ISL26134AVZ-T7A - Intersil Corporation

Low-Noise 24-bit Delta Sigma ADC

ISL26132, ISL26134

The ISL26132 and ISL26134 are complete analog front ends

for high resolution measurement applications. These 24-bit

Delta-Sigma Analog-to-Digital Converters include a very

low-noise amplifier and are available as either two or four

differential multiplexer inputs. The devices offer the same

pinout as the ADS1232 and ADS1234 devices and are

functionally compatible with these devices. The ISL26132 and

ISL26134 offer improved noise performance at 10Sps and

80Sps conversion rates.

The on-chip low-noise programmable-gain amplifier provides

gains of 1x/2x/64x/128x. The 128x gain setting provides an

input range of ±9.766mVFS when using a 2.5V reference. The

high input impedance allows direct connection of sensors such

as load cell bridges to ensure the specified measurement

accuracy without additional circuitry. The inputs accept signals

100mV outside the supply rails when the device is set for unity

gain.

The Delta-Sigma ADC features a third order modulator

providing up to 21.6-bit noise-free performance.

The device can be operated from an external clock source,

crystal (4.9152MHz typical), or the on-chip oscillator.

The two channel ISL26132 is available in a 24 Ld TSSOP

package and the four channel ISL26134 is available in a 28 Ld

TSSOP package. Both are specified for operation over the

automotive temperature range (-40°C to +105°C).

Features

• Up to 21.6 Noise-free bits.

• Low Noise Amplifier with Gains of 1x/2x/64x/128x

• RMS noise: 10.2nV @ 10Sps (PGA = 128x)

• Linearity Error: 0.0002% FS

• Simultaneous rejection of 50Hz and 60Hz (@ 10Sps)

• Two (ISL26132) or four (ISL26134) channel differential

input multiplexer

• On-chip temperature sensor (ISL26132)

• Automatic clock source detection

• Simple interface to read conversions

• +5V Analog, +5 to +2.7V Digital Supplies

• Pb-Free (RoHS Compliant)

• TSSOP packages: ISL26132, 24 pin; ISL26134, 28 pin

Applications

•Weigh Scales

• Temperature Monitors and Controls

• Industrial Process Control

• Pressure Sensors

ADC

PGA

1x/2x/64x/

128x

INTERNAL

CLOCK

SDO/RDY

SCLK

DVDDAVDD

DGNDAGND

XTALIN/CLOCK

VREF+

EXTERNAL

OSCILLATOR XTALOUT

VREF-

A0 A1/TEMP

AIN1+

AIN1-

AIN2+

AIN2-

AIN3+

AIN3-

AIN4+

AIN4-

INPUT

MULTIPLEXER

ISL26134

Only

CAP

GAIN1GAIN0

PWDN

SPEED

DGND

NOTE for A1/TEMP pin: Functions as A1 on ISL26134; Functions as TEMP on ISL26132

FIGURE 1. BLOCK DIAGRAM

September 9, 2011

FN6954.1

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.

All other trademarks mentioned are the property of their respective owners.

ISL26132, ISL26134

2FN6954.1

September 9, 2011

Ordering Information

PART NUMBER

(Notes 2, 3) PART MARKING

TEMPERATURE RANGE

(°C)

PACKAGE

(Pb-free)

PKG. DWG

NUMBER

ISL26132AVZ 26132 AVZ -40 to +105 24 Ld TSSOP M24.173

ISL26132AVZ-T (Note 1) 26132 AVZ -40 to +105 24 Ld TSSOP (Tape & Reel) M24.173

ISL26132AVZ-T7A (Note 1) 26132 AVZ -40 to +105 24 Ld TSSOP (Tape & Reel) M24.173

ISL26134AVZ 26134 AVZ -40 to +105 28 Ld TSSOP M28.173

ISL26134AVZ-T (Note 1) 26134 AVZ -40 to +105 28 Ld TSSOP (Tape & Reel) M28.173

ISL26134AVZ-T7A (Note 1) 26134 AVZ -40 to +105 28 Ld TSSOP (Tape & Reel) M28.173

ISL26134AV28EV1Z Evaluation Board

NOTES:

1. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information page for ISL26132, ISL26134. For more information on MSL please see techbrief

TB363.

TABLE 1. KEY DIFFERENCES OF PARTS

PART NUMBER NUMBER OF CHANNELS ON-CHIP TEMPERATURE SENSOR NUMBER OF PINS

ISL26132 2 YES 24

ISL26134 4 NO 28

Pin Configurations

ISL26132

(24 LD TSSOP)

TOP VIEW

ISL26134

(28 LD TSSOP)

TOP VIEW

DVDD

DGND

XTALIN/CLOCK

XTALOUT

DGND

TEMP

CAP

AIN1+

AIN1-

SDO/RDY

PDWN

SPEED

GAIN1

GAIN0

AGND

VREF-

AIN2+

AIN2-

SCLK

AVDD

VREF+

DVDD

DGND

XTALIN/CLOCK

XTALOUT

DGND

CAP

AIN1+

AIN1-

AIN3+

AIN3-

SDO/RDY

PDWN

SPEED

GAIN1

GAIN0

AGND

VREF-

AIN2+

AIN2-

AIN4+

AIN4-

SCLK

AVDD

VREF+

ISL26132, ISL26134

3FN6954.1

September 9, 2011

Pin Descriptions

NAME

PIN NUMBER ANALOG/DIGITAL

INPUT/OUTPUT DESCRIPTIONISL26132 ISL26134

DVDD 1 1 Digital Digital Power Supply (2.7V to 5.25V)

DGND 2, 5, 6 2, 5, 6 Digital Digital Ground

XTALIN/CLOCK 3 3 Digital/Digital Input External Clock Input: typically 4.9152MHz. Tie low to activate

internal oscillator. Can also use external crystal across

XTALIN/CLOCK and XTALOUT pins.

