1 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
DESCRIPTION
The ICPL3120 consists of an Infrared Light Emitting
Diode optically coupled to an Integrated Circuit with a
Power Driving Output. ICPL3120 is ideally suitable to
drive the Power IGBT and MOSFET in Inverters of
Motor Controls and in Power Supplies.
The 2.5A peak output current is capable to direct drive
IGBT/MOSFET up to ratings of 1200V/100A. For IGBTs
with higher ratings, ICPL3120 can be used to drive a
discrete power stage which drives the IGBT gate.
FEATURES
• ±2.5A Maximum Peak Output Current
• 25kV/μs Minimum Common Mode Rejection
at VCM 1500V
• Maximum Propagation Delay 500ns
• Maximum Propagation Delay Difference 100ns
• Wide Operating Voltage Range
VCC 15 to 30 V
• Maximum Supply Current ICC 3.5mA
• Under Voltage Lock Out (UVLO) Protection
with Hysteresis
• Guaranteed Performance over
Temperature Range - 40°C to +105°C
• MSL 1
• Lead Free and RoHS Compliant
• Safety Approvals Pending
APPLICATIONS
• IGBT/MOSFET Gate Drive
• UPS
• Inverters
• AC Brushless and DC Motor Drives
ORDER INFORMATION
• Add G after PN for 10mm lead spacing
• Add SM after PN for Surface Mount
• Add SMT&R after PN for Surface Mount
Tape & Reel
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
http://www.isocom.com
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office,
Block A, 8/F, Wah Hing Industrial mansion,
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong.
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
A 0.1μF bypass Capacitor must be connected between Pins 8 and 5.
Input
Forward Current 20mA
Forward Current Rise / Fall Time 500ns
Power dissipation 45mW
Reverse Voltage 5V
Forward Peak Current
(Pulse Width ≤ 1μs, 300pps) 1A
Output
High Level Peak Output Current
(Exponential waveform,
Pulse Width ≤ 0.3μs, f ≤ = 15kHz)
2.5A
Low Level Peak Output Current
(Exponential waveform,
Pulse Width ≤ 0.3μs, f ≤ = 15kHz)
2.5A
Power Dissipation 250mW
Supply Voltage (VCC - VEE) 0V to 35V
Output Voltage 0V to VCC
Isolation Voltage 5000VRMS
Total Power Dissipation 295mW
Operating Temperature -40 to 105 °C
Storage Temperature -55 to 125 °C
Lead Soldering Temperature
(10s) 260°C
Total Package
1 NC
2 Anode
3 Cathode
4 NC
5 GND (VEE)
6 VO
7 VO
8 VCC
2 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
LED VCC GND
(Turn ON, +ve going) VCC GND
(Turn OFF – ve going) VO
OFF 0 30V 0 30V LOW
ON 0 11.0V 0 9.5V LOW
Truth Table
ON 11.0 13.5V 9.5 12.0V TRANSITION
ON 13.5 30V 12 30V HIGH
Parameter Symbol Min Max Unit
Operating Temperature TA - 40 105 °C
Supply Voltage VCC VEE 15 30 V
Input Current (ON) IF(ON) 7 16 mA
Input Voltage (OFF) VF(OFF) 0 0.8 V
Recommended Operating Conditions
3 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
ELECTRICAL CHARACTERISTICS (Typical Values at VCC VEE = 30V and TA = 25°C,
Minimum and Maximum Values at Recommended Operating Conditions,
unless otherwise specified)
