General Description
The MAX9995 dual, high-linearity, downconversion
mixer provides 6.1dB gain, +25.6dBm IIP3, and 9.8dB
NF for WCDMA, TD-SCDMA, LTE, TD-LTE, and
GSM/EDGE base-station applications.
This device integrates baluns in the RF and LO ports, a
dual-input LO selectable switch, an LO buffer, two double-
balanced mixers, and a pair of differential IF output ampli-
fiers. The MAX9995 requires a typical LO drive of 0dBm
and supply current is guaranteed to be below 380mA.
These devices are available in a compact 36-pin TQFN
package (6mm ×6mm) with an exposed pad. Electrical
performance is guaranteed over the extended tempera-
ture range, from TC= -40°C to +85°C.
Applications
Features
o1700MHz to 2700MHz RF Frequency Range
o1400MHz to 2600MHz LO Frequency Range
o40MHz to 350MHz IF Frequency Range
o6.1dB Conversion Gain
o+25.6dBm Input IP3
o9.8dB Noise Figure
o66dBc 2RF - 2LO Spurious Rejection at
PRF = -10dBm
oDual Channels Ideal for Diversity Receiver
Applications
oIntegrated LO Buffer
oIntegrated RF and LO Baluns for Single-Ended
Inputs
oLow -3dBm to +3dBm LO Drive
oBuilt-In SPDT LO Switch with 50dB LO1 - LO2
Isolation and 50ns Switching Time
o44dB Channel-to-Channel Isolation
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
________________________________________________________________
Maxim Integrated Products
1
19-3383; Rev 1; 3/11
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
cdma2000 is a registered trademark of Telecommunications
Industry Association.
Ordering Information
PART TEMP RANGE PIN-PACKAGE
MAX9995ETX+ TC* = -40°C to +85°C 36 TQFN-EP**
MAX9995ETX+T TC* = -40°C to +85°C 36 TQFN-EP**
+Denotes a lead(PB)-free and RoHS-compliant package.
*
TC= Case temperature.
**
EP = Exposed pad.
T = Tape and reel.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18 28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27 LO2
VCC
GND
VCC
GND
GND
TAPDIV
TAPMAIN
RFMAIN
RFDIV
EXPOSED
PAD*
IFD_SET
GND
IND_EXTD
LO_ADJ_D
N.C.
V
CC
V
CC
N.C.
LO_ADJ_M
V
CC
IND_EXTM
GND
IFM_SET
IFD+
IFD-
V
CC
IFM+
IFM-
LO1
LOSEL
GND
GND
GND
GND
GND
VCC
MAX9995
*EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
6mm x 6mm TQFN
TOP VIEW
Pin Configuration/
Functional Diagram
WCDMA, TD-SCDMA,
and cdma2000®3G
Base Stations
LTE and TD-LTE
Base Stations
GSM/EDGE
Base Stations
PHS/PAS Base Stations
Fixed Broadband
Wireless Access
Wireless Local Loop
Private Mobile Radio
Military Systems
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC ........................................................................-0.3V to +5.5V
LO1, LO2 to GND ...............................................................±0.3V
IFM_, IFD_, IFM_SET, IFD_SET, LOSEL,
LO_ADJ_M, LO_ADJ_D to GND.............-0.3V to (VCC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ..........................+20dBm
RFMAIN, RFDIV Current
(RF is DC shorted to GND through balun) ......................50mA
Continuous Power Dissipation (Note 1) ...............................8.8W
Operating Temperature Range (Note 2).....TC= -40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, no input RF or LO signals applied, VCC = 4.75V to 5.25V, TC= -40°C to +85°C. Typical values are at VCC
= 5.0V, TC= +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 4.75 5 5.25 V
Total supply current 332 380
VCC (pin 16) 82 90
VCC (pin 30) 97 110
IFM+/IFM- (total of both) 70 90
Supply Current ICC
IFD+/IFD- (total of both) 70 90
mA
LOSEL Input High Voltage VIH 2V
LOSEL Input Low Voltage VIL 0.8 V
LOSEL Input Current IIL and IIH -10 +10 µA
Note 1: Based on junction temperature TJ= TC+ (θJC x VCC x ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details. The junction
temperature must not exceed +150°C.
Note 2: TCis the temperature on the exposed pad of the package. TAis the ambient temperature of the device and PCB.
