APL5501/2/3 Low IQ, Low Dropout 500mA Fixed Voltage Regulator Features * * * * * * * General Description The APL5501/2/3 are micropower, low noise, low dropout linear regulators. Operate from 2.7V to 6V input volt- Low Noise : 50VRMS (100Hz to 100kHz) Low Quiescent Current : 50A (No load) age and deliver up to 500mA. Typical output noise is just 50VRMS with the addition of an external 0.1F bypass ca- Low Dropout Voltage : 170mV (@500mA) Very Low Shutdown Current : < 0.5A pacitor in BP pin and typical dropout voltage is only 170mV at 500mA loading. Designed for use in battery-powered Fixed Output Voltage : 1.3V ~ 3.4V Stable with 4.7F Output Capacitor system, the low 50A quiescent current makes it an ideal choice. Stable with Aluminum, Tantalum, or Ceramic Capacitors * * * * * * * * Design with an internal P-channel MOSFET pass transistor, the APL5501/2/3 maintain a low supply current, Reverse Current Protection independent of the load current and dropout voltage. Other features include reverse current protection, thermal-shut- No Protection Diodes Needed Built-In Thermal Protection down protection, and current-limit protection to ensure specified output current and controlled short-circuit Built-In Current-Limit Protection Controlled Short Circuit Current : 150mA current. The APL5501/2/3 regulators come in a miniature SOT-23-5, SOT-89, SOT-89-5, SOT-223, SOP-8, TO-252- Fast Transient Response Short Setting Time 3, and TO-252-5 packages. SOT-23-5, SOT-89, SOT-89-5, SOT-223, SOP-8 TO-252-3, and TO-252-5 Packages * Applications Lead Free and Green Devices Available (RoHS Compliant) * * * Notebook Computer PDA or Portable Equipments Noise-Sensitive Instrumentation Systems Pin Configuration APL5501 BP TAB is GND GND 5 1 2 GND 4 3 1 VIN SHDN VOUT SOT-89 (Top View) VOUT 2 GND 3 IN 1 8 OUT GND 2 7 GND GND 3 6 GND SHDN 4 5 BYP VIN 1 GND 2 SHDN 3 5 4 VOUT BP VIN SOT-89-5 (Top View) SOP-8 (Top View) SOT-23-5 (Top View) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 1 www.anpec.com.tw APL5501/2/3 Pin Configuration (Cont.) APL5501 1 2 1 2 3 4 5 3 VOUT BP GND SHDN VIN VIN TAB is GND TAB is GND GND VOUT TO-252-5 (Top View) TO-252-3 (Top View) 1 2 3 VIN GND VOUT SOT-223 (Top View) APL5503 APL5502 TAB is VIN TAB is VIN 1 GND 2 VIN TAB is GND 3 1 2 3 1 2 3 GND VIN VOUT VOUT GND VIN VOUT SOT-89 (Top View) SOT-223 (Top View) SOT-223 (Top View) Ordering and Marking Information Package Code B : SOT-23-5 D : SOT-89 D5 : SOT-89-5 U : TO-252-3 U5 : TO-252-5 V : SOT-223 K : SOP-8 Operating Ambient Temperature Range C : 0 to 70 oC Handling Code TR : Tape & Reel Voltage Code : 13 : 1.3V ~ 34 : 3.4V Assembly Material G : Halogen and Lead Free Device APL5501/2/3 Assembly Material Handling Code Temperature Range Package Code Voltage Code APL5501/2/3 - 13 D/V/K : APL5501/2/3 XXXXX13 XXXXX - Date Code , 13 - 1.3V APL5501/2/3 - 13 U : 13 APL5501/2/3 XXXXX XXXXX - Date Code , 13 - 1.3V Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 2 www.anpec.com.tw APL5501/2/3 Marking Information SOT-23-5 package Product Name Marking Product Name Marking Product Name Marking APL5501-13B 517X APL5501-21B 51FX APL5501-28B 51MX APL5501-14B 518X APL5501-22B 51GX APL5501-29B 51NX APL5501-15B 519X APL5501-23B 51HX APL5501-30B 51OX APL5501-16B 51AX APL5501-24B 51IX APL5501-31B 51PX APL5501-17B 51BX APL5501-25B 51JX APL5501-32B 51QX APL5501-18B 51CX APL5501-26B 51KX