Parameter Symbol Test Condition Min Typ. Max Unit
High Level
Supply Current
ICCH IF = 10mA, VCC = 30V
VO = Open
2.4 3.5 mA
Low Level
Supply Current
ICCL I
F = 0mA, VCC = 30V
VO = Open
2.5 3.5 mA
High Level
Output Current
IOH Maximum Pulse Width = 50μs,
VO = VCC – 1.5V
-1.0 A
Maximum Pulse Width = 10μs,
VO = VCC – 4V
-2.5
Low Level
Output Current
IOL Maximum Pulse Width = 50μs,
VO = VEE + 1.5V
1.0 A
Maximum Pulse Width = 10μs,
VO = VEE + 4V
2.5
High Level
Output Voltage
VOH I
F = 10mA, IO = -100mA
VCC 0.3 VCC 0.1 V
Low Level
Output Voltage
VOL I
F = 0mA, IO = 100mA VEE +0.1 VEE +0.25 V
UVLO Threshold VUVLO+ V
O > 5V, IF = 10mA 11.0 12.7 13.5 V
VUVLO- V
O < 5V, IF = 10mA 9.5 11.2 12.0 V
UVLO Hysteresis UVLOHYS 1.5 V
OUTPUT
Parameter Symbol Test Condition Min Typ. Max Unit
Forward Voltage VF IF = 10mA 1.2 1.37 1.8 V
Forward Voltage
Temperature
Coefficient
ΔVF/ΔT IF = 10mA 1.237 mV/°C
Reverse Voltage VR I
R = 10μA 5 V
Input Threshold Current
(Low to High)
IFLH V
CC = 30V
VO > 5V
1.8 5 mA
Input Threshold Voltage
(High to Low)
VFHL V
CC = 30V
VO < 5V
0.8 V
Input Capacitance CIN V
F = 0V, f = 1MHz 33 pF
INPUT
4 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
ELECTRICAL CHARACTERISTICS (Typical Values at VCC VEE = 30V and TA = 25°C,
Minimum and Maximum Values at Recommended Operating Conditions,
unless otherwise specified)
Parameter Symbol Test Condition Min Typ. Max Unit
Propagation Delay Time
to High Output Level
tPLH IF = 7 to 16mA,
VCC = 15 to 30V,
VEE = 0V
Rg = 10Ω,
Cg = 25nF,
f = 10kHz,
Duty Cycle = 50%
50 130 500 ns
Propagation Delay Time
to Low Output Level
tPHL 50 130 500
Pulse Width Distortion
|tPHL - tPLH| for any given
device
PWD 5 70
Propagation Delay
Difference (tPHL - tPLH)
between any two
Devices
PDD -100 100
Output Rise Time
(10% to 90%)
tr 35
Output Fall Time
(90% to 10%)
tf 35
Common Mode
Transient Immunity at
High Output Level
CMH I
F = 10 to 16mA,
VCC = 30V
VCM = 1500V,
TA = 25°C
25 35 kV/μs
Common Mode
Transient Immunity at
Low Output Level
CML V
F = 0V,
VCC = 30V
VCM = 1500V,
TA = 25°C
25 35 kV/μs
SWITCHING
5 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
ELECTRICAL CHARACTERISTICS (Typical Values at VCC VEE = 30V and TA = 25°C,
Minimum and Maximum Values at Recommended Operating Conditions,
unless otherwise specified)
Note :
1. A 0.1uF or bigger bypass capacitor must be connected across pin 8 and pin 5.
2. PDD is the difference of tPHL and tPLH between any two ICPL3120 under same test conditions.
3. Common Mode Transient Immunity in High stage is the maximum tolerable negative dVCM/dt on the trailing edge of the common mode
impulse signal, VCM, to assure that the output will remain high (VO > 15V).
4. Common Mode Transient Immunity in Low stage is the maximum tolerable positive dVCM/dt on the leading edge of the common mode
impulse signal, VCM, to assure that the output will remain low (VO < 1V).
