) 0 to 70 ℃
Ambient Operating Temperature (Industrial Temperature Range) -40 to 85 ℃
TBIAS Temperature Under Bias -50 to 125 ℃
TSTG Storage Temperature -65 to 150 V
VIO(2) Input or Output Voltage -0.6 to 4.6 V
Vcc Supply Voltage -0.6 to 4.6 V
Table 8: Absolute maximum ratings
NOTE:
1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute
Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and operation of
the device at these or any other conditions above those indicated in the Operating sections of this spec ificat ion is
not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Refe r also to the Hynix SURE Program and other relevant quality documents.
2. Minimum Voltage may undershoot to -2V during transition and for less than 20ns during transitions.
Rev 0.2 / Jan. 2008 19
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure 5: Block Diagram
$''5(66
5(*,67(5
&2817(5
352*5$0
(5$6(
&21752//(5
+9*(1(5$7,21
&200$1'
,17(5)$&(
/2*,&
&200$1'
5(*,67(5
'$7$
5(*,67(5
,2
5(
%8))(56
<'(&2'(5
3$*(%8))(5
;
'
(
&
2
'
(
5
0ELW0ELW
1$1')ODVK
0(025<$55$<
:3
&(
:(
&/(
$/(
$a$
Rev 0.2 / Jan. 2008 20
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Parameter Symbol Test Conditions 3.3Volt Unit
Min Typ Max
Operating
Current
Sequential
Read ICC1 tRC=25ns
CE=VIL, IOUT=0mA -1530mA
Program ICC2 - - 15 30 mA
Erase ICC3 - - 15 30 mA
Stand-by Current (TTL) ICC4 CE=VIH,
WP=0V/Vcc -1mA
Stand-by Current (CMOS) ICC5 CE=Vcc-0.2,
WP=0V/Vcc -1050uA
Input Leakage Current ILI VIN=0 to Vcc (max) - - ±10 uA
Output Leakage Current ILO VOUT =0 to Vcc (max) - - ±10 uA
Input High Voltage VIH - 0.8xVcc - Vcc+0.3 V
Input Low Voltage VIL - -0.3 - 0.2xVcc V
Output High Voltage Level VOH IOH=-400uA 2.4 - - V
Output Low Voltage Level VOL IOL=2.1mA - - 0.4 V
Output Low Current (R/B)IOL
(R/B)VOL=0.4V 8 10 - mA
Table 9: DC and Operating Characteristics
Parameter Value
3.3Volt
Input Pulse Levels 0V to VCC
Input Ri se and Fall Times 5ns
Input and Output Timing Levels VCC/2
Output Load (2.7V - 3.6V) 1 TTL GATE and CL=50pF
Table 10: AC Conditions
Rev 0.2 / Jan. 2008 21
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Item Symbol Test Condition Min Max Unit
Input / Output Capacitance CI/O VIL=0V - 10 pF
Input Capacitance CIN VIN=0V - 10 pF
Table 11: Pin Capacitance (TA=25C, F=1.0MHz)
Parameter Symbol Min Typ Max Unit
Program Time / Multi-Plane Program Time tPROG - 200 700 us
Dummy Busy Time for Two Plane Program tDBSY -0.51 us
Number of partial Program Cycles in the same page NOP - - 8 Cycles
Block Erase Time / Multi-Plane Block Erase Time tBERS -1.52 ms
Read Cache Busy Time tRBSY -3tRus
Table 12: Program / Erase Characteristics
Rev 0.2 / Jan. 2008 22
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Parameter Symbol 3.3V Unit
Min Max
CLE Setup time tCLS 12 ns
CLE Hold time tCLH 5ns
CE setup time tCS 20 ns
CE hold time tCH 5ns
WE pulse width tWP 12 ns
ALE setup time tALS 12 ns
ALE hold time tALH 5ns
Data setup time tDS 12 ns
Data hold time tDH 5ns
Write Cycle time tWC 25 ns
WE High hold time tWH 10 ns
Data Transfer from Cell to register tR25 us
ALE to RE Delay tAR 10 ns
CLE to RE Delay tCLR 10 ns
Ready to RE Low tRR 20 ns
RE Pulse Width tRP 12 ns
WE High to Busy tWB 100 ns
Read Cycle Time tRC 25 ns
RE Access Time tREA 20 ns
RE High to Output High Z tRHZ 100 ns
CE High to Output Hig h Z tCHZ 50 ns
CE High to Output hold tCOH 15 ns
RE High to Output Hold tRHOH 15 ns
RE Low to Output Hold tRLOH 5ns
RE High Hold Time tREH 10 ns
Output High Z to RE low tIR 0ns
CE Low to RE Lo w tCR 10 ns
Address to data loading time tADL 70 ns
WE High to RE low tWHR 60 ns
RE High to WE low tRHW 100 ns
Device Resetting Time (Read / Program / Erase) tRST 5/10/500(1) us
Write Protection time tWW(2) 100 ns
Table 13: AC Timing Characteristics
NOTE:
