1. Product profile
1.1 General description
ElectroStatic Discharge (ESD) protection diode in a very small SOT323 (SC-70 )
Surface-Mounted Device (SMD) plastic package designed to protect two automotive
Controller Area Network (CAN) bus lines from the damage caused by ESD and other
transients.
1.2 Features and benefits
One very small SOT323 package to protect two CAN bus lines
Low clamping voltage VCL =35V at I
PP =1A
Typical diode capacitance matching Cd/Cd=0.1%
ESD protection up to 23 kV; IEC 61000-4-2, level 4
IEC 61000-4-5 (surge); IPPM =3A at t
p=8/20s
AEC-Q101 qualified
1.3 Applications
CAN bus protection
Automotive applications
1.4 Quick reference data
2. Pinning information
PESD1CAN-U
CAN bus ESD protection diode
Rev. 1 — 27 March 2013 Product data sheet
SOT323
Table 1. Quick reference data
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse standoff voltage - - 24 V
Cddiode capacitance f = 1 MHz; VR=0V - 9.3 12 pF
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode 1
2 cathode 2
3 common cathod e
12
3
2
1
006aaa155
3
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 2 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
3. Ordering information
4. Marking
[1] * = placeholder for manufacturing site code.
5. Limiting values
[1] Device stressed with ten non-repetitive current pulses (8/20 s exponential decay waveform according to
IEC 61000-4-5 and IEC 61643-321).
[2] Measured from pin 1 or 2 to 3.
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1 or 2 to 3.
Tabl e 3. Ordering i nfo rmation
Type number Package
Name Description Version
PESD1CAN-U SC-70 plastic surface-mounted package; 3 leads SOT323
Table 4. Marking codes
Type number Marking code[1]
PESD1CAN-U NB*
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
PPPM rated peak pulse power [1][2] -150W
IPPM rated peak pulse current [1][2] -3A
Tjjunction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
Table 6. ESD maximum ratings
Symbol Parameter Conditions Min Max Unit
VESD electrostatic
discharge voltage IEC 61000-4-2 (contact discharge) [1][2] -23kV
machine model [2] - 400 V
MIL-STD-883 (h uman body model) - 10 kV
Table 7. ESD standards compliance
Standard Conditions
IEC 61000-4-2, level 4 (ESD) > 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3B (human body model) > 8 kV
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 3 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
6. Characteristics
[1] Device stressed with 8/20 s exponential decay waveform according to IEC 61000-4-5 and IEC 61643-321.
[2] Measured from pin 1 or 2 to 3.
[3] Cd is the difference of the capacit ance measured between pin 1 and pin 3 and the capacitance measured
between pin 2 and pin 3.
[4] Non-repetitive current pulse, Transmission Line Pulse (TLP) tp= 100 ns; square pulse;
ANS/IESD STM5.1-2008.
Fig 1. 8/20 s pulse waveform according to
IEC 61000-4-5 and IEC 61643-321 Fig 2. ESD pulse waveform according to
IEC 61000-4-2
t (μs)
0403010 20
001aaa630
40
80
120
IPP
(%)
0
et
100 % IPP; 8 μs
50 % IPP; 20 μs
001aaa631
I
PP
100 %
90 %
t
30 ns 60 ns
10 %
t
r
= 0.7 ns to 1 ns
Table 8. Characteristics
Tamb = 25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse standoff
voltage --24V
IRM reverse leakage
current VRWM =24V - 1 50 nA
VBR breakdown voltage IR= 5 mA 25.4 27.8 30.3 V
VCL clamping voltage IPP =1A [1][2] --35V
IPPM =3A - - 50 V
Cddiode capacitance f = 1 MHz; VR=0V - 9.3 12 pF
f=1MHz; V
R= 2.5 V - 7.2 - pF
Cd/Cdcapacitance matching f = 1 MHz; VR=0V [3] -0.1-%
f=1MHz; V
R=2.5V - 0.1 - %
rdyn dynamic resistance IR=10A [2][4] -1.5-
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 4 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
Tamb =25C
Fig 3. Rated peak pulse power as a function of
square pulse duration; typical values Fig 4. Relative variation of peak pulse power as a
function of junction temperature; typical
values
f=1MHz; T
amb =25C.
