ams Datasheet Page 1
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TSL12T, TSL13T
Light-to-Voltage Converters
The TSL12T and TSL13T are cost-optimized, highly integrated
light-to-voltage optical sensors, each combining a photodiode
and a transimpedance amplifier (feedback resistor = 80M and
20M, respectively) on a single monolithic integrated circuit.
The photodiode active area is 0.5mm × 0.5mm and the sensors
respond to light in the range of 320nm to 1050nm. Output
voltage is linear with light intensity (irradiance) incident on the
sensor over a wide dynamic range. These devices are supplied
in a low-profile surface-mount package (T).
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of the TSL12T and TSL13T,
Light-to-Voltage Converters, are listed below:
Figure 1:
Added Value of Using TSL12T and TSL13T
•Converts light intensity to output voltage
•Monolithic silicon IC containing photodiode,
transconductance amplifier, and feedback components
•Single-supply operation: 2.7V to 5.5V
•Low supply current: 1.1mA typical
•Low-profile surface-mount package
Benefits Features
• Enables extremely fast response to change •Single photo-diode and transimpedance
architecture
•Enables fast response to visible light in range of
400nm to 700nm wavelengths •6.5µs output rise-time response
• Provides for high sensitivity to detect a small
change in light
•High irradiance responsivity 96mV/(µW/cm2)
@ λp = 640nm (TSL12T)
• Reduces board space requirements while
simplifying designs •2.6mm x 3.8mm 4-lead SMD (T) package
General Description
Page 2 ams Datasheet
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TSL12T, TSL13T − General Description
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TSL12T and TSL13T Block Diagram
Voltage
Output
+
−
ams Datasheet Page 3
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TSL12T, TSL13T − Pin Assignments
The TSL12T and TSL13T pin assignments are described below:
Figure 3:
Pin Diagram of Package T 4-LEAD SMD (Top View)
Figure 4:
Terminal Func tions
Terminal
Description
Name T PKG No.
N/C 1 No connection
GND 2 Power supply ground (substrate). All voltages are referenced to GND.
VDD 3 Supply voltage
OUT 4 Output voltage
Pin Assignments
N/C 1
GND 2
4 OUT
3 VDD
Page 4 ams Datasheet
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TSL12T, TSL13T − Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 5:
Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)
Note(s):
1. All voltages are with respect to GND.
2. Output may be shorted to supply.
Symbol Parameter Min Max Unit
VDD Supply voltage (1) 6V
IOOutput current ±10 mA
Duration of short-circuit current at (or below) 25°C (2) 5s
TAOperating free-air temperature range -25 85 °C
Tstrg Storage temperature range -25 85 °C
Solder conditions in accordance with JEDEC J-STD-020A,
maximum temperature 260 °C
Absolute Maximum Ratings
ams Datasheet Page 5
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TSL12T, TSL13T − Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
Figure 6:
Recommended Operating Conditions
Figure 7:
Electrical Characteristics at VDD = 5V, TA = 25°C, λp = 640nm, RL = 10kΩ
(unless otherwise noted) (1), (2), (3)
Note(s):
1. Measurements are made with RL = 10k between output and ground.
2. Optical measurements are made using small-angle incident radiation from an LED optical source.
3. The 640nm input irradiance Ee is supplied by an AlInGaP LED with peak wavelength λp = 640nm.
4. Irradiance responsivity is characterized over the range VO = 0.2 to 4V. The best-fit straight line of Output Voltage VO versus irradiance
Ee over this range may have a positive or negative extrapolated VO value for Ee = 0. For low irradiance values, the output voltage VO
versus irradiance Ee characteristic is non linear with a deviation toward VO = 0, Ee = 0 origin from the best-fit straight line referenced
above.
