MC74LVX245 Octal Bus Transceiver With 5 V-Tolerant Inputs The MC74LVX245 is an advanced high speed CMOS octal bus transceiver. It is intended for two-way asynchronous communication between data buses. The direction of data transmission is determined by the level of the T/R input. The output enable pin (OE) can be used to disable the device, so that the buses are effectively isolated. All inputs are equipped with protection circuits against static discharge. http://onsemi.com MARKING DIAGRAMS 20 Features * * * * * * * * * High Speed: tPD = 4.7 ns (Typ) at VCC = 3.3 V Low Power Dissipation: ICC = 4 mA (Max) at TA = 25C Power Down Protection Provided on Inputs Balanced Propagation Delays Low Noise: VOLP = 0.8 V (Max) Pin and Function Compatible with Other Standard Logic Families Latchup Performance Exceeds 300 mA ESD Performance: Human Body Model > 2000 V; Machine Model > 200 V These Devices are Pb-Free and are RoHS Compliant SOIC-20 DW SUFFIX CASE 751D 20 1 1 20 TSSOP-20 DT SUFFIX CASE 948E 20 1 1 Application Notes * Do not force a signal on an I/O pin when it is an active output, * * damage may occur All floating (high impedance) input or I/O pins must be fixed by means of pullup or pulldown resistors or bus terminator ICs A parasitic diode is formed between the bus and VCC terminals. Therefore, the LVX245 cannot be used to interface 5.0 V to 3.0 V systems directly VCC OE B0 B1 B2 B3 B4 B5 B6 B7 20 19 18 17 16 15 14 13 12 11 LVX245 AWLYYWWG 20 SOEIAJ-20 M SUFFIX CASE 967 1 20 1 LVX245 A WL, L Y WW, W G or G LVX 245 ALYWG G LVX245 AWLYWWG = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. 1 2 3 4 5 6 7 8 9 10 T/R A0 A1 A2 A3 A4 A5 A6 A7 GND Figure 1. 20-Lead Pinout (Top View) (c) Semiconductor Components Industries, LLC, 2011 May, 2011 - Rev. 4 1 Publication Order Number: MC74LVX245/D MC74LVX245 Table 1. PIN NAMES OE 19 Pins OE T/R A0-A7 Bo-B7 T/R 1 A0 2 18 A1 L B Data to A Bus L H A Data to B Bus H X Z B3 B4 B5 8 12 A7 L 7 13 A6 T/R 6 14 A5 OPERATING MODE Non-Inverting OE H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions are Acceptable; For ICC reasons, Do Not Float Inputs B2 5 15 A4 B1 4 16 A3 INPUTS 3 17 A2 B0 Function Output Enable Input Transmit/Receive Input Side A 3-State Inputs or 3-State Outputs Side B 3-State Inputs or 3-State Outputs B6 9 11 B7 Figure 2. Logic Diagram ORDERING INFORMATION Package Shipping MC74LVX245DWR2G SOIC-20 (Pb-Free) 1000 / Tape & Reel MC74LVX245DTR2G TSSOP-20* 2500 / Tape & Reel MC74LVX245MG SOEIAJ-20 (Pb-Free) 50 Units / Rail MC74LVX245MELG SOEIAJ-20 (Pb-Free) 2000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free. http://onsemi.com 2 MC74LVX245 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage Parameter -0.5 to +7.0 V Vin DC Input Voltage (T/R, OE) -0.5 to +7.0 V VI/O DC Output Voltage -0.5 to VCC +0.5 V IIK Input Diode Current -20 mA IOK Output Diode Current 20 mA Iout DC Output Current, per Pin 25 mA ICC DC Supply Current, VCC and GND Pins 75 mA PD Power Dissipation 180 mW Tstg Storage Temperature -65 to +150 C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIII IIIIII IIIIIIIII IIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIII IIIIIII III III II III IIII III III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 2.0 3.6 V VCC DC Supply Voltage Vin DC Input Voltage (T/R, OE) 0 5.5 V VI/O DC Output Voltage 0 VCC V -40 +85 C 0 100 ns/V TA Dt/DV Operating Temperature, All Package Types Input Rise and Fall Time DC ELECTRICAL CHARACTERISTICS Symbol Parameter Test Conditions TA = 25C VCC V Min 1.5 2.0 2.4 VIH High-Level Input Voltage 2.0 3.0 3.6 VIL Low-Level Input Voltage 2.0 3.0 3.6 VOH High-Level Output Voltage (Vin = VIH or VIL) IOH = -50 mA IOH = -50 mA IOH = -4 mA 2.0 3.0 3.0 VOL Low-Level Output Voltage (Vin = VIH or VIL) IOL = 50 mA IOL = 50 mA IOL = 4 mA 2.0 3.0 3.0 Iin Input Leakage Current Vin = 5.5 V or GND (T/R, OE) IOZ Maximum 3-State Leakage Current ICC Quiescent Supply Current Typ TA = - 40 to 85C Max Min 1.5 2.0 2.4 0.5 0.8 0.8 1.9 2.9 2.58 Max 2.0 3.0 V 0.5 0.8 0.8 1.9 2.9 2.48 V V 0.1 0.1 0.36 0.1 0.1 0.44 V 3.6 0.1 1.0 mA Vin = VIL or VIH Vout = VCC or GND 3.6 0.2 5 2.5 mA Vin = VCC or GND 3.6 4.0 40.0 mA http://onsemi.com 3 0.0 0.0 Unit MC74LVX245 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIII IIIIII IIIIIIIII IIIIII IIII IIIIIIIII IIIIIIIIII III II III IIII III III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIII IIIIIIIIII III II III IIII III III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIII IIIIIIIIII III II III IIII III III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) TA = 25C Symbol tPLH, tPHL tPZL, tPZH tPLZ, tPHZ tOSHL tOSLH Parameter Propagation Delay Input to Output Output Enable Time to High and Low Level Output Disable Time From High and Low Level Output-to-Output Skew (Note 1) Test Conditions Min TA = - 40 to 85C Typ Max Min Max Unit ns VCC = 2.7 V CL = 15 pF CL = 50 pF 6.1 8.6 10.7 14.2 1.0 1.0 13.5 17.0 VCC = 3.3 0.3 V CL = 15 pF CL = 50 pF 4.7 7.2 6.6 10.1 1.0 1.0 8.0 11.5 VCC = 2.7 V RL = 1 kW CL = 15 pF CL = 50 pF 9.0 11.5 16.9 20.4 1.0 1.0 20.5 24.0 VCC = 3.3 0.3 V RL = 1 kW CL = 15 pF CL = 50 pF 7.1 9.6 11.0 14.5 1.0 1.0 13.0 16.5 VCC = 2.7 V RL = 1 kW CL = 50 pF 11.5 18.0 1.0 21.0 VCC = 3.3 0.3 V RL = 1 kW CL = 50 pF 9.6 12.8 1.0 14.5 VCC = 2.7 V VCC = 3.3 0.3 V CL = 50 pF CL = 50 pF 1.5 1.5 1.5 1.5 ns ns ns 1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH); parameter guaranteed by design. IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIII IIIIII IIIIII IIIIIIIII IIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII CAPACITIVE CHARACTERISTICS TA = 25C Symbol Min Parameter TA = - 40 to 85C Typ Max 4 10 Min Max Unit 10 pF Cin Input Capacitance (T/R, OE) CI/O Maximum 3-State I/O Capacitance 8 pF CPD Power Dissipation Capacitance (Note 2) 21 pF 2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 8 (per bit). CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 3.3V, Measured in SOIC Package) TA = 25C Characteristic Symbol Typ Max Unit VOLP Quiet Output Maximum Dynamic VOL 0.5 0.8 V VOLV Quiet Output Minimum Dynamic VOL -0.5 -0.8 V VIHD Minimum High Level Dynamic Input Voltage 2.0 V VILD Maximum Low Level Dynamic Input Voltage 0.8 V http://onsemi.com 4 MC74LVX245 SWITCHING WAVEFORMS VCC T/R 50% GND VCC VCC Input A or B OE 50% GND tPZL GND tPLH Output B or A 50% VCC 50% VCC tPLZ HIGH IMPEDANCE tPHL A or B 50% VCC 50% VCC tPZH A or B VOL +0.3V tPHZ VOH -0.3V 50% VCC Figure 3. HIGH IMPEDANCE Figure 4. TEST CIRCUITS TEST POINT TEST POINT OUTPUT DEVICE UNDER TEST OUTPUT DEVICE UNDER TEST CL* *Includes all probe and jig capacitance 1 kW CL* CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. *Includes all probe and jig capacitance Figure 5. Propagation Delay Test Circuit Figure 6. 3-State Test Circuit http://onsemi.com 5 MC74LVX245 PACKAGE DIMENSIONS SOIC-20 CASE 751D-05 ISSUE G D A 11 X 45 _ E h H M 10X 0.25 B M 20 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. q 1 10 20X B B 0.25 DIM A A1 B C D E e H h L q M T A S B S L A 18X e A1 SEATING PLANE MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ C T SOEIAJ-20 CASE 967-01 ISSUE A 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 6 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.032 MC74LVX245 PACKAGE DIMENSIONS TSSOP-20 CASE 948E-02 ISSUE C 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V IIII IIII IIII S J J1 11 B -U- PIN 1 IDENT 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. K K1 SECTION N-N 0.25 (0.010) N 10 M 0.15 (0.006) T U S N A -V- F DETAIL E -W- C G D H 0.100 (0.004) -T- SEATING DETAIL E SOLDERING FOOTPRINT PLANE DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 http://onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC74LVX245/D