ams Datasheet (discontinued) Page 1
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AS5163
12-Bit Automotive Angle Position
Sensor
The AS5163 is a contactless magnetic angle position sensor for
accurate angular measurement over a full turn of 360º. A sub
range can be programmed to achieve the best resolution for
the application. It is a system-on-chip, combining integrated
Hall elements, analog front-end, digital signal processing and
best in class automotive protection features in a single device.
To measure the angle, only a simple two-pole magnet, rotating
over the center of the chip, is required. The magnet may be
placed above or below the IC.
The absolute angle measurement provides instant indication of
the magnet’s angular position with a resolution of
0.022º = 16384 positions per revolution. According to this
resolution the adjustment of the application specific
mechanical positions are possible. The angular output data is
available over a 12-bit PWM signal or 12-bit ratiometric analog
output.
The AS5163 operates at a supply voltage of 5V and the supply
and output pins are protected against overvoltage up to +27V.
In addition, the supply pins are protected against reverse
polarity up to -18V.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS5163, 12-Bit Automotive Angle
Position Sensor are listed below:
Figure 1:
Added Value of Using AS5163
Benefits Features
•Great flexibility on angular excursion •360º contactless high resolution angular position sensing
•Simple programming
•User programmable start and end point of the application
region
•Saw tooth mode 1-4 slopes per revolution
•Clamping levels
•Transition point
•Additional linearization points for
output characteristic •Output linearization
•Failure diagnostics •Broken GND and VDD detection for all external load cases
General Description
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AS5163 − General Description
Applications
AS5163 is ideal for automotive applications like:
•Throttle and valve position sensing
•Gearbox position sensor
•Headlight position control
•Torque sensing
•Pedal position sensing
•Non-contact potentiometers
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
AS5163 Block Diagram
•Selectable output signal •Analog output ratiometric to VDD or PWM-encoded digital
output
•Ideal for applications in harsh
environments due to contactless
position sensing
•Wide temperature range: - 40°C to 150°C
Benefits Features
GND
OUT
Sin
Cos
Single pin
Interface
12
OUT
Driver
KDOWN
High voltage/
Reverse polarity
protection
Angle
Programable
Angle
Zero
Position
VDD
VDD5VDD3
12-bit
DAC
AS5163
OTP
Register
CORDIC
14-bit
Hall Array
Frontend
Amplifier
ADC
Output
DSP
12-bit
PWM
M
U
X
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AS5163 − Pin Assignment
Figure 3:
Pin Diagram (Top View)
Pin Description
Figure 4 provides the description of each pin of the standard
TSSOP14 package (14-Lead Thin Shrink Small Outline Package)
(see Figure 3).
Figure 4:
Pin Descriptions
Pin
Number Pin Name Pin Type Description
1 VDD Supply pin Positive supply pin. This pin is high voltage protected.
2 VDD5 Supply pin
4.5V- Regulator output, internally regulated from VDD.
This pin needs an external ceramic capacitor of minimum
2.2μF.
3 NC DIO/AIO
multi purpose pin
Test pin for fabrication. Connected to ground in the
application board.
4 VDD3 Supply pin
3.45V- Regulator output, internally regulated from
VDD5. This pin needs an external ceramic capacitor of
minimum 2.2μF.
5 GNDA Supply pin
Analog ground pin. Connected to ground in the application
board.
Pin Assignment
AS5163
1
2
3
4
5
6
78
10
14
13
12
11
VDD5
NC
VDD
NC
VDD3
GNDA
NC
NC
OUT
KDOWN
NC
GNDD
9
GNDP
NC
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AS5163 − Pin Assignment
6 NC DIO/AIO
multi purpose pin
Test pin for fabrication. Connected to ground in the
application board.
7 NC DIO/AIO
multi purpose pin Test pin for fabrication. Open in the application.
8 GNDD Supply pin
Digital ground pin. Connected to ground in the application
board.
9 NC DIO/AIO
multi purpose pin Test pins for fabrication. Connected to ground in the
application board.
10 NC DIO/AIO
multi purpose pin
11 KDOWN
Digital output
open drain
Additional output pin with kick down functionality. This
pin can be used for a compare function including a
hysteresis. An open drain configuration is used. If the internal
angle is above a programmable threshold, then the output is
switched to low. Below the threshold the output is high
using a pull-up resistor.
12 GNDP Supply pin
Analog ground pin. Connected to ground in the application
board.
13 NC DIO/AIO
multi purpose pin
Test pin for fabrication. Connected to ground in the
application board.
14 OUT DIO/AIO
multi purpose pin
Output pin. This pin is used for the analog output or digital
PWM signal. In addition, this pin is used for programming of
the device.
Pin
Number Pin Name Pin Type Description
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AS5163 − Absolute Maximum Ratings
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated in Electrical
Characteristics is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Figure 5:
Absolute Maximum Ratings
Symbol Parameter Min Max Units Comments
Electrical Parameters
VDD DC supply voltage at pin
VDD Overvoltage -18 27 V No operation
VOUT Output voltage OUT -0.3 27 V
Permanent
VKDOWN Output voltage KDOWN -0.3 27 V
VDD3 DC supply voltage at pin
VDD3 -0.3 5 V
VDD5 DC supply voltage at pin
VDD5 -0.3 7 V
Iscr Input current
(latchup immunity) -100 100 mA JEDEC 78
Electrostatic Discharge
ESD Electrostatic discharge ±4 kV
MIL 883 E method 3015 This value is
applicable to pins VDD, GND, OUT, and
KDOWN.
All other pins ±2 kV.
Temperature Ranges and Storage Conditions
TStrg Storage temperature -55 150 ºC Min -67ºF; Max 257ºF
TBody Body temperature
(lead-free package) 260 ºC
t=20s to 40s,
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification
for Non-Hermetic Solid State Surface Mount
Devices”. The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
RHNC Relative humidity
non-condensing 5 85 %
MSL Moisture sensitivity level 3 Represents a maximum floor life time of
168h
Absolute Maximum Ratings
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AS5163 − Electrical Characteristics
Operating Conditions
In this specification, all the defined tolerances for external
components need to be assured over the whole operation
conditions range and also over lifetime.
TAMB = -40°C to 150°C, VDD = +4.5V to +5.5V, CLREG5 = 2.2μF,
CLREG3 = 2.2μF, R PU = 1KΩ, RPD = 1KΩ to 5.6KΩ, (Analog only),
CLOAD =0nF to 42nF, RPUKDWN = 1KΩ to 5.6KΩ,
CLOAD_KDWN = 0nF to 42nF, unless otherwise specified. A
positive current is intended to flow into the pin.
Figure 6:
Operating Conditions
Magnetic Input Specification
TAMB = -40ºC to 150ºC, VDD = 4.5V to 5.5V (5V operation), unless
otherwise noted.
