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ACAC 0612, ACAS 0612 - Precision
Vishay Beyschlag
Precision Thin Film Chip Resistor Array
ACAC 0612 (concave terminations) and ACAS 0612 (convex
terminations) thin film chip resistor arrays combine the
proven reliability of precision thin film chip resistor products
with the advantages of chip resistor arrays. Defined
tolerance matching and TCR tracking make this product
perfectly suited for applications with outstanding
requirements towards stable fixed resistor ratios. A small
package enables the design of high density circuits in
combination with reduction of assembly costs. Four equal
resistor values or two pairs are available.
FEATURES
•
Advanced thin film technology
•Two pairs or four equal resistor values
•TCR tracking down to 10 ppm/K (± 5 ppm/K)
•Tolerance matching down to 0.1 % (± 0.05 %)
•Pure Sn termination on Ni barrier layer
•Compliant to RoHS directive 2002/95/EC
APPLICATIONS
•Precision analogue circuits
•Voltage divider
•Feedback circuits
•Signal conditioning
Notes
(1) Resistance values to be selected from E24 and E96
(2) In applications with defined resistance ratios like voltage dividers or feedback circuits, an array with a defined tracking of e.g. 10 ppm/K is
required to replace discrete resistors with a temperature coefficient of resistance of ± 5 ppm/K. Furthermore, in order to achieve the same
tolerance of ± 0.05 % of individual resistors, an array requires a matching of 0.1 %.
(3) Please refer to APPLICATION INFORMATION, see below
(4) For higher max. film temperature and AEC-Q200 qualification please refer to data sheet ACAS 0606 AT, ACAS 0612 AT - Precision available
on our web site at www.vishay.com/doc?28770
TECHNICAL SPECIFICATIONS
DESCRIPTION ACAC 0612, ACAS 0612
EIA size 0612
Metric size RR 1632M
Configuration, isolated 4 x 0603
Design:
All equal AE
Two pairs TP
Resistance values 47 Ωto 221 kΩ (1)
Absolute tolerance ± 0.5 %; ± 0.25 %
Tolerance matching (2)
0.5 % (equivalent to ± 0.25 %)
0.25 % (equivalent to ± 0.125 %)
0.1 % (equivalent to ± 0.05 %)
Absolute temperature coefficient ± 50 ppm/K; ± 25 ppm/K
Temperature coefficient tracking (2)
50 ppm/K (equivalent to ± 25 ppm/K)
25 ppm/K (equivalent to ± 12.5 ppm/K)
15 ppm/K (equivalent to ± 7.5 ppm/K)
10 ppm/K (equivalent to ± 5 ppm/K)
Max. resistance ratio Rmin./Rmax. 1:5
Rated dissipation: P70 (3)
Element 0.1 W
Package, 4 x 0603 0.3 W
Operating voltage 75 V
Permissibe film temperature 125 °C (4)
Insulation voltage (Uins) against ambient and between isolated
resistors, continuous 75 V
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APPLICATION INFORMATION
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support
of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not
exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits.