Fig 5. Diode capacitance as a function of reverse
voltage; typical values Fig 6. V-I characteristics for a bidirectional ESD
protection diode
tp (ms)
10-1 101
aaa-007015
10
102
PPPM
(W)
1
Tj (°C)
0 20015050 100
006aab321
0.4
0.8
1.2
PPPM
0
PPPM(25°C)
VR (V)
-30 3010-10
aaa-007016
6
8
10
Cd
(pF)
4
006aab325
-VCL -VBR -VRWM
VCL
VBR
VRWM
-IRM
IRM
-IR
IR
-IPP
IPP
-+
IPPM
-IPPM
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 5 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
Fig 7. ESD clamping test setu p and waveforms
50 Ω
Rd
Cs
DUT
(DEVICE
UNDER
TEST)
GND
GND
450 Ω
RG 223/U
50 Ω coax
ESD TESTER
IEC 61000-4-2 network
Cs = 150 pF; Rd = 330 Ω
4 GHz DIGITAL
OSCILLOSCOPE
10x
ATTENUATOR
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
unclamped -8 kV ESD pulse waveform
(IEC 61000-4-2 network)
GND
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
aaa-007017
GND
clamped -8 kV ESD pulse waveform
(IEC 61000-4-2 network)
vertical scale = 2 kV/div
horizontal scale = 10 ns/div
vertical scale = 2 kV/div
horizontal scale = 10 ns/div
vertical scale = 50 V/div
horizontal scale = 10 ns/div
vertical scale = 50 V/div
horizontal scale = 10 ns/div
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 6 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
7. Application information
The device is designed for the protection of two automotive CAN bus lines from surge
pulses and ESD damage. The device is suitable on lines where the signal polarities are
both, positive and negative with respect to ground.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as clos e to the input terminal or connector as possible.
2. Minimize the path length between the device and the protected line.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductor s in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Fig 8. Application di ag ram
aaa-007049
CG
CAN BUS
TRANSCEIVER CAN
bus
PESD1CAN-U
SPLIT
2
3
1
RT/2
RT/2
CANH
CANL Common
mode choke
(optional)
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 7 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
9. Package outline
Fig 9. Package outline SOT323 (SC-70)
04-11-04Dimensions in mm
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0 1.35
1.15
1.3
0.4
0.3 0.25
0.10
12
3
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 8 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
10. Soldering
Fig 10. Reflow soldering footprint SOT323 (SC-70)
Fig 11. Wave soldering footprint SOT323 (SC-70)
solder lands
solder resist
occupied area
solder paste
sot323_fr
2.65
2.35 0.6
(3×)
0.5
(3×)
0.55
(3×)
1.325
1.85
1.3
3
2
1
Dimensions in mm
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 9 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
11. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PESD1CAN-U v.1 20130327 Product data sheet - -
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 10 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or comple teness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ionThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidenta l ,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descripti ons, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use in automotive applications — T his NXP
Semiconductors product has been qualified for use in automotive
applications. Unless ot herwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associate d with t heir
applications and products.
NXP Semiconductors does not accept any liabil ity related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and pro ducts using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress rating s only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the obj ective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.
Product [short] dat a sheet Production This document contains the product specification.
PESD1CAN-U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 27 March 2013 11 of 12
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
No offer to sell or license — Nothing in this document may be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PESD1CAN-U
CAN bus ESD protection diode
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 March 2013
Document identifier: PESD1CAN-U
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Application information. . . . . . . . . . . . . . . . . . . 6
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Contact information. . . . . . . . . . . . . . . . . . . . . 11
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12