Two-Pole Cylindrical Diametrically Magnetized Source
Figure 7:
Magnetic Input Specification
Symbol Parameter Condition Min Typ Max Units
TAMB Ambient temperature -40ºF to 302ºF -40 150 ºC
Isupp Supply current Lowest magnetic input field 20 mA
Symbol Parameter Condition Min Typ Max Units
Bpk Magnetic input field
amplitude
Required vertical component of
the magnetic field strength on
the die’s surface, measured
along a concentric circle with a
radius of 1.1mm
30 70 mT
Boff Magnetic offset Constant magnetic stray field ±10 mT
Field non-linearity Including offset gradient 5 %
Electrical Characteristics
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AS5163 − Electrical Characteristics
Electrical System Specifications
TAMB = -40ºC to 150ºC, VDD = 4.5V to 5.5V (5V operation),
Magnetic Input Specification, unless otherwise noted.
Figure 8:
Electrical System Specifications
Note(s):
1. This parameter is a system parameter and is dependant on the selected magnet.
2. The noise performance is dependent on the programming of the output characteristic.
3. The INL performance is specified over the full turn of 360 degrees. An operation in an angle segment increases the accuracy. A two
point linearization is recommended to achieve the best INL performance for the chosen angle segment.
Symbol Parameter Conditions Min Typ Max Units
RES Resolution Analog and
PWM Output
Angular operating range
≥ 90ºC 12 bit
INLopt
Integral non-linearity
(optimum)360 degree
full turn
Maximum error with respect to the
best line fit. Centered magnet
without calibration, TAMB=25ºC
±0.5 deg
INLtemp
Integral non-linearity
(optimum) 360 degree
full turn
Maximum error with respect to the
best line fit. Centered magnet
without calibration,
TAMB = -40ºC to 150ºC
±0.9 deg
INL Integral non-linearity
360 degree full turn
Best line fit = (Errmax – Errmin) / 2
Over displacement tolerance with
6mm diameter magnet, without
calibration,
TAMB = -40ºC to 150ºC. (1)
±1.4 deg
TN Transition noise 1 sigma; (2) 0.06 deg
RMS
VDD5LowTH Undervoltage lower
threshold
VDD5 = 5V
3.1 3.4 3.7
V
VDD5HighTH Undervoltage higher
threshold 3.6 3.9 4.2
tPwrUp Power-up time Fast mode, times 2 in slow mode 10 ms
tdelay
System propagation
delay absolute output:
delay of ADC, DSP and
absolute interface
Fast mode, times 2 in slow mode 100 μs
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AS5163 − Electrical Characteristics
Timing Characteristics
Figure 9:
Timing Conditions
Symbol Parameter Conditions Min Typ Max Units
FRCOT Internal Master Clock 4.05 4.5 4.95 MHz
TCLK Interface Clock Time TCLK = 1/ FRCOT 202 222.2 247 ns
TDETWD WatchDog error detection time 12 ms
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AS5163 − Detailed Description
The AS5163 is manufactured in a CMOS process and uses a
spinning current Hall technology for sensing the magnetic field
distribution across the surface of the chip.
The integrated Hall elements are placed around the center of
the device and deliver a voltage representation of the magnetic
field at the surface of the IC.
Through Sigma-Delta Analog / Digital Conversion and Digital
Signal-Processing (DSP) algorithms, the AS5163 provides
accurate high-resolution absolute angular position
information. For this purpose, a Coordinate Rotation Digital
Computer (CORDIC) calculates the angle and the magnitude of
the Hall array signals.
The DSP is also used to provide digital information at the
outputs that indicate movements of the used magnet towards
or away from the device’s surface.
A small low cost diametrically magnetized (two-pole) standard
magnet provides the angular position information.
The AS5163 senses the orientation of the magnetic field and
calculates a 14-bit binary code. This code is mapped to a
programmable output characteristic. The type of output is
programmable and can be selected as PWM or analog output.
This signal is available at the pin 14 (OUT).
The analog and PWM output can be configured in many ways.
The application angular region can be programmed in a user
friendly way. The start angle position T1 and the end point T2
can be set and programmed according to the mechanical range
of the application with a resolution of 14 bits. In addition, the
T1Y and T2Y parameter can be set and programmed according
to the application. The transition point 0 to 360 degree can be
shifted using the break point parameter BP. This point is
programmable with a high resolution of 14 bits of 360 degrees.
The voltage for clamping level low CLL and clamping level high
CLH can be programmed with a resolution of 7 bits. Both levels
are individually adjustable.
These parameters are also used to adjust the PWM duty cycle.
The AS5163 also provides a compare function. The internal
angular code is compared to a programmable level using
hysteresis. The function is available over the output pin 11
(KDOWN).
Detailed Description
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AS5163 − Detailed Description
The output parameters can be programmed in an OTP register.
No additional voltage is required to program the AS5163. The
setting may be overwritten at any time and will be reset to
default when power is cycled. To make the setting permanent,
the OTP register must be programmed by using a lock bit. Else,
the content could be frozen for ever.
The AS5163 is tolerant to magnet misalignment and unwanted
external magnetic fields due to differential measurement
technique and Hall sensor conditioning circuitry.
Figure 10:
Typical Arrangement of AS5163 and Magnet
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AS5163 − Detailed Description
Operation
The AS5163 operates at 5V ±10%, using two internal
Low-Dropout (LDO) voltage regulators. For operation, the 5V
supply is connected to pin VDD. While VDD3 and VDD5 (LDO
outputs) must be buffered by 2.2μF capacitors, the VDD
requires a 1μF capacitor. All capacitors (low ESR ceramic) are
supposed to be placed close to the supply pins (see Figure 11).
The VDD3 and VDD5 outputs are intended for internal use only.
It must not be loaded with an external load.
Figure 11:
Connections for 5V Supply Voltages
Note(s):
1. The pins VDD3 and VDD5 must always be buffered by a capacitor. These pins must not be left floating, as this may cause unstable
internal supply voltages, which may lead to larger output jitter of the measured angle
2. Only VDD is overvoltage protected up to 27V. In addition, the VDD has a reverse polarity protection.
VDD Voltage Monitor
VDD Overvoltage Management
If the voltage applied to the VDD pin exceeds the overvoltage
upper threshold for longer than the detection time, then the
device enters a low power mode reducing the power
consumption. When the overvoltage event has passed and the
voltage applied to the VDD pin falls below the overvoltage
lower threshold for longer than the recovery time, then the
device enters the normal mode.
2.2μF
1μF
4.5 - 5.5V
VDD5
GND
VDD
5V Operation
Internal
VDD 4. 5 V
LDO
Internal
VDD 3.45V
VDD 3
LDO
2.2μF
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AS5163 − Detailed Description
VDD5 Undervoltage Management
When the voltage applied to the VDD5 pin falls below the
undervoltage lower threshold for longer than the VDD5_
detection time, then the device stops the clock of the digital
part and the output drivers are turned OFF to reduce the power
consumption. When the voltage applied to the VDD5 pin
exceeds the VDD5 undervoltage upper threshold for longer
than the VDD5_recovery time, then the clock is restarted and
the output drivers are turned ON.
Analog Output
The reference voltage for the Digital-to-Analog converter (DAC)
is taken internally from VDD. In this mode, the output voltage
is ratiometric to the supply voltage.
Programming Parameters
The Analog output voltage modes are programmable by OTP.
Depending on the application, the analog output can be
adjusted. The user can program the following application
specific parameters.
