ZXTC6718MC
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COMPLEMENTARY 20V LOW SATURATION TRANSISTORS
Features
NPN Transistor
BVCEO > 20V
I
C = 4.5A Continuous Collector Current
Low Saturation Voltage (150mV max @ 1A)
R
SAT = 47m for a low equivalent On-Resistance
PNP Transistor
BVCEO > -20V
I
C = -3.5A Continuous Collector Current
Low Saturation Voltage (-220mV max @ -1A)
R
SAT = 64m for a low equivalent On-Resistance
h
FE characterized up to 6A for high current gain hold up
Low profile 0.8mm high package for thin applications
R
θJA efficient, 40% lower than SOT26
6mm2 footprint, 50% smaller than TSOP6 and SOT26
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP capable (Note 4)
Mechanical Data
Case: W-DFN3020-8 Type B
Nominal package height: 0.8mm
Case material: molded plastic. “Green” molding compound.
UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - NiPdAu, Solderable per MIL-STD-202,
Method 208
Weight: 0.013 grams (approximate)
Applications
DC – DC Converters
Charging circuits
Power switches
Motor control
LED Backlighting circuits
Portable applications
Ordering Information (Note 4 & 5)
Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel
ZXTC6718MCTA AEC-Q101 DB2 7 8 3,000
ZXTC6718MCQTA Automotive DB2 7 8 3,000
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com for more information about Diodes In corpor ated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally
the same, except where specified.
5. For packaging details, go to our website at http://www.diodes.com
Marking Information
DB2 = Product type marking code
Top view, dot denotes pin 1
Equivalent Circuit
Top View Bottom View
Pin-Out
NPN Transistor
W-DFN3020-8
Type B
Bottom View
C
1
E
1
B
1
C
2
E
2
B2
PNP Transistor
C2 C2 C1 C1
E2 B2 E1 B1
C2 C1
Pin 1
DB2
e4
ZXTC6718MC
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Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol NPN PNP Unit
Collector-Base Voltage VCBO 40 -25 V
Collector-Emitter Voltage VCEO 20 -20 V
Emitter-Base Voltage VEBO 7 -7 V
Peak Pulse Current ICM 12 -6 A
Continuous Collector Current (Notes 6 & 9) IC 4.5 -3.5 A
Continuous Collector Current (Notes 7 & 9) 5 -3.8
Base Current IB 1 A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol NPN PNP Unit
Power Dissipation
Linear Derating Factor
(Notes 6 & 9)
PD
1.5
12
W
mW/°C
(Notes 7 & 9) 2.45
19.6
(Notes 8 & 9) 1.13
8
(Notes 8 & 10) 1.7
13.6
Thermal Resistance, Junction to Ambient
(Notes 6 & 9)
RθJA
83.3
°C/W
(Notes 7 & 9) 51.0
(Notes 8 & 9) 111
(Notes 8 & 10) 73.5
Thermal Resistance, Junction to Lead (Notes 9 & 11) R
θ
JL 17.1
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C
Notes: 6. For a dual device surface mounted on 28mm x 28mm (8cm2) FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; the device is
measured when operating in a steady-state condition. The heatsink is split in half with the exposed collector pads connected to each half.
7. Same as note (6), except the device is measured at t <5 sec.
8. Same as note (6), except the device is surface mounted on 31mm x 31mm (10cm2) FR4 PCB with high coverage of single sided 1oz copper .