Notes
(1) Figures are given for arrays with equal values, design type AE
(2) Equivalent to ± 0.05 %
(3) Equivalent to ± 0.125 %
(4) Equivalent to ± 0.25 %
SKETCHES
MAXIMUM RESISTANCE CHANGE AT RATED POWER (1)
DESCRIPTION ACAC 0612, ACAS 0612
Configuration, isolated 4 x 0603
Operation mode Precision Standard
Rated power per element, P70 0.032 W 0.1 W
Rated power per packaging, P70 0.1 W 0.3 W
Film temperature 85 °C 125 °C
Operating voltage, Umax. AC/DC 25 V 75 V
Max. resistance change at P70
ΔR/R max., after:
1000 h ± 0.1 % ± 0.25 %
8000 h ± 0.25 % ± 0.5 %
Max. relative resistance change (relative drift) at P70
ΔR/R max., after:
1000 h 0.1 % (2) 0.25 % (3)
8000 h 0.25 % (3) 0.5 % (4)
DESIGN
TYPE ACAC 0612, ACAS 0612
AE R1 = R2 = R3 = R4
TP R1 = R4 < R2 = R3
1
R
2
R
3
R
4
R
ACAC 0612, ACAS 0612
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Notes
(1) Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
(2) R1 = R4 ≤ R2 = R3
(3) Please refer to table TEMPERATURE COEFFICIENT AND RESISTANCE RANGE, see below
(4) Please refer to table PACKAGING, see next page
Note
(5) Please refer to TECHNICAL SPECIFICATIONS, Note (2), see above
PART NUMBER AND PRODUCT DESCRIPTION (1)
PART NUMBER: ACASA1100A2200P500
MODEL TERMINAL SIZE RESISTANCE
VALUE (2)
ACCURACY
GRADE (3)
RESISTANCE
VALUE (2) PAC K A G I N G (4) SPECIAL
ACA C = Concave
S = Convex
square
A = 0612 3 digit
resistance
value R1, R4
1 digit multiplier
MULTIPLIER
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
TCR, tracking,
tolerance and
matching
A, B, E, F,
J, K, N or P
3 digit
resistance
value R2, R3
1 digit multiplier
MULTIPLIER
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
P1
P5
00
= Standard
PRODUCT DESCRIPTION: ACAS 0612 110R A 220R P5
ACA S 0612 110R A 220R P5
MODEL
TERMINATION
SIZE
RESISTANCE
VALUE
R
1
,
R
4
(2)
ACCURACY
GRADE (3)
RESISTANCE
VALUE R2, R3 (2) PACKAGING (4)
ACA = Chip
array
C = Concave
S = Convex
square
0612 110R = 110 Ω
1K1 = 1.1 kΩ
22K1 = 22.1 kΩ
TCR, tracking,
tolerance and
matching
A, B, E, F,
J, K, N or P
220R = 220 Ω
1K1 = 1.1 kΩ
22K1 = 22.1 kΩ
P1
P5
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
DESCRIPTION RESISTANCE VALUE
ACCURACY
GRADE ABSOLUTE TCR TCR TRACKING (5) ABSOLUTE
TOLERANCE
TOLERANCE
MATCHING (5) ACAC 0612, ACAS 0612
A ± 25 ppm/K 10 ppm/K ± 0.25 % 0.1 % 47 Ω to 221 kΩ
B ± 25 ppm/K 10 ppm/K ± 0.5 % 0.25 % 47 Ω to 221 kΩ
E ± 25 ppm/K 15 ppm/K ± 0.25 % 0.1 % 47 Ω to 221 kΩ
F ± 25 ppm/K 15 ppm/K ± 0.5 % 0.25 % 47 Ω to 221 kΩ
J ± 25 ppm/K 25 ppm/K ± 0.25 % 0.1 % 47 Ω to 221 kΩ
K ± 25 ppm/K 25 ppm/K ± 0.5 % 0.25 % 47 Ω to 221 kΩ
N ± 50 ppm/K 25 ppm/K ± 0.5 % 0.5 % 47 Ω to 221 kΩ
P ± 50 ppm/K 50 ppm/K ± 0.5 % 0.5 % 47 Ω to 221 kΩ
SA1100A 2 0C AA 20 50P0
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DIMENSIONS ACAC 0612
DIMENSIONS ACAS 0612
PACKAGING
MODEL TAPE WIDTH DIAMETER PIECES PITCH
PACKAGING CODE
PAPER TAPE
ACAC 0612
ACAS 0612
8 mm 180 mm/7" 1000 4 mm P1
8 mm 180 mm/7" 5000 4 mm P5
DIMENSIONS - Chip resistor array, mass and relevant physical dimensions
TYPE L
(mm)
W
(mm)
H
(mm)
P
(mm)
WT
(mm)
T1
(mm)
T2
(mm)
d
(mm)
l1
(mm)
l2
(mm)
MASS
(mg)
ACAC 0612 1.6 ± 0.15 3.2 ± 0.15 0.55 ± 0.1 0.8 ± 0.1 0.5 ± 0.15 0.3 ± 0.15 0.4 ± 0.15 0.3 ± 0.1 min. 0.15 min. 0.25 9.6
I
1
T
1
W
T
I
2
T
2
W
T
Top view Bottom view
DIMENSIONS - Chip resistor array, mass and relevant physical dimensions
TYPE L
(mm)
W
(mm)
H
(mm)
P