TQFN
Junction-to-Ambient Thermal Resistance (θJA)
(Note 3, 4) ....................................................................38°C/W
Junction-to-Case Thermal Resistance (θJC)
(Note 1, 4) ...................................................................7.4°C/W
PACKAGE THERMAL CHARACTERISTICS
Note 3: Junction temperature TJ= TA+ (θJAx VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency Range fRF (Note 5) 1700 2700 MHz
LO Frequency Range fLO (Note 5) 1400 2600 MHz
IF Frequency Range fIF (Note 5) 40 350 MHz
LO Drive Level PLO (Note 5) -3 +3 dBm
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 3
AC ELECTRICAL CHARACTERISTICS—fRF = 1700MHz TO 2200MHz
(
Typical Application Circuit,
VCC = 4.75V to 5.25V, RF and LO ports are driven from 50Ωsources, PLO = -3dBm to +3dBm, fRF =
1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, with fRF > fLO, TC= -40°C to +85°C. Typical values are at VCC =
5.0V, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, and TC= +25°C, unless otherwise noted.) (Notes 6, 7)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT
fRF = 1710MHz to 1875MHz 6
fRF = 1850MHz to 1910MHz 6.2
Conversion Gain GC
fRF = 2110MHz to 2170MHz 6.1
dB
fRF = 1710MHz to 1875MHz ±0.5 ±1
fRF = 1850MHz to 1910MHz ±0.5 ±1
Gain Variation from Nominal
VCC = 5.0V,
TC = +25°C,
PLO = 0dBm,
PRF = -10dBm
(Note 8) fRF = 2110MHz to 2170MHz ±0.5 ±1
dB
Gain Variation with Temperature ±0.75 dB
fRF = 1710MHz to 1875MHz 9.7
fRF = 1850MHz to 1910MHz 9.8
Noise Figure NF No blockers
present fRF = 2110MHz to 2170MHz 9.9
dB
Noise Figure (with Blocker)
8dBm blocker tone applied to RF port at
2000MHz, fRF = 1900MHz, fLO = 1710MHz, PLO
= -3dBm
22 dB
Input 1dB Compression Point P1dB (Note 8) 9.5 12.6 dBm
Input Third-Order Intercept Point IIP3 (Notes 8, 9) 23 25.6 dBm
PRF = -10dBm 66
2RF - 2LO Spur Rejection 2 x 2
fRF = 1900MHz,
fLO = 1700MHz,
fSPUR = 1800MHz (Note 8) PRF = -5dBm 61
dBc
PRF = -10dBm 70 88
3RF - 3LO Spur Rejection 3 x 3
fRF = 1900MHz,
fLO = 1700MHz,
fSPUR = 1766.7MHz (Note 8) PRF = -5dBm 60 78
dBc
Maximum LO Leakage at RF Port fLO = 1400MHz to 2000MHz -29 dBm
M axi m um 2LO Leakag e at RF P or tf
LO = 1400MHz to 2000MHz -17 dBm
Maximum LO Leakage at IF Port fLO = 1400MHz to 2000MHz -25 dBm
Minimum RF-to-IF Isolation fRF = 1700MHz to 2200MHz, fIF = 200MHz 37 dB
LO1 - LO2 Isolation PLO1 = 0dBm, PLO2 = 0dBm (Note 10) 40 50.5 dB
Minimum Channel-to-Channel
Isolation
PRF = -10dBm, RFMAIN (RFDIV)
power measured at IFDIV (IFMAIN),
relative to IFMAIN (IFDIV),
all unused ports terminated at 50Ω
40 44 dB
LO Switching Time 50% of LOSEL to IF settled to within 2° 50 ns
RF Return Loss 14 dB
LO port selected 18
LO Return Loss LO port unselected 21 dB
IF Return Loss LO driven at 0dBm, RF terminated into 50Ω
(Note 11) 21 dB
CONVERSION GAIN vs. RF FREQUENCY
MAX9995 toc01
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
2100200019001800
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
3.0
1700 2200
TC = -20°C
TC = +85°C
TC = +25°C
CONVERSION GAIN vs. RF FREQUENCY
MAX9995 toc02
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
2100200019001800
5.6
5.7
5.8
5.9
6.0
6.1
6.2
6.3
6.4
6.5
5.5
1700 2200
PLO = -3dBm to +3dBm
CONVERSION GAIN vs. RF FREQUENCY
MAX9995 toc03
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
2100200019001800
5.6
5.7
5.8
5.9
6.0
6.1
6.2
6.3
6.4
6.5
5.5
1700 2200
VCC = 4.75V
VCC = 5.0V
VCC = 5.25V
Typical Operating Characteristics
(
Typical Application Circuit
, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
4 _______________________________________________________________________________________
Note 5: Operation outside this frequency band is possible but has not been characterized. See the
Typical Operating Characteristics
.