Figure 12:
Programming Parameters
The above listed parameters are input parameters. Over the
provided programming software and programmer, these
parameters are converted and finally written into the AS5163
128-bit OTP memory.
T1 Mechanical angle start point
T2 Mechanical angle end point
T1Y Voltage level at the T1 position
T2Y Voltage level at the T2 position
CLL Clamping Level Low
CLH Clamping Level High
BP Break point (transition point 0 to 360
degree)
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AS5163 − Detailed Description
Application Specific Angular Range Programming
The application range can be selected by programming T1 with
a related T1Y and T2 with a related T2Y into the AS5163. The
internal gain factor is calculated automatically. The clamping
levels CLL and CLH can be programmed independent from the
T1 and T2 position and both levels can be separately adjusted.
Figure 13:
Programming of an Individual Application Range
Figure 13 shows a simple example of the selection of the range.
The mechanical starting point T1 and the mechanical end point
T2 define the mechanical range. A sub range of the internal
CORDIC output range is used and mapped to the needed output
characteristic. The analog output signal has 12 bit, hence the
level T1Y and T2Y can be adjusted with this resolution. As a
result of this level and the calculated slope the clamping region
low is defined. The break point BP defines the transition
between CLL and CLH. In this example, the BP is set to 0 degree.
The BP is also the end point of the clamping level high CLH.
This range is defined by the level CLH and the calculated slope.
Both clamping levels can be set independently form each other.
The minimum application range is 10 degrees.
T1
T2
CLL
CLH
BP
T1 T2
100%VDD
0
Application range
T1Y
T2Y
CLL
CLH
mechanical range
electrical range
clamping range
low
clamping range
high
270 degree
0 degree
180 degree
90 degree
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AS5163 − Detailed Description
Application Specific Programming of the Break Point
The break point BP can be programmed as well with a resolution
of 14 bits. This is important when the default transition point is
inside the application range. In such a case, the default
transition point must be shifted out of the application range.
The parameter BP defines the new position. The function can
be used also for an ON-OFF indication.
Figure 14:
Individual Programming of the Break Point BP
T1
T2
CLL
CLH
BP
T1 T2
100%VDD
0
Application range
T1Y
T2Y
CLL
CLH
mechanical range
electrical range
clamping range
low
clamping range
high
270 degree
0 degree
180 degree
90 degree
clamping range
low
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AS5163 − Detailed Description
Full Scale Mode
The AS5163 can be programmed as well in the full scale mode.
The BP parameter defines the position of the transition.
Figure 15:
Full Scale Mode
For simplification, Figure 15 describes a linear output voltage
from rail to rail (0V to VDD) over the complete rotation range.
In practice, this is not feasible due to saturation effects of the
output stage transistors. The actual curve will be rounded
towards the supply rails (as indicated Figure 15).
Duty Cycle
0
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AS5163 − Detailed Description
Resolution of the Parameters
The programming parameters have a wide resolution of up to
14 bits.
Figure 16:
Resolution of the Programming Parameters
Figure 17:
Overview of the Angular Output Voltage
Symbol Parameter Resolution Note
T1 Mechanical angle start point 14 bits
T2 Mechanical angle stop point 14 bits
T1Y Mechanical start voltage level 12 bits
T2Y Mechanical stop voltage level 12 bits
CLL Clamping level low 7 bits 4096 LSBs is the maximum level
CLH Clamping level high 7 bits 31 LSBs is the minimum level
BP Break point 14 bits
Clamping Region Low
Failure Band Low
0
4
CLL
CLH
96
100
Output Voltage in percent of VDD
Failure Band High
Application Region
Clamping Region High
T2Y
T1Y
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AS5163 − Detailed Description
Figure 17 gives an overview of the different ranges. The failure
bands are used to indicate a wrong operation of the AS5163.
This can be caused due to a broken supply line. By using the
specified load resistors, the output level will remain in these
bands during a fail. It is recommended to set the clamping level
CLL above the lower failure band and the clamping level CLH
below the higher failure band.
Analog Output Diagnostic Mode
Due to the low pin count in the application, a wrong operation
must be indicated by the output pin OUT. This could be realized
using the failure bands. The failure band is defined with a fixed
level. The failure band low is specified from 0% to 4% of the
supply range. The failure band high is defined from 100% to
96%. Several failures can happen during operation. The output
signal remains in these bands over the specified operating and
load conditions. All the different failures can be grouped into
the internal alarms (failures) and the application related
failures.
CLOAD ≤ 42nF, RPU= 2kΩ to 5.6kΩ
RPD= 2kΩ to 5.6kΩ load pull-up
Figure 18:
Different Failure Cases of AS5163
For efficient use of diagnostics, it is recommended to program
to clamping levels CLL and CLH.
Type Failure Mode Symbol Failure
Band Note
Internal
alarms
(failures)
Out of magnetic
range (too less or too
high magnetic input)
MAGRng High/Low
Could be switched OFF by one OTP bit
ALARM_DISABLE.
Programmable by OTP bit DIAG_HIGH
CORDIC overflow COF High/Low Programmable by OTP bit DIAG_HIGH
Offset compensation
finished OCF High/Low Programmable by OTP bit DIAG_HIGH
Watchdog fail WDF High/Low Programmable by OTP bit DIAG_HIGH
Oscillator fail OF High/Low Programmable by OTP bit DIAG_HIGH
Application
related failures
Overvoltage
condition OV
High/Low
Dependant on the load resistor
Pull up->failure band high
Pull down->failure band low
Broken VDD BVDD
Broken VSS BVSS
Short circuit output SCO High/Low Switch OFF-> short circuit dependent
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AS5163 − Detailed Description
Analog Output Driver Parameters
The output stage is configured in a push-pull output. Therefore
it is possible to sink and source currents.
CLOAD ≤ 42nF, RPU= 2kΩ to 5.6kΩ
RPD= 2kΩ to 5.6kΩ load pull-up
Figure 19:
General Parameters for the Output Driver
Note(s):
1. A Pull-Up/Down load is up to 1kΩ with increased diagnostic bands from 0%-6% and 94%-100%.
Symbol Parameter Min Typ Max Units Note
IOUTSCL Short circuit output current (low
side driver) 8 32 mA
VOUT=27V
IOUTSCH Short circuit output current (high
side driver) -8 -32 mA
VOUT=0V
TSCDET Short circuit detection time 20 600 μs output stage turned OFF
TSCREC Short circuit recovery time 2 20 ms output stage turned ON
ILEAKOUT Output leakage current -20 20 μA VOUT=VDD=5V
BGNDPU Output voltage broken GND with
pull-up 96 100 %VDD
RPU = 2k to 5.6k
BGNDPD Output voltage broken GND with
pull-down 0 4 %VDD
RPD = 2k to 5.6k
BVDDPU Output voltage broken VDD with
pull-up 96 100 %VDD
RPU = 2k to 5.6k
BVDDPD Output voltage broken VDD with
pull-down 0 4 %VDD
RPD = 2k to 5.6k
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Figure 20:
Electrical Parameters for the Analog Output Stage
Note(s):