XTALOUT 4 4 Digital External Crystal connection

TEMP 7 - Digital Input On-chip Temperature Diode Enable

Digital Input

CAP 9, 10 9, 10 Analog PGA Filter Capacitor

AIN1+ 11 11 Analog Input Positive Analog Input Channel 1

AIN1- 12 12 Analog Input Negative Analog Input Channel 1

AIN3+ - 13 Analog Input Positive Analog Input Channel 3

AIN3- - 14 Analog Input Negative Analog Input Channel 3

AIN4- - 15 Analog Input Negative Analog Input Channel 4

AIN4+ - 16 Analog Input Positive Analog Input Channel 4

AIN2- 13 17 Analog Input Negative Analog Input Channel 2

AIN2+ 14 18 Analog Input Positive Analog Input Channel 2

VREF- 15 19 Analog Input Negative Reference Input

VREF+ 16 20 Analog Input Positive Reference Input

AGND 17 21 Analog Analog Ground

AVDD 18 22 Analog Analog Power Supply 4.75V to 5.25V

GAIN0

GAIN1

Digital Input

TABLE 2. INPUT MULTIPLEXER SELECT

ISL26134 ISL26132

A1 A0 CHANNEL

00AIN1

01AIN2

10AIN3

11AIN4

TABLE 3. GAIN SELECT

GAIN1 GAIN0 GAIN

001

012

1064

11128

ISL26132, ISL26134

4FN6954.1

September 9, 2011

Circuit Description

The ISL26132 (2-channel) and ISL26134 (4-channel) devices are

very low noise 24-bit delta-sigma ADCs that include a

programmable gain amplifier and an input multiplexer. The

ISL26132 offers an on-chip temperature measurement

capability.

The ISL26132, ISL26134 provide pin compatibility and output

data compatibility with the ADS1232/ADS1234, and offer the

same conversion rates of 10Sps and 80Sps.

All the features of the ISL26132, ISL26134 are pin-controllable,

while offset calibration, standby mode, and output conversion

data are accessible through a simple 2-wire interface.

The clock can be selected to come from an internal oscillator, an

external clock signal, or crystal (4.9152MHz typical).

SPEED 21 25 Digital Input

PDWN 22 26 Digital Input Power-Down: Holding this pin low powers down the entire

converter and resets the ADC.

SCLK 23 27 Digital Input Serial Clock: Clock out data on the rising edge. Also used to

initiate Offset Calibration and Sleep modes. See “Serial Clock

Input (SCLK)” on page 14 for more details.

SDO/RDY 24 28 Digital Output Dual-Purpose Output:

Data Ready: Indicate valid data by going low.

Data Output: Outputs data, MSB first, on the first rising edge

of SCLK.

Pin Descriptions (Continued)

NAME

PIN NUMBER ANALOG/DIGITAL

INPUT/OUTPUT DESCRIPTIONISL26132 ISL26134

TABLE 4. DATA RATE SELECT

SPEED DATA RATE

010Sps

1 80Sps

ISL26132, ISL26134

5FN6954.1

September 9, 2011

Absolute Maximum Ratings Thermal Information

AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V

Analog In to AGND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to AVDD+0.3V

Digital In to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to DVDD+0.3V

Input Current

Momentary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA

Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA

ESD Rating

Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . . . . . . . . . .7.5kV

Machine Model (Per JESD22-A115). . . . . . . . . . . . . . . . . . . . . . . . . . 450V

Charged Device Model (Per JESD22-C101) . . . . . . . . . . . . . . . . . . . . . . . . 2kV

Latch-up (Per JEDEC JESD-78B; Class 2, Level A)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA @ Room and Hot (+105°C)

Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W)

24 Ld TSSOP (Notes 4, 5) . . . . . . . . . . . . . . 65 18

28 Ld TSSOP (Notes 4, 5) . . . . . . . . . . . . . . 63 18

Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80mW

Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C

Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C

Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C

AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.75V to 5.25V

DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.25V

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product

reliability and result in failures not covered by warranty.

NOTES:

4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

5. For θJC, the “case temp” location is taken at the package top center.

Electrical Specifications VREF+ = 5V, VREF- = 0V, AVDD = 5V, DVDD = 5V, AGND = DGND = 0V, MCLK = 4.9152MHz, and

TA= -40°C to +105°C, unless otherwise specified. Boldface limits apply over the operating temperature range, -40°C to +105°C

SYMBOL PARAMETER TEST LEVEL or NOTES

MIN

(Note 6) TYP

MAX

(Note 6) UNITS

ANALOG INPUTS

Differential Input Voltage Range ±0.5VREF/

Gain

Common Mode Input Voltage

Range

Gain = 1, 2 AGND - 0.1 AVDD + 0.1 V

Gain = 64, 128 AGND+1.5 AVDD - 1.5 V

Differential Input Current

Gain = 1 ±20 nA

Gain = 2 ±40 nA

Gain = 64, 128 ±1 nA

SYSTEM PERFORMANCE

Resolution No Missing Codes 24 Bits

Data Rate

Internal Osc. SPEED = High 80 SPS

Internal Osc. SPEED = Low 10 SPS

External Osc. SPEED = High fCLK/61440 SPS

External Osc. SPEED = Low fCLK/49152

SPS

Digital Filter Settling Time Full Setting 4 Conversions

INL Integral Nonlinearity Differential Input Gain = 1, 2 ±0.0002 ±0.001 % of FSR (Note 7)

Differential Input Gain = 64, 128 ±0.0004 % of FSR

(Note 7)