Note 6: Guaranteed by design and characterization.
Note 7: All limits reflect losses of external components. Output measurements taken at IF outputs of
Typical Application Circuit
.
Note 8: Production tested.
Note 9: Two tones 3MHz spacing, -5dBm per tone at RF port.
Note 10: Measured at IF port at IF frequency. fLO1 and fLO2 are offset by 1MHz.
Note 11: IF return loss can be optimized by external matching components.
AC ELECTRICAL CHARACTERISTICS—fRF = 2540MHz
(
Typical Application Circuit
, RF and LO ports are driven from 50Ωsources, fRF > fLO, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF =
2540MHz, fLO = 2400MHz, fIF = 140MHz, TC= +25°C, unless otherwise noted.) (Note 7)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Conversion Gain GC5.2 dB
Input Third-Order Intercept Point IIP3 Two tones: fRF1 = 2540MHz, fRF2 = 2541MHz,
PRF = -5dBm/tone 24.6 dBm
PRF = -10dBm 58
2RF - 2LO Spurious Response 2 x 2 PRF = -5dBm 63 dBc
PRF = -10dBm 72
3RF - 3LO Spurious Response 3 x 3 PRF = -5dBm 82 dBc
LO Leakage at IF Port -45 dBm
RF-to-IF Isolation 49 dB
Channel-to-Channel Isolation
PRF = -10dBm, RFMAIN (RFDIV) power
measured at IFDIV (IFMAIN), relative to IFMAIN
(IFDIV), all unused ports terminated at 50Ω
48 dB
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________
5
INPUT IP3 vs. RF FREQUENCY
IIP3 (dBm)
24.8
25.2
25.6
26.0
26.4
26.8
24.4
MAX9995 toc04
RF FREQUENCY (MHz)
21002000190018001700 2200
TC = +85°C
TC = -20°C
TC = +25°C
2RF - 2LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc07
2RF - 2LO (dBc)
35
40
45
50
55
60
65
70
75
30
FUNDAMENTAL FREQUENCY (MHz)
21002000190018001700 2200
TC = +85°C
TC = +25°C
TC = -20°C
PRF = -5dBm
25.4
25.6
25.8
26.0
26.2
26.4
26.6
25.2
INPUT IP3 vs. RF FREQUENCY
IIP3 (dBm)
MAX9995 toc05
RF FREQUENCY (MHz)
21002000190018001700 2200
PLO = 0dBm
PLO = +3dBm
PLO = -3dBm
INPUT IP3 vs. RF FREQUENCY
IIP3 (dBm)
25.0
25.4
25.8
26.2
26.6
27.0
24.6
MAX9995 toc06
RF FREQUENCY (MHz)
21002000190018001700 2200
VCC = 5.25V
VCC = 4.75V VCC = 5.0V
52
54
56
58
62
60
64
66
50
2RF - 2LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc08
2RF - 2LO (dBc)
FUNDAMENTAL FREQUENCY (MHz)
21002000190018001700 2200
PLO = -3dBm
PLO = +3dBm
PLO = 0dBm
PRF = -5dBm
52
54
56
58
62
60
64
66
50
2RF - 2LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc09
2RF - 2LO (dBc)
FUNDAMENTAL FREQUENCY (MHz)
21002000190018001700 2200
VCC = 4.75V
VCC = 5.0V
VCC = 5.25V
PRF = -5dBm
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
72
74
76
78
80
82
84
86
88
90
70
3RF - 3LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc10
3RF - 3LO (dBc)
FUNDAMENTAL FREQUENCY (MHz)
21002000190018001700 2200
TC = -20°C
TC = +25°C
TC = +85°C
PRF = -5dBm
74
76
78
80
84
82
86
88
72
3RF - 3LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc11
3RF - 3LO (dBc)
FUNDAMENTAL FREQUENCY (MHz)
21002000190018001700 2200
PLO = -3dBm PLO = 0dBm
PLO = +3dBm
PRF = -5dBm
74
76
78
80
84
82
86
88
72
3RF - 3LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc12
3RF - 3LO (dBc)
FUNDAMENTAL FREQUENCY (MHz)
21002000190018001700 2200
VCC = 5.0V
VCC = 5.25V
VCC = 4.75V
PRF = -5dBm