1. Not tested in production; characterization only.
Symbol Parameter Min Typ Max Units Note
VOUT Output voltage range
4 96
% VDD
6 94 Valid when 1k ≤ RLOAD < 2k
VOUTINL Output integral
nonlinearity 10 LSB
VOUTDNL Output differential
nonlinearity -10 10 LSB
VOUTOFF Output offset -50 50 mV At 2048 LSB level
VOUTUD Update rate of the output 100 μs Info parameter
VOUTSTEP Output step response 550 μs
Between 10% and 90%,
RPU/RPD =1kΩ, CLOAD=1nF;
VDD=5V
VOUTDRIFT Output voltage
temperature drift 2 2 % Of value at mid code
VOUTRATE Output ratiometricity error -1.5 1.5 %VDD 0.04*VDD ≤ VOUT ≤ 0.96*VDD
VOUTNOISE Noise(1) 10 mVpp
1Hz to 30kHz;
at 2048 LSB level
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AS5163 − Detailed Description
Pulse Width Modulation (PWM) Output
The AS5163 provides a pulse width modulated output (PWM),
whose duty cycle is proportional to the measured angle. This
output format is selectable over the OTP memory OP_MODE(0)
bit. If o utput pi n OUT is configured as open drain configuration,
then an external load resistor (pull up) is required. The PWM
frequency is internally trimmed to an accuracy of ±10% over
full temperature range. This tolerance can be cancelled by
measuring the ratio between the ON and OFF state. In addition,
the programmed clamping levels CLL and CLH will also adjust
the PWM signal characteristic.
Figure 21:
PWM Output Signal
Position 1
Position 4094
Position 0
Position 4095
PWmin
PWmax
TPWM = 1/fPWM
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AS5163 − Detailed Description
The PWM frequency can be programmed by the OTP bits PWM_
frequency (1:0). Therefore, four different frequencies are
possible.
Figure 22:
PWM Signal Parameters
Taking into consideration the AC characteristic of the PWM
output including load, it is recommended to use the clamping
function. The recommended range is 0% to 4% and 96% to
100%.
Figure 23:
Electrical Parameters for the PWM Output Mode
Symbol Parameter Min Typ Max Units Note
fPWM1 PWM frequency1 123.60 137.33 151.06 Hz PWM_frequency (1:0) = “11”
fPWM2 PWM frequency2 247.19 274.66 302.13 Hz PWM_frequency (1:0) = “10”
fPWM3 PWM frequency3 494.39 549.32 604.25 Hz PWM_frequency (1:0) = “01”
fPWM4 PWM frequency4 988.77 1098.63 1208.50 Hz PWM_frequency (1:0) = “00”
PWMIN MIN pulse width (1+1)*1/
fPWM μs
PWMAX MAX pulse width (1+4094)*1
/ fPWM ms
Symbol Parameter Min Typ Max Units Note
PWMVOL Output voltage low 0 0.4 V IOUT=8mA
ILEAK Output leakage -20 20 μA
VOUT=VDD=5V
PWMDC PWM duty cycle range 4 96 %
PWMSRF PWM slew rate 1 2 4 V/μs
Between 75% and 25%
RPU/RPD = 1kΩ,
CLOAD = 1nF, VDD = 5V
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AS5163 − Detailed Description
Kick Down Function
The AS5163 provides a special compare function. This function
is implemented using a programmable angle value with a
programmable hysteresis. It will be indicated over the open
drain output pin KDOWN. If the actual angle is above the
programmable value plus the hysteresis, the output is switched
to low. The output will remain at low level until the value KD is
reached in the reverse direction.
Figure 24:
Kick Down Hysteresis Implementation
Figure 25:
Programming Parameters for the Kick Down Function
Symbol Parameter Resolution Note
KD Kick Down Angle 6 bits
KDHYS Kick Down Hysteresis 2 bits
KDHYS (1:0) = “00” -> 8 LSB hysteresis
KDHYS (1:0) = “01” ->16 LSB hysteresis
KDHYS (1:0) = “10” -> 32 LSB hysteresis
KDHYS (1:0) = “11” -> 64 LSB hysteresis
KDOWN
KD(5:0)
KDHYS
KD(5:0)+KDHYS
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AS5163 − Detailed Description
Pull-up resistance 1k to 5.6K to VDD
CLOAD max 42nF
Figure 26:
Electrical Parameters of the KDOWN Output
Symbol Parameter Min Typ Max Unit Note
IKDSC Short circuit output current
(Low Side Driver) 6 24 mA
VKDOWN = 27V
TSCDET Short circuit detection time 20 600 μs Output stage turned OFF
TSCREC Short circuit recovery time 2 20 ms Output stage turned ON
KDVOL Output voltage low 0 1.1 V IKDOWN = 6mA
KDILEAK Output leakage -20 20 μA VKDOWN = 5V
KDSRF KDOWN slew rate (falling edge) 1 2 4 V/μs
Between 75% and 25%,
RPUKDWN = 1kΩ,
CLOAD_KDWN = 1nF, VDD = 5V
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AS5163 − Application Information
The benefits of AS5163 are as follows:
•Unique fully differential patented solution
•Best protection for automotive applications
•Easy to program
•Flexible interface selection PWM, analog output
•Ideal for applications in harsh environments due to
contactless position sensing
•Robust system, tolerant to magnet misalignment, airgap
variations, temperature variations and external magnetic
fields
•No calibration required because of inherent accuracy
•High driving capability of analog output (including
diagnostics)
Programming the AS5163
The AS5163 programming is a one-time-programming (OTP)
method, based on polysilicon fuses. The advantage of this
method is that no additional programming voltage is needed.
The internal LDO provides the current for programming.
The OTP consists of 128 bits, wherein several bits are available
for user programming. In addition, factory settings are stored
in the OTP memory. Both regions are independently lockable
by built-in lock bits.
A single OTP cell can be programmed only once. By default,
each cell is “0”; a programmed cell will contain a “1”. While it is
not possible to reset a programmed bit from “1” to “0”, multiple
OTP writes are possible, as long as only unprogrammed “0”-bits
are programmed to “1”.
Independent of the OTP programming, it is possible to
overwrite the OTP register temporarily with an OTP write
command. This is possible only if the user lock bit is not
programmed.
Due to the programming over the output pin, the device will
initially start in the communication mode. In this mode, the
digital angle value can be read with a specific protocol format.
It is a bidirectional communication possible. Parameters can be
written into the device. A programming of the device is
triggered by a specific command. With another command
(pass2funcion), the device can be switched into operation
mode (analog or PWM output). In case of a programmed user
lock bit, the AS5163 automatically starts up in the functional
operation mode. No communication of the specific protocol is
possible after this.
Application Information
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AS5163 − Application Information
Hardware Setup
The pin OUT and the supply connection are required for OTP
memory access. Without the programmed Mem_Lock_USER
OTP bit, the device will start up in the communication mode
and will remain into an IDLE operation mode. The pull up
resistor RCommunication is required during startup. Figure 2
shows the configuration of an AS5163.