1. If Reset Command (FFh) is written at Ready state, the device goes into Busy for maximum 5us
2. Program / Erase Enable Operation : WP high to WE High.
Program / Erase Disable Operation : WP Low to WE High.
Rev 0.2 / Jan. 2008 23
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
DEVICE IDENTIFIER CYCLE DESCRIPTION
1st Manufacturer Code
2nd Device Identifier
3rd Internal chip number, cell Type, etc.
4th Page Size, Block Size, Spare Size, Orga nization
5th Multiplane information
Table 15: Device Identifier Coding
Part Number Voltage Bus
Width 1st cycle
(Manufacture Code) 2nd cycle
(Device Code) 3rd
cycle 4th
cycle 5th
cycle
HY27UF082G2B 3.3V x8 ADh DAh 10h 95h 44h
HY27UF162G2B 3.3V x16 ADh CAh 10h D5h 44h
Table 16: Re ad ID Data Table
IO Page Program Block Erase Read Cache Read CODING
0 Pass / Fail Pass / Fail NA NA Pass: ‘0’ Fail: ‘1’
1NA NA NA NA -
2NA NA NA NA -
3NA NA NA NA -
4NA NA NA NA -
5 Ready / Busy Ready / Busy Ready /
Busy P/E/R
Controller Bit Active: ‘0’ Idle:’1’
6 Ready / Busy Ready / Busy Ready /
Busy Ready/Busy Busy: ‘0’ Ready:’1’
7 Write Protect Write Protect Write
Protect NA Protected: ‘0’
Not Protected: ‘1’
Table 14 : Status Register Coding
Rev 0.2 / Jan. 2008 24
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Description IO7 IO6 IO5-4 IO3 IO2 IO1-0
Page Size
(Without Spare Area)
1KB
2KB
4KB
8KB
0 0
0 1
1 0
1 1
Spare Area Size
(Byte / 512Byte) 8
16 0
1
Serial Access Time
50ns
30ns
25ns
Reserved
0
0
1
1
0
1
0
1
Block Size
(Without Spare Area)
64K
128K
256K
512KB
0 0
0 1
1 0
1 1
Organization X8
X16 0
1
Table 18: 4th Byte of Device Identifier Description
Description IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0
Die / Package
1
2
4
8
0 0
0 1
1 0
1 1
Cell Type
2 Level Cell
4 Level Cell
8 Level Cell
16 Level Cell
0 0
0 1
1 0
1 1
Number of
Simultaneously
Programmed Pages
1
2
4
8
0 0
0 1
1 0
1 1
Interleave program
Between multiple chips Not
Supported 0
1
Write Cache Not
Supported 0
1
Table 17: 3rd Byte of Device Idendifier Description
Rev 0.2 / Jan. 2008 25
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Description IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0
Plane Number
1
2
4
8
0 0
0 1
1 0
1 1
Plane Size
(w/o redundant Area)
64Mb 0 0 0
128Mb 0 0 1
256Mb 0 1 0
512Mb 0 1 1
1Gb 1 0 0