APL5501-33B 51RX APL5501-19B 51DX APL5501-27B 51LX APL5501-34B 51SX APL5501-20B 51EX The last character "X" in the marking is for data code. Absolute Maximum Ratings Symbol VIN, VOUT SHDN PD TSTG TL Parameter Input Voltage or Out Voltage Shutdown Control Pin Power Dissipation Storage Temperature Range Maximum Lead Soldering Temperature, 10 Seconds Rating Unit 6.5 V 6.5 V Internally Limited W -65 to +150 C 260 C Typical Value Unit Thermal Characteristic Symbol Parameter Thermal Resistance - Junction to Ambient RTH,JA SOT-89 SOT-223 SOP-8 SOT-23-5 180 135 150 260 SOT-89 SOT-223 SOP-8 SOT-23-5 38 15 20 130 C/W Thermal Resistance - Junction to Case RTH,JC C/W Operating Junction Temperature TJ Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 Control Section Power Transistor 3 0 to 125 0 to 150 C www.anpec.com.tw APL5501/2/3 Electrical Characteristics Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1F, COUT=4.7F, SHDN=VIN, TJ=0 to 125C. Typical values refer to TJ=25C. Symbol VIN Parameter APL5501/2/3 Test Conditions Input Voltage Unit Min. Typ. Max. 2.7 - 6 V VOUT Output Voltage VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX VOUT -2% VOUT VOUT +2% V ILIMIT Circuit Current Limit VIN=4.3V - 0.7 - A ISHORT Short Current VOUT=0V - 200 - mA IOUT Load Current 500 - - mA REGLINE Line Regulation VOUT+0.5V< VCC<6.0V, IOUT = 1mA - 4 10 mV REGLOAD Load Regulation VIN =VOUT+1.0V, 0mA< IOUT < IMAX - 1 0.1 6 mV % 1.3VVOUT<1.5V 1.3V<-VOUT<1.5V - 1100 1300 mV 1.5VVOUT<2V - 900 1050 2VVOUT<2.5V - 500 700 2.5VVOUT<3.4V - 280 380 55 65 - dB No load - 50 100 A IOUT=500mA - 370 450 Shutdown = low IOUT=0, VCC =6.0V - 0.01 1 A 100Hz1.6V) enables the regulator, EN low (<0. ramic capacitor. The input capacitor with larger value and lower ESR provides better PSRR and line-transient 4V) disables the regulator and enter the shutdown mode. In shutdown mode, the quiescent current can reduce response. The output capacitor also can use Aluminum, Tantalum, or Ceramic capacitor, and a minimum value of below 1A. The EN pin cannot be floating, a floating EN pin may cause an indeterminate state on the output. If it 1F and ESR above 0.06 is recommended. The curve of the stable region in typical characteristics shows the is no use, connect to VIN for normal operation. Current Limit appropriate output capacitor ESR for different load current stable operation. A larger output capacitor can reduce The APL5501/2/3 have current-limit protection. The ouptut noise and improve load-transient response, stability, and PSRR. Note that some ceramic dielectrics exhibit large voltage will drop close to zero volt when load current reaches the limit, and then the load current will be limited capacitance and ESR variation with temperature. When using this capacitor, a minimum 10F or more may be at 150mA after output voltage is below 0.7V. When the load current back to the value where limiting started, the required to ensure the stability at low temperature operation. Use a bypass capacitor at BP pin for low output output voltage and current will return to normal value. When output is shortened to the ground, the APL5501/2/ nvise. Increasing the capacitance will slightly decrease the output noise but increase the start-up time. 3 will keep short circuit current at 150mA. Thermal Protection Load-Transient Consideration Thermal protection limits total power dissipation in the