Figure 27:
Programming Schematic of the AS5163
VDD3
GND
VDD5
GNDA
2.2μF
(low ESR)
0.3 ohm
OUT
VDD
SENSOR PCB
Programmer
2.2μF
(low ESR)
1μF
KDOWN
VDD
GNDD GNDP
R
Communication
VDD
GND
DIO
AS5163
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AS5163 − Application Information
Protocol Timing and Commands of Single Pin
Interface
During the communication mode, the output level is defined
by the external pull up resistor RCommunication. The output driver
of the device is in tristate. The bit coding (see Figure 35) has
been chosen in order to allow the continuous synchronization
during the communication, which can be required due to the
tolerance of the internal clock frequency. Figure 35 shows how
the different logic states '0' and '1' are defined. The period of
the clock TCLK is defined with 222.2 ns.
The voltage levels VH and VL are CMOS typical.
Each frame is composed by 20 bits. The 4 MSB (CMD) of the
frame specifies the type of command that is passed to the
AS5163. The 16 data bits contain the communication data.
There will be no operation when the ‘not specified’ CMD is used.
The sequence is oriented in such a way that the LSB of the data
is followed by the command. The number of frames vary
depending on the command. The single pin programming
interface block of the AS5163 can operate in slave
communication or master communication mode. In the slave
communication mode, the AS5163 receives the data organized
in frames. The programming tool is the driver of the single
communication line and can pull down the level.
In case of the master communication mode, the AS5163
transmits data in the frame format. The single communication
line can be pulled down by the AS5163.
Figure 28:
Bit Coding of the Single Pin Programming Interface
Bit “0” Bit “1”
T
1
T
2
T
1
T
2
V
H
V
L
V
H
V
L
T
1
= 128 * T
CLK
T
BIT
= T
1
+ T
2
= 512 * T
CLK
T
2
= 384 * T
CLK
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AS5163 − Application Information
Figure 29:
Protocol Definition
Figure 30:
OTP Commands and Communication Interface Modes
Note(s):
1. Other commands are reserved and shall not be used.
Possible Interface
Commands Description
AS5163
Communication
Mode
Command
CMD
Number
of
Frames
UNBLOCK Resets the interface SLAVE 0x0 1
WRITE128 Writes 128 bits (user + factory
settings) into the device SLAVE 0x9
(0x1) 8
READ128 Reads 128 bits (user + factory
settings) from the device SLAVE and MASTER 0xA 9
UPLOAD Transfers the register content
into the OTP memory SLAVE 0x6 1
DOWNLOAD Transfers the OTP content to
the register content SLAVE 0x5 1
FUSE Command for permanent
programming SLAVE 0x4 1
PASS2FUNC Change operation mode from
communication to operation SLAVE 0x7 1
READ Read related to address the
user data SLAVE and MASTER 0xB 2
WRITE Write related to address the
user data SLAVE 0xC 1
PACKET
IDLE START IDLE START
COMMANDDATA
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AS5163 − Application Information
When single pin programming interface bus is in high
impedance state, the logical level of the bus is held by the pull
up resistor RCommunication. Each communication begins by a
condition of the bus level which is called START. This is done by
forcing the bus in logical low level (done by the programmer or
AS5163 depending on the communication mode). Afterwards
the bit information of the command is transmitted as shown in
Figure 31.
Figure 31:
Bus Timing for the WRITE128 Command
Figure 32:
Bus Timing for the READ128 Command
In case of READ or READ128 command (seeFigure 32) the idle
phase between the command and the answer is 10 TBIT (TSW).
Figure 33:
Bus Timing for the READ Commands
In case of a WRITE command, the device stays in slave
communication mode and will not switch to master
communication mode.
LSB
LSB
MSB
LSB
MSB
LSB
MSB
1100
LSB
MSB
LSB
MSB
LSB
MSB
1000
DATA1 DATA0 DATA3 DATA2
1000
DATA14
MSB
20*TBIT
START
IDLE
IDLE
LSB
MSB
LSB
MSB
LSB
MSB
0110
LSB
MSB
LSB
MSB
P000
DATA1 DATA0
P000
DATA14
MSB
20*TBIT
DO NOT CARE DO NOT CARE
Slave Communication Mode Master Communication Mode
TSW
LSB
DATA3
IDLE
START
IDLE
LSB
MSB
LSB
MSB
LSB
MSB
0110
LSB
MSB
LSB
MSB
P00 0
DATA1 DATA0
20*TBIT
ADDR2 ADDR1
Slave Communication Mode Master Communication ModeTSW
IDLE
START
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AS5163 − Application Information
When using other commands like DOWNLOAD, UPLOAD, etc.
instead of READ or WRITE, it does not matter what is written in
the address fields (ADDR1, ADDR2).
UNBLOCK
The Unblock command can be used to reset only the one-wire
interface of the AS5163 in order to recover the possibility to
communicate again without the need of a POR after a stacking
event due to noise on the bus line or misalignment with the
AS5163 protocol.
The command is composed by a not idle phase of at least 6 TBIT
followed by a packet with all 20 bits at zero (see Figure 34).
Figure 34:
Unblock Sequence
VH
VL
= 6 * TBIT => 3072* TCLK
PACKET[19:0] = 0x00000
START
= 512*TCLK= 512*TCLK 20*TBIT => 10240*TCLK = 512*TCLK
IDLE IDLE
COMMAND FROM EXT MASTER
NOT IDLE
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AS5163 − Application Information
WRITE128
Figure 35 illustrates the format of the frame and the command.
Figure 35:
Frame Organization of the WRITE128 Command
DATA1 DATA0 CMD
LSB MSB LSB MSB LSB MSB
1100
DATA3 DATA2 CMD
LSB MSB LSB MSB LSB MSB
1000
DATA5 DATA4 CMD
LSB MSB LSB MSB LSB MSB
1000
DATA7 DATA6 CMD
LSB MSB LSB MSB LSB MSB
1000
DATA9 DATA8 CMD
LSB MSB LSB MSB LSB MSB
1000
DATA11 DATA10 CMD
LSB MSB LSB MSB LSB
1000
DATA13 DATA12 CMD
LSB MSB LSB MSB LSB
1000
DATA15 DATA14 CMD
LSB MSB LSB MSB LSB
1000
MSB
MSB
MSB
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AS5163 − Application Information
The command contains 8 frames. With this command, the
AS5163 receives only frames. This command will transfer the
data in the special function registers (SFRs) of the device. The
data is not permanent programmed using this command.
Figure 43 describe the organization of the OTP data bits.
The access is performed with CMD field set to 0x9. The next 7
frames with CMD field set to 0x1. The 2 bytes of the first
command will be written at address 0 and 1 of the SFRs; the 2
bytes of the second command will be written at address 2 and
3; and so on, in order to cover all the 16 bytes of the 128 SFRs.
Note(s): It is important to always complete the command. All
8 frames are needed. In case of a wrong command or a
communication error, a power ON reset must be performed. The
device will be delivered with the programmed Mem_Lock_
AMS OTP bit. This bit locks the content of the factory settings.
It is impossible to overwrite this particular region. The written
information will be ignored.
Page 32 ams Datasheet (discontinued)
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AS5163 − Application Information
READ128
Figure 36 illustrates the format of the frame and the command.