(mm)
A1
(mm)
A
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
ACAS 0612 1.5 ± 0.15 3.2 ± 0.15 0.45 ± 0.1 0.8 ± 0.1 0.6 ± 0.1 0.4 ± 0.1 0.3 ± 0.15 0.4 ± 0.15 6.6
T2
H
A1A
A
T1
W
L
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Vishay Beyschlag Precision Thin Film Chip Resistor Array
PATTERN STYLES FOR CHIP RESISTOR ARRAYS
DESCRIPTION
The production of the components is strictly controlled and
follows an extensive set of instructions established for
reproducibility. A homogeneous film of metal alloy is
deposited on a high grade (96 % Al2O3) ceramic substrate
using a mask to separate the adjacent resistors and
conditioned to achieve the desired temperature coefficient.
Specially designed inner contacts are realized on both sides.
A special laser is used to achieve the target value by
smoothly cutting a meander groove in the resistive layer
without damaging the ceramics.
The resistor elements are covered by a protective coating
designed for electrical, mechanical and climatic protection.
The terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with IEC 60286-3 (3).
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using reflow or vapour phase as shown in
IEC 61760-1 (3). For ACAC resistor arrays automatic
soldering using wave can also be used. The encapsulation is
resistant to all cleaning solvents commonly used in the
electronics industry, including alcohols, esters and aqueous
solutions.
The suitability of conformal coatings, if applied, shall be
qualified by appropriate means to ensure the long-term
stability of the whole system. The resistors are RoHS
compliant; the pure tin plating provides compatibility with
lead (Pb)-free and lead-containing soldering processes. The
permitted storage time is 20 years, whereas the solderability
is specified for 2 years after production or requalification. The
immunity of the plating against tin whisker growth has been
proven under extensive testing.
All products comply with the GADSL (1) and the
CEFIC-EECA-EICTA (2) list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
•2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
•2002/95/EC Restriction of the use of Hazardous
Substances directive (RoHS)
•2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
TESTS
Where applicable, the resistors are tested in accordance with
EN 140401-801 which refers to EN 60115-1 and EN 140400.
Notes
(1) Global Automotive Declarable Substance List, see www.gadsl.org
(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org → policy →
environmental policy group → chemicals → jig → Joint Industry Guide (JIG-101 Ed 2.0)
(3) The quoted IEC standards are also released as EN standards with the same number and identical contents
RECOMMENDED SOLDER PAD DIMENSIONS FOR CHIP RESISTOR ARRAYS
TYPE G
(mm)
Y
(mm)
X
(mm)
U
(mm)
Z
(mm)
I
(mm)
P
(mm)
ACAC 0612 0.7 0.7 0.5 - 2.1 0.3 0.8
ACAS 0612 0.7 0.7 0.64 0.5 2.1 0.3 0.8
0.1
Z
G
Y
UI X
ACAS 0612
Dimensions in mm
limits for solder resist
0.1
Z
P
G
Y
I
X
ACAC 0612
P
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FUNCTIONAL PERFORMANCE
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-801, detail specification
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068 (1)
and under standard atmospheric conditions according to
IEC 60068-1 (1), 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days) is
valid (LCT = - 55 °C/UCT = 125 °C).
