Multi Purpose Axial Leaded Glass PIN Diodes
Axial Leaded Glass PIN Diodes
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266Europe Tel: +353.21.244.6400
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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V6
Features
Glass Hermetically Sealed Packages
Large Signal Switch Design
Available in Low Capacitance
Passivated Chip for Low Leakage Current
Tape and Reel Packaging Available
Fully RoHS Compliant
MIL-STD 19500 Screening Available
Description
M/A-COM Technology Solutions series of low and
medium power glass PIN diodes are specifically
designed for use in switches, duplexers, electrically
tuned digital filters AGC attenuators, TR switches
and RF modulators. They preform particularly well in
distortion sensitive environments from HF through
S-Band. These hermetically sealed axial leaded PIN
diodes are designed for use in the harshest
commercial and military applications where their
inherent ruggedness makes them an ideal choice.
They may ordered screened to meet MIL-STD 19500
requirements.
Absolute Maximum Ratings
TAMB = +25°C (Unless Otherwise Noted) 1
Parameter Absolute Maximum
D.C. Reverse Voltage (See Tables)
Operating Temperature -55°C to +175°C
Storage Temperature -55°C to +200°C
Installation Temperature +280°C for 10 Seconds
Case Style 54 250mW without heatsink
Case Style 139 500mW without heatsink
Case Style 4 & 146 1000mW without heatsink
Power Dissipation Listed Below Will De-Rate
Linearly to 0mW at 175˚C
Glass Package Styles
Design Recommendations
The axial leaded, glass, PIN diode series is available
in four glass package styles. The ODS 54 is the
most suitable to meet low power, low capacitance
requirements for high isolation in a series connected
switch at VHF frequencies. The ODS 4, 139 and 146
are most suited for moderate power applications
requiring low package inductance.
1. Operation of this device above any one of these
parameters may cause permanent damage.
Notes
ODS 4, 54 , 139, 146
M/A-COM Technology Solutions silicon PIN
diode chips are also available in a wide variety
of alternative package styles besides glass. For
case style options, availability and electrical
specifications, please refer to the “Packaged
PIN Diode Datasheet” located on the M/A-COM
Technology Solutions website at :
www.macomtech.com/DataSheets/packagedpindiodes.pdf
PIN Chip
Glass Cylinder
Tin Plated Dumet Leads
Multi Purpose Axial Leaded Glass PIN Diodes
Axial Leaded Glass PIN Diodes
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266Europe Tel: +353.21.244.6400
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
2
V6
*Specifications subject to change without notice
Part Number
Package
Style
Rev. Volt.5
VR < 10 µA
VDC
Unless
otherwise noted
Max. Cap.
1MHz
CT @ -50V
pF
Unless
otherwise noted
Max. Series Res.
100MHz
RS @ 10mA
Nominal Characteristics
Carrier
Lifetime4
μS
I Region
Length
Mils
MA47120 54 35 1.00 1 0.5 3.0 0.4
1N5719 54 100 0.35 1.5 2 1.0 2.0
MA4P203 54 100 0.25 3 1.5 0.1 0.8
MA47047 54 200 0.30 3.0 1.0 2.0
MA47600 54 200 0.30 6.0 2.0 4.0
MA4P404 54 250 0.30 .60 2 1.0 1.0
Part Number
Package
Style
Rev. Volt.5
VR < 10 µA
VDC
Max. Cap.
1MHz
CT @ -50V
pF
Max. Series Res.
100MHz
RS @ 10mA
Nominal Characteristics
Carrier
Lifetime4
μS
I Region
Length
Mils
MA4PH151 139 100 1.20 0.6 1.0 0.8
MA47110 139 200 0.55 6.0 2.0 4.0
MA47123 139 200 0.50 3.0 1.0 2.0
Part Number
Package
Style
Rev. Volt.5
VR < 10 µA
VDC
Max. Cap.
1MHz
CT @ -50V
pF
Max. Series Res.
100MHz
RS @ 50mA
Nominal Characteristics
Carrier
Lifetime4
μS
I Region
Length
Mils
MA47266 146 200 1.50 0.6 3.0 3.0
MA4PH301 146 200 1.10 1.0 5.0 5.0
Part Number
Package
Style
Rev. Volt.5
VR < 10 µA
VDC
Max. Cap.