Figure 36:
Frame Organization of the READ128 Command
DO NOT CARE DO NOT CARE CMD
LSB MSB LSB MSB LSB MSB
0110
DATA1 DATA0 CMD DUMMY
LSB MSB LSB MSB
P000
DATA3 DATA2
LSB MSB LSB MSB
DATA5 DATA4
LSB MSB LSB MSB
DATA7 DATA6
LSB MSB LSB MSB
DATA9 DATA8
LSB MSB LSB MSB
DATA11 DATA10
LSB MSB LSB MSB
DATA13 DATA12
LSB MSB LSB MSB
DATA15 DATA14
LSB MSB LSB MSB
CMD DUMMY
P000
CMD DUMMY
P000
CMD DUMMY
P000
CMD DUMMY
P000
CMD DUMMY
P000
CMD DUMMY
P000
CMD DUMMY
P000
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AS5163 − Application Information
The command is composed by a first frame transmitted to the
AS5163. The device is in slave communication mode. The device
remains for the time TSWITCH in IDLE mode before changing into
the master communication mode. The AS5163 starts to send 8
frames. This command will read the SFRs. The numbering of the
data bytes correlates with the address of the related SFR.
An even parity bit is used to guarantee a correct data
transmission. Each parity (P) is related to the frame data content
of the 16 bit word. The MSB of the CMD dummy (P) is reserved
for the parity information.
DOWNLOAD
Figure 37 shows the format of the frame.
Figure 37:
Frame Organization of the DOWNLOAD Command
The command consists of one frame received by the AS5163
(slave communication mode). The OTP cell fuse content will be
downloaded into the SFRs.
The access is performed with CMD field set to 0x5.
UPLOAD
Figure 38 shows the format of the frame.
Figure 38:
Frame Organization of the UPLOAD Command
The command consists of one frame received by the AS5163
(slave communication mode) and transfers the data from the
SFRs into the OTP fuse cells. The OTP fuses are not permanent
programmed using this command.
The access is performed with CMD field set to 0x6.
DO NOT CARE DO NOT CARE CMD
LSB MSB LSB MSB LSB MSB
1001
DO NOT CARE DO NOT CARE CMD
LSB MSB LSB MSB LSB MSB
0011
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AS5163 − Application Information
FUSE
Figure 39 shows the format of the frame.
Figure 39:
Frame Organization of the FUSE Command
The command consists of one frame received by the AS5163
(slave communication mode) and it is giving the trigger to
permanent program the non volatile fuse elements.
The access is performed with CMD field set to 0x4.
Note(s): After this command, the device automatically starts to
program the built-in programming procedure. It is not allowed
to send other commands during this programming time. This
time is specified to 4ms after the last CMD bit.
PASS2FUNC
Figure 40 shows the format of the frame.
Figure 40:
Frame Organization of the PASS2FUNCTION Command
The command consists of one frame received by the AS5163
(slave communication mode). This command stops the
communication receiving mode, releases the reset of the DSP
of the AS5163 device and starts to work in functional mode with
the values of the SFR currently written.
The access is performed with CMD field set to 0x7.
DO NOT CARE DO NOT CARE CMD
LSB MSB LSB MSB LSB MSB
0001
DO NOT CARE DO NOT CARE CMD
LSB MSB LSB MSB LSB MSB
1011
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AS5163 − Application Information
READ
Figure 41 shows the format of the frame.
Figure 41:
Frame Organization of the READ Command
The command is composed by a first frame sent to the AS5163.
The device is in slave communication mode. The device remains
for the time TSWITCH in IDLE mode before changing into the
master communication mode. The AS5163 starts to send the
second frame transmitted by the AS5163.
The access is performed with CMD field set to 0xB.
When the AS5163 receives the first frame, it sends a frame with
data value of the address specified in the field of the first frame.
Figure 45 shows the possible readable data information for the
AS5163 device.
An even parity bit is used to guarantee a correct data
transmission. The parity bit (P) is generated by the 16 data bits.
The MSB of the CMD dummy (P) is reserved for the parity
information.
ADDR2 ADDR1 CMD
LSB MSB LSB MSB LSB MSB
1110
DATA2 DATA1 CMD DUMMY
LSB MSB LSB MSB
P000
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AS5163 − Application Information
WRITE
Figure 42 shows the format of the frame.
Figure 42:
Frame Organization of the WRITE Command
The command consists of one frame received by the AS5163
(slave communication mode). The data byte will be written to
the address. The access is performed with CMD field set to 0xC.
Figure 45 shows the possible write data information for the
AS5163 device.
Note(s): It is not recommended to access OTP memory
addresses using this command.
DATA ADDR CMD
LSB MSB LSB MSB LSB MSB
0101
ams Datasheet (discontinued) Page 37
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AS5163 − Application Information
OTP Programming Data
Figure 43:
OTP Data Organization
Data
Byte
Bit
Number Symbol Default Description
DATA15
(0x0F)
0 AMS_Test FS
ams Test Area
Factory Settings
1 AMS_Test FS
2 AMS_Test FS
3 AMS_Test FS
4 AMS_Test FS
5 AMS_Test FS
6 AMS_Test FS
DATA14
(0x0E)
0 AMS_Test FS
1 AMS_Test FS
2 AMS_Test FS
3 AMS_Test FS
4 ChipID<0> FS
Chip ID
5 ChipID<1> FS
6 ChipID<2> FS
7 ChipID<3> FS
DATA13
(0x0D)
0 ChipID<4> FS
1 ChipID<5> FS
2 ChipID<6> FS
3 ChipID<7> FS
4 ChipID<8> FS
5 ChipID<9> FS
6 ChipID<10> FS
7 ChipID<11> FS
DATA12
(0x0C)
0 ChipID<12> FS
1 ChipID<13> FS
2 ChipID<14> FS
3 ChipID<15> FS
Page 38 ams Datasheet (discontinued)
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AS5163 − Application Information
4 ChipID<16> FS
Chip ID
Factory Settings
5 ChipID<17> FS
6 ChipID<18> FS
7 ChipID<19> FS
DATA11
(0x0B)
0 ChipID<20> FS
1 MemLock_AMS 1 Lock of the Factory Setting Area
2 KD<0> 0
Kick Down Threshold
Customer Settings
3 KD<1> 0
4 KD<2> 0
5 KD<3> 0
6 KD<4> 0
7 KD<5> 0
DATA10
(0x0A)
0 ClampLow<0> 0
Clamping Level Low
1 ClampLow<1> 0
2 ClampLow<2> 0
3 ClampLow<3> 0
4 ClampLow<4> 0
5 ClampLow<5> 0
6 ClampLow<6> 0
7 DAC_MODE 0 DAC12/DAC10 Mode
DATA9
(0x09)
0 ClampHi<0> 0
Clamping Level High
1 ClampHi<1> 0
2 ClampHi<2> 0
3 ClampHi<3> 0
4 ClampHi<4> 0
5 ClampHi<5> 0
6 ClampHi<6> 0
7 DIAG_HIGH 0
Diagnostic Mode, default=0 for
Failure Band Low
Data
Byte
Bit
Number Symbol Default Description
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AS5163 − Application Information
DATA8
(0x08)
0 OffsetIn<0> 0
Offset
Customer Settings
1 OffsetIn<1> 0
2 OffsetIn<2> 0
3 OffsetIn<3> 0
4 OffsetIn<4> 0
5 OffsetIn<5> 0
6 OffsetIn<6> 0
7 OffsetIn<7> 0
DATA7
(0x07)
0 OffsetIn<8> 0
1 OffsetIn<9> 0
2 OffsetIn<10> 0
3 OffsetIn<11> 0
4 OffsetIn<12> 0
5 OffsetIn<13> 0
6 OP_Mode<0> 0
Selection of Analog=‘00’ or PWM
Mode=‘01’
7 OP_Mode<1> 0
DATA6
(0x06)
0 OffsetOut<0> 0
Output Offset
1 OffsetOut<1> 0
2 OffsetOut<2> 0
3 OffsetOut<3> 0
4 OffsetOut<4> 0
5 OffsetOut<5> 0
6 OffsetOut<6> 0
7 OffsetOut<7> 0
Data
Byte
Bit
Number Symbol Default Description
Page 40 ams Datasheet (discontinued)
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AS5163 − Application Information
DATA5
(0x05)
0 OffsetOut<8> 0
Customer Settings
1 OffsetOut<9> 0
2 OffsetOut<10> 0
3 OffsetOut<11> 0
4 KDHYS<0> 0
Kick Down Hysteresis
5 KDHYS<1> 0
6 PWM
Frequency<0> 0
Select the PWM frequency
(4 frequencies)
7 PWM
Frequency<1> 0
DATA4
(0x04)
0 BP<0> 0
Break Point
1 BP<1> 0
2 BP<2> 0
3 BP<3> 0
4 BP<4> 0
5 BP<5> 0
6 BP<6> 0
7 BP<7> 0
DATA3
(0x03)
0 BP<8> 0
1 BP<9> 0
2 BP<10> 0
3 BP<11> 0
4 BP<12> 0
5 BP<13> 0
6 FAST_SLOW 0 Output Data Rate
7 EXT_RANGE 0 Enables a wider z-Range
Data
Byte
Bit
Number Symbol Default Description
ams Datasheet (discontinued) Page 41
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AS5163 − Application Information
Note(s):
1. Factory settings (FS) are used for testing and programming at ams. These settings are locked (only read access possible).