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
The requirements stated in the “Test Procedures and
Requirements” table are based on the required tests and
permitted limits of EN 140401-801 where applicable.
100- 55
Ambient Temperature in °C
150
0
Rated Power in %
050
70
Derating
Standard Mode
Precision Mode
20
40
60
80
100
125 180
For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED POWER
85
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2 (1)
TEST
METHOD
TEST PROCEDURE REQUIREMENTS (2)
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
ACAC 0612
ACAS 0612
47 Ωto 221 kΩ
47 Ωto 221 kΩ
4.5 - Resistance - ± 0.5 % R; ± 0.25 % R
4.8.4.2 - Temperature coefficient At (20/-55/20) °C and
(20/125/20) °C ± 50 ppm/K; ± 25 ppm/K
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4.25.1 -
Endurance at 70 °C:
Precision operation mode
U = or U = Umax.;
1.5 h on; 0.5 h off;
1000 h:
Absolute
Relative (3)
± (0.1 % R +0.05Ω)
0.1 % R +0.05Ω
8000 h:
Absolute
Relative (3)
± (0.25 % R +0.05Ω)
0.25 % R +0.05Ω
Endurance at 70 °C:
Standard operation mode
U = or U = Umax.;
1.5 h on; 0.5 h off;
1000 h:
Absolute
Relative (3)
± (0.25 % R +0.05Ω)
0.25 % R +0.05Ω
8000 h:
Absolute
Relative (3)
± (0.5 % R +0.05Ω)
0.5 % R +0.05Ω
4.25.3 - Endurance at upper
category temperature
85 °C; 1000 h:
Absolute
Relative (3)
± (0.1 % R +0.05Ω)
0.1 % R +0.05Ω
125 °C; 1000 h:
Absolute
Relative (3)
± (0.25 % R +0.05Ω)
0.25 % R +0.05Ω
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.25 % R+ 0.05 Ω)
4.13 - Short time overload (4) U= 2.5 x or
U = 2 x Umax.; 5 s
± (0.1 % R+ 0.01 Ω)
no visible damage
4.19 14 (Na) Rapid change of
temperature
30 min at - 55 °C and
30 min at 125 °C;
5 cycles
± (0.1 % R+ 0.01 Ω)
no visible damage
4.18.2 58 (Td) Resistance to soldering
heat
Reflow method 2
(IR/forced gas convention);
(260 ± 5) °C;
(10 ± 1) s
± (0.1 % R+ 0.01 Ω)
no visible damage
4.17.2 58 (Td) Solderability
Solder bath method;
SnPb; non-activated flux
accelerated ageing 4 h/155 °C
(215 ± 3) °C; (3 ± 0.3) s Good tinning (≥ 95 % covered);
no visible damage
Solder bath method;
SnAgCu; non-activated flux
accelerated ageing 4 h/155 °C
(235 ± 3) °C; (2 ± 0.2) s
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2 (1)
TEST
METHOD
TEST PROCEDURE REQUIREMENTS (2)
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
ACAC 0612
ACAS 0612
47 Ωto 221 kΩ
47 Ωto 221 kΩ
P70 x R
P70 x R
P70 x R
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Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) Figures are given for arrays with equal values, design type AE
(3) Relative values are equivalent to the half of its value with ± symbol, i.e. 0.1 % is equivalent to ± 0.05 %
(4) For a single element
4.32 21 (Ue3) Shear (adhesion) 45 N No visible damage
4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times
± (0.1 % R+ 0.01 Ω)
no visible damage;
no open circuit in bent position
4.7 - Voltage proof
URMS = Uins
(60 ± 5) s; against ambient,
between adjacent resistors
No flashover or breakdown
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2 (1)
TEST
METHOD
TEST PROCEDURE REQUIREMENTS (2)
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
ACAC 0612
ACAS 0612
47 Ωto 221 kΩ
47 Ωto 221 kΩ
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Revision: 02-Oct-12 1Document Number: 91000
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
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about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