2Gb 1 0 1
4Gb 1 1 0
8Gb 1 1 1
Reserved 0 0 0
Table 19: 5rd Byte of Device Idendifier Description
Rev 0.2 / Jan. 2008 26
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Table 20: Page organization in EDC units (x8)
Table 21: Page organization in EDC units (x16)
IO Copy back Program CODING
0 Pass/Fail Pass: ‘0’ Fail: ‘1’
1 EDC status NO error: ‘0’
2 EDC Validity Invalid: ‘0’ Valid: ‘1’
3NA -
4NA -
5 Ready/Busy Busy: ‘0’ Ready: ‘1’
6 Ready/Busy Busy: ‘0’ Ready: ‘1’
7 Write Protect Protected: ‘0’ Not Protected: ‘1’
Table 22: EDC Register Coding
Rev 0.2 / Jan. 2008 27
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure 6: Command Latch Cycle
W&/
6
W&6
W:3
&RPPDQG
&/(
&(
:(
$/(
,2[
W'+W'6
W$/6 W$/+
W&/+
W&+
W&/6
W&6
W:&
W$/6 W$/6 W$/6 W$/6 W$/6 W$/+W$/+W$/+W$/+W$/+
W:& W:& W:&
W:3 W:3
W:+
W:3 W:3
W:+
W:+ W:+
W'6
&RO$GG
&/(
&(
:(
$/(
,2[
&RO$GG 5RZ$GG 5RZ$GG 5RZ$GG
W'6 W'6 W'6 W'6
W'+W'+W'+W'+W'+
Figure 7: Address Latch Cycle
Rev 0.2 / Jan. 2008 28
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
W:&
W&/+
W&+
W:3
W:+
1RWHV',1ILQDOPHDQV%\WHV[
',1 ',1ILQDO
W:+
W'+ W'+ W'+
W'6 W'6 W'6
W:3 W:3
&/(
$/(
&(
,2[
:(
W$/6
Figure 8: Input Data Latch Cycle
Rev 0.2 / Jan. 2008 29
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
W5&
W53 W5(+
W5($
W&5
W5/2+
W55
W5($
W&+=
W&2+
W5+=
W5+2+
'RXW'RXW
&(
5(
,2[
5%
1RWHV7UDQVLWLRQLVPHDVXUHGDWP9IURPVWHDG\VWDWHYROWDJHZLWKORDG
7KLVSDUDPHWHULVVDPSOHGDQGQRWWHVWHGW&+=W5+=
W5/2+LVYDOLGZKHQIUHTXHQF\LVKLJKHUWKDQ0+]
W5+2+VWDUWVWREHYDOLGZKHQIUHTXHQF\LVORZHUWKDQ0+]
Figure 10: Sequential Out Cycl e after Read (EDO Type CLE=L, WE=H, ALE=L)
W5&
&(
5(
,2[
5%
W5($
W55
'RXW 'RXW 'RXW
1RWHV7UDQVLWLRQLVPHDVXUHGDWP9IURPVWHDG\VWDWHYROWDJHZLWKORDG
7KLVSDUDPHWHULVVDPSOHGDQGQRWWHVWHGW&+=W5+=
W5+2+VWDUWVWREHYDOLGZKHQIUHTXHQF\LVORZHUWKDQ0+]
W5($
W5+= W5+=
W5($
W&+=
W&2+
W5+2+
W5(+
Figure 9: Sequential Out Cycle after Read (CLE=L, WE=H, ALE=L)
Rev 0.2 / Jan. 2008 30
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure 11: Status Read Cycle
W&/6
W&/5
W&/+
W&6
W&+
W:3
W:+5
W&5
W'6 W5($
W&+=
W&2+
W5+=
W5+2+
K 6WDWXV2XWSXW
W'+ W,5
&(
:(
,2
[
&/(
5(
&/(
$/(
&(
,2[
:(
5(
5'
W
:&
W
&/5
W
55
K K
&RO$GG
&ROXPQ$GGUHVV 5RZ$GGUHVV
&RO$GG
5RZ$GG 5RZ$GG 5RZ$GG
%XV\
'RXW1 'RXW1 'RXW0
W
:%
W
$5
W
5
W
5&
W
5+=
