F-219 SUPPLEMENT MB1-130-01-F-S-01-SL-N MB1-130-01-F-S-01-SL (1.00 mm) .0394" MB1 SERIES MINI EDGE CARD SOCKET WITH GUIDES Choice of two card thicknesses Mates with: (0.80 mm) .031" PCB, (1.60 mm) .062" PCB SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MB1 Insulator Material: Black LCP Contact Material: BeCu Plating: Sn or Au over 50 " (1.27 m) Ni Current Rating: 2.2 A per pin (6 pins powered) Operating Temp Range: -55 C to +125 C Insertion Depth: (5.26 mm) .207" to (6.10 mm) .240" RoHS Compliant: Yes (5.44 mm) .214" (1.00 mm) .03937" pitch PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (20-30) (0.15 mm) .006" max (40-50)* *(.004" stencil solution may be available; contact IPG@samtec.com) 1 MB1 NO. OF PINS 01 PLATING OPTION CARD SLOT S RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality = Gold flash on contact, Matte Tin on tail (No. of Positions + 2) x (1.00) .03937 + (4.06) .160 FILE NO. E111594 Specify CARD SLOT from chart -F 20, 30, 40, 50 -L (3.81) .150 = 10 " (0.25 m) Gold on contact, Matte Tin on tail ALSO AVAILABLE SL CARD SLOT -01 (MOQ Required) -02 * Other platings -N = No Card Guides MATES WITH BOARD THICKNESS (0.97) (0.80) .038 .031 (1.83) (1.60) .072 .062 A (25.5) 1.004 (7.24) .285 (7.24) .285 -N OPTION 01 (1.00) .03937 50 (0.36) .014 (1.27) .050 (No. of Positions + 2) x (1.00) .03937 (1.52) .060 Notes: Patented Some sizes, styles and options are non-standard, non-returnable. OTHER OPTION (5.44) .214 (1.27) .050 DIA A (0.15) .006 (0.69) .027 (2.36) .093 Important Note: Samtec recommends that pads on the mating board be Gold plated. Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec's specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply. (1.27) .050