Input Offset Error Gain = 1 ±0.4 ppm of FS

Gain = 128 ±1.5 ppm of FS

Input Offset Drift Gain = 1 0.3 µV/°C

Gain = 128 10 nV/°C

Gain Error (Note 8) Gain = 1 ±0.007 ±0.02 %

Gain = 128 ±0.02 %

Gain Drift Gain = 1 0.5 ppm/°C

Gain = 128 7 ppm/°C

ISL26132, ISL26134

6FN6954.1

September 9, 2011

CMRR Common Mode Rejection At DC, Gain = 1, ΔV = 1V 85 100 dB

At DC, Gain = 128, ΔV = 0.1V 100 dB

50Hz/60Hz Rejection (Note 9) External 4.9152MHz Clock 130 dB

PSRR Power Supply Rejection At DC, Gain = 1, ΔV = 1V 82 100 dB

At DC, Gain = 128, ΔV = 0.1V 100 105 dB

Input Referred Noise See “Typical Characteristics” beginning

on page 8

Noise Free Bits See “Typical Characteristics” beginning

on page 8

VOLTAGE REFERENCE INPUT

VREF Voltage Reference Input VREF = VREF+ - VREF- 1.5 AVDD AVDD + 0.1 V

VREF- Negative Reference Input AGND - 0.1 VREF+ - 1.5 V

VREF+ Positive Reference Input VREF- + 1.5 AVDD + 0.1 V

IREF Voltage Reference Input Current ±350 nA

POWER SUPPLY REQUIREMENTS

AVDD Analog Supply Voltage 4.75 5.0 5.25 V

DVDD Digital Supply Voltage 2.7 3.3 5.25 V

AIDD Analog Supply Current Normal Mode, AVDD = 5, Gain = 1, 2 7 8.5 mA

Normal Mode, AVDD = 5, Gain = 64, 128 9 12 mA

Standby Mode 0.2 3µA

Power-Down 0.2 2.5 µA

DIDD Digital Supply Current Normal Mode, AVDD = 5, Gain = 1, 2 750 950 µA

Normal Mode, AVDD = 5, Gain = 64, 128 750 950 µA

Standby Mode 1.5 26 µA

Power-Down 1 26 µA

PDPower Dissipation, Total Normal Mode, AVDD = 5, Gain = 1, 2 49.6 mW

Normal Mode, AVDD = 5, Gain = 64, 128 68 mW

Standby Mode 0.14 mW

Power-Down 0.14 mW

DIGITAL INPUTS

VIH 0.7 DVDD V

VIL 0.2 DVDD V

VOH IOH = -1mA DVDD - 0.4 V

VOL IOL = 1mA 0.2 DVDD V

Input Leakage Current ±10 µA

External Clock Input Frequency 0.3 4.9152 MHz

Serial Clock Input Frequency 1 MHz

NOTE:

6. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.

7. FSR = Full Scale Range = VREF/Gain

8. Gain accuracy is calibrated at the factory (AVDD = +5V).

9. Specified for word rate equal to 10Sps.

Electrical Specifications VREF+ = 5V, VREF- = 0V, AVDD = 5V, DVDD = 5V, AGND = DGND = 0V, MCLK = 4.9152MHz, and

TA= -40°C to +105°C, unless otherwise specified. Boldface limits apply over the operating temperature range, -40°C to +105°C (Continued)

SYMBOL PARAMETER TEST LEVEL or NOTES

MIN

(Note 6) TYP

MAX

(Note 6) UNITS

ISL26132, ISL26134

7FN6954.1

September 9, 2011

Noise Performance

The ISL26132 and ISL26134 provide excellent noise

performance. The noise performance on each of the gain

settings of the PGA at the selected word rates is shown in

Tables 5 and 6.

Resolution in bits decreases by 1-bit if the ADC is operated as a

single-ended input device. Noise measurements are

input-referred, taken with bipolar inputs under the specified

operating conditions, with fCLK = 4.9152MHz.

TABLE 5. AVDD = 5V, VREF = 5V, DATA RATE = 10Sps

GAIN

RMS NOISE

(nV)

PEAK-TO-PEAK NOISE

(nV) (Note 10)

NOISE-FREE BITS

(Note 11)

1 243 1604 21.6

2 148 977 21.3

64 10.8 71 20.1

128 10.2 67 19.1

TABLE 6. AVDD = 5V, VREF = 5V, DATA RATE = 80Sps

GAIN

RMS NOISE

(nV)

PEAK-TO-PEAK NOISE

(nV) (Note 10)

NOISE-FREE BITS

(Note 11)

1 565 3730 20.4

2 285 1880 20.3

64 28.3 187 18.7

128 27 178 17.7

NOTES:

10. The peak-to-peak noise number is 6.6 times the rms value. This

encompasses 99.99% of the noise excursions that may occur. This

value best represents the worst case noise that could occur in the

output conversion words from the converter.

11. Noise-Free Bits is defined as: Noise-Free Bits = ln(FSR/peak-to-peak

noise)/ln(2) where FSR is the full scale range of the converter,

VREF/Gain.

ISL26132, ISL26134

8FN6954.1

September 9, 2011

Typical Characteristics

FIGURE 2. NOISE AT GAIN = 1, 10Sps FIGURE 3. NOISE HISTOGRAM AT GAIN = 1, 10Sps

FIGURE 4. NOISE AT GAIN = 2, 10Sps FIGURE 5. NOISE HISTOGRAM AT GAIN = 2, 10Sps

FIGURE 6. NOISE AT GAIN = 64, 10Sps FIGURE 7. NOISE HISTOGRAM AT GAIN = 64, 10Sps

-10

-5

0 200 400 600 800 1000

GAIN = 1

RATE = 10Sps

TIME (SAMPLES)

OUTPUT CODE (LSB)

100

150

200

250

300

-7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7

OUTPUT CODE (LSB)

GAIN = 1, N = 1024

RATE = 10Sps

STD DEV = 1.635 LSB

VREF = 2.5V

COUNTS

-10

-5

0 200 400 600 800 1000

TIME (SAMPLES)

OUTPUT CODE (LSB)

GAIN = 2

RATE = 10Sps

100

150

200

250

-8 -6 -4 -2 0 2 4 6 8

GAIN = 2, N = 1024

RATE = 10Sps

STD DEV = 1.989 LSB

VREF = 2.5V

OUTPUT CODE (LSB)

COUNTS

-15

-10

-5

0 200 400 600 800 1000

TIME (SAMPLES)

