CREAT BY ART
- Glass passivated chip junction
- High current capability, Low VF
- High reliability
- High surge current capability
- Low power loss, high efficiency
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
SYMBOL UNIT
V
RRM
V
V
RMS
V
V
DC
V
I
F(AV)
A
Trr ns
Cj pF
R
θJA O
C/W
T
JO
C
T
STG O
C
Document Number: DS_D1405009 Version: G14
BA157G thru BA159G
Taiwan Semiconductor
Glass Passivated Fast Recover
y
Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER
Note 1: Pulse Test with PW=300μs, 1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
MECHANICAL DATA
Case: DO-204AL (DO-41) DO-204AL (DO-41)
Weight: 0.33 g (approximately)
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 1
BA157G BA158G BA159G
400 600 1000
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
30 A
Maximum instantaneous forward voltage (Note 1)
@ 1 A V
F
1.2 V
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
5μA
100
Typical junction capacitance (Note 3) 15
Maximum reverse recovery time (Note 2) 150 250
Typical thermal resistance 60
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
280 420 700
400 600 1000
CREAT BY ART
PART NO.
PART NO.
BA157G
BA157G
BA157G
(TA=25℃ unless otherwise noted)
Document Number: DS_D1405009 Version: G14
BA157G thru BA159G
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
PACKING COD E GREEN COMPOUND
CODE
PACKAGE PACKING
BA15xG
(Note 1) Prefix "H"
A0
Suffix "G"
DO-41 3,000 / Ammo box (52mm taping)
RATINGS AND CHARACTERISTICS CURVES
BA157G A0
BA157G A0G A0 G
A0
R0 DO-41 5,000 / 13" Paper reel
R1 DO-41 5,000 / 13" Paper reel (Reverse)
B0 DO-41 1,000 / Bulk packing
AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
Note 1: "x" defines voltage from 400V (BA157G) to 1000V (BA159G)
EXAMPLE
PREFERRED P/N
Green compound
H A0 AEC-Q101 qualifiedBA157GHA0
0
0.5
1
1.5
0 25 50 75 100 125 150 175
AVERAGE FORWARD CURRENT
(A)
AMBIENT TEMPERATURE (oC)
FIG.1- MAXIMUM FORWARD CURRENT
DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
0
10
20
30
40
50
60
1 10 100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
0.1
1
10
100
1000
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2- TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
TJ=75℃
0.1
1
10
100
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
INSTANTANEOUS FORWARD CURRENT
(A)
FORWARD VOLTAGE (V)
FIG. 4- TYPICAL FORWARD CHARACTERISTICS
Pulse Width=300μs
1% Duty Cycle
CREAT BY ART
Min Max Min Max
A 2.00 2.70 0.079 0.106
B 0.71 0.86 0.028 0.034
C 25.40 - 1.000 -
D 4.20 5.20 0.165 0.205
E 25.40 - 1.000 -
P/N = Specific Device Code
G = Green Compound
YWW = Date Code
F = Factory Code
Document Number: DS_D1405009 Version: G14
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
MARKING DIAGRAM
BA157G thru BA159G
Taiwan Semiconductor
10
100
1 10 100
JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5- TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405009 Version: G14
BA157G thru BA159G
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
