Ferrite Chip EMI Suppressors ACB Series The ferrite chip EMI suppressor is a chip type ferrite bead for use as a measure to prevent EMI interference noises between electronic circuits. The ACB series is high density SMD type. FEATURES e Three materials and four shapes are available, covering wide frequency bands. Any of the series, when properly selected, provides EMI prevention in a wide variety of circuits. Small type having a higher impedance per volume because of its structure based on our unique device. Highly effective in designing a higher density circuit. e The form and size are in accordance with the EIAJ standard. This facilitates surface mounting by an existing automatic mounter. * Excellent in physical properties, such as terminal strength, flexure strength, bending strength, solder heat resistance, and solderability. Applicable to both of reflow and flow soldering processes. PRODUCT IDENTIFICATION HF70 ACB 201209 [] (1) =) (3) (4) (1) Material name Materialname = HF70_HFSOHF3O pi 1500 250 46 Temperature coefficient 1to3 9to 15 5 to 15 ai (x 10~6/C) _ - a Bms (mT) 280 290 320 at H [A/m] [1600] __ [1600] 7 [4000] Te (C) min. 100 125 300 6 (Q-m) 108 106 105 * 1 (mT) = 10 (G), 1 (A/m) = 0.012566 (Oe) (2) Series name (3) Dimensions L x W x T (mm) [inches] 201209 2.0x 1.25x0.9[.079x.049x.035] d S161 3.2 1.61.1 [126 x.069x.043] oo? d 322513 3.2x2.5x1.3[.126x.098x.051] go sd D> 453215 4.5 3.2x 1.5 [.177 x 126 x .059] SOs (4) Packaging style e068 T ______Taping ($178 mm [7.008 inches] reel) oes TL -__ Taping (330 mm [12.992 inches] reel) goo o o@ B Bulk oDeP 186Ferrite Chip EMI Suppressors ACB Series ACB201209 TYPE SHAPES AND DIMENSIONS/CIRCUIT/RECOMMENDED PC BOARD PATTERN 240.2 [.079+ .008 Terminal electrode 1.25+0.2 [.049 + .008] Ferrite YY o 1 [.039] 0.3+0.2 [.012 + .008] my No directionality Insulation resin eo? 0.9+0.2 [.035 + 008} ELECTRICAL CHARACTERISTICS Impedance DC resistance Rated Part No- {SOOMHz] (Q) max. (ima) max. HF70ACB201209-()* 10+ 25% 0.1 600 HF50ACB201209-L) 11+25% 0.1 600 HF30ACB201209-(] 7+25% 0.1 600 *(]: Please specify the packaging style (T: 6178 mm [7.008 inches] reel taping, TL: 6330 mm [12.992 inches] reel taping, 8: Bulk) TYPICAL ELECTRICAL CHARACTERISTICS |Z|, Xt, R vs. FREQUENCY CHARACTERISTICS HF70ACB201209 Test RF 100 YHP4191 10 |Z], Xt, R(Q) 0.1 1 10 100 Frequency (MHz) 1 1 1 [039] [.039] [.039] eApplicable to reflow and flow solderings. Dimensions in mm [inches} HF50ACB201209 Test equipment: RF YHP4191 = 10 S oc x N 1 0.1 1 10 100 Frequency (MHz) HF30ACB201209 Test equipment: RF 100 = 10 S iva x N 1 0.1 1 10 100 1000 Frequency (MHz) 187Ferrite Chip EMI Suppressors ACB Series ACB321611 TYPE SHAPES AND DIMENSIONS/CIRCUIT/RECOMMENDED PC BOARD PATTERNS 3.2+0.2 [.126 + .008] - ad Terminal 5 ., _ | electrode oo Ferrite 8, 0.340.2[.012+ .008 " I ~ 008 *No directionality N | y Insulati 5; oO! nsulation ret DP ELECTRICAL CHARACTERISTICS Part No. Qe one baent [100MHz] (mA) max. HF70ACB321611-| 1* 26+25% 0.2 = 500 HF50ACB321611-.] 31+25% 0.2 |= 500 HF30ACB321611-L! 19425% 0.2 500 *| 1: Please specify the packaging style (T: 6178 mm [7.008 inches] reel taping, TL: $330 mm [12.992 inches] reel taping, B: Bulk) TYPICAL ELECTRICAL CHARACTERISTICS |Z|, Xt, R vs. FREQUENCY CHARACTERISTICS HF70ACB321611 oT TTT 7 Test RF 100 oa YHP4191A 10} --- a x N { ol. tod . 1 10 100 1000 Frequency (MHz) 188 (Z|, Xt, R (Q) | 1.4 : eg ee} [.055] a itt 22 | 44) [.043] [.087] [.043] Applicable to reflow and flow solderings. Dimensions in mm [inches] HF50ACB321611 Test equipment: RF 100 YHP4191 @ 10 iva x N 1 0.1 1 10 100 1 Frequency (MHz) HF30ACB321611 Test RF YHP4191A 1 10 100 1000 Frequency (MHz)Ferrite Chip EMI Suppressors ACB Series ACB322513 TYPE SHAPES AND DIMENSIONS/CIRCUIT/RECOMMENDED PC BOARD PATTERNS 3.2+0.2[.126 + .008] n g Terminal = of, electrode +1 +t) o- wo . a Ferrite a i rere No directionality 0.3+0.2 [.012 + .008} Insulation resin ELECTRICAL CHARACTERISTICS | geod HS 1.3+02 [.054 + .008) Part No. ree? DC resistance Baten [10OMHz} _s2) Max. (mA) max. HF70ACB322513-! |* 52+25% 0.3 400 HF50ACB322513-|| 60+25% 03 400 HF30ACB322513-.] 