OUTPUT CODE (LSB)

GAIN = 64

RATE = 10Sps

100

120

-20 -15 -10 -5 0 5 10 15 20

GAIN = 64, N = 1024

RATE = 10Sps

STD DEV = 4.627 LSB

VREF = 2.5V

OUTPUT CODE (LSB)

COUNTS

ISL26132, ISL26134

9FN6954.1

September 9, 2011

FIGURE 8. NOISE AT GAIN = 128, 10Sps FIGURE 9. NOISE HISTOGRAM AT GAIN = 128, 10Sps

FIGURE 10. NOISE AT GAIN = 1, 80Sps FIGURE 11. NOISE HISTOGRAM AT GAIN = 1, 80Sps

FIGURE 12. NOISE AT GAIN = 2, 80Sps FIGURE 13. NOISE HISTOGRAM AT GAIN = 2, 80Sps

Typical Characteristics (Continued)

-50

-30

-10

0 200 400 600 800 1000

GAIN = 128

RATE = 10Sps

TIME (SAMPLES)

OUTPUT CODE (LSB)

-30-25-20-15-10-5 0 5 1015202530

OUTPUT CODE (LSB)

COUNTS

GAIN = 128, N = 1024

RATE = 10Sps

STD DEV = 8.757 LSB

VREF = 2.5V

-25

-20

-15

-10

-5

0 200 400 600 800 1000

GAIN = 1

RATE = 80Sps

TIME (SAMPLES)

OUTPUT CODE (LSB)

100

120

-15 -10 -5 0 5 10 15

OUTPUT CODE (LSB)

COUNTS

GAIN = 1, N = 1024

RATE = 80Sps

STD DEV = 3.791 LSB

VREF = 2.5V

-25

-15

-5

0 200 400 600 800 1000

GAIN = 2

RATE = 80Sps

TIME (SAMPLES)

OUTPUT CODE (LSB)

100

120

-15 -10 -5 0 5 10 15

OUTPUT CODE (LSB)

COUNTS

GAIN = 2, N = 1024

RATE = 80Sps

STD DEV = 3.831 LSB

VREF = 2.5V

ISL26132, ISL26134

10 FN6954.1

September 9, 2011

FIGURE 14. NOISE AT GAIN = 64, 80Sps FIGURE 15. NOISE HISTOGRAM AT GAIN = 64, 80Sps

FIGURE 16. NOISE AT GAIN = 128, 80Sps FIGURE 17. NOISE HISTOGRAM AT GAIN = 128, 80Sps

FIGURE 18. ANALOG CURRENT vs TEMPERATURE FIGURE 19. DIGITAL CURRENT vs TEMPERATURE

Typical Characteristics (Continued)

-100

-50

100

0 200 400 600 800 1000

GAIN = 64

RATE = 80Sps

TIME (SAMPLES)

OUTPUT CODE (LSB)

-40-35-30-25-20-15-10-5 0 5 10152025303540

OUTPUT CODE (LSB)

COUNTS

GAIN = 64, N = 1024

RATE = 80Sps

STD DEV = 12.15 LSB

VREF = 2.5V

-200

-160

-120

-80

-40

120

160

0 200 400 600 800 1000

GAIN = 128

RATE = 80Sps

TIME (SAMPLES)

OUTPUT CODE (LSB)

-80 -60 -40 -20 0 20 40 60 80

OUTPUT CODE (LSB)

COUNTS

GAIN = 128, N = 1024

RATE = 80Sps

STD DEV = 23.215 LSB

VREF = 2.5V

-40 -10 20 50 80 110

TEMPERATURE (°C)

CURRENT (mA)

NORMAL MODE, PGA = 64.128

NORMAL MODE, PGA = 1, 2

100

1000

10000

-40 -10 20 50 80 110

TEMPERATURE (°C)

CURRENT (µA)

NORMAL MODE, ALL PGA GAINS

POWERDOWN MODE

ISL26132, ISL26134

11 FN6954.1

September 9, 2011

FIGURE 20. TYPICAL WORD RATE vs TEMPERATURE USING

INTERNAL OSCILLATOR

FIGURE 21. NOISE DENSITY vs FREQUENCY AT GAIN = 1, 80Sps

FIGURE 22. NOISE DENSITY vs FREQUENCY AT GAIN = 128, 80Sps

Typical Characteristics (Continued)

9.6

9.8

10.0

10.2

10.4

10.6

10.8

11.0

-40 -10 20 50 80 110

TEMPERATURE (°C)

DATA RATE (Sps)

WORD RATE = 10Sps

100

1000

10000

0.01 0.1 1 10

FREQUENCY (Hz)

NOISE (nV/√Hz)

GAIN = 1, 80Sps

64k FFT

25 AVERAGES

100

0.01 0.1 1 10

FREQUENCY (Hz)

NOISE (nV/√Hz)

GAIN = 128, 80Sps

64k FFT

25 AVERAGES

ISL26132, ISL26134

12 FN6954.1

September 9, 2011

Functional Description

Analog Inputs

The analog signal inputs to the ISL26132 connect to a 2-Channel

differential multiplexer and the ISL26134 connect to a 4-Channel

differential multiplexer (Mux). The multiplexer connects a pair of

inputs to the positive and negative inputs (AINx+, AINx-), selected

by the Channel Select Pins A0 and A1 (ISL26134 only). Input

channel selection is shown in Table 7. On the ISL26132, the

TEMP pin is used to select the Temperature Sensor function.

Whenever the MUX channel is changed (i.e. if any one of the

following inputs - A0/A1, Gain1/0, SPEED is changed), the

digital logic will automatically restart the digital filter and will

cause SDO/RDY to go low only when the output is fully settled.

But if the input itself is suddenly changed, then the user needs to

ignore first four RDY pulses (going low) to get an accurate

measurement of the input signal.