9. For a dual device with one active die.
10. For dual device with 2 active die running at equal power.
11. Thermal resistance from junction to solder-point (on the exposed collector pads).
ZXTC6718MC
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Thermal Characteristics and Derating Information
0.1 1 10
0.01
0.1
1
10
0 25 50 75 100 125 150
0.0
0.5
1.0
1.5
2.0
100µ 1m 10m 100m 1 10 100 1k
0
20
40
60
80
0.1 1 10 100
0
25
50
75
100
125
150
175
200
225
100m 1 10 100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.1 1 10
0.01
0.1
1
10
8sqcm 2oz Cu
On e a ctive die 100us
100ms
1s
VCE(SAT)
Limited
1ms
NPN Safe Operating Area
Single Pulse, Tamb=25°C
DC
10ms
IC Collector Current (A)
VCE Collector-Emitter Voltage (V)
10sqcm 1oz Cu
One active die
10sqcm 1oz Cu
Two active die
8sqcm 2oz Cu
One active die
Derating Curve
Ma x Pow e r Dissi p ati o n (W )
Temperatu re (°C)
8sqcm 2oz Cu
One active die
D=0.2
D=0.5
D=0.1
Transient Thermal Im ped an ce
S ingle Pulse
D=0.05
Thermal Resistance (°C/W)
Puls e Width (s)
1oz Cu
Two active die
1oz Cu
One active die
2oz Cu
On ce a ctive die 2oz Cu
Two a ctive die
Thermal Resistance v B oard A rea
Thermal Resistance (°C/W)
Board Cu Area (sqcm)
1oz Cu
One active die
1oz Cu
Two a ctive die
2oz Cu
One active die
2oz Cu
Two a ctive die
Tamb=25°C
Tj max=150°C
Continuous
Power Dissipation v Bo ard A rea
PD Dissipation (W)
Board Cu Area (sqcm)
8sqcm 2oz Cu
One active die 100us
1ms
10ms
100ms
1s
DC
Single Pulse, Tamb=25°C
VCE(SAT)
Limited
PNP Safe O p erating Area
-IC Collector Current (A)
-VCE Collector-Emitter Voltage (V)
ZXTC6718MC
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NPN - Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage BVCBO 40 100 - V
IC = 100µA
Collector-Emitter Breakdown Voltage (Note 12) BVCEO 20 27 - V
IC = 10mA
Emitter-Base Breakdown Voltage BVEBO 7 8.2 - V
IE = 100µA
Collector Cutoff Current ICBO - - 100 nA
VCB = 30V
Emitter Cutoff Current IEBO - - 100 nA VEB = 6V
Collector Emitter Cutoff Current ICES - - 100 nA
VCE = 16V
Static Forward Current Transfer Ratio (Note 12) hFE
200
300
200
100
400
450
360
180
-
-
-
-
-
-
-
-
IC = 10mA, VCE = 2V
IC = 200mA, VCE = 2V
IC = 2A, VCE = 2V
IC = 6A, VCE = 2V
Collector-Emitter Saturation Voltage (Note 12) VCE(sat) -
8
90
115
190
210
15
150
135
250
300
mV
IC = 0.1A, IB = 10mA
IC = 1A, IB = 10mA
IC = 2A, IB = 50mA
IC = 3A, IB = 100mA
IC = 4.5A, IB= 125mA
Base-Emitter Turn-On Voltage (Note 12) VBE
(
on
)
- 0.88 0.97 V
IC = 4.5A, VCE = 2V
Base-Emitter Saturation Voltage (Note 12) VBE
(
sat
)
- 0.98 1.07 V
IC = 4.5A, IB = 125mA
Output Capacitance Cobo - 23 30 pF
VCB = 10V, f = 1MHz
Transition Frequency fT 100 140 - MHz
VCE = 10V, IC = 50mA,
f = 100MHz
Turn-on Time ton - 170 - ns
VCC = 10V, IC = 3A
IB1 = IB2 = 10mA Turn-off Time toff - 400 - ns
Notes: 12. Measured under pulsed conditions. Pulse width 300µs. Duty cycle 2%.