1MHz
CT @ -100V
pF
Max. Series Res.
100MHz
RS @ 100mA
Nominal Characteristics
Carrier I Region
Lifetime4 Length
μS Mils
MA4P504 4 500 0.35 0.60 1.0 2.0
MA4P505 4 500 0.50 0.45 2.0 2.0
MA4P506 4 500 0.85 0.30 3.0 2.0
MA4P606 4 1000 0.70 0.70 4.0 4.0
Notes:
1. Tested at VR = 20V.
2. Tested at IF = 50mA.
3. Tested at VR = 10V.
4. Nominal carrier lifetime, TL, specified at IF = + 10mA , IREV = - 6mA.
5. Minimum specified reverse voltage, VR, is sourced and the resultant reverse leakage current, IR, is measured to be <10μA.
Multi Purpose Axial Leaded Glass PIN Diodes
Axial Leaded Glass PIN Diodes
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266Europe Tel: +353.21.244.6400
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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V6
Typical RS vs. IF @ TAMB = +25°C
Multi Purpose Axial Leaded Glass PIN Diodes
Axial Leaded Glass PIN Diodes
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266Europe Tel: +353.21.244.6400
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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V6
SERIES RESISTANCE Rs (OHMS)
FORWARD CURRENT (IF)
FORWARD CURRENT (IF)
SERIES RESISTANCE Rs (OHMS)
Typical RS vs. IF @ TAMB = +25°C
Multi Purpose Axial Leaded Glass PIN Diodes
Axial Leaded Glass PIN Diodes
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266Europe Tel: +353.21.244.6400
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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V6
Dimension A Dimension B Dimension C Dimension D (Min.)
Mils mm Mils mm Mils mm Mils mm
4 265 ± 35 7.33 ± .89 96 ± 11 2.44 ± .28 20 ± 2 .51 ± .05 1000 25.4
54 155 ± 10 3.94 ± .25 71 ± 3 1.8 ± .08 15 ± 1 .38 ± .03 1000 25.4
139 150 ± 15 3.81 ± .38 60 ± 10 1.52 ± .25 20 ± 3 .51 ± .08 1000 25.4
146 220 ± 20 5.59 ± .51 95 ± 10 2.41 ± .25 30 ± 3 .51 ± .08 1000 25.4
Package
Style
Package Outline Dimensions
B
A C
D
(2 plcs)
Assembly Recommendations
Leads on axial leaded devices must be formed while being held firm. Bending the leads too close to the body
of the part may cause internal damage to the device. Bends <0.060” from body are not recommended.
Appropriate fixturing should be used.
Devices may be soldered using standard 60/40, Sn/Pb or RoHS compliant solders. Axial leads are tin plated,
50μM, thick to ensure an optimum connection.
For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM
Technology Solutions website.
Multi Purpose Axial Leaded Glass PIN Diodes
Axial Leaded Glass PIN Diodes
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
North America Tel: 800.366.2266Europe Tel: +353.21.244.6400
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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V6
M/A-COM Technology Solutions axially leaded glass PIN diodes are designed to meet most
environmental and electrical requirements and may be ordered screened to MIL-STD-19500. Examples
of the methods and conditions are described in the table below.
TEST METHOD
MIL-STD 750 DESCRIPTION/ CONDITIONS
Moisture Resistance 1021 85°C, 85% Relative Humidity
High Temperature Storage 1031 +175°C
HTRB 1038 80% of rated VR, 50°C
Temperature Cycling 1051 -65°C to +175°C, 20 Cycles
Shock 2016 500 g’s
Vibration 2056 15 g’s
Solderability 2026 IPC/JDEC J-STD-02
Constant Acceleration 2006 20,000 g’s
Fine Leak 1071 H
Gross Leak 1071 C or E
*Specifications subject to change without notice
Environmental Ratings
Ordering Information
M/A-COM Technology Solutions glass PIN diodes are tape and reeled in 1000 piece quantities. The various base
part numbers are only available in the case styles as shown in the tables on page 2. To order, indicate the base part
number followed by a dash and the indicated package style. Also add a “T” at the end for tape and reel
For example: The MA4P504-4T is the MA4P504 chip in case style 4, tape and reeled.