Figure 12: Read1 Operation (Read One Page)
Rev 0.2 / Jan. 2008 31
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
W:%
W$5
W&+=
W&2+
W5&
W5
W55
%XV\
K K 'RXW
1'RXW
1 'RXW
1
&RO
$GG &RO
$GG 5RZ
$GG 5RZ
$GG 5RZ
$GG
&ROXPQ$GGUHVV 5RZ$GGUHVV
&/(
&(
:(
$/(
5(
,2[
5%
Figure 13: Read1 Operation intercepted by CE
Rev 0.2 / Jan. 2008 32
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
&/(
$/(
&(
5(
5%
,2[
:(
W&/5
K
&ROXPQ$GGUHVV 5RZ$GGUHVV
%XV\
K K (K
'RXW1 'RXW0
'RXW1 'RXW0
&RO$GG 5RZ$GG 5RZ$GG 5RZ$GG
&RO$GG
&ROXPQ$GGUHVV
&RO$GG &RO$GG
W5 W5&
W:%
W$5
W55
W:+5
W5($
W5+:
Figure 14 : Random Data output
Rev 0.2 / Jan. 2008 33
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
K
$/(
&(
&/(
:(
5(
5%
,2[
W5%6<W5%6< W5%6<
W5%6<
K
&RO
$GG
&RO
$GG
5RZ
$GG
5RZ
$GG
5RZ
$GG
K
K
K
'DWD&DFKH
3DJH%XIIHU
&HOO$UUD\
K
$
'RXW1 'RXW0
'RXW0
'RXW1
'RXW1
'RXW1
)K
'RXW0'RXW1
'RXW1
'RXW0'RXW1
'RXW1
W5
$
$/(
&(
&/(
:(
5(
5%
,2[
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
Figure 15: Read Operation with Read Cache
Rev 0.2 / Jan. 2008 34
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure 16: Page Program Operation
&/(
$/(
&(
5(
5%
,2[
:(
W:&
K &RO
$GG
6HULDO'DWD
,QSXW&RPPDQG &ROXPQ$GGUHVV
127(6W$'/LVWKHWLPHIURPWKH:(ULVLQJHGJHRIILQDODGGUHVVF\FOHWRWKH:(ULVLQJHGJHRIILUVWGDWDF\FOH
5RZ$GGUHVV 5HDG6WDWXV
&RPPDQG
3URJUDP
&RPPDQG
,2 6XFFHVVIXO3URJUDP
,2 (UURULQ3URJUDP
XSWRP%\WH
6HULDO,QSXW
&RO
$GG 5RZ
$GG 5RZ
$GG 5RZ
$GG 'LQ
1'LQ
0K K ,2R
W:&
W:% W352*
W:+5
W:&
W$'/
Rev 0.2 / Jan. 2008 35
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
&/(
$
/(
&(
5(
5%
,2[
:(
W:&
K 'LQ
1'LQ
0'LQ
-'LQ
.
K K K
,2
&RO$GG &RO$GG &RO$GG &RO$GG5ZR$GG 5ZR$GG 5ZR$GG
W:&
W:%
W:+5
W352*
6HULDO'DWD
,QSXW&RPPDQG 5DQGRP'DWD
,QSXW&RPPDQG
&ROXPQ$GGUHVV &ROXPQ$GGUHVV5RZ$GGUHVV
127(6W$'/LVWKHWLPHIURPWKH:(ULVLQJHGJHRIILQDODGGUHVVF\FOHWRWKH:(UVLQJHGJHRIILUVWGDWDF\FOH
6HULDO,QSXW 6HULDO,QSXW 3URJUDP
&RPPDQG
5HDG6WDWXV
&RPPDQG
W:&
W$'/ W$'/
Figure 17: Random Data In
Rev 0.2 / Jan. 2008 36
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
&(
W:&
W:%
W5
&RODGG5RZDGG
&RODGG5RZDGG
'DWDLQ K K ,2[DGGUHVVKK
K
5HDGFRPPDQG &ROXPQDGGUHVV &ROXPQDGGUHVV SDJHURZDGGUHVV (UURUFRUUHFWLRQGDWDLQSXW
&RS\EDFN
3URJUDP
FRPPDQG
3DJHURZDGGUHVV 5HDGFRQILUP
&RPPDQG
K K
'DWD
1
'DWD
1
'DWD
0
'DWD
0
K K ,2
