PESD1CAN-U - NXP - Datasheet.Live

1. Product profile

1.1 General description

ElectroStatic Discharge (ESD) protection diode in a very small SOT323 (SC-70 )

Surface-Mounted Device (SMD) plastic package designed to protect two automotive

Controller Area Network (CAN) bus lines from the damage caused by ESD and other

transients.

1.2 Features and benefits

One very small SOT323 package to protect two CAN bus lines

Low clamping voltage VCL =35V at I

PP =1A

Typical diode capacitance matching Cd/Cd=0.1%

ESD protection up to 23 kV; IEC 61000-4-2, level 4

IEC 61000-4-5 (surge); IPPM =3A at t

p=8/20s

AEC-Q101 qualified

1.3 Applications

CAN bus protection

Automotive applications

1.4 Quick reference data

2. Pinning information

PESD1CAN-U

CAN bus ESD protection diode

Rev. 1 — 27 March 2013 Product data sheet

SOT323

Table 1. Quick reference data

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff voltage - - 24 V

Cddiode capacitance f = 1 MHz; VR=0V - 9.3 12 pF

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode 1

2 cathode 2

3 common cathod e

006aaa155

Product data sheet Rev. 1 — 27 March 2013 2 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

3. Ordering information

4. Marking

[1] * = placeholder for manufacturing site code.

5. Limiting values

[1] Device stressed with ten non-repetitive current pulses (8/20 s exponential decay waveform according to

IEC 61000-4-5 and IEC 61643-321).

[2] Measured from pin 1 or 2 to 3.

[1] Device stressed with ten non-repetitive ESD pulses.

[2] Measured from pin 1 or 2 to 3.

Tabl e 3. Ordering i nfo rmation

Type number Package

Name Description Version

PESD1CAN-U SC-70 plastic surface-mounted package; 3 leads SOT323

Table 4. Marking codes

Type number Marking code[1]

PESD1CAN-U NB*

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

PPPM rated peak pulse power [1][2] -150W

IPPM rated peak pulse current [1][2] -3A

Tjjunction temperature - 150 C

Tamb ambient temperature 55 +150 C

Tstg storage temperature 65 +150 C

Table 6. ESD maximum ratings

Symbol Parameter Conditions Min Max Unit

VESD electrostatic

discharge voltage IEC 61000-4-2 (contact discharge) [1][2] -23kV

machine model [2] - 400 V

MIL-STD-883 (h uman body model) - 10 kV

Table 7. ESD standards compliance

Standard Conditions

IEC 61000-4-2, level 4 (ESD) > 15 kV (air); > 8 kV (contact)

MIL-STD-883; class 3B (human body model) > 8 kV

Product data sheet Rev. 1 — 27 March 2013 3 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

6. Characteristics

[1] Device stressed with 8/20 s exponential decay waveform according to IEC 61000-4-5 and IEC 61643-321.

[2] Measured from pin 1 or 2 to 3.

[3] Cd is the difference of the capacit ance measured between pin 1 and pin 3 and the capacitance measured

between pin 2 and pin 3.

[4] Non-repetitive current pulse, Transmission Line Pulse (TLP) tp= 100 ns; square pulse;

ANS/IESD STM5.1-2008.

Fig 1. 8/20 s pulse waveform according to

IEC 61000-4-5 and IEC 61643-321 Fig 2. ESD pulse waveform according to

IEC 61000-4-2

t (μs)

0403010 20

001aaa630

120

IPP

(%)

e−t

100 % IPP; 8 μs

50 % IPP; 20 μs

001aaa631

100 %

90 %

30 ns 60 ns

10 %

= 0.7 ns to 1 ns

Table 8. Characteristics

Tamb = 25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff

voltage --24V

IRM reverse leakage

current VRWM =24V - 1 50 nA

VBR breakdown voltage IR= 5 mA 25.4 27.8 30.3 V

VCL clamping voltage IPP =1A [1][2] --35V

IPPM =3A - - 50 V

Cddiode capacitance f = 1 MHz; VR=0V - 9.3 12 pF

f=1MHz; V

R= 2.5 V - 7.2 - pF

Cd/Cdcapacitance matching f = 1 MHz; VR=0V [3] -0.1-%

f=1MHz; V

R=2.5V - 0.1 - %

rdyn dynamic resistance IR=10A [2][4] -1.5-

Product data sheet Rev. 1 — 27 March 2013 4 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

Tamb =25C

Fig 3. Rated peak pulse power as a function of

square pulse duration; typical values Fig 4. Relative variation of peak pulse power as a

function of junction temperature; typical

values

f=1MHz; T

amb =25C.