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
6 _______________________________________________________________________________________
CHANNEL ISOLATION vs. RF FREQUENCY
CHANNEL ISOLATION (dB)
30
40
50
60
70
80
20
MAX9995 toc19
RF FREQUENCY (MHz)
21002000190018001700 2200
TC = +85°CTC = +25°C
TC = -20°C
CHANNEL ISOLATION vs. RF FREQUENCY
CHANNEL ISOLATION (dB)
40
50
60
70
80
90
30
MAX9995 toc20
RF FREQUENCY (MHz)
21002000190018001700 2200
PLO = 0dBm
PLO = +3dBm
PLO = -3dBm
CHANNEL ISOLATION vs. RF FREQUENCY
CHANNEL ISOLATION (dB)
40
50
60
70
80
90
30
MAX9995 toc21
RF FREQUENCY (MHz)
21002000190018001700 2200
VCC = 4.75V VCC = 5.0V
VCC = 5.25V
INPUT P1dB vs. RF FREQUENCY
INPUT P1dB (dBm)
12.8
13.2
13.6
14.0
14.4
12.4
MAX9995 toc13
RF FREQUENCY (MHz)
21002000190018001700 2200
TC = +25°CTC = +85°C
TC = -20°C
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9995 toc16
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
19001800170016001500
46
47
48
49
50
51
52
53
54
55
45
1400 2000
TC = -20°C
TC = +25°C
TC = +85°C
13.0
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
12.9
INPUT P1dB vs. RF FREQUENCY
INPUT P1dB (dBm)
MAX9995 toc14
RF FREQUENCY (MHz)
21002000190018001700 2200
PLO = 0dBm
PLO = -3dBm
PLO = +3dBm
12.6
12.8
13.0
13.2
13.4
13.6
13.8
14.0
14.2
14.4
12.4
INPUT P1dB vs. RF FREQUENCY
INPUT P1dB (dBm)
MAX9995 toc15
RF FREQUENCY (MHz)
21002000190018001700 2200
VCC = 5.25V
VCC = 4.75V
VCC = 5.0V
48
49
50
51
52
53
54
47
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9995 toc17
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
190018001700160015001400 2000
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
48
49
50
51
52
53
54
47
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9995 toc18
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
190018001700160015001400 2000
VCC = 4.75V TO 5.25V
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________
7
-55
-50
-45
-40
-30
-35
-25
-20
-60
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9995 toc22
LO LEAKAGE AT IF PORT (dBm)
LO FREQUENCY (MHz)
1800 19001700160015001400 2000
TC = -20°C
TC = +85°CTC = +25°C
-50
-45
-40
-30
-35
-25
-20
-55
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9995 toc25
LO LEAKAGE AT RF PORT (dBm)
LO FREQUENCY (MHz)
1800 1900
1700160015001400 2000
TC = -20°C
TC = +85°C
TC = +25°C
-50
-45
-40
-35
-30
-25
-55
LO LEAKAGE AT IF PORT vs. LO FREQUENC
Y
MAX9995 toc23
LO LEAKAGE AT IF PORT (dBm)
LO FREQUENCY (MHz)
1800 19001700160015001400 2000
PLO = -3dBm
PLO = +3dBm PLO = 0dBm
-45
-40
-35
-30
-25
-50
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9995 toc24
LO LEAKAGE AT IF PORT (dBm)
LO FREQUENCY (MHz)
1800 19001700160015001400 2000
VCC = 5.25V
VCC = 4.75V
VCC = 5.0V
-45
-40
-35
-30
-25
-20
-50
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9995 toc26
LO LEAKAGE AT RF PORT (dBm)
LO FREQUENCY (MHz)
1800 19001700160015001400 2000
PLO = +3dBm
PLO = -3dBm PLO = 0dBm -55
-50
-45
-40
-30
-35
-25
-20
-60
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
LO LEAKAGE AT RF PORT (dBm)
LO FREQUENCY (MHz)
1800 19001700160015001400 2000
VCC = 4.75V TO 5.25V
MAX9995 toc27