&RO
DGG
&RO
DGG
5RZ
DGG
5RZ
DGG
5RZ
DGG
5RZ
DGG
5RZ
DGG
5RZ
DGG
&RO
DGG
&RO
DGG
K 'DWDRXW
DGGUHVV
W352*
W5 W552*
:(
5(
5%
,2[
,2
&/(
$/(
5%
Figure 18: Copy Back Program Operation
Rev 0.2 / Jan. 2008 37
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
&/(
&(
:(
W:&
W:%
W5 W5&
W$'/
W352*
W:+5
W:%
$
/(
5(
K K K
,2
K
K
'DWD
'DWD
'DWD
1
'DWD
1
%XV\
127(6W$'/LVWKHWLPHIURPWKH:(ULVLQJHGJHRIILQDODGGUHVVF\FOHWRWKH:(ULVLQJHGJHRIILUVWGDWDF\FOH
&ROXPQ$GGUHVV &ROXPQ$GGUHVV
5RZ$GGUHVV 5RZ$GGUHVV 5HDO6WDWXV&RPPDQG
%XV\
,2 6XFHVVIXO3URJUDP
,2 (UURULQ3URJUDP
&RS\%DFN'DWD
,QSXW&RPPDQG
&RO
$GG
5RZ
$GG
5RZ
$GG
5RZ
$GG
&RO
$GG
&RO
$GG
5RZ
$GG
5RZ
$GG
5RZ
$GG
&RO
$GG
,2[
5%
5% W5 W352*
,2a K K
&RODGG5RZDGG &RODGG5RZDGG &RODGG
K K K ,2[KDGGUHVV DGGUHVV DGGUHVV
'DWDRXW 'DWD,Q 'DWD,Q
Figure 19: Copy Back Program Operation with Random Data Input
Rev 0.2 / Jan. 2008 38
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
W:&
&/(
&(
:(
$/(
5(
,2[
5%
W:% W%(56
%86<
K ,2
5RZ$GG 5RZ$GG 5RZ$GG
K
$XWR%ORFN(UDVH6HWXS&RPPDQG
(UDVH&RPPDQG
5HDG6WDWXV
&RPPDQG
,2 6XFFHVVIXO(UDVH
,2 (UURULQ(UDVH
3DJH5RZ$GGUHVV
'K
Figure 20: Block Erase Operation (Erase One Block)
Rev 0.2 / Jan. 2008 39
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure 21: Multiple plane page program
7ZR3ODQH3DJH3URJUDP2SHUDWLRQ[
$/(
&/(
&(
5(
5%
,2[
:(
5%
,2a
([7ZR3ODQH3DJH3URJUDP
W:&
K K ,2
&RO$GG5RZ$GG
%\WH'DWD
&RO$GG5RZ$GG
%\WH'DWD
1RWH
$a$9DOLG
$a$)L[HGµ/RZ¶
$)L[HGµ/RZ¶
$a$)L[HGµ/RZ¶
$a$9DOLG
$a$9DOLG
$)L[HGµ+LJK¶
$a$9DOLG
1RWH$Q\FRPPDQGEHWZHHQKDQGKLVSURKLEWHGH[FHSWKDQG))+
W'%6<
W352*
6HULDO'DWD
,QSXW&RPPDQG &ROXPQ$GGUHVV 3DJH5RZ$GGUHVV
XSWR%\WH'DWD
6HULDO,QSXW
3URJUDP
&RPPDQG
'XPP\
K
K K K K
$GGUHVV'DWD,QSXW $GGUHVV'DWD,QSXW
K
'LQ
1
'LQ
0
6HULDO,QSXW 3URJUDP
&RPPDQG
7UXH
K
'LQ
1'LQ
0
&RO$GG
K
&RO$GG
5RZ$GG
5RZ$GG 5RZ$GG 5RZ$GG
&RO$GG &RO$GG
5RZ$GG
5RZ$GG
W:%
W:+5
W352*
W:% W'%6<
W'%6<XV7\S
XV0D[
Rev 0.2 / Jan. 2008 40
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure 22: Multiple plane erase operation
5RZ$GGUHVV
%ORFN(UDVH6HWXS&RPPDQG %ORFN(UDVH6HWXS&RPPDQG (UDVH&RQILUP&RPPDQG
5HDG6WDWXV&RPPDQG
,2 6XFFHVVIXO(UDVH
,2 (UURULQ(UDVH
%XV\
5RZ$GGUHVV
([$GGUHVV5HVWULFWLRQIRU7ZR3ODQH%ORFN(UDVH2SHUDWLRQ
$/(
&/(
&(
5(
5%
,2[
:(
5%
,2a
W:&
K
K
5RZ$GG 5RZ$GG
$a$)L[HGµ/RZ¶
$)L[HGµ/RZ¶