Fig 5. Diode capacitance as a function of reverse

voltage; typical values Fig 6. V-I characteristics for a bidirectional ESD

protection diode

tp (ms)

10-1 101

aaa-007015

102

PPPM

(W)

Tj (°C)

0 20015050 100

006aab321

0.4

0.8

1.2

PPPM

PPPM(25°C)

VR (V)

-30 3010-10

aaa-007016

(pF)

006aab325

-VCL -VBR -VRWM

VCL

VBR

VRWM

-IRM

IRM

-IR

-IPP

IPP

IPPM

-IPPM

Product data sheet Rev. 1 — 27 March 2013 5 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

Fig 7. ESD clamping test setu p and waveforms

50 Ω

DUT

(DEVICE

UNDER

TEST)

GND

450 Ω

RG 223/U

50 Ω coax

ESD TESTER

IEC 61000-4-2 network

Cs = 150 pF; Rd = 330 Ω

4 GHz DIGITAL

OSCILLOSCOPE

10x

ATTENUATOR

unclamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

unclamped -8 kV ESD pulse waveform

(IEC 61000-4-2 network)

GND

clamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

aaa-007017

GND

clamped -8 kV ESD pulse waveform

(IEC 61000-4-2 network)

vertical scale = 2 kV/div

horizontal scale = 10 ns/div

vertical scale = 2 kV/div

horizontal scale = 10 ns/div

vertical scale = 50 V/div

horizontal scale = 10 ns/div

vertical scale = 50 V/div

horizontal scale = 10 ns/div

Product data sheet Rev. 1 — 27 March 2013 6 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

7. Application information

The device is designed for the protection of two automotive CAN bus lines from surge

pulses and ESD damage. The device is suitable on lines where the signal polarities are

both, positive and negative with respect to ground.

Circuit board layout and protection device placement

Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)

and surge transients. The following guidelines are recommended:

1. Place the device as clos e to the input terminal or connector as possible.

2. Minimize the path length between the device and the protected line.

3. Keep parallel signal paths to a minimum.

4. Avoid running protected conductor s in parallel with unprotected conductors.

5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and

ground loops.

6. Minimize the length of the transient return path to ground.

7. Avoid using shared transient return paths to a common ground point.

8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

Fig 8. Application di ag ram

aaa-007049

CAN BUS

TRANSCEIVER CAN

bus

PESD1CAN-U

SPLIT

RT/2

CANH

CANL Common

mode choke

(optional)

Product data sheet Rev. 1 — 27 March 2013 7 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

9. Package outline

Fig 9. Package outline SOT323 (SC-70)

04-11-04Dimensions in mm

0.45

0.15

1.1

0.8

2.2

1.8

2.2

2.0 1.35

1.15

1.3

0.4

0.3 0.25

0.10

Product data sheet Rev. 1 — 27 March 2013 8 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

10. Soldering

Fig 10. Reflow soldering footprint SOT323 (SC-70)

Fig 11. Wave soldering footprint SOT323 (SC-70)

solder lands

solder resist

occupied area

solder paste

sot323_fr

2.65

2.35 0.6

(3×)

0.5

(3×)

0.55

(3×)

1.325

1.85

1.3

Dimensions in mm

sot323_fw

3.65 2.1

1.425

(3×)

4.6

(2×)

2.575

1.8

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Product data sheet Rev. 1 — 27 March 2013 9 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

11. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PESD1CAN-U v.1 20130327 Product data sheet - -

Product data sheet Rev. 1 — 27 March 2013 10 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or comple teness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidenta l ,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use in automotive applications — T his NXP

Semiconductors product has been qualified for use in automotive

applications. Unless ot herwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 1 — 27 March 2013 11 of 12

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

No offer to sell or license — Nothing in this document may be interpret ed or

construed as an of fer to sell product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PESD1CAN-U

CAN bus ESD protection diode

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 27 March 2013

Document identifier: PESD1CAN-U

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Application information. . . . . . . . . . . . . . . . . . . 6

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13 Contact information. . . . . . . . . . . . . . . . . . . . . 11

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12