The APL5501/2/3 load-transient response graphs in typi- device. When the junction temperature exceeds TJ=+150oC, the thermal sensor generates a logic signal cal characteristics show the transient response. A step change in the load current from 0mA to 500mA at 1s will to turn off the pass transistor and allows IC to cool. When the IC's junction temperature is down by 10oC, the ther- cause a 100mV transient spike. Larger output capacitor and lower ESR can reduce transient spike. mal sensor will turn the pass transistor on again, resulting in a pulsed output during continuous thermal Input-Output (Dropout) Voltage The minimum input-output voltage difference (dropout) protection. Thermal protection is designed to protect the APL5501/2/3 in the event of fault conditions. For continu- determines the lowest usable supply voltage. In batterypowered systems, this will determine the useful end-of- ous operation, do not exceed the absolute maximum junction temperature of TJ=+150oC. life battery voltage. Because the APL5501/2/3 uses a pchannel MOSFET pass transistor, the dropout voltage is Operating Region and Power Dissipation the function of drain-to-source on-resistance (RDS(ON)) multiplied by the load current. The thermal resistance of the case to circuit board, and the rate of air flow all control the APL5501/2/3's maxi- Reverse Current Protection mum power dissipation. The power dissipation across the device is PD = IOUT (VIN-VOUT) and the maximum power The APL5501/2/3 have an internal reverse protection, they dissipation is: PDMAX = (TJ-TA) / (JC +CA) do not need an external Schottky diode to connect the regulator input and output. If the output voltage is forced where TJ-TA is the temperature difference between the junction and ambient air, JC is the thermal resistance of above the input voltage by more than 11mV, the IC will be shutdown and the ground pin current is below 0.1A. Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 the package, and CA is the thermal resistance through 11 www.anpec.com.tw APL5501/2/3 Application Information (Cont.) Operating Region and Power Dissipation (Cont.) the printed circuit board, copper traces, and other materials to the ambient air. The GND pin of the APL5501/3 provides an electrical connection to ground and channeling heat away. If power dissipation is large, connect the GND pin to the ground using a large pad or ground plane, can improve the problem of over heat of IC. Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 12 www.anpec.com.tw APL5501/2/3 Package Information SOT-23-5 D e E E1 SEE VIEW A b c 0.25 A L 0 GAUGE PLANE SEATING PLANE A1 A2 e1 VIEW A S Y M B O L SOT-23-5 INCHES MILLIMETERS MIN. MIN. MAX. A MAX. 1.45 0.057 0.00 0.15 0.000 0.006 A2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 0.009 A1 c 0.08 0.22 0.003 D 2.70 3.10 0.106 0.122 E 2.60 3.00 0.102 0.118 1.80 0.055 0.071 E1 1.40 e 0.95 BSC e1 0.037 BSC 1.90 BSC 0.075 BSC L 0.30 0.60 0 0 8 0.012 0 0.024 8 Note : 1. Follow JEDEC TO-178 AA. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 13 www.anpec.com.tw APL5501/2/3 Package Information SOP-8 D E E1 SEE VIEW A h X 45 c A 0.25 b GAUGE PLANE SEATING PLANE A1 A2 e L VIEW A S Y M B O L SOP-8 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.75 0.069 0.010 0.004 0.25 A1 0.10 A2 1.25 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 0.049 1.27 BSC 0.050 BSC h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 0 0 8 0 8 Note: 1. Follow JEDEC MS-012 AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 14 www.anpec.com.tw APL5501/2/3 Package Information SOT-223 D b2 E E1 SEE VIEW A e c 0.25 L b 0 A A1 A2 e1 GAUGE PLANE SEATING PLANE VIEW A S Y M B O L SOT-223 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.80 0.071 A1 0.02 0.10 0.001 0.004 A2 1.50 1.70 0.059 0.067 b 0.66 0.84 0.026 0.033 b2 2.90 3.10 0.114 0.122 c 0.23 0.33 0.009 0.013 D 6.30 6.70 0.248 0.264 E 6.70 7.30 0.264 0.287 E1 3.30 3.70 0.130 0.146 e 2.30 BSC e1 L 0 0.091 BSC 4.60 BSC 0.181 BSC 0.030 0.75 0 0 10 10 Note : 1. Follow from JEDEC TO-261 AA. 2. Dimension D and E1 are determined at the outermost extremes of the plastic exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 15 www.anpec.com.tw APL5501/2/3 Package Information SOT-89 A D1 C L H E E1 D e e1 B B1 SOT-89 S Y M B O L A MIN. MAX. MIN. MAX. 1.40 1.60 0.055 0.063 B 0.44 0.56 0.017 0.022 0.019 MILLIMETERS INCHES B1 0.36 0.48 0.014 C 0.35 0.44 0.014 0.017 D 4.40 4.60 0.173 0.181 D1 1.62 1.83 0.064 0.072 E 2.29 2.60 0.090 0.102 E1 2.13 2.29 0.084 0.090 e 1.50 BSC e1 0.059 BSC 3.00 BSC 0.118 BSC H 3.94 4.25 0.155 0.167 L 0.89 1.20 0.035 0.047 Note : Follow JEDEC TO-243 AA. Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 16 www.anpec.com.tw APL5501/2/3 Package Information SOT-89-5 D D1 A L H E1 E C e e1 B SOT-89-5 S Y M B O L A MIN. MAX. MIN. MAX. 1.40 1.60 0.055 0.063 B 0.36 0.56 0.014 0.022 MILLIMETERS INCHES C 0.35 0.44 0.014 0.017 D 4.40 4.60 0.173 0.181 D1 1.62 1.83 0.064 0.072 E 2.29 2.60 0.090 0.102 E1 2.13 2.29 0.084 e 1.50 BSC e1 0.090 0.059 BSC 3.00 BSC 0.118 BSC H 3.94 4.25 0.155 0.167 L 0.89 1.20 0.035 0.047 Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 17 www.anpec.com.tw APL5501/2/3 Package Information TO-252-3 E A E1 c2 L4 H D D1 L3 b3 c b e SEE VIEW A 0 GAUGE PLANE SEATING PLANE 0.25 A1 L VIEW A TO-252-3 S Y M B O L MIN. MAX. MIN. MAX. A 2.18 2.39 0.086 0.094 MILLIMETERS INCHES 0.005 0.13 A1 b 0.50 0.89 0.020 0.035 b3 4.95 5.46 0.195 0.215 0.024 c 0.46 0.61 0.018 c2 0.46 0.89 0.018 0.035 D 5.33 6.22 0.210 0.245 D1 4.57 6.00 0.180 0.236 E 6.35 6.73 0.250 0.265 E1 3.81 6.00 0.150 0.236 9.40 10.41 0.370 0.410 L 0.90 1.78 0.035 0.070 L3 0.89 2.03 0.035 0.080 e H 2.29 BSC 0.040 1.02 L4 0 0.090 BSC 0 8 0 8 Note : Follow JEDEC TO-252 . Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 18 www.anpec.com.tw APL5501/2/3 Package Information TO-252-5 E A c2 E1 H D D1 L3 b3 c b e SEE VIEW A 0 SEATING PLANE L A1 0.25 GAUGE PLANE VIEW A TO-252-5 S Y M B O L MIN. MAX. MIN. MAX. A 2.18 2.39 0.086 0.094 INCHES MILLIMETERS 0.005 0.13 A1 0.50 0.89 0.020 0.035 b3 4.32 5.46 0.170 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.89 0.018 0.035 D 5.33 6.22 0.210 0.245 b D1 4.57 6.00 0.180 0.236 E 6.35 6.73 0.250 0.265 E1 3.81 6.00 0.150 0.236 e 0.050 BSC 1.27 BSC H 9.40 10.41 0.370 0.410 L 1.40 1.78 0.055 0.070 L3 0.89 2.03 0.035 0.080 0 0 8 Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 0 19 8 www.anpec.com.tw APL5501/2/3 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOT-23-5 Application SOP-8 Application SOT-223 A H T1 C d D W E1 F 178.02.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.00.30 1.750.10 3.50.05 P0 P1 P2 D0 D1 T A0 B0 K0 1.0 MIN. 0.6+0.00 -0.40 3.200.20 3.100.20 1.500.20 W E1 F 4.00.10 4.00.10 2.00.05 1.5+0.10 -0.00 A H T1 C d D 330.02.