The input span of the ADC is ±0.5 VREF/GAIN. For a 5V VREF and

a gain of 1x, the input span will be 5VP-P fully differential as

shown in Figure 23. Note that input voltages that exceed the

supply rails by more than 100mV will turn on the ESD protection

diodes and degrade measurement accuracy.

If the differential input exceeds well above the +VE or the -VE FS

(by ~1.5x times) the output code will clip to the corresponding FS

value. Under such conditions, the output data rate will become

1/4th of the original value as the Digital State Machine will

RESET the Delta-Sigma Modulator and the Decimation Filter.

Temperature Sensor (ISL26132 only)

When the TEMP pin of the ISL26132 is set High, the input

multiplexer is connected to a pair of diodes, which are scaled in

both size and current. The voltage difference measured between

them corresponds to the temperature of the die according to

Equation 1:

Note: Valid only for GAIN = 1x or 2x

Where T is the temperature of the die, and Gain = the PGA Gain

Setting.

At a temperature of +25°C, the measured voltage will be

approximately 111.7mV. Note that this measurement indicates

only the temperature of the die itself. Applying the result to

correct for the temperature drift of a device external to the

package requires that thermal coupling between the sensor and

the die be taken into account.

Low-Noise Programmable Gain Amplifier

(PGA)

The chopper-stabilized programmable gain amplifier features a

variety of gain settings to achieve maximum dynamic range and

measurement accuracy from popular sensor types with excellent

low noise performance, input offset error, and low drift, and with

minimal external parts count. The GAIN0 and GAIN1 pins allow the

user to select gain settings of 1x, 2x, 64x, or 128x. A block diagram

is shown in Figure 24. The differential input stage provides a gain of

64, which is bypassed when the lower gain settings are selected.

The lower gain settings (1 and 2) will accept inputs with common

mode voltages up to 100mV outside the rails, allowing the device to

accept ground-referred signals. At gain settings of 64 or 128 the

common mode voltage at the inputs is limited to 1.5V inside the

supply rails while maintaining specified measurement accuracy.

TABLE 7. INPUT CHANNEL SELECTION

CHANNEL SELECT PINS ANALOG INPUT PINS SELECTED

A1 A0 AIN+ AIN-

00AIN1+ AIN1-

01AIN2+ AIN2-

10AIN3+ AIN3-

11AIN4+ AIN4-

3.75

2.50

1.25

1.25V

INPUT VOLTAGE RANGE = ±0.5VREF/GAIN

VREF = 5V, GAIN = 1X

3.75

2.50

1.25

AIN+

AIN-

2.50V

FIGURE 23. DIFFERENTIAL INPUT FOR VREF = 5V, GAIN = 1X

V102.2mV(379μV+= ∗T°C())∗Gain (EQ. 1)

ISL26132, ISL26134

13 FN6954.1

September 9, 2011

Filtering PGA Output Noise

The programmable gain amplifier, as shown in Figure 24,

includes a passive RC filter on its output. The resistors are

located inside the chip on the outputs of the differential amplifier

stages. The capacitor (nominally a 100nF C0G ceramic or a PPS

film (Polyphenylene sulfide)) for the filter is connected to the two

CAP pins of the chip. The outputs of the differential amplifier

stages of the PGA are filtered before their signals are presented

to the delta-sigma modulator. This filter reduces the amount of

noise by limiting the signal bandwidth and filters the chopping

artifacts of the chopped PGA stage.

Voltage Reference Inputs (VREF+, VREF-)

The voltage reference for the ADC is derived from the difference

in the voltages presented to the VREF+ and VREF- pins;

VREF = (VREF+ - VREF-). The ADCs are specified with a voltage

reference value of 5V, but a voltage reference as low as 1.5V can

be used. For proper operation, the voltage on the VREF+ pin

should not be greater than AVDD + 0.1V and the voltage on the

VREF- pin should not be more negative than AGND - 0.1V.

Clock Sources

The ISL26132, ISL26134 can operate from an internal oscillator,

an external clock source, or from a crystal connected between

the XTALIN/CLOCK and XTALOUT pins. See the block diagram of

the clock system in Figure 25. When the ADC is powered up, the

CLOCK DETECT block determines if an external clock source is

present. If a clock greater than 300kHz is present on the

XTALIN/CLOCK pin, the circuitry will disable the internal oscillator

on the chip and use the external clock as the clock to drive the

chip circuitry. If the ADC is to be operated from the internal

oscillator, the XTALIN/CLOCK pin should be grounded.

If the ADC is to be operated from a crystal, it should be located

close to the package pins of the ADC. Note that external loading

capacitors for the crystal are not required as there are loading

capacitors built into the silicon, although the capacitor values are

optimized for operation with a 4.9152MHz crystal.

The XTALOUT pin is not intended to drive external circuits.

Digital Filter Characteristics

The digital filter inside the ADC is a fourth-order Siinc filter.

Figures 26 and 27 illustrate the filter response for the ADC when

it is operated from a 4.9152MHz crystal. The internal oscillator is

factory trimmed so the frequency response for the filter will be

much the same when using the internal oscillator. The figures

illustrate that when the converter is operated at 10Sps the digital

filter provides excellent rejection of 50Hz and 60Hz line

interference.

FIGURE 24. SIMPLIFIED PROGRAMMABLE GAIN AMPLIFIER BLOCK DIAGRAM

AINx-

AINx+

ADC

RINT

RF1

RF2

CAP

FIGURE 25. CLOCK BLOCK DIAGRAM

XTALIN/ CRYSTAL

OSCILLATOR

XTALOUT

TO ADC

INTERNAL

OSCILLATOR

CLOCK DETECT

MUX

CLOCK

ISL26132, ISL26134

14 FN6954.1

September 9, 2011

Serial Clock Input (SCLK)

The serial clock input is provided with hysteresis to minimize

false triggering. Nevertheless, care should be taken to ensure

reliable clocking.