Symbol Parameter Min Nom Max Unit
VDD Supply voltage 2.7 5.5 V
TAOperating free-air temperature range 0 70 °C
Symbol Parameter Test
Conditions
TSL12T TSL13T
Unit
Min Typ Max Min Typ Max
VOM Maximum
output voltage 4.6 4.9 4.6 4.9 V
VOOutput voltage
Ee = 20.5W/cm21.5 2 2.5
V
Ee = 83W/cm21.5 2 2.5
Ee = 41W/cm24
Ee = 166W/cm24
ReIrradiance
responsivity See note (4) 96 24 mV/
(W/cm2)
VOS Extrapolated
offset voltage See note (4) -0.02 0.03 0.08 -0.02 0.03 0.08 V
VdDark voltage Ee = 0 0 0.08 0 0.08 V
IdSupply current
Ee = 20.5W/cm21.1 1.7
mA
Ee = 83W/cm21.1 1.7
Electrical Characteristics
Page 6 ams Datasheet
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TSL12 T, TSL13T − Electrical Charac teristics
Figure 8:
Dynamic Characteristics at VDD = 5V, TA = 25°C, λp = 640nm, RL = 10kΩ
(unless otherwise noted) (see Figure 9, Figure 10)
Symbol Parameter Test
Conditions
TSL12T TSL13T
Unit
Min Typ Max Min Typ Max
tdr
Output pulse
delay time for
rising edge
(0% to 10%)
Min VO = 0V;
Peak VO = 2V 13 1.7
s
Min VO = 0.5V;
Peak VO = 2V 2.3 1.2
tr
Output pulse
rise time
(10% to 90%)
Min VO = 0V;
Peak VO = 2V 20 7.2
s
Min VO = 0.5V;
Peak VO = 2V 10 6.5
tdf
Output pulse
delay time for
rising edge
(100% to 90%)
Min VO = 0V;
Peak VO = 2V 2.3 1.2
s
Min VO = 0.5V;
Peak VO = 2V 2.2 1.1
tf
Output pulse
rise time
(90% to 10%)
Min VO = 0V;
Peak VO = 2V 10 6.8
s
Min VO = 0.5V;
Peak VO = 2V 96.4
ams Datasheet Page 7
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TSL12T, TSL13T − Parameter Measurement Information
Figure 9:
Switching Times: Test Circuit
Figure 10:
Switching Times: Output Voltage Waveform
Note(s):
1. The input irradiance is supplied by a pulsed AlInGaP light-emitting diode
with the following characteristics:
λp = 640nm, tr < 1s, tf < 1s.
2. The output waveform is monitored on an oscilloscope with the following
characteristics: tr < 100ns, Zi ≥ 1M, Ci ≤ 20pF.
Parameter Measurement
Information
LIGHT TO VOLTAGE CONVERTERS
TAOS062D ï APRIL 2007
PARAMETER MEASUREM
TEST CIRCUIT
TSL1x R
L
V
DD
3
2
4
+
ï
Pulse
Generator
LED
(see Note )
NOTES: A. The input irradiance is supplied by a pulsed AlInGaP light
t
r
< 1 Ps, t
f
< 1 Ps.
B. The output waveform is monitored on an oscilloscope with th
EMENT INFORMATION
OUTPUT VOLTAGE WAVEFORM (See Note )
Peak E
e
10%
Min V
O
t
r
Output 90%
ght-emitting diode with the following characteristics: O
p
= 640 nm,
h the following characteristics: t
r
< 100 ns, Z
i
t 1 M:, C
i
d 20 pF.
ing Times
t
dr
10%
90%
t
df
t
f
Peak V
O
Min E
e
Input
Page 8 ams Datasheet
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TSL12T, TSL13T − Typical Operating Characteristics
Figure 11:
Photodiode Spectral Responsivity
TSL12T
Figure 12:
Rising Edge Dynamic Characteristics vs. Peak Output
Voltage
Typical Operating
Characteristics
O ï Wavelength ï nm
400 500 600 700 800 900 1000 1100300
0
0.2
0.4
0.6
0.8
1
Relative Responsivity
VO ï Peak Output Voltage ï V
Time  ms
tr
tdr
Min VO = 0 V
1
10
100
1000
0.5 1 1.5 2 2.5 3 3.5 40
ams Datasheet Page 9
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TSL12T, TSL13T − Typical Operating Characteristics
Figure 13:
Rising Edge Dynamic Characteristics vs. Peak Output
Voltage
Figure 14:
Falling Edge Dynamic Characteristics vs. Peak Output
Voltage
VO ï Peak Output Voltage ï V
Time  ms
tr
tdr
Min VO = 0.5 V
1
10
100
1000
0.5 1 1.5 2 2.5 3 3.5 40
Page 10 ams Datasheet
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TSL12T, TSL13T − Typical Operating Characteristics
Figure 15:
Falling Edge Dynamic Characteristics vs. Peak Output
Voltage
Figure 16:
Normalized Output Voltage vs. Angular Displacement
VO ï Peak Output Voltage ï V
Time  ms
tf
tdf
Min VO = 0.5 V
1
10
100
1000
0.5 1 1.5 2 2.5 3 3.5 40
NORMALIZED OUTPUT VOLTAGE
vs.