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
39
40
41
42
43
44
45
38
RF-TO-IF ISOLATION vs. RF FREQUENCY
RF-TO-IF ISOLATION (dB)
MAX9995 toc28
RF FREQUENCY (MHz)
21002000190018001700 2200
TC = +85°C
TC = -20°C
TC = +25°C
37
39
38
40
41
43
42
45
44
46
36
RF-TO-IF ISOLATION vs. RF FREQUENCY
RF-TO-IF ISOLATION (dB)
MAX9995 toc29
RF FREQUENCY (MHz)
21002000190018001700 2200
PLO = -3dBm TO +3dBm
40.0
40.5
41.0
41.5
42.0
42.5
43.0
39.5
RF-TO-IF ISOLATION vs. RF FREQUENCY
RF-TO-IF ISOLATION (dB)
MAX9995 toc30
RF FREQUENCY (MHz)
21002000190018001700 2200
VCC = 5.25V
VCC = 4.75V
VCC = 5.0V
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
8 _______________________________________________________________________________________
LO RETURN LOSS vs. LO FREQUENCY
(LO INPUT UN SELECTED)
MAX9995 toc37
LO FREQUENCY (MHz)
LO RETURN LOSS (dB)
19001800170016001500
30
25
20
15
10
5
0
35
1400 2000
PLO = -3dBm TO +3dBm
310
330
325
320
315
340
335
360
355
350
345
365
-20-5102540557085
SUPPLY CURRENT vs. TEMPERATURE (TC)
MAX9995 toc38
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
VCC = 5.25V
VCC = 4.75V
VCC = 5.0V
NOISE FIGURE vs. RF FREQUENCY
MAX9995 toc31
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
210020001800 1900
7
8
9
10
12
11
13
14
6
1700 2200
TC = +85°CTC = +25°C
TC = -20°C
RF RETURN LOSS (dB)
25
20
15
10
5
0
30
RF RETURN LOSS vs. RF FREQUENCY
MAX9995 toc34
RF FREQUENCY (MHz)
210020001800 19001700 2200
PLO = -3dBm TO +3dBm
9.7
9.8
9.9
10.0
10.1
10.2
9.6
NOISE FIGURE vs. RF FREQUENCY
MAX9995 toc32
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
210020001800 19001700 2200
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
9.6
9.7
9.8
9.9
10.0
10.1
10.2
10.3
10.4
10.5
9.5
NOISE FIGURE vs. RF FREQUENCY
MAX9995 toc33
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
210020001800 19001700 2200
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
IF RETURN LOSS vs. IF FREQUENCY
MAX9995 toc35
IF FREQUENCY (MHz)
IF RETURN LOSS (dB)
320280200 240120 16080
40
35
30
25
20
15
10
5
0
45
40 360
LO RETURN LOSS vs. LO FREQUENCY
(LO INPUT SELECTED)
MAX9995 toc36
LO FREQUENCY (MHz)
LO RETURN LOSS (dB)
19001800170016001500
20
15
10
5
0
25
1400 2000
PLO = +3dBm
PLO = 0dBm
PLO = -3dBm
Typical Operating Characteristics (continued)
(
Typical Application Circuit
, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 9
PIN NAME FUNCTION
1 RFMAIN Main Channel RF Input. Internally matched to 50Ω. Requires an input DC-blocking capacitor.
2 TAPMAIN Main Channel Balun Center Tap. Connect a 0.033µF capacitor from this pin to the board ground.
3, 5, 7, 12, 20, 22,
24, 25, 26, 34 GND Ground
4, 6, 10, 16, 21, 30,
36 VCC Power Supply. Connect bypass capacitors as close as possible to the pin (see the Typical
Application Circuit).
8 TAPDIV Diversity Channel Balun Center Tap. Connect a 0.033µF capacitor from this pin to the ground.
9 RFDIV Diversity Channel RF Input. Internally matched to 50Ω. Requires an input DC-blocking capacitor.
11 IFD_SET IF Diversity Amplifier Bias Control. Connect a 1.2kΩ resistor from this pin to ground to set the
bias current for the diversity IF amplifier.