Filter Settling Time and ADC Latency

Whenever the analog signal into the ISL26132, ISL26134

converters is changed, the effects of the digital filter must be

taken into account. The filter takes four data ready periods for

the output code to fully reflect a new value at the analog input. If

the multiplexer control input is changed, the modulator and the

digital filter are reset, and the device uses four data ready

periods to fully settle to yield a digital code that accurately

represents the analog input. Therefore, from the time the control

inputs for the multiplexer are changed until the SDO/RDY goes

low, four data ready periods will elapse. The settling time delay

after a multiplexer channel change is listed in Table 8 for the

converter operating in continuous conversion mode.

-50

-100

-150 0 102030405060708090100

FREQUENCY (Hz)

GAIN (dB)

DATA RATE = 10 SPSDATA RATE = 10Sps

FIGURE 26. 10Sps: FREQUENCY RESPONSE OUT TO 100Hz

-50

-60

-70

-80

-90

-100

-110

-120

-130

-140

-150

45 50 55 60 65

FREQUENCY (Hz)

GAIN (dB)

DATA RATE = 10Sps

FIGURE 27. 10Sps: 50/60Hz NOISE REJECTION, 45Hz TO 65Hz

TABLE 8. SETTLING TIME

PARAMETER

DESCRIPTION

(fCLK = 4.9152MHz) MIN MAX UNITS

tSA0, A1, SPEED, Gain1, Gain0 change

set-up time

40 50 µs

t1 Settling time SPEED = 1 54 55 ms

SPEED = 0 404 405 ms

FIGURE 28. SDO/RDY DELAY AFTER MULTIPLEXER CHANGE

SDO/RDY

A0, A1, SPEED, Gain1, Gain0

ISL26132, ISL26134

15 FN6954.1

September 9, 2011

Conversion Data Rate

The SPEED pin is used to select between the 10Sps and 80Sps

conversion rates. The 10Sps rate (SPEED = Low) is preferred in

applications requiring 50/60Hz noise rejection. Note that the

sample rate is directly related to the oscillator frequency, as

491,520 clocks are required to perform a conversion at the

10Sps rate, and 61,440 clocks at the 80Sps rate.

Output Data Format

The 24-bit converter output word is delivered in two’s

complement format. Input exceeding full scale results in a

clipped output which will not return to in-range values until after

the input signal has returned to the specified allowable voltage

range and the digital filter has settled as discussed previously.

Reading Conversion Data from the Serial

Data Output/Ready SDO/RDY Pin

When the ADC is powered, it will automatically begin doing

conversions. The SDO/RDY signal will go low to indicate the

completion of a conversion. After the SDO/RDY signal goes low,

the MSB data bit of the conversion word will be output from the

SDO/RDY pin after SCLK is transitioned from a low to a high.

Each subsequent new data bit is also output on the rising edge of

SCLK (see Figure 30). The receiving device should use the falling

edge of SCLK to latch the data bits. After the 24th SCLK, the

SDO/RDY output will remain in the state of the LSB data bit until

a new conversion is completed. At this time, the SDO/RDY will go

high if low and then go low to indicate that a new conversion

word is available. If not all data bits are read from the SDO/RDY

pin prior to the completion of a new conversion, they will be

overwritten. SCLK should be low during time t6, as shown in

Figure 30, when SDO/RDY is high.

If the user wants the SDO/RDY signal to go high after reading the

24 bits of the conversion data word, a 25th SCLK can be issued.

The 25th SCLK will force the SDO/RDY signal to go high and

remain high until it falls to signal that a new conversion word is

available. Figure 31 illustrates the behavior of the SDO/RDY

signal when a 25th SCLK is used.

FIGURE 29. SDO/RDY DELAY AFTER MULTIPLEXER CHANGE

SDO/RDY

TABLE 9. OUTPUT CODES CORRESPONDING TO INPUT

INPUT SIGNAL OUTPUT CODE (HEX)

≥ + 0.5VREF/GAIN 7FFFFF

(+0.5VREF/GAIN)/(223 - 1) 000001

0 000000

(-0.5VREF/GAIN)/(223 - 1) FFFFFF

≤ - 0.5VREF/GAIN 800000

FIGURE 30. OUTPUT DATA WAVEFORMS USING 24 SCLKS TO READ CONVERSION DATA

SDO/RDY

DATA READYDATA READY

DATA

MSB LSB

NEW DATA READY

23 22 21 0

SCLK

ISL26132, ISL26134

16 FN6954.1

September 9, 2011

Offset Calibration Control

The offset internal to the ADC can be removed by performing an

offset calibration operation. Offset calibration can be initiated

immediately after reading a conversion word with 24 SCLKs by

issuing two additional SCLKs. The offset calibration operation will

begin immediately after the 26th SCLK occurs. Figure 32

illustrates the timing details for the offset calibration operation.

During offset calibration, the analog inputs are shorted internally

and a regular conversion is performed. This conversion generates

a conversion word that represents the offset error. This value is

stored and used to digitally remove the offset error from future

conversion words. The SDO/RDY output will fall to indicate the

completion of the offset calibration operation.