ANGULAR DISPLACEMENT
Q ï Angular Displacement ï q
VO  Output Voltage Normalized
0
0.2
0.4
0.6
0.8
1
ï90 ï60 ï30 0 30 60 90
Optical Axis
-Q +Q
ams Datasheet Page 11
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TSL12T, TSL13T − Typical Operating Characteristics
Figure 17:
Normalized Output Voltage vs. Angular Displacement
TSL13T
Figure 18:
Rising Edge Dynamic Characteristics vs. Peak Output
Voltage
NORMALIZED OUTPUT VOLTAGE
vs.
ANGULAR DISPLACEMENT
Q ï Angular Displacement ï q
VO  Output Voltage Normalized
0
0.2
0.4
0.6
0.8
1
ï90 ï60 ï30 0 30 60 90
Optical Axis
-Q +Q
VO ï Peak Output Voltage ï V
0.5 1 1.5 2 2.5 3 3.5 40
0
4
8
12
16
20
Time  ms
tr
tdr
Min VO = 0 V
Page 12 ams Datasheet
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TSL12T, TSL13T − Typical Operating Characteristics
Figure 19:
Rising Edge Dynamic Characteristics vs. Peak Output
Voltage
Figure 20:
Falling Edge Dynamic Characteristics vs. Peak Output
Voltage
VO ï Peak Output Voltage ï V
0.5 1 1.5 2 2.5 3 3.5 40
0
4
8
12
16
20
Time  ms
tr
tdr
Min VO = 0.5 V
VO ï Peak Output Voltage ï V
0.5 1 1.5 2 2.5 3 3.5 40
Time  ms
0
5
10
15
20
25
30
tf
tdf
Min VO = 0 V
ams Datasheet Page 13
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TSL12T, TSL13T − Typical Operating Characteristics
Figure 21:
Falling Edge Dynamic Characteristics vs. Peak Output
Voltage
Figure 22:
Normalized Output Voltage vs. Angular Displacement
VO ï Peak Output Voltage ï V
0.5 1 1.5 2 2.5 3 3.5 40
Time  ms
0
5
10
15
20
25
30
tf
tdf
Min VO = 0.5 V
NORMALIZED OUTPUT VOLTAGE
vs.
ANGULAR DISPLACEMENT
Q ï Angular Displacement ï q
VO  Output Voltage Normalized
0
0.2
0.4
0.6
0.8
1
ï90 ï60 ï30 0 30 60 90
Optical Axis
-Q +Q
Page 14 ams Datasheet
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TSL12T, TSL13T − Typical Operating Characteristics
Figure 23:
Normalized Output Voltage vs. Angular Displacement
NORMALIZED OUTPUT VOLTAGE
vs.
ANGULAR DISPLACEMENT
Q ï Angular Displacement ï q
VO  Output Voltage Normalized
0
0.2
0.4
0.6
0.8
1
ï90 ï60 ï30 0 30 60 90
Optical Axis
-Q +Q
ams Datasheet Page 15
[v1-00] 2016-Apr-12 Document Feedback
TSL12T, TSL13T − Application Information
PCB Pad Layout
Suggested PCB pad layout guidelines for the T package are
shown in Figure 24.
Figure 24:
Suggested T Package PCB Layout
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
Application Information
1.50
2.90
0.90
1.00
Page 16 ams Datasheet
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TSL12T, TSL13T − Packaging Mechanical Data
The TSL12T and TSL13T are supplied in a low-profile
surface-mount package. This package contains no lead (Pb).
Figure 25:
Package T - Four-Lead Surface Mount Device Packaging Configuration
Note(s):
1. All linear dimensions are in millimeters.
2. Terminal finish is gold.
3. The center of the 0.50mm × 0.50mm integrated photodiode active area is typically located in the center of the package.
4. Dimension tolerance is ±0.15mm.
5. This drawing is subject to change without notice.
Packaging Mechanical Data
PACKAGE T Four-Lead Surface Mount Device
TOP VIEW
SIDE VIEW
BOTTOM VIEW
3.80
2.60
A
PIN 1
1.50
0.55
DETAIL A: TYPICAL PACKAGE TERMINAL
0.80
0.900.10
0.40
R 0.20
Lead Free
Pb
1.35
3.10
0.35
0.50
ÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈ
ÎÎÎ
ÎÎÎ
2 7
Photodiode
(Note C)
PIN 1
0.45
Green
RoHS
(Note 3)
ams Datasheet Page 17
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TSL12T, TSL13T − Packaging Mechanical Data
Figure 26:
Four-Lead Surface Mount Package Carrier Tape
Note(s):
1. All linear dimensions are in millimeters.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 1000 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
0.30 0.050 2.10
4 0.100
2 0.100
8 Typ
1.75 0.100
5.50
0.100
AA
B
B
12 0.100
R 0.20 TYP
1.50
1.50
SIDE VIEW
TOP VIEW
END VIEW
3.09 MAX
2.90 0.100 Ao
R 0.20 TYP
1.80 Ko
4.29 MAX
4.10 0.100 Bo
DETAIL B
DETAIL A
R 0.20 TYP
Page 18 ams Datasheet
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TSL12T, TSL13T − Manufacturing Information
The reflow profile specified here describes expected maximum
heat exposure of devices during the solder reflow process of
the device on a PWB. Temperature is measured at the top of the
device. Devices should be limited to one pass through the
solder reflow profile.
Figure 27:
TSL12T, TSL13T Solder Reflow Profile
Figure 28:
TSL12T, TSL13T Solder Reflow Profile Graph
Note(s):
1. Not to scale - for reference only.
Parameter Reference TSL12T, TSL13T
Average temperature gradient in preheating 2.5°C/s
Soak time tsoak 2 to 3 minutes
Time above T1, 217°C t1Max 60 s
Time above T2, 230°C t2Max 50 s
Time above T3, (Tpeak - 10°C) t3Max 10 s
Peak temperature in reflow Tpeak 260°C (-0°C/+5°C)
Temperature gradient in cooling Max -5°C/s
Manufacturing Information
t3
t2
t1
tsoak
T3
T2
T1
Tpeak
Not to scale  for reference only
Time (sec)
Temperature (C)
(s)
ams Datasheet Page 19
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TSL12T, TSL13T − Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
This package has been assigned a moisture sensitivity level of
MSL 3 and the devices should be stored under the following
conditions:
•Temperature Range: 5°C to 50°C
•Relative Humidity: 60% maximum
•Total Time: 6 months from the date code on the
aluminized envelope - if unopened
•Opened Time: 168 hours or fewer
Rebaking will be required if the devices have been stored
unopened for more than 6 months or if the aluminized envelope
has been open for more than 168 hours. If rebaking is required,
it should be done at 90°C for 4 hours.
Page 20 ams Datasheet
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TSL12T, TSL13T − Ordering & Contact Information
Figure 29:
Ordering Information
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Ordering Code Device TAPackage - Leads Package Designator
TSL12T TSL12 0°C to 70°C 4-lead Low-Profile
Surface-Mount T
TSL13T TSL13 0°C to 70°C 4-lead Low-Profile
Surface-Mount T
Ordering & Contact Information
ams Datasheet Page 21
[v1-00] 2016-Apr-12 Document Feedback
TSL12T, TSL13T − RoHS Compliant & ams Green Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
RoHS Compliant & ams Green
Statement
Page 22 ams Datasheet
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TSL12T, TSL13T − Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Copyrights & Disclaimer
ams Datasheet Page 23
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TSL12T, TSL13T − Document Status
Document Status Product Status Definition
Product Preview Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Preliminary Datasheet Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Datasheet Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Datasheet (discontinued) Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Document Status
Page 24 ams Datasheet
Document Feedback [v1-00] 2016-Apr-12
TSL12T, TSL13T − Revision Information
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Changes from TAOS062D (2007-Apr) to current revision 1-00 (2016-Apr-12) Page
Content of TAOS datasheet was converted to the latest ams design
Added Figure 1 1
Revision Information
ams Datasheet Page 25
[v1-00] 2016-Apr-12 Document Feedback
TSL12T, TSL13T − Content Guide
1 General Description
1 Key Benefits & Features
2 Block Diagram
3 Pin Assignments
4Absolute Maximum Ratings
5 Electrical Characteristics
7 Parameter Measurement Information
8 Typical Operating Characteristics
8 TSL12T
11 TSL13T
15 Application Information
15 PCB Pad Layout
16 Packaging Mechanical Data
18 Manufacturing Information
19 Moisture Sensitivity
20 Ordering & Contact Information
21 RoHS Compliant & ams Green Statement
22 Copyrights & Disclaimer
23 Document Status
24 Revision Information
Content Guide