PEMI4CSP/RT,135 - NXP SEMICONDUCTORS

1. Product profile

1.1 General description

The devices are a fa mily of 4-, 6- and 8- channel RC low pass filters wh ich are designed to

provide filtering of undesired RF signals on the I/O ports of portable communication or

computing devices. In addition the devices incorporate diodes to provide protection to

downstream components from ElectroStatic Discharge (ESD) voltages up to 20 kV.

The PEMIxCSP family is fabricated using monolithic silicon technology and integrates

up to eight resistors and 16 protection diodes in a single Wafer Level Chip-Size

Package (WLCSP).

These features make the devices ideal for use in applications requiring the utmost in

miniaturization such as mobile phone handsets, cordless telephones and personal digital

devices.

1.2 Features and benefits

Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halo gen

and antimony (Dark Green compliant)

Integrated 4-, 6- and 8-channel -type RC filter network

Channel series resistance Rs(ch) =100

Channel capacitance Cch = 23 or 30 pF at Vbias(DC) =2.5V

Channel capacitance Cch = 41 or 54 pF at Vbias(DC) =0V

Available in 10, 15 and 20-ball WLCSP

ESD protection up to 20 kV contact discharge accord ing to IEC 61000-4 -2,

far exceeding level 4

1.3 Applications

General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency

Interference (RFI) filtering and downstream ESD protection for:

Cellular phone and Personal Communication Systems (PCS) mobile handsets

Cordless telephones

Wireless data (WAN/LAN) systems

PEMIxCSP family

Integrated 4-, 6- and 8-channel passive filter network with

ESD protection

Rev. 2 — 27 January 2012 Product data sheet

Product data sheet Rev. 2 — 27 January 2012 2 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

2. Pinning information

2.1 Pinning

2.2 Pin description

Fig 1. PEMI4CSP: pin configuratio n Fig 2. PEMI6CSP: pin configuration

Fig 3. PEMI8CSP: pin configuratio n

001aak062

transparent top view,

solder balls facing down

bump A1

index area

transparent top view,

solder balls facing down

bump A1

index area

001aak063

transparent top view,

solder balls facing down

bump A1

index area

001aak064

Table 1. Pinning

Pin Description

PEMI4CSP PEMI6CSP PEMI8CSP

A1 and C1 A1 and C1 A1 and C1 filter channel 1

A2 and C2 A2 and C2 A2 and C2 filter channel 2

A3 and C3 A3 and C3 A3 and C3 filter channel 3

A4 and C4 A4 and C4 A4 and C4 filter channel 4

- A5 and C5 A5 and C5 filter channel 5

- A6 and C6 A6 and C6 filter channel 6

- - A7 and C7 filter channel 7

- - A8 and C8 filter channel 8

B1 and B2 B1, B2 and B3 B1, B2, B3 and B4 ground (GND)

Product data sheet Rev. 2 — 27 Janu ary 2012 3 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

3. Ordering information

4. Functional diagram

Table 2. Ordering information

Type number Package

Name Description Version

PEMI4CSP/RT WLCSP10 wafer level chip-size package; 10 bumps; 1.56 1.05 0.61 mm PEMI4CSP/RT

PEMI4CSP/RW WLCSP10 wafer level chip-size package; 10 bumps; 1.56 1.05 0.61 mm PEMI4CSP/RW

PEMI6CSP/RT WLCSP15 wafer level chip-size package; 15 bumps; 2.36 1.05 0.61 mm PEMI6CSP/RT

PEMI6CSP/RW WLCSP15 wafer level chip-size package; 15 bumps; 2.36 1.05 0.61 mm PEMI6CSP/RW

PEMI8CSP/RT/P WLCSP20 wafer level chip-size package; 20 bumps; 3.16 1.05 0.61 mm PEMI8CSP/RT/P

PEMI8CSP/RW/P WLCSP20 wafer level chip-size package; 20 bumps; 3.16 1.05 0.61 mm PEMI8CSP/RW/P

Fig 4. PEMI4CSP: schematic diagram Fig 5. PEMI6CSP: schematic diagram

Fig 6. PEMI8CSP: schematic diagram

018aaa077

Rs(ch)

Cch

C1 to C4

GND

A1 to A4

2Cch

018aaa078

Rs(ch)

Cch

C1 to C6

GND

A1 to A6

2Cch

018aaa079

Rs(ch)

Cch

C1 to C8

GND

A1 to A8

2Cch

Product data sheet Rev. 2 — 27 Janu ary 2012 4 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

5. Limiting values

[1] Device is qualified with 1000 pulses of 15 kV contact discharges each, according to the IEC 61000-4-2

model and far exceeds the specified level 4 (8 kV contact discharge).

6. Characteristics

[1] Guaranteed by design.

[2] According to IEC 61000-4-5 and IEC 61000-4-9.