TABLE 10. INTERFACE TIMING CHARACTERISTICS

PARAMETER DESCRIPTION MIN TYP MAX UNITS

t2SDO/RDY Low to first SLK 0 ns

t3SCLK pulsewidth, Low or High 100 ns

t4SCLK High to Data Valid 50 ns

t5Data Hold after SCLK High 0 ns

t6Register Update Time 39 µs

t7Conversion Period SPEED = 1 12.5 ms

SPEED = 0 100 ms

FIGURE 31. OUTPUT DATA WAVEFORMS FOR SDO/RDY POLLING

NEW DATA READY

DATA READY

SDO/RDY

SCLK

23 22 21 0

125

DATA

25TH SCLK FORCES

SDO/RDY HIGH

FIGURE 32. OFFSET CALIBRATION WAVEFORMS

DATA READY AFTER CALIBRATION

CALIBRATION BEGINS

SDO/RDY

SCLK

23 22 21 0 23

24 25 26

FIGURE 33. STANDBY MODE WAVEFORMS

DATA READY

START

CONVERSION

STANDBY MODE

SDO/RDY

SCLK

23 22 21 0

124

t11

t10

TABLE 11. SDO/RDY DELAY AFTER CALIBRATION

PARAMETER MIN MAX UNITS

t8SPEED = 1 108 109 ms

SPEED = 0 808 809 ms

ISL26132, ISL26134

17 FN6954.1

September 9, 2011

Standby Mode Operation

The ADC can be put into standby mode to save power. Standby

mode reduces the power to all circuits in the device except the

crystal oscillator amplifier. To enter the standby mode, take the

SCLK signal high and hold it high after SDO/RDY falls. The

converter will remain in standby mode as long as SCLK is held

high. To return to normal operation, take SCLK back low and wait

for the SDO/RDY to fall to indicate that a new conversion has

completed. Figure 33 and Table 12 illustrate the details of

standby mode.

Supply currents are equal in Standby and Power-down modes

unless a Crystal is used. If the Crystal is used, the Crystal

amplifier is turned ON, even in the standby mode.

Performing Offset Calibration After Standby

Mode

To perform an offset calibration automatically upon returning

from standby, deliver 2 or more additional SCLKs following a

data read cycle, and then set and hold SCLK high. The device will

remain in Standby as long as SCLK remains high. A calibration

cycle will begin once SCLK is brought low again to resume

normal operation. Additional time will be required to perform the

calibration after returning from Standby. Figure 34 and Table 13

illustrate the details of performing offset calibration after

standby mode.

TABLE 12. STANDBY MODE TIMING

PARAMETER DESCRIPTION MIN MAX UNITS

t9SCLK High after

SDO/RDY Low

SPEED = 1 0 12.44 ms

SPEED = 0 0 99.94

t10 Standby Mode Delay SPEED = 1 12.5

SPEED = 0 100

t11 SDO/RDY falling edge

after SCLK Low

SPEED = 1 50 60

SPEED = 0 400 410

TABLE 13. OFFSET CALIBRATION TIMING AFTER STANDY

PARAMETER DESCRIPTION MIN MAX UNITS

t12 SDO/RDY Low after

SCLK Low

SPEED = 1 108 113 ms

SPEED = 0 808 813 ms

FIGURE 34. OFFSET CALIBRATION WAVEFORMS AFTER STANDBY

SDO/RDY

SCLK

23 22 2121 0

12425

STANDBY MODE DATA READY AFTER CALIBRATION

BEGIN

CALIBRATION

t12t10

ISL26132, ISL26134

18 FN6954.1

September 9, 2011

Operation of PDWN

PDWN must transition from low to high after both power supplies

have settled to specified levels in order to initiate a correct

power-up reset (Figure 35). This can be implemented by an

external controller or a simple RC delay circuit, as shown in

Figure 36.

In order to reduce power consumption, the user can assert the

Power-down mode by bringing PDWN Low as shown in Figure 37.

All circuitry is shut down in this mode, including the Crystal

Oscillator. After PDWN is brought High to resume operation, the

reset delay varies depending on the clock source used. While an

external clock source will resume operation immediately, a

circuit utilizing a crystal will incur about a 20 millisecond delay

due to the inherent start-up time of this type of oscillator.

FIGURE 35. POWER-DOWN TIMING RELATIVE TO SUPPLIES

≥10µs

AVDD

DVDD

PDWN

FIGURE 36. PDWNDELAY CIRCUIT

DVDD

1kΩ

2.2nF

CONNECT TO

PDWN PIN

FIGURE 37. POWER-DOWN MODE WAVEFORMS

SDO/RDY

SCLK

t11

PDWN

POWER-DOWN

MODE

START

CONVERSION

DATA

READY

CLK

SOURCE

WAKEUP

t13

t14

TABLE 14. POWER-DOWN RECOVERY TIMING

PARAMETER DESCRIPTION TYP UNITS

t13 Clock Recovery after PDWN

High

Internal Oscillator 7.95 µs

External Clock Source 0.16 µs

4.9152MHz Crystal

Oscillator

5.6 ms

t14 PDWN Pulse Duration 26 µs (min)

ISL26132, ISL26134

19 FN6954.1

September 9, 2011

Applications Information

Power-up Sequence – Initialization and

Configuration

The sequence to properly power-up and initialize the device are

as follows. For details on individual functions, refer to their

descriptions.

1. AVDD, DVDD ramp to specified levels

2. Apply External Clock

3. Pull PDWN High to initiate Reset

4. Device begins conversion

5. SDO/RDY goes low at end of first conversion

OPTIONAL ACTIONS

• Perform Offset Calibration

• Place device in Standby

• Return device from Standby

• Read on-chip Temperature (applicable to ISL26132 only)

Application Examples

WEIGH SCALE SYSTEM

Figure 38 illustrates the ISL26132 connected to a load cell. The

A/D converter is configured for a gain of 128x and a sample rate

of 10Sps. If a load cell with 2mV/V sensitivity is used, the full

scale output from the load cell will be 10mV. On a gain of 128x

and sample rate of 10Sps, the converter noise is 67nVP-P. The

converter will achieve 10mV/67nVP-P = 149,250 noise free

counts across its 10mV input signal. This equates to 14,925

counts per mV of input signal. If five output words are averaged

together this can be improved by √5 to yield √5*14925

counts = 33,370 counts per mV of input signal with an effective

update rate of 2 readings per second.

THERMOCOUPLE MEASUREMENT

Figure 39 illustrates the ISL26132 in a thermocouple

application. As shown, the 4.096V reference combined with the

PGA gain set to 128x sets the input span of the converter to

±16mV. This supports the K type thermocouple measurement for

temperatures from -270°C at -6.485mV to +380°C at about

16mV.

If a higher temperature is preferred, the PGA can be set to 64x to

provide a converter span of ±32mV. The will allow the converter

to support temperature measurement with the K type

thermocouple up to about +765°C.