31+25% 03 400 "| |: Please specify the packaging style (T: 6178 mm [7.008 inches] reel taping, TL: 6330 mm [12.992 inches] reel taping, B: Bulk) TYPICAL ELECTRICAL CHARACTERISTICS |Z|, XL, R vs. FREQUENCY CHARACTERISTICS HF70ACB322513 Po oS TTT PPT TTT | Test equipment: RF IMPEDANCE ANALYZER 100 = Tobe YHP4191A . \2Z| / = o |Z |, Xt, R (Q) 1 10 - 100 1000 Frequency (MHz) aoe 23 [.091] ia 22 14 1.043] [.087] ].043}) eApplicabie to reflow and flow solderings. Dimensions in mm [inches] HF50ACB322513 Test equipment: RF IMPEDANCE 100 YHP41 Zz 10 |Z|. Xt, R (Q) 0.1 1 10 100 1000 Frequency (MHz) HF30ACB322513 Test equipment: RF IMPEDANCE 100 YHP4191A |Z|, Xi, R (Q) 3 0.1 1 10 100 1000 Frequency (MHz) 189Ferrite Chip EMI Suppressors ACB Series ACB453215 TYPE SHAPES AND DIMENSIONS/CIRCUIT/RECOMMENDED PC BOARD PATTERNS 4.5+0.25 [.177+ .010] = | = ee Terminal = ols 3 ; electrode Y = +l a a a Ferrite - No directionality 1.5 3 15 [.059] [.118] [.059] .3+0.2 [.012+ .008 3 0.2 1012 *Applicable to reflow and flow solderings. ae o No Insulation r a +1 Li fesin p> 2 8 BD Dimensions in mm [inches] ELECTRICAL CHARACTERISTICS Part No. esanee DC resistance Rated oMHz] (9) max. (mA) max. HF70ACB453215-L]* 120+25% 0.4 300 HF50ACB453215-L]) 125+25% 0.4 300 HF30ACB453215-L] 70425% 0.4 300 [ 1: Please specify the packaging style (T: 178 mm [7.008 inches] reel taping, TL: 330 mm [12.992 inches] reel taping, B: Bulk) TYPICAL ELECTRICAL CHARACTERISTICS |Z], Xt, R vs. FREQUENCY CHARACTERISTICS HF70ACB453215 T Test equipment: RF 1000 YHP4191A IZ, Xe, BQ) 8 1 10 100 1000 Frequency (MHz) 190 HF50ACB453215 Te RF 1000 YHP4191A 100 |Z, Xt, R (Q) 1 10 100 1000 Frequency (MHz) HF30ACB453215 Test equipment: RF 1000 YHP4191A; 100 |Z|, Xt, R (a) 10 100 Frequency (MHz)Ferrite Chip EMI Suppressors ACB Series ~ RELIABILITY AND TEST CONDITIONS Item Performance Test condition Operating temperature 25 to + 85C range Storage temperature 3 and humidity 40C max., 70%RH max. ranges Soldering The chip must have no cracks. Preheat: 150C, 60 seconds heat More than 75% of the terminal electrode must be Solder: H63A resistance covered with solder. Solder temperature: 260 + 5C Impedance: Within + 20% of the initial value Flux: Rosin Dip time: 10+ 0.5 seconds Preheating Dipping Natural cooling 260C 150C 60 seconds _ | 10+0.5 seconds Lo Solderability More than 90% of the terminal electrode must be Preheat: 150C, 60 seconds covered with new solder. Solder: H63A Solder temperature: 230 + 5C Flux: Rosin Dip time: 4+ 1 seconds [ Preheating Dipping Natural cooling 230C 150C | 60 seconds 4+ 1 seconds w Terminal The terminal electrode and the ferrite must not After soldering a lead wire to a terminal electrode, i strength be damaged by the forces applied on the right and then apply a load P in the arrow direction. conditions. ne Type P(N) ACB201209 5.9 EL = -P(N) ACB321611 98 , ACB322513 9.8 AGB453215 14.7 191Ferrite Chip EMI Suppressors ACB Series RELIABILITY AND TEST CONDITIONS Item Performance Test condition ; After soldering a chip to a test substrate, bend the Flexure The terminal electrode and the ferrite must not strength be damaged by the forces applied on the right substrate by 2mm [.079 inches] and then return. conditions. Soldering shall be done in accordance with the recommended PC board pattern and reflow soldering. a 10 [.394] 20 [.787] <> : 5 [1.772] | 45 [1.772] ch cp 100 [3.937] lt 1 [.039] Glass epoxy PC board Dimensions in mm [inches} High Appearance: Ferrite shall not be damaged. Temperature: 85 + 2C temperature Impedance: Within + 20% of the initial value Applied current: Rated current (maximum value) resistance Testing time: 1008 + 12 hours Measurement: After placing for 24 hours min. Room temperature 1W08hours 24 hours Humidity Appearance: Ferrite shall not be damaged. Humidity: 90 to 95%RH resistance Impedance: Within + 20% of the initial value Temperature: 40 + 2C Applied current: Rated current (maximum value) Testing time: 1008 + 12 hours Measurement: After placing for 24 hours min. 40C Room temperature ___. 1008 hours 24 hours 192Ferrite Chip EMI Suppressors ACB Series RELIABILITY AND TEST CONDITIONS Item Performance Test condition Thermal Appearance: Cracking, chipping or any other Temperature: 40C, + 85C, kept stabilized for 30 shock defects harmful to the characteristics shall not be minutes each allowed. Impedance: Within 20% of the initial value Cycle: 100 cycles Measurement: After placing for 24 hours min. 1 cycle + 85C) Room | a [ temperature , - 40C {30 minutes; 30 minutes Temperature: 40+42C Testing time: 1008 + 12 hours Measurement: After placing for 24 hours min. Appearance: Cracking, chipping or any other defects harmful to the characteristics shall not be allowed. Impedance: Within 20% of the initial value Low temperature storage life test RECOMMENDED SOLDERING CONDITIONS REFLOW SOLDERING IRON SOLDERING Perform soldering at 280C on 30Wmax. within 5 Preheat Soldering Natural cooling seconds. : . : 100 seconds max. 10 seconds max. Take care not to apply the tip of the soldering iron to 990C |--------eeeeeeeeeeeenenenney the terminal electrodes. 200C Cc Gs 150C 20 seconds max. 60 seconds min. a FLOW SOLDERING FLUX AND CLEANING 6 x 4 solder should be used. 4 Rosin-based flux is recommended. Cleaning Conditions Preheat Soldering 100 seconds max. 10 seconds max. Natural cooling I Chlorine-based solvent 208 C [oon Solvent (Do not use acid or alkali solvents.) Time TI minute min. Ultrasonic output 20W/e max. 150C power 60 seconds min. 193Ferrite Chip EMI Suppressors 194 ACB Series PACKAGINGS PACKAGING QUANTITIES REEL DIMENSIONS Tye T (#178 mm TL (330 mm Material: Plastic ype {7.008 inches] reel) _ [12.992 inches] reel) ACB201209 2000 pcs./reel 10000 pcs./reel ACB321611 2000 pcs./reel 10000 pcs./reel ACB322513 2000 pcs./reel 10000 pcs./reel lla ACB453215 1000 pcs./reel 5000 pcs./reel TAPE DIMENSIONS 38 es of Hiei 4401 2+0.05 $1.5-0 Ww _ "8 [157+ 004] [.079+.002] [.4723"] _, t+0.06 [.002] Dimensions in mm [inches] = 2 Sta T (#178 mm [7.008 TL (330 mm [12.992 1/88 ye z Symbol inches] reel) inches] reel) &| ie _ ot A 617842 [7.008+ .079] 4330+ 2 [12.992 + .079] a|= i | B $60 + 1 {2.362+.039] 4100+2 [3.937 + .079] 2 O |_|. 7*0.05 [.002] Cc $13+0.8 [.512+.031] $13+0.8 [.512+ .031] tigre og, SOF \ 91.4 +0.05 .049+.002) $21 +0.8 [.8274.031] 421+0.8[.827+.031] Fig. 1 E 2 [.079] 2 [.079] 8(.315] 10+1.5[.394+.059] 10+1.5[.394+.059] - 3 4+0.1 [.157+ .004] 12[.472] 14.5+1.5[571+.059] 14.5+41.5[571+ .059]) # 4 2+ 0.05 [.079 + .002] t 2+0.5[.079+.020} 2+0.5[.079+.020] nD =18 $1.52"[.472% 8%) +0.05 [.002 R 1 [.039] 1 [.039] = tr Bs 88] a _ TAPING FIGURE 4 r . . = ee 4 3 Carrier tape material: Polystyrene 30] = 1 S 5 Cover tape material: Polyethylene +! + x \ a $1.6 +0.1 [.063 + 004) / Top cover tape A+0.1 [.004] T 0.05 [.002 ee) ~ ee ar Fig. 2 avity [Chip insert] Dimensions in mm [inches] Type A B T t Fig. 155 23 1.2 0.2 ACB201209 [061] [091] .047]_[.008] | 1.9 3.5 1.4 0.2 AcHSereN 075] [-138] 055] 008) 1 2.9 3.6 1.7 0.25 ACB322513 F444) [142] [.067] Loto) 3.6 49 205 0.3 ACB453215 1442] [193] [.081] [.012] 2 500 to 560 [19.685 to 22.047] Blank Chips Blank Leader 10 to 20 pitches 440 [17.323] min. Aum oDUOMoOU oo cooooommooomol| / | Drawing direction