$a$)L[HGµ/RZ¶
$a$)L[HGµ/RZ¶
$)L[HGµ+LJK¶
$a$9DOLG
$GGUHVV $GGUHVV
K K'RK
K 'K K ,2
5RZ$GG 5RZ$GG5RZ$GG 5RZ$GG
5RZ$GG 5RZ$GG
W:&
W:% W%(56
W%(56
W:+5
Rev 0.2 / Jan. 2008 41
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
$
$
$
$
,2a
,2a
,2[
,2[
&/(
&/(
$
/(
$
/(
&(
&(
5%
5%
5%
5%
:(
5( W:&
W:%
W5
W5 W5
W'%6<
W'%6< W352*
W5
:(
5(
W352*
K
K
5HDGFRPPDQG
FRS\EDFN
SURJUDP
VWDUWFRPPDQG
FRS\EDFN
SURJUDP
FRPPDQG
^GXPP\`
FRS\EDFN
SURJUDP
FRPPDQG
^WUXH`
&ROXPQDGGUHVV SDJHURZDGGUHVV
&ROXPQDGGUHVV SDJHURZDGGUHVV (RUURFRUUHFWLRQGDWDLQSXW &ROXPQDGGUHVV SDJHURZDGGUHVV (RUURFRUUHFWLRQGDWDLQSXW
&ROXPQDGGUHVV SDJHURZDGGUHVV
5HDGFRQILUP
FRPPDQG
K K
K
&RO
DGG &RO
DGG
5RZ
DGG
5RZ
DGG
5RZ
DGG
&RO
DGG 'LQ
1'LQ
0
&RO
DGG
5RZ
DGG
5RZ
DGG
5RZ
DGG
K K
&RO
DGG 'LQ
1'LQ
0
&RO
DGG
5RZ
DGG
5RZ
DGG
5RZ
DGG
KK K
&RO
DGG
&RO
DGG
5RZ
DGG
5RZ
DGG
5RZ
DGG
K
DGGUHVV
K K
DGGUHVV
&RODGG5RZDGG'HVWLQDWLRQ$GGUHVV
$a$YDOLG
$a$)L[HG³/RZ´
$)L[HG³/RZ´
$a$)L[HG³/RZ´
127($Q\FRPPDQGEHWZHHQKDQGKLVSURKLELWHGH[FHSWKDQG))K
&RODGG5RZDGG6RXUFH$GGUHVV3ODQH
$a$YDOLG
$a$YDOLG
$)L[HG³/RZ´
$a$YDOLG
&RODGG5RZDGG'HVWLQDWLRQ$GGUHVV
$a$YDOLG
$a$YDOLG
$)L[HG³KLJK´
$a$)L[HGYDOLG
&RODGG5RZDGG6RXUHF$GGUHVV3ODQH
$a$YDOLG
$a$YDOLG
$)L[HG³KLJK´
$a$)L[HGYDOLG
KK K
$GGUHVVGDWDLQSXW $GGUHVVGDWDLQSXW
Figure 23: Multi plane copyback program Operation
Rev 0.2 / Jan. 2008 42
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
K
&/(
&(
:(
$/(
5(
,2[ K
W5($
5HDG,'&RPPDQG $GGUHVVF\FOH 0DNHU&RGH 'HYLFH&RGH
$'K
WK&\FOH WK&\FOHUG&\FOH
'$K K KK
W$5
Figure 24: Read ID Operation
Rev 0.2 / Jan. 2008 43
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
,IVHTXHQWLDOURZUHDGHQDEOHG
&(PXVWEHKHOGORZGXULQJW5 &(GRQ¶WFDUH
K K
&/(
&(
5(
$/(
5%
:(
,2[
6WDUW$GG&\FOH 'DWD2XWSXWVHTXHQWLDO
W5
Figure 26: Read Operation with CE don’t-care.
System Interface Using CE don’t care
To simplify system interface, CE signal is ignored during data loading or sequential data-reading as shown below.
So, it is possible to connect NAND Flash to a microprocessor. The only function that was remov ed from standard NAND
Flash to make CE don’t care read operation was disabling of the automatic sequential read function.
&(GRQ¶WFDUH
K 6WDUW$GG&\FOH 'DWD,QSXW K'DWD,QSXW
&/(
&(
:(
$/(
,2[
Figure 25: Program Operation with CE don’t-care.