In the circuit shown, the thermocouple is referenced to a voltage

dictated by the resistor divider from the +5V supply to ground.

These set the common mode voltage at about 2.5V. The 5M

resistors provide a means for detection of an open thermocouple.

If the thermocouple fails open or is not connected, the bias

through the 5M resistors will cause the input to the PGA to go to

full scale.

AVDD

VREF+

CAP

AIN+1

AIN-1

AIN+2

AIN-2

VREF-

AGND DGND

TEMP

SPEED

XTALOUT

PDWN

SCLK

SDO/RDY

GAIN0

GAIN1

DVDD

ISL26132

XTALIN/CLOCK

0.1µF

VDD

MICRO

CONTROLLER

GND

17 2, 5, 6

GAIN = 128

3V5V

0.1µF 18 1

FIGURE 38. WEIGH SCALE APPLICATION

ISL26132, ISL26134

20 FN6954.1

September 9, 2011

PCB Board Layout and System

Configuration

The ISL26132,ISL26134 ADC is a very low noise converter. To

achieve the full performance available from the device will

require attention to the printed circuit layout of the circuit board.

Care should be taken to have a full ground plane without

impairments (traces running through it) directly under the chip

on the back side of the circuit board. The analog input signals

should be laid down adjacent (AIN+ and AIN- for each channel) to

achieve good differential signal practice and routed away from

any traces carrying active digital signals. The connections from

the CAP pins to the off-chip filter capacitor should be short, and

without any digital signals nearby. The crystal, if used should be

connected with relatively short leads. No active digital signals

should be routed near or under the crystal case or near the

traces, which connect it to the ADC. The AGND and DGND pins of

the ADC should be connected to a common solid ground plane.

All digital signals to the chip should be powered from the same

supply, as that used for DVDD (do not allow digital signals to be

active high unless the DVDD supply to the chip is alive). Route all

active digital signals in a way to keep distance from any analog

pin on the device (AIN, VREF, CAP, AVDD). Power on the AVDD

supply should be active before the VREF voltage is present.

PCB layout patterns for the chips (ISL26132 and ISL26134) are

found on the respective package outline drawings on pages 22,

and 23.

AVDD

VREF+

AIN+1

AIN-1

AIN+2

AIN-2

VREF-

AGND DGND

TEMP

SPEED

XTALOUT

PDWN

SCLK

SDO/RDY

GAIN0

GAIN1

DVDD

XTALIN/CLOCK

MICRO

CONTROLLER

17 2, 5, 6

+3V

+5V

0.1µF

18 1

FIGURE 39. THERMOCOUPLE MEASUREMENT APPLICATION

4.9152

MHz

ISL21009

4.096V

10nF

1µF

10k

0.1µF

TYPE K

ISL26132, ISL26134

Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted

in the quality certifications found at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time

without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be

accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN6954.1

September 9, 2011

For additional products, see www.intersil.com/product_tree

Products

Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products

address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.

Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a

complete list of Intersil product families.

For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on

intersil.com: ISL26132, ISL26134

To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff

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Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make

sure you have the latest Rev.

DATE REVISION CHANGE

09/08/11 FN6954.1 Power Supply Requirements on page 6 - AIDD - Analog Supply Current - Normal Mode, AVDD = 5, Gain = 1,2

changed TYP and MAX from “6, 7.3” to “7, 8.5”

Power Dissipation, Total Normal Mode, AVDD = 5, Gain = 1, 2 changed from “43.3” to “49.6” mW (Max)

08/22/11 FN6954.0 Initial Release.

ISL26132, ISL26134

22 FN6954.1

September 9, 2011

Package Outline Drawing

M24.173

24 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)

Rev 1, 5/10

DETAIL "X"

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

SIDE VIEW

END VIEW

Dimension does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.

Dimension does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.25 per side.

Dimensions are measured at datum plane H.

Dimensioning and tolerancing per ASME Y14.5M-1994.

Dimension does not include dambar protrusion. Allowable protrusion

shall be 0.08mm total in excess of dimension at maximum material

condition. Minimum space between protrusion and adjacent lead

is 0.07mm.

Dimension in ( ) are for reference only.

Conforms to JEDEC MO-153.

NOTES:

SEATING PLANE

1 3

PLANE

GAUGE

0.05 MIN

0.15 MAX

0°-8°

0.60± 0.15

0.90

1.00 REF

0.25

SEE DETAIL "X"

0.15

0.25

(0.65 TYP)

(5.65)

(0.35 TYP)

(1.45)

6.40

4.40 ±0.10

0.65

1.20 MAX

PIN #1

I.D. MARK

7.80 ±0.10

+0.05

-0.06

+0.05

-0.10

+0.15

0.20 C B A

0.10 C

0.05

0.10 C B A

ISL26132, ISL26134

23 FN6954.1

September 9, 2011

Package Outline Drawing

M28.173

28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)

Rev 1, 5/10

DETAIL "X"

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

SIDE VIEW

END VIEW

Dimension does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.

Dimension does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.25 per side.

Dimensions are measured at datum plane H.

Dimensioning and tolerancing per ASME Y14.5M-1994.

Dimension does not include dambar protrusion. Allowable protrusion

shall be 0.08mm total in excess of dimension at maximum material

condition. Minimum space between protrusion and adjacent lead

is 0.07mm.

Dimension in ( ) are for reference only.

Conforms to JEDEC MO-153.

NOTES:

SEATING PLANE

1 3

PLANE

GAUGE

0.05 MIN

0.15 MAX

0°-8°

0.60 ±0.15

0.90

1.00 REF

0.25

SEE DETAIL "X"

0.25

(0.65 TYP)

(5.65)

(0.35 TYP)

(1.45)

6.40

4.40 ± 0.10

0.65

1.20 MAX

PIN #1

I.D. MARK

9.70± 0.10

-0.06

0.15 +0.05

-0.10

+0.15

-0.06

+0.05

0.20 C B A

0.10 C

0.05

0.10 C B A