ZXTC6718MC
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NPN - Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
1m 10m 100m 1 10
1m
10m
100m
1m 10m 100m 1 10
0.00
0.05
0.10
0.15
0.20
0.25
1m 10m 100m 1 10
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1m 10m 100m 1 10
0.4
0.6
0.8
1.0
1m 10m 100m 1 10
0.4
0.6
0.8
1.0
0
90
180
270
360
450
540
630
VCE(SAT) v IC
Tamb=25°C
IC/IB=100
IC/IB=50
IC/IB=10
VCE(SAT) (V)
IC Collector Current (A)
VBE(SAT) v IC
IC/IB=50
100°C
25°C
-55°C
VCE(SAT) (V)
IC Collector Current (A)
hFE v IC
VCE=2V
-55°C
25°C
100°C
Normalised Gain
IC Coll ecto r Curre nt (A)
25°C
VCE(SAT) v IC
IC/IB=50
100°C
-55°C
VBE(SAT) (V)
IC Collector Current (A)
VBE(ON) v IC
VCE=2V
100°C
25°C
-55°C
VBE(ON) (V )
IC Collector Current (A)
Typical Gain (hFE)
ZXTC6718MC
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PNP - Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage BVCBO -25 -35 - V
IC = -100µA
Collector-Emitter Breakdown Voltage (Note 12) BVCEO -20 -25 - V
IC = -10mA
Emitter-Base Breakdown Voltage BVEBO -7 -8.5 - V
IE = -100µA
Collector Cutoff Current ICBO - - -100 nA
VCB = -20V
Emitter Cutoff Current IEBO - - -100 nA VEB = -6V
Collector Emitter Cutoff Current ICES - - -100 nA
VCES = -16V
Static Forward Current Transfer Ratio (Note 12) hFE
300
300
150
15
475
450
230
30
-
-
-
-
-
IC = -10mA, VCE = -2V
IC = -100mA, VCE = -2V
IC = -2A, VCE = -2V
IC = -6A, VCE = -2V
Collector-Emitter Saturation Voltage (Note 12) VCE(sat)
-
-
-
-
-
-19
-170
-190
-240
-225
-30
-220
-250
-350
-300
mV
IC = -0.1A, IB = -10mA
IC = -1A, IB = -20mA
IC = -1.5A, IB = -50mA
IC = -2.5A, IB = -150mA
IC = -3.5A, IB = -350mA
Base-Emitter Turn-On Voltage (Note 12) VBE
(
on
)
- -0.87 -0.95 V
IC = -3.5A, VCE = -2V
Base-Emitter Saturation Voltage (Note 12) VBE
(
sat
)
- -1.01 -1.12 V
IC = -3.5A, IB = -350mA
Output Capacitance Cobo - 21 30 pF
VCB = -10V. f = 1MHz
Transition Frequency fT 150 180 - MHz
VCE = -10V, IC = -50mA,
f = 100MHz
Turn-on Time ton - 40 - ns
VCC = -10V, IC = -1A
IB1 = IB2 = -10mA Turn-off Time toff - 670 - ns
Notes: 12. Measured under pulsed conditions. Pulse width 300µs. Duty cycle 2%.
ZXTC6718MC
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PNP - Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
1m 10m 100m 1 10
10m
100m
1
1m 10m 100m 1 10
0.00
0.05
0.10
0.15
0.20
0.25
1m 10m 100m 1 10
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1m 10m 100m 1 10
0.4
0.6
0.8
1.0
1m 10m 100m 1 10
0.2
0.4
0.6
0.8
1.0
0
90
180
270
360
450
540
630
VCE(SAT) v IC
Tamb=2C
IC/IB=100
IC/IB=50
IC/IB=10
VCE(SAT) (V)
IC Collector Cu rrent (A)
VBE(SAT) v IC
IC/IB=50
100°C
25°C
-55°C
VCE(SAT) (V)
IC Collector Current (A)
hFE v IC
VCE=2V
-55°C
25°C
100°C
Normali sed Gai n
IC Collector Cu rrent (A)
25°C
VCE(SAT) v IC
IC/IB=50
100°C
-55°C
VBE(SAT) (V)
IC Collector Current (A)
VBE(ON) v IC
VCE=2V
100°C
25°C
-55°C
VBE(ON) (V )
IC Collector Cu rrent (A)
Typical Gain (hFE)
ZXTC6718MC
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
W-DFN3020-8
Type B
Dim Min Max Typ
A 0.77 0.83 0.80
A1 0 0.05 0.02
A3 - - 0.15
b 0.25 0.35 0.30
D 2.95 3.075 3.00
D2 0.82 1.02 0.92
D4 1.01 1.21 1.11
e - - 0.65
E 1.95 2.075 2.00
E2 0.43 0.63 0.53
L 0.25 0.35 0.30
Z - - 0.375
All Dimensions in mm
Dimensions Value (in mm)
C 0.650
G 0.285
G1 0.090
X 0.400
X1 1.120
Y 0.730
Y1 0.500
Y2 0.365
be
E2
D2
L
D
E
A
Z
A1
A3
D4 D4
C
X1
G1
X
Y1
Y
Y2
G
ZXTC6718MC
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the e xpress
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
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failure of the life support device or to affect its safety or effectiveness.
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