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage 0.5 +5.6 V

VESD electrostatic discharge

voltage all pins to ground [1]

contact discharge - 20 kV

air discharge - 30 kV

IEC 61000-4-2, level 4

all pins to ground

contact discharge - 8kV

air discharge - 15 kV

Ich channel current (DC) Tamb =70C-33mA

Pch channel power dissipation continuous power;

Tamb =70C-60mW

Ptot total power dissipation continuous power;

Tamb =70C-250mW

Tstg storage temperature 55 +150 C

Tamb ambient temperature 40 +85 C

Table 4. Channel characteristics

Tamb =25



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Rs(ch) channel series resistance 80 100 120 

Cch channel capacitance for the total channel;

f = 100 kHz [1]

PEMIxCSP/RT Vbias(DC) =0V 334149pF

Vbias(DC) =2.5V - 23 - pF

PEMIxCSP/RW Vbias(DC) =0V 435465pF

Vbias(DC) =2.5V - 30 - pF

VBR breakdown voltage positive clamp; II=1mA 5.8 - 9 V

VFforward voltage negative clamp; IF=1mA 1.5 - 0.4 V

ILR reverse leakage current per channel; VI= 3.5 V - - 0.1 A

Rdyn dynamic resistance I = 1 A [2]

positive transient - 0.3 - 

negative transient - 0.85 - 

Product data sheet Rev. 2 — 27 Janu ary 2012 5 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

7. Application information

7.1 Insertion loss

The devices are designed as EMI/RFI filters for multichannel interfaces.

All measurements were performed in a typical 50  NetWork Analyzer (NWA) setup as

shown in Figure 7. The measured insertion loss in a 50  system is depicted in Figure 8.

Table 5. Frequency chara cteristics

Tamb =25



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

il insertion loss Rsource =50; RL=50

PEMIxCSP/RT 800 MHz < fi<3GHz 25 30 - dB

fi=1.7GHz - 35 - dB

PEMIxCSP/RW 800 MHz < fi<3GHz 27 32 - dB

fi=1.7GHz - 37 - dB

ct crosstalk attenuation Rsource =50; RL=50;

800 MHz < fi<3GHz -30-dB

f3dB cut-off frequency Rsource =50; RL=50

PEMIxCSP/RT - 128 - MHz

PEMIxCSP/RW - 98 - MHz

Fig 7. Frequency response setup

018aaa074

50 Ω

Vgen

50 Ω

DUT OUTIN

Product data sheet Rev. 2 — 27 Janu ary 2012 6 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

7.2 Use cases

The selection of one of the filter device has to be performed in dependence of the

maximum clock frequency, the driver strength, the capa citive load of the sink and the

maximum applicable rise and fall times.

7.3 LCD interfaces, medium-speed interfaces

For digital interfaces such as Liquid Crystal Display (LCD) interfaces running at clock

speeds between 10 MHz and 25 MHz or more, the devices can be used in depende nce of

the sink load, the clock speed, the driver strength and the rise and fall time requirements.

The minimum EMI filter requirements may be an important factor, too.

7.4 Keypad, low-speed interfaces

Especially for lower-speed interfaces such as keypads, low-speed serial interfaces and

low-speed control signals, the PEMIxCSP family offers a very robust ESD protection and

strong suppression of unwanted frequencies (EMI filtering). Due to their small size the

devices can easily be spread on a Printed-Circuit Board (PCB) in order to move the

ESD and EMI protection close to the part of the design which shall be protected.

(1) PEMIxCSP/RT

(2) PEMIxCSP/RW

Fig 8. Frequency response curves

018aaa080

−40

−20

S21

(dB)

−60

f (MHz)

10−1104

103

110

(1)

(2)

Product data sheet Rev. 2 — 27 Janu ary 2012 7 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

8. Marking

All dies are laser-marked with the following information (see Figure 9 and 10):

•A marker indicating the pin A1 position.

•Two line s of ch aracters or number s:

–The first line (placeholder <marking code>) indicates the marking code.

Mapping of product type numbers to marking codes is given in Table 6.

–The second line (placeholder <lot ID>) indicates the production lot.

This information enable to track a device down to a particular production date.

Fig 9. PEMI4CSP and PEMI6CSP: outline of the marking

Fig 10. PEMI8CSP: outline of the mar king

Table 6. Marking codes

Type number Marking code Type number Marking code

PEMI4CSP/RT RT PEMI6CSP/RW RW

PEMI4CSP/RW RW PEMI8CSP/RT/P RT

PEMI6CSP/RT RT PEMI8CSP/RW/P RW

018aaa081

pin A1 marker

018aaa082

pin A1 marker

Product data sheet Rev. 2 — 27 Janu ary 2012 8 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