13, 14 IFD+, IFD- Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC
(see the Typical Application Circuit).
15 IND_EXTD Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation.
17 LO_ADJ_D LO Diversity Amplifier Bias Control. Connect a 392Ω resistor from this pin to ground to set the
bias current for the diversity LO amplifier.
18, 28 N.C. No Connection. Not internally connected.
19 LO1 Local Oscillator 1 Input. This input is internally matched to 50Ω. Requires an input DC-blocking
capacitor.
23 LOSEL Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2.
27 LO2 Local Oscillator 2 Input. This input is internally matched to 50Ω. Requires an input DC-blocking
capacitor.
29 LO_ADJ_M LO Main Amplifier Bias Control. Connect a 392Ω resistor from this pin to ground to set the bias
current for the main LO amplifier.
31 IND_EXTM Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation.
32, 33 IFM-, IFM+ Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC
(see the Typical Application Circuit).
35 IFM_SET IF Main Amplifier Bias Control. Connect a 1.2kΩ resistor from this pin to ground to set the bias
current for the main IF amplifier.
—EP
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses
multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These
multiple via grounds are also required to achieve the noted RF performance.
Pin Description
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
10 ______________________________________________________________________________________
Detailed Description
The MAX9995 dual, high-linearity, downconversion
mixer provides 6.1dB gain and +25.6dBm IIP3, with a
9.8dB noise figure. Integrated baluns and matching cir-
cuitry allow 50Ωsingle-ended interfaces to the RF and
LO ports. A single-pole, double-throw (SPDT) LO
switch provides 50ns switching time between LO
inputs, with 50dB LO-to-LO isolation. Furthermore, the
integrated LO buffer provides a high drive level to the
mixer core, reducing the LO drive required at the
MAX9995’s inputs to -3dBm. The IF port incorporates a
differential output, which is ideal for providing
enhanced 2RF - 2LO performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in WCDMA, TD-SCDMA, LTE,
TD-LTE, and GSM/EDGE base stations. The MAX9995
is specified to operate over an RF input range of
1700MHz to 2700MHz, an LO range of 1400MHz to
2600MHz, and an IF range of 40MHz to 350MHz.
Operation beyond this is possible; however, perfor-
mance is not characterized. This device is available in
a compact 6mm x 6mm, 36-pin TQFN package with an
exposed pad.
RF Input and Balun
The MAX9995’s two RF inputs (RFMAIN and RFDIV) are
internally matched to 50Ω, requiring no external match-
ing components. DC-blocking capacitors are required
as the inputs are internally DC shorted to ground
through the on-chip baluns. Input return loss is typically
14dB over the entire RF frequency range of 1700MHz
to 2700MHz.
LO Input, Switch, Buffer, and Balun
The mixers can be used for either high-side or low-side
injection applications with an LO frequency range of
1400MHz to 2600MHz. As an added feature, the
MAX9995 includes an internal LO SPDT switch that can
be used for frequency-hopping applications. The
switch selects one of the two single-ended LO ports,
allowing the external oscillator to settle on a particular
frequency before it is switched in. LO switching time is
typically less than 50ns, which is more than adequate
for virtually all GSM applications. If frequency hopping
is not employed, set the switch to either of the LO
inputs. The switch is controlled by a digital input
(LOSEL): logic-high selects LO1, and logic-low selects
LO2. LO1 and LO2 inputs are internally matched to
50Ω, requiring only a 22pF DC-blocking capacitor.
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifica-
tions are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF out-
puts are integrated on-chip.
High-Linearity Mixers
The core of the MAX9995 is a pair of double-balanced,
high-performance passive mixers. Exceptional linearity
is provided by the large LO swing from the on-chip LO
buffer. When combined with the integrated IF ampli-
fiers, the cascaded IIP3, 2RF - 2LO rejection, and NF
performance is typically +25.6dBm, 66dBc, and 9.8dB,
respectively.
Differential IF Output Amplifiers
The MAX9995 mixers have an IF frequency range of
40MHz to 350MHz. The differential, open-collector IF
output ports require external pullup inductors to VCC.
Note that these differential outputs are ideal for provid-
ing enhanced 2RF - 2LO rejection performance. Single-
ended IF applications require a 4:1 balun to transform
the 200Ωdifferential output impedance to a 50Ωsingle-
ended output. After the balun, VSWR is typically 1.5:1.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω.