Rev 0.2 / Jan. 2008 44
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
9&&
9
9
9
9
XVPD[
,QYDOLG
9
&(
9
,/
9
2SHUDWLRQ
PVPD[
,+
9
,/
:3
5HDG\%XV\
GRQ¶W
FDUH
GRQ¶W
FDUH
GRQ¶W
FDUH
Figure 27: Reset Operation
))K
W567
:(
$/(
&/(
5(
,2
5%
Figure 28: Power On and Data Protection Timing
VTH = 2.5 Volt for 3.3 Volt Supply devices
Rev 0.2 / Jan. 2008 45
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
5SYDOXHJXLGHQFH
5SPLQ
ZKHUH,/LVWKHVXPRIWKHLQSXWFXUUHQWVRIDOOGHYLFHVWLHGWRWKH5%SLQ
5SPD[LVGHWHUPLQHGE\PD[LPXPSHUPLVVLEOHOLPLWRIWU
#9FF 97D &&
/
S)
)LJ5SYVWUWI5SYVLEXV\
9FF0D[9
2/0D[ 9
P$,/,2/,/
5S LEXV\
5SRKP
LEXV\
LEXV\>$@
WUWI>V@
WI
%XV\
5HDG\ 9FF
9
2+
WUWI
9
2/
9
2/
99
2+
9
9FF
Q P
N N N N
Q P
Q P
*1'
'HYLFH
RSHQGUDLQRXWSXW
5%
Figure 29: Ready/Busy Pin electrical specifications
Rev 0.2 / Jan. 2008 46
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure 30: page programming within a block
kh{hGpuGaGkGOXP kGO][P kGO][P
kG
wG]Z wG]Z
wGZX
wGY
wGX
wGW
O][P
a
OZYP
a
OZP
OYP
OXP
lUPGyGGGOwP
kh{hGpuGaGkGOXP
kG
wGZX
wGY
wGX
wGW
a
OXP
a
OZP
OZYP
OXP
O][P
Rev 0.2 / Jan. 2008 47
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
<HV
<HV
1R
1R
67$57
%ORFN$GGUHVV
%ORFN
'DWD
))K"
/DVW
EORFN"
(1'
,QFUHPHQW
%ORFN$GGUHVV
8SGDWH
%DG%ORFNWDEOH
Bad Block Management
Devices with Bad Blocks have the same quality level and the same AC and DC characteristics as devices where all the
blocks are va lid. A Bad Block does not affect the perf ormance of valid blocks because it is isolated from the bit line and
common source line by a select transi stor. The devices are supplied with all the locations inside valid blocks
erased(FFh). The Bad Block Information is written prior to shipping. Any block where the 1st Byte in the spare area of
the 1st or 2nd th page (if the 1st page is Bad) does not cont ain FFh is a Bad Block. The Ba d Block Inf ormation must be
read before any erase is attempted as the Bad Block Information may be erased. For the system to be able to recog-
nize the Bad Blocks based on the original information it is recommended to create a Bad Block table following the flow-
chart shown in Figure 31. The 1st block, which is placed on 00h block address is guaranteed to be a valid block.
Figure 31: Bad Block Management Flowchart
Rev 0.2 / Jan. 2008 48
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
'DWD
%XIIHUPHPRU\RIWKHFRQWUROOHU
%ORFN$ %ORFN%
QSDJH
))K
'DWD
))K
)DLOXUH
WK
QSDJH
WK
Bad Block Replacement
Over the lifetime of the device additional Bad Blocks may develop. In this case the block has to be replaced by copying
the data to a valid block. These additional Bad Blocks can be identified as attempts to program or erase the m will give
errors in the Status Register.
Unlike the case of odd page which carries a possibility of af fecting previous page, the failure of a page program oper-
ation does not affect the da ta in other pages in the same block, the block can be r eplaced by re-pr ogr amming the cur-
rent data and copying the rest of the replaced block to an available valid block.
Refer to Table 23 and Figure 32 for the recommended procedure to follow if an error occurs during an operation.