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T A0 B0 K0 4.00.10 8.00.10 2.00.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 6.400.20 5.200.20 2.100.20 A H T1 C d D W E1 F 320.02.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. P0 P1 P2 D0 D1 T A0 B0 K0 2.000.50 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 6.900.20 7.500.20 2.100.20 4.000.10 8.000.10 12.00.30 1.750.10 20.2 MIN. 12.000.30 1.750.10 5.50.05 5.500.05 (mm) Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 20 www.anpec.com.tw APL5501/2/3 Carrier Tape & Reel Dimensions (Cont.) Application A H T1 C d D 178.02.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T A0 B0 K0 4.00.10 8.00.10 2.00.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 4.800.20 4.500.20 1.800.20 A H T1 C d D W E1 F 178.02.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T A0 B0 K0 2.00.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 4.800.20 4.500.20 1.800.20 W E1 F SOT-89 Application SOT-89-5 4.00.10 8.00.10 A H T1 C d D 330.02.00 50 MIN. 16.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T 2.00.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 Application TO-252-3 4.00.10 8.00.10 A H T1 C d D 330.02.00 50 MIN. 16.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T 2.00.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 Application TO-252-5 4.00.10 8.00.10 W E1 12.00.30 1.750.10 12.00.30 1.750.10 16.00.30 1.750.10 A0 B0 F 5.500.05 5.500.05 7.500.05 K0 6.800.20 10.400.20 2.500.20 W E1 16.00.30 1.750.10 A0 B0 F 7.500.05 K0 6.800.20 10.400.20 2.500.20 (mm) Devices Per Unit Package Type Unit Quantity SOT-23-5 Tape & Reel 3000 SOP-8 Tape & Reel 2500 SOT-223 Tape & Reel 2500 SOT-89 Tape & Reel 1000 SOT-89-5 Tape & Reel 1000 TO-252-3 Tape & Reel 2500 TO-252-5 Tape & Reel 2500 Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 21 www.anpec.com.tw APL5501/2/3 Taping Direction Information SOT-23-5 USER DIRECTION OF FEED SOP-8 USER DIRECTION OF FEED SOT-223 USER DIRECTION OF FEED SOT-89 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 22 www.anpec.com.tw APL5501/2/3 Taping Direction Information SOT-89-5 USER DIRECTION OF FEED TO-252-3 USER DIRECTION OF FEED TO-252-5 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 23 www.anpec.com.tw APL5501/2/3 Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Temperature Ramp-up TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25C to Peak Time Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245C, 5 sec 1000 Hrs Bias @125C 168 Hrs, 100%RH, 121C -65C~150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly Pb-Free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 217C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. Time 25C to Peak Temperature Note: All temperatures refer to topside of the package. Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 24 8 minutes max. www.anpec.com.tw APL5501/2/3 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process - Package Peak Reflow Temperatures 3 Package Thickness 3 Volume mm <350 240 +0/-5C 225 +0/-5C <2.5 mm 2.5 mm Volume mm 350 225 +0/-5C 225 +0/-5C Table 2. Pb-free Process - Package Classification Reflow Temperatures Package Thickness 3 3 3 Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level. Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. B.4 - Jan., 2009 25 www.anpec.com.tw