9. Package outline

Fig 11. Package outline PEMI4CSP (WLCSP10)

wlcsp10_4-2-4_po

European

projection

WLCSP10: wafer level chip-size package; 10 bumps (4-2-4)

detail X

B2B1

bump A1

index area

1/2 e

Table 7. Package outline dimensions of PEMI4CSP

Symbol Min Typ Max Unit

A 0.570.610.65mm

A10.18 0.20 0.22 mm

A20.39 0.41 0.43 mm

b 0.210.260.31mm

D 1.511.561.61mm

E 1.001.051.10mm

e- 0.4- mm

e1-0.346-mm

e2-0.692-mm

e3-0.8-mm

Product data sheet Rev. 2 — 27 Janu ary 2012 9 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

Fig 12. Package outline PEMI6CSP (WLCSP15)

wlcsp15_6-3-6_po

European

projection

WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)

detail X

bump A1

index area

12 4365

1/2 e

B1 B2 B3

Table 8. Package outline dimensions of PEMI6CSP

Symbol Min Typ Max Unit

A 0.570.610.65mm

A10.18 0.20 0.22 mm

A20.39 0.41 0.43 mm

b 0.210.260.31mm

D 2.312.362.41mm

E 1.001.051.10mm

e- 0.4- mm

e1-0.346-mm

e2-0.692-mm

e3-0.8-mm

Product data sheet Rev. 2 — 27 Janu ary 2012 10 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

Fig 13. Package outline PEMI8CSP (WLCSP20)

wlcsp20_8-4-8_po

European

projection

WLCSP20: wafer level chip-size package; 20 bumps (8-4-8)

detail X

bump A1

index area

32165487

1/2 e

B1 B2 B3 B4

Table 9. Package outline dimensions of PEMI8CSP

Symbol Min Typ Max Unit

A 0.570.610.65mm

A10.18 0.20 0.22 mm

A20.39 0.41 0.43 mm

b 0.210.260.31mm

D 3.11 3.16 3.21 mm

E 1.001.051.10mm

e- 0.4- mm

e1-0.346-mm

e2-0.692-mm

e3-0.8-mm

Product data sheet Rev. 2 — 27 Janu ary 2012 11 o f 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

10. Design and assembly recommendations

10.1 PCB design guidelines

It is recommended, for optimum performance, to use a Non-Solder Mask

Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled

micro-vias connecting the ground pads to a buried ground-plane layer. This results in the

lowest possible ground inductance and provides the best high frequency and

ESD performance. Refer to Table 10 for the recommended Printed-Circuit Board (PCB)

design parameters.

10.2 PCB assembly guidelines for Pb-free soldering

Table 10. Recommended PCB design parameters

Parameter Value or specification

PCB pad diameter 250 m

Micro-via diameter 100 m (0.004 inch)

Solder mask aperture diameter 325 m

Copper thickness 20 m to 40 m

Copper finish AuNi

PCB material FR4

Table 11. Assembly recommenda tions

Parameter Value or specification

Solder screen aperture diameter 290 m

Solder screen thickness 100 m (0.004 inch)

Solder paste: Pb-free SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)

Solder to flux ratio 50 : 50

Solder reflow profile see Figure 14

Product data sheet Rev. 2 — 27 Janu ary 2012 12 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

The device is capable of withstanding at least three reflows of this profile.

Fig 14. Pb-free solder reflow profile

Table 12. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Treflow(peak) peak reflow tempera ture 230 - 260 C

t1time 1 soak time 60 - 180 s

t2time 2 time during T 250 C--30s

t3time 3 time during T 230 C10 - 50 s

t4time 4 time during T > 217 C 30 - 150 s

t5time 5 - - 540 s

dT/dt rate of change of temperature cooling rate - - 6C/s

pre-heat 2.5 - 4.0 C/s

001aai943

Treflow(peak)

250

230

217

(°C)

cooling rate

preheat

t2t (s)

Product data sheet Rev. 2 — 27 Janu ary 2012 13 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

11. Revision history

Table 13. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PEMIXCSP_FAM v.2 20120127 Product data sheet - PEMIXCSP_FAM v.1

PEMIXCSP_FAM v.1 20110203 Product data sheet - -

Product data sheet Rev. 2 — 27 Janu ary 2012 14 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the shor t data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregat e and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or cu stomer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by custo m er’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 27 Janu ary 2012 15 of 16

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automo tive use. It is neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and st andards, customer

(a) shall use the product without NXP Semicond uctors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims result ing from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 27 January 2012

Document identif ie r: PEMIXCSP_FAM

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Application information. . . . . . . . . . . . . . . . . . . 5

7.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.2 Use cases. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.3 LCD interfaces, medium-speed interfaces . . . . 6

7.4 Keypad, low-speed interfaces. . . . . . . . . . . . . . 6

8 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

10 Design and assembly recommendations . . . 11

10.1 PCB design guidelines . . . . . . . . . . . . . . . . . . 11

10.2 PCB assembly guidelines for Pb-free

soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

13 Contact information. . . . . . . . . . . . . . . . . . . . . 15

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16