DATA2
(0x02)
0 Gain<0> 0
Gain
Customer Settings
1 Gain<1> 0
2 Gain<2> 0
3 Gain<3> 0
4 Gain<4> 0
5 Gain<5> 0
6 Gain<6> 0
7 Gain<7> 0
DATA1
(0x01)
0 Gain<8> 0
1 Gain<9> 0
2 Gain<10> 0
3 Gain<11> 0
4 Gain<12> 0
5 Gain<13> 0
6 Invert_Slope 0
Clockwise / Counterclockwise
rotation
7 Lock_OTPCUST 0 Customer Memory Lock
DATA0
(0x00)
0 redundancy<0> 0
Redundancy Bits
1 redundancy<1> 0
2 redundancy<2> 0
3 redundancy<3> 0
4 redundancy<4> 0
5 redundancy<5> 0
6 redundancy<6> 0
7 redundancy<7> 0
Data
Byte
Bit
Number Symbol Default Description
Page 42 ams Datasheet (discontinued)
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AS5163 − Application Information
Data Content
• Redundancy (7:0): For a better programming reliability,
a redundancy is implemented. In case the programming
of one bit fails, then this function can be used. With an
address (7:0) one bit can be selected and programmed.
Figure 44:
Redundancy
Redundancy Code OTP Bit Selection
Redundancy <7:0>
in decimal
0 None
1 OP_Mode<1>
2 DIAG_HIGH
3 PWM Frequency<0>
4 - 10 ClampHi<6> - ClampHi<0>
11 - 17 ClampLow<6> - ClampLow<0>
18 OP_Mode<0>
19 - 32 OffsetIn<13> - OffsetIn<0>
33 - 46 Gain<13> - Gain<0>
47 - 60 BP<13> - BP<0>
61 - 72 OffsetOut<11> - OffsetOut<0>
73 Invert_Slope
74 FAST_SLOW
75 EXT_RANGE
76 DAC_MODE
77 Lock_OTPCUST
78 - 83 KD<5> - KD<0>
84 - 85 KDHYS<1> - KDHYS<0>
86 PWM Frequency<1>
ams Datasheet (discontinued) Page 43
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AS5163 − Application Information
•Lock_OTPCUST = 1, locks the customer area in the OTP
and the device is starting up from now on in operating
mode.
• Invert_Slope = 1, inverts the output characteristic in
analog output mode.
•Gain (7:0): With this value one can adjust the steepness
of the output slope.
•EXT_RANGE = 1, provides a wider z-Range of the magnet
by turning OFF the alarm function.
•FAST_SLOW = 1, improves the noise performance due to
internal filtering.
• BP (13:0): The breakpoint can be set with resolution of 14
bit.
• PWM Frequency (1:0): Four different frequency settings
are possible. Please refer to Figure 22.
• KDHYS (1:0): Avoids flickering at the KDOWN output (pin
11). For settings, refer to Figure 25.
• OffsetOut (11:0): Output characteristic parameter
• ANALOG_PWM = 1, selects the PWM output mode.
• OffsetIn (13:0): Output characteristic parameter
• DIAG_HIGH = 1: In case of an error, the signal goes into
high failure-band.
• ClampHI (6:0): Sets the clamping level high with respect
to VDD.
•DAC_MODE disables filter at DAC
• ClampLow (6:0): Sets the clamping level low with respect
to VDD.
•KD (5:0): Sets the kick-down level with respect to VDD.
Page 44 ams Datasheet (discontinued)
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AS5163 − Application Information
Read / Write User Data
Figure 45:
Read / Write Data
Data Content
Data only for read:
•CORDIC_OUT(13:0): 14-bit absolute angular position
data.
•OCF (Offset Compensation Finished): logic high indicates
the finished Offset Compensation Algorithm. As soon as
this bit is set, the AS5163 has completed the startup and
the data is valid.
•COF (CORDIC Overflow): Logic high indicates an out of
range error in the CORDIC part. When this bit is set, the
CORDIC_OUT(13:0) data is invalid. The absolute output
maintains the last valid angular value. This alarm may be
resolved by bringing the magnet within the X-Y-Z
tolerance limits.
•AGC_VALUE (7:0): magnetic field indication.
Data for write and read:
• DSP_RES resets the DSP part of the AS5163 the default
value is 0. This is active low. The interface is not affected
by this reset.
•R1K_10K defines the threshold level for the OTP fuses.
This bit can be changed for verification purpose. A
verification of the programming of the fuses is possible.
The verification is mandatory after programming.
Area
Region Address Address Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
R/W User
Data
0x10 16 CORDIC_OUT[7:0]
0x11 17 0 0 CORDIC_OUT[13:8]
0x12 18
OCF COF 0 0 0 0 DSP_RES R1K_10K
0x17 23 AGC_VALUE[7:0]
Read Only
Read and Write
ams Datasheet (discontinued) Page 45
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AS5163 − Application Information
Programming Procedure
Note(s): After programming the OTP fuses, a verification is
mandatory. The procedure described below must be strictly
followed to ensure properly programmed OTP fuses.
•Pull-Up / Pull-Down on OUT pin
•VDD=5V
•Wait startup time, device enters communication mode
•Write128 command: The trimming bits are written in the
SFR memory.