Parameter Symbol Test Condition Min Typ. Max Unit
Insulation Voltage VISO RH = 40% - 60%, TA = 25°C
t = 1 min,
5000 V
Input - Output
Resistance
RI-O V
I-O = 500VDC 1012 Ω
Input - Output
Capacitance
CI-O f = 1MHz
0.92 pF
ISOLATION
6 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
Fig 1 Supply Current vs Supply Voltage Fig 2 Supply Current vs Ambient Temperature
Fig 3 Transfer Characteristics Fig 4 Output Low Voltage vs Ambient Temperature
Fig 5 Output High Voltage vs Ambient Temperature Fig 6 Output High Voltage Drop vs
Ambient Temperature
7 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
Fig 7 Input Threshold Current vs
Ambient Temperature
Fig 8 Propagation Delay vs Ambient Temperature
Fig 9 Propagation Delay vs Forward Current Fig 10 Propagation Delay vs Supply Voltage
Fig 11 Propagation Delay vs
Series Load Resistance
Fig 12 Propagation Delay vs
Series Load Capacitance
8 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
Fig 13 Forward Current vs Forward Voltage
VOL Test Circuit
IOH Test Circuit IOL Test Circuit
VOH Test Circuit
9 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
IFLH Test Circuit
UVLO Test Circuit
CMR Test Circuit
tr, tf, tPLH and tPHL
Test Circuit
10 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
ORDER INFORMATION
DEVICE MARKING
After PN Description Packing quantity
None Standard DIP8 50 pcs per tube
G 10mm Lead Spacing 50 pcs per tube
SM Surface Mount 50 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
ICPL3120
PN
ICPL3120
ICPL3120G
ICPL3120SM
ICPL3120SMT&R
ICPL3120
IYWW
ICPL3120 denotes Device Part Number
Y denotes 1 digit Year code
WW denotes 2 digit Week code
I
denotes Isocom
11 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
PACKAGE DIMENSIONS in mm (inch)
DIP
G Form
SMD
12 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
Description Symbol Dimension
mm (inch)
Tape Width W 16 ± 0.3 (0.63)
Pitch of Sprocket Holes P0 4 ± 0.1 (0.15)
F 7.5 ± 0.1 (0.295)
P2 2 ± 0.1 (0.079)
Distance of Compartment to Compartment P1 12 ± 0.1 (0.47)
Distance of Compartment to Sprocket Holes
TAPE AND REEL PACKAGING
DIP
13 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
IR REFLOW SOLDERING TEMPERATURE PROFILE
(One Time Reflow Soldering is Recommended)
TIME (s)
TEMP (°C)
25°C
ts Preheat
60s – 120s
Tsmin
Tsmax
260°C
TL 217°C
Time 25°C to Peak Temperature
tP
TP - 5°C
TP
Max Ramp Up Rate
3°C/s
Max Ramp Down Rate
6°C/s
TL
200°C
150°C
Profile Details Conditions
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
150°C
200°C
60s - 120s
Soldering Zone
- Peak Temperature (TP)
- Time at Peak Temperature
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max
Average Ramp Up Rate (Tsmax to TP) 3°C/s max
Time 25°C to Peak Temperature 8 minutes max
14 19/04/2017
ICPL3120
DD93213
ISOCOM
COM-
NOTES :
- Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make
changes without further notices.
- The products shown in this publication are designed for the general use in electronic applications such as
office automation equipment, communications devices, audio/visual equipment, electrical application and
instrumentation.
- For equipment/application where high reliability or safety is required, such as space applications, nuclear power
control equipment, medical equipment, etc., please contact our sales representatives.
- When requiring a device for any ”specific” application, please contact our sales for advice.
- The contents described herein are subject to change without prior notice.
- Do not immerse device body in solder paste.
15 19/04/2017
DISCLAIMER
DD93213
ISOCOM
COM-
ISOCOM is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing ISOCOM products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such
ISOCOM products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that ISOCOM products are used within specified
operating ranges as set forth in the most recent ISOCOM products specifications.
__ The ISOCOM products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily
injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments,
airplane or spaceship instruments, transportation Instruments, traffic signal instruments,
combustion control instruments, medical Instruments, all types of safety devices, etc..
Unintended Usage of ISOCOM products listed in this document shall be made at the
customer’s own risk.
__ Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
__ The products described in this document are subject to the foreign exchange and foreign
trade laws.
__ The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by ISOCOM Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of
ISOCOM Components or others.
__ The information contained herein is subject to change without notice.
