Express-CB/CBE COM Express(R) Basic Size Type 2 Module with Intel(R) Core i7/i5/i3 Processor Features Type 2 Intel(R) CoreTM i7/i5/i3 Processor with Mobile Intel(R) QM57 Express Chipset Up to 8 GB Dual Channel DDR3 SDRAM at 1066 MHz (optional ECC) Six PCIe x1, one PCIe x16 for graphics (or general purpose x8/4/1) 18/24-bit LVDS and Embedded DisplayPort SATA 3 Gb/s IDE (PATA), Gigabit Ethernet, USB 2.0 Specifications Audio Core System CPU Memory Chipset L2 Cache BIOS Hardware Monitor Watchdog Timer Expansion Busses Intel(R) CoreTM i7-610E Processor (4M Cache, 2.53 GHz) 35 W Intel(R) CoreTM i5-520E Processor (3M Cache, 2.40 GHz) 35 W Intel(R) CoreTM i7-620LE Processor (4M Cache, 2.00 GHz) 25 W Intel(R) CoreTM i7-620UE Processor (4M Cache, 1.06 GHz) 18 W Intel(R) CoreTM i3-330E Processor (3M Cache, 2.13 GHz) 35W Intel(R) Celeron(R) Processor P4505 (2M Cache, 1.86 GHz) 35 W Intel(R) Celeron(R) Processor U3405 (2M Cache, 1.06GHz) 18W Dual channel 800/1066 MHz DDR3 memory up to 8 GB in dual stacked SODIMM socket; ECC memory for CBE series only Mobile Intel(R) QM57 Express Chipset 2 MB (Celeron(R) M), 4/3 MB (Intel(R) CoreTM i7 / i5) AMI EFI with CMOS backup in 16 Mbit SPI flash Supply voltages and CPU temperature Programmable timer ranges to generate RESET PCI Express x16 bus for discrete graphics solution or general purpose PCI Express (2 x8 or 2 x4 or 2 x1) or Embedded Display Port (eDP) 7 PCI Express x1: Lanes 0/1/2/3/4/5 are free, lane 6 is occupied by GbE; can be optionally configured as 1 PCIe x4 (on 0/1/2/3) and 2 PCIe x1 (4/5) 32-bit PCI: PCI Rev. 2.3 at 33MHz, supporting 4 bus masters LPC bus, SMBus (system) , I2C (user) VGA LVDS Integrated in Intel(R) PCH QM57 On Express-BASE carrier (ALC886) Ethernet Chipset Interface Integrated in Mobile QM57 with 82577LM PHY 10/100/1000 Mbps Ethernet I/O Interfaces Chipset USB SATA PATA Integrated on Intel(R) PCH QM57 Supports up to eight ports USB v. 2.0 Four ports SATA 3 Gb/s with optional support for RAID 0,1,5,10 SATA to PATA bridge on SATA channel 1, Master only Super I/O Connected to LPC bus on carrier if needed TPM (optional) Chipset Type Infineon SLB9635TT1.2 TPM 1.2 Power Video Integrated in Processor Integrated Video Feature Support Chipset Audio Codec Gen 5.75 with 12 execution units DirectX 10 and OpenGL 2.1 Intel(R) Dynamic Video Memory Technology (Intel(R) DVMT 5.0) Video capture via x1 concurrent PCI Express port PAVP (Protected Audio-Video Path) support for Protected Intel HD Audio Playback High performance MPEG-2 decoding WMV9 (VC-1) and H.264 (AVC) support Hardware acceleration for MPEG2 VLD/iDCT Microsoft DirectX 10 support OpenGL 2.1 support Blu-ray support @ 40 Mb/s Hardware motion compensation Intermediate Z in classic rendering Analog VGA support by 300 MHz DAC Analog monitor support up to QXGA ( 2048 X 1536) Single / Dual channel 18/24-bit panels Input Power Power States Power Consumption Smart Battery Support AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 21 W with CoreTM i7-620UE at 1.2 GHz and 2 GB memory typical Yes Mechanical and Environmental Dimension Operating Temperature Storage Temperature Humidity Shock Vibration Compatibility Certification Basic size: 125 mm x 95 mm Standard: 0C to +60C -20C to +80C 90% at +60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM Express(R) Type 2, Basic form factor 125 mm x 95 mm CE, FCC Operating Systems Standard Support Windows XP(e), Vista, Windows 7, Linux Extended Support (BSP) Embedded XP support package, Linux 2.6.x BSP, VxWorks 6.x BSP, AIDI Library for Windows and Linux http://www.adlinktech.com/Computer-on-Module Functional Diagram CPU DDR3 Memory Controller with ECC Intel(R) Core i7 / i5 / i3 Channel A DDR3 SODIMM with or without ECC Channel B DDR3 SODIMM with or without ECC 800/1066 MHz 800/1066 MHz PCIe x16 Gfx 2 PCIe x8 Embedded DisplayPort (eDP) Embedded Graphics Core VGA LVDS DMI FDI AB VGA SDVO HDMI (3x) DVI (3x) DisplayPort (3x) LVDS dual 18/24-bit HD Audio LAN Intel(R) PHY 82577LM LAN (occupies PCIe x1 port 6) GbE MAC PCH Mobile Intel(R) QM57 Express Chipset PCIe x1 PCIe x1 (port 0/1/2/3/4/5) 8x USB 2.0 GPIO 6x SATA 2 SMBus SATA (1 port) SATA (4 ports) CD Audio JM330 SPI PATA IDE SATA to PATA PCI 33 MHz v2.3 PCI LPC USB SMBus GPIO BIOS MAX6621 Mon(T) I2C to GPIO LM87 Mon(T/V) I 2C Test Header TPM BC LPC Ordering Information Accessories Modules Non-ECC Model Number ECC Model Number Description/Configuration Express-CB-i3-330E Express-CBE-i3-330E COM Express(R) Basic Size Type 2 Module with Intel(R) CoreTM i3-330E SV at 2.13 GHz Model Number Description/Configuration Heat Spreaders Express-CB-i5-520E Express-CBE-i5-520E COM Express Basic Size Type 2 Module with Intel(R) CoreTM i5-520 SV at 2.4 GHz (R) Express-CB-i7-610E Express-CBE-i7-610E COM Express(R) Basic Size Type 2 Module with Intel(R) CoreTM i7-610E SV at 2.53 GHz Express-CB-i7-620LE Express-CBE-i7-620LE COM Express(R) Basic Size Type 2 Module with Intel(R) CoreTM i7-620LE LV at 2.0 GHz Express-CB-i7-620UE Express-CBE-i7-620UE COM Express(R) Basic Size Type 2 Module with Intel(R) CoreTM i7-620UE ULV at 1.07 GHz Express-CB-U3405 Express-CBE-U3405 COM Express(R) Basic Size Type 2 Module with Intel(R) Celeron(R) U3405 ULV at 1.06 GHz Express-CB-P4505 Express-CBE-P4505 COM Express(R) Basic Size Type 2 Module with Intel(R) Celeron(R) P4505 SV at 1.86 GHz Note: All specifications are subject to change without further notice. HTS-CB-B Heatspreader with threaded standoffs for Express-CB/CBE HTS-CB-BT Heatspreader with thouth hole for top mounting for Express-CB/CBE Active Heatsink THSF-CB-B Heatsink with fan and threaded standoffs for Express-CB/ CBE Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ADLINK Technology: Express-CB-i5-520E HTS-CB-BT HTS-CB-B THSF-CB-B