•Read128 command: The trimming bits are read back.
•Upload command: The SFR memory is transferred into the
OTP RAM.
•Fuse command: The OTP RAM is written in the Poly Fuse
cells.
•Wait fuse time (6 ms)
•Write command (R1K_10K=1): Poly Fuse cells are
transferred into the RAM cells compared with 10kΩ
resistor.
•Download command: The OTP RAM is transferred into the
SFR memory.
•Read128 command: The fused bits are read back.
•Write command (R1K_10K=0): Poly Fuse cells are
transferred into the RAM cells compared with 1kΩ resistor.
•Download command: The OTP RAM is transferred into the
SFR memory.
•Read128 command: The fused bits are read back.
•Pass2Func command or POR: Go to Functional mode.
For further information, please refer to Application Note
AN5163-10 available at www.ams.com.
Page 46 ams Datasheet (discontinued)
Document Feedback [v2-10] 2017-Jun-23
AS5163 − Application Information
Physical Placement of the Magnet
The best linearity can be achieved by placing the center of the
magnet exactly over the defined center of the chip as shown in
Figure 46.
Figure 46:
Defined Chip Center and Magnet Displacement Radius
Area of recommended maximum magnet
misalignment
Defined
center
Rd
3.2mm 3.2mm
2.5mm
2.5mm
1
ams Datasheet (discontinued) Page 47
[v2-10] 2017-Jun-23 Document Feedback
AS5163 − Application Information
Magnet Placement
The magnet’s center axis should be aligned within a
displacement radius Rd of 0.25mm (larger magnets allow more
displacement) from the defined center of the IC.
The magnet may be placed below or above the device. The
distance should be chosen such that the magnetic field on the
die surface is within the specified limits (see Figure 46). The
typical distance “z” between the magnet and the package
surface is 0.5mm to 1.5mm, provided the recommended
magnet material and dimensions (6mm x 3mm) are used. Larger
distances are possible, as long as, the required magnetic field
strength stays within the defined limits.
However, a magnetic field outside the specified range may still
produce usable results, but the out-of-range condition will be
indicated by an alarm forcing the output into the failure band.
Figure 47:
Vertical Placement of the Magnet
0.2299±0.100
0.2341±0.100
0.7701±0.150
N S
Package surface
Die surface
Page 48 ams Datasheet (discontinued)
Document Feedback [v2-10] 2017-Jun-23
AS5163 − Application Information
Mechanical Data
The internal Hall elements are placed in the center of the
package on a circle with a radius of 1 mm.
Figure 48:
Hall Element Position
Note(s):
1. All dimensions in mm.
2. Die thickness 203 μm nom.
3. Adhesive thickness 30 ± 15 μm.
4. Lead frame downest 152 ± 25 μm.
5. Lead frame thickness 125 ± 8 μm.
ams Datasheet (discontinued) Page 49
[v2-10] 2017-Jun-23 Document Feedback
AS5163 − Package Drawings & Markings
The device is available in a 14-Lead Thin Shrink Small Outline
Package.
Figure 49:
Package Drawings and Dimensions
Note(s):
1. Dimensions and tolerancing confirm to ASME Y14.5M-1994.
2. All dimensions are in miilimeters. Angles are in degrees.
Figure 50:
Marking: @YYWWMZZ
JEDEC Package Outline Standard: MO - 153
Thermal Resistance Rth(j-a): 89 K/W in still air, soldered on PCB
@YY WW MZZ
Sublot identifier Year Week Assembly plant identifier Assembly traceability code
Package Drawings & Markings
Symbol Min Nom Max
A--1.20
A1 0.05 - 0.15
A2 0.80 1.00 1.05
b 0.19 - 0.30
c 0.09 - 0.20
D 4.90 5.00 5.10
E - 6.40 BSC -
E1 4.30 4.40 4.50
e - 0.65 BSC -
L 0.45 0.60 0.75
L1 - 1.00 REF -
Symbol Min Typ Max
R0.09- -
R1 0.09 - -
S0.20- -
Θ10º - 8º
Θ2-12 REF-
Θ3-12 REF-
aaa - 0.10 -
bbb - 0.10 -
ccc - 0.05 -
ddd - 0.20 -
N14
Green
RoHS
Page 50 ams Datasheet (discontinued)
Document Feedback [v2-10] 2017-Jun-23
AS5163 − Ordering & Contact I nformation
The devices are available as the standard products shown in
Figure 51.
Figure 51:
Ordering Information
Not Recommended for New Designs!
ams AG is discontinuing production of this device. Final lifetime
buy order must be placed by DECEMBER 31, 2017.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Ordering Code Description Package Delivery Form Delivery Quantity
AS5163-HTSP 12-Bit High Voltage
Rotary Magnetic Encoder 14-pin TSSOP Tape & Reel
4500 pcs/reel
AS5163-HTSM 500 pcs/reel
Ordering & Contact Information
ams Datasheet (discontinued) Page 51
[v2-10] 2017-Jun-23 Document Feedback
AS5163 − RoHS Compliant & ams Green Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
RoHS Compliant & ams Green
Statement
Page 52 ams Datasheet (discontinued)
Document Feedback [v2-10] 2017-Jun-23
AS5163 − Copyright s & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Copyrights & Disclaimer
ams Datasheet (discontinued) Page 53
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AS5163 − Document Status
Document Status Product Status Definition
Product Preview Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Preliminary Datasheet Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Datasheet Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Datasheet (discontinued) Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Document Status
Page 54 ams Datasheet (discontinued)
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AS5163 − Revision Information
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision
2. Correction of typographical errors is not explicitly mentioned.
Changes from 2-09 (2016-Jul-18) to current revision 2-10 (2017-Jun-23) Page
Update of document status
Update of Ordering Information section by adding NRND statement 50
Revision Information
ams Datasheet (discontinued) Page 55
[v2-10] 2017-Jun-23 Document Feedback
AS5163 − Content Guide
1 General Description
1 Key Benefits & Features
2 Applications
2 Block Diagram
3 Pin Assignment
3 Pin Description
5Absolute Maximum Ratings
6 Electrical Characteristics
6 Operating Conditions
6 Magnetic Input Specification
7 Electrical System Specifications
8 Timing Characteristics
9 Detailed Description
11 Operation
11 VDD Voltage Monitor
12 Analog Output
12 Programming Parameters
13 Application Specific Angular Range Programming
14 Application Specific Programming of the Break Point
15 Full Scale Mode
16 Resolution of the Parameters
17 Analog Output Diagnostic Mode
18 Analog Output Driver Parameters
20 Pulse Width Modulation (PWM) Output
22 Kick Down Function
24 Application Information
24 Programming the AS5163
25 Hardware Setup
26 Protocol Timing and Commands of Single Pin Interface
29 UNBLOCK
30 WRITE128
32 READ128
33 DOWNLOAD
33 UPLOAD
34 FUSE
34 PASS2FUNC
35 READ
36 WRITE
37 OTP Programming Data
42 Data Content
44 Read / Write User Data
45 Programming Procedure
46 Physical Placement of the Magnet
47 Magnet Placement
48 Mechanical Data
Content Guide
