ADVANCED Ball Grid Array , INTERCONNECTIONS. (BGA) Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 Fax 401-823-8723 * Email info@advintcorp.com Internet http:/Awww.advintcorp.com BGA Sockets Standard Socket (S): * Mates with Standard Adapter (A) * Socket size same size as BGA device body e Use with SMT Adapter for LGA and reworked BGA device socketing Extraction Socket (SB): * Mates with Extraction Slot Adapter (AX) * Socket size equals BGA body + .079/(2.0) * Protects valuable PCB during device/adapter extraction - tool never touches PCB Available in 1.0, 1.27 and 1.5mm pitch only Features: Advanced? exclusive eutectic solder ball Guide Post Socket (SG): terminals offer superior SMT processing. * Integral molded corners allow accurate positioning of * Uses same footprint as BGA device. device/adapter assembly in blind-mating applications. Proven long-term performance in vigorous Mates with Extraction Slot Adapter (AX) temperature cycling applications - solder Socket size equals BGA body + .276/(7.00) ball terminal absorbs TCE mismatch. * Closed bottom socket terminal for 100% * Available in 1.27 and 1.5mm pitch only anti-wicking of soider. Terminals: Gold contacts allow gold/gold . 1.27 & 1.8mm Pitch Terminals 1.0mm Pitch Terminals interconnections to male Adapter pins. Type -636 Type -673 Type -716 Type -717 Low insertion force socket with multi- Solder Ball Thru-Hole Solder Balt Thru-Hole STANDARD fingered high reliability Beryllium Copper contacts. * Coplanarity consistently under .006 inch industry standard. 128 ro gh , (3.28) .024/(0.61) Dia. 015 Dial. In-house Tape and Reel packaging one pia. | ji (0.38) + t available. PATENTED | PATENTED See page 4 for How It Works. O.80mm Piich Terminals 0.75mm Pitch Terminals . Type -702 Type -731 Type -758 Terminals and Contacts: Seer Ball Thru-Hole Seer Bal Terminals: Brass - Copper Alloy (C36000) ASTM-B-16 Contacts: Beryllium Copper - Copper Alloy (C17200), ASTM-B-124 rv me .020/{0.51) Dia. .018/(0.46) Dia. . O11 Dia. Plating: (0.28) a SP PATENTED PATENTED : How To Order G - Gold over Nickel Body Material: M - Molded High Temp. Glass Filled 1M G S XXX -636 G G_ Thermoplastic (PPS.), U.L. Rated 94V-O, Footprint Dash# __] | ee Plating -60C to 260C (-76F to 500F) if Applicable - Gold - - a T le Plating F - FR-4 Glass Epoxy, U.L. Rated 94V-O Bot ye ops (1.27 & 1.5mm pitch) G- Gold Solder: F -FR-4 (0.75, 0.80 & 1.0mm pitch) Terminal Type i . Pitch Number of Positi 6361/37Pb, Eutectic, 183C (361 A F) B = .059/(1.5mm) See BGA Footprint section or web site 52 6590 ga = mm Model T J = .0315/(0.80mm) S= Standard Socket K = .0295/(0.75mm) SB = Extraction Slot (1.5, 1.27 and 1.0mm pitch only) SG = Guide Post Socket (1.5 and 1.27mm pitch only) inch/(mm) Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Page 5