No matching components are required. Return loss at
each RF port is typically 14dB over the entire input
range (1700MHz to 2700MHz), and return loss at the
LO ports is typically 18dB (1400MHz to 2000MHz). RF
and LO inputs require only DC-blocking capacitors for
interfacing.
The IF output impedance is 200Ω(differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ωsingle-
ended output (see the
Typical Application Circuit
).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning the resistors (R1, R2, R4, and
R5). If reduced current is required at the expense of per-
formance, contact the factory. If the ±1% bias resistor
values are not readily available, substitute standard ±5%
values.
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 11
INDEXTM and INDEXTD Inductors
Short INDEXTM and INDEXTD to ground using 0Ω
resistors. For applications requiring improved RF-to-IF
and LO-to-IF isolation, use 10nH inductors (L3 and L6)
in place of the 0Ωresistors. However, to ensure stable
operation, the mixer IF ports must be presented with
low common-mode load impedance. Contact the facto-
ry for details. Since approximately 100mA flows through
INDEXTM and INDEXTD, it is important to use low-DCR
wire-wound inductors.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
For the best performance, route the ground pin traces
directly to the exposed pad under the package. The
PCB exposed pad MUST be connected to the ground
plane of the PCB. It is suggested that multiple vias be
used to connect this pad to the lower-level ground
planes. This method provides a good RF/thermal-con-
duction path for the device. Solder the exposed pad on
the bottom of the device package to the PCB. The
MAX9995 evaluation kit can be used as a reference for
board layout. Gerber files are available upon request at
www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each VCC pin with a
capacitor as close as possible to the pin (
Typical
Application Circuit
).
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX9995’s 36-pin TQFN-
EP package provides a low thermal-resistance path to
the die. It is important that the PCB on which the
MAX9995 is mounted be designed to conduct heat
from the EP. In addition, provide the EP with a low-
inductance path to electrical ground. The EP MUST be
soldered to a ground plane on the PCB, either directly
or through an array of plated via holes.
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
36 TQFN-EP T3666+2 21-0141 90-0049
Chip Information
PROCESS: SiGe BiCMOS
Table 1. Component Values
COMPONENT VALUE DESCRIPTION
C1, C8 4pF Microwave capacitors (0402)
C2, C7 10pF Microwave capacitors (0402)
C3, C6 0.033µF Microwave capacitors (0603)
C4, C5, C14, C16 22pF Microwave capacitors (0402)
C9, C13, C15,
C17, C18 0.01µF Microwave capacitors (0402)
C10, C11, C12,
C19, C20, C21 150pF Microwave capacitors (0603)
L1, L2, L4, L5 330nH Wire-wound high-Q inductors
(0805)
L3, L6 10nH Wire-wound high-Q inductors
(0603)
R1, R4 1.21kΩ±1% resistors (0402)
R2, R5 392Ω±1% resistors (0402)
R3, R6 10Ω±1% resistors (1206)
T1, T2 4:1
(200:50) IF baluns
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
12 ______________________________________________________________________________________
RF MAIN INPUT
RF DIV INPUT
C2C3
C1
C8
C9
C13
C17
C18
R1
VCC
L2
L1
R3
C20
C19
IF MAIN OUTPUT
T1
C16
R2
L3
LO2
C14
LO1
4:1
4:1
VCC
VCC
VCC
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18 28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27 LO2
VCC
GND
VCC
GND
GND
TAPDIV
TAPMAIN
RFMAIN
RFDIV
EXPOSED
PAD
IFD_SET
GND
IND_EXTD
LO_ADJ_D
N.C.
V
CC
V
CC
N.C.
LO_ADJ_M
V
CC
IND_EXTM
GND
IFM_SET
IFD+
IFD-
V
CC
IFM+
IFM-
LO1
LOSEL
GND
GND
GND
GND
GND
VCC
MAX9995
C4
C7C6
C5
VCC
VCC
C21
LO SELECT
C15
VCC
R5
R4
VCC
L4
L5
R6
L6
C10
C11
T2
IF DIV OUTPUT
C12
Typical Application Circuit
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
13
© 2011 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 8/04 Initial release —
1 3/11 Updated the band coverage throughout the data sheet 1–13