Operation Recommended Procedure
Erase Block Replacement
Program Block Replacement
Read ECC (with 1bit/528byte)
Table 23: Block Failure
Figure 32: Bad Block Replacement
NOTE :
1. An error occurs on nth page of the Block A during program or erase operation.
2. Data in Block A is copied to same location in Block B which is valid block.
3. Nth data of block A which is in controller buffer memory is copied into nth page of Block B
4. Bad block table should be updated to prevent from eraseing or programming Block A
Rev 0.2 / Jan. 2008 49
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Write Protect Operation
The Erase and Program Operations are automatically reset when WP goes Low (tWW = 100ns, min). The operations
are enabled and disabled as follows (Figure 33~36)
::
W
K K
:(
,2[
:3
5%
K K
W::
:(
,2[
:3
5%
Figure 33: Enable Programming
Figure 34: Disable Programming
Rev 0.2 / Jan. 2008 50
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
K
W
'K
::
:(
,2[
:3
5%
K
W::
'K
:(
,2[
:3
5%
Figure 35: Enable Erasing
Figure 36: Disable Erasing
Rev 0.2 / Jan. 2008 51
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Table 24: 48-TSOP1 - 48-lead Plastic Thin Small Outline,
12 x 20mm, Package Mechanical Data
Symbol millimeters
Min Typ Max
A1.200
A1 0.050 0.150
A2 0.980 1.030
B 0.170 0.250
C 0.100 0.200
CP 0.100
D 11.910 12.000 12.120
E 19.900 20.000 20.100
E1 18.300 18.400 18.500
e 0.500
L 0.500 0.680
alpha 0 5
Figure 37: 48-TSOP1 - 48-lead Plastic Thin Small Outline, 12 x 20mm, Pack age Outline
'
$
',(
$
H
%
/
Į
(
(
&
&3
$
Rev 0.2 / Jan. 2008 52
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
$
$
$
6(
)(
)(
H
((
%$//³FS´
(
H
HE
'
'
6'
)'
)'
'
Symbol Millimeters
Min Typ Max
A 0.80 0.90 1.00
A1 0.25 0.30 0.35
A2 0.55 0.60 0.65
b 0.40 0.45 0.50
D 8.90 9.00 9.10
D1 4.00
D2 7.20
E 10.90 11.00 11.10
E1 5.60
E2 8.80
e0.80
FD 2.50
FD1 0.90
FE 2.70
FE1 1.10
SD 0.40
SE 0.40
Figure 38: 63-ball FBGA - 9 x 11 ball array 0.8mm pitch, Pakage Outline
NOTE: Drawing is not to scale.
Table 25: 63-ball FBGA - 9 x 11 ball array 0.8mm pitch, Pakage Mechanical Data
Rev 0.2 / Jan. 2008 53
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Symbol millimeters
Min Typ Max
A 16.90 17.00 17.10
A1 13.00
A2 12.00
B 11.90 12.00 12.10
B1 10.00
B2 6.00
C1.00
C1 1.50
C2 2.00
D1.00
D1 1.00
E0.65
CP1 0.65 0.70 0.75
CP2 0.95 1.00 1.05
Figure 39: 52-ULGA, 12 x 17mm, Package Outline
(Top view through package)
%
$$$
FS
(
FS
&
&
&
%
%
''
0
&$%
0
&$%
Table 26: 52-ULGA, 12 x 17mm, Package Mechanical Data
Rev 0.2 / Jan. 2008 54
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
MARKING INFORMATION - TSOP1 / FBGA / ULGA
Packag M arking Exam ple
TSOP1
/
FBGA
/
ULGA
K O R
H Y 2 7 U F x x 2 G 2 B
x x x x Y W W x x
- hynix
- K O R
- H Y27UFxx2G2B xxxx
HY : Hynix
2 7 : NAND Flash
U: Pow er Supply
F: Classification
xx : Bit O rganization
2G: Density
2: Mode
B: Version
x : Package Type
x : Package Material
x : O peratin g Tem perature
x : Bad Block
- Y : Year (ex: 5=year 2005, 6= year 2006)
- w w: W ork W eek (ex: 12= w ork week 12)
- xx : Process C ode
Note
- C ap ita l Le tter
- Small Le tter
: H y nix S y m b o l
: Or ig in C o u n t ry
: U (2.7V ~3.6V)
: Single L e v e l Ce ll + S in gle Die +L a rg e Bl o ck
: 0 8(x8), 16(x16)
: 2 G b it
: 2(1nCE & 1R/nB; Sequential R ow Read D isable)
: 3 rd Ge n era tio n
: T(48-TSOP1), F(63-FBG A), U (52-U LGA )
: B lank(Norm al), P(Lead Free)
: C (0 ℃~70℃), I(-4 0℃~85℃)
: B(Included Bad Block), S(1~ 5 Bad Block),
P (A ll G o o d B loc k)
: F ix ed Ite m
: N o n-fixe d Item
: P art N u mb er
