THC63LVD824 Rev.1.03
Copyright 2000 THine Electronics, Inc. All rights reserved 1 THine Electr o n ics, Inc.
THine
THC63LVD824
Single(135MHz)/Dual(170MHz) Link LVDS Receiver for XGA/SXGA/SXGA+/UXGA
General Description
The TH C63LVD82 4 receiver is designed to support
Single Link transmission between Host and Flat Panel
Display up to SXGA+ resolutions and Dual Link trans-
mission between Host and Flat Panel Display up to
UXGA resolution s. The THC63LVD824 co nverts the
LVDS data streams back into 48bits o f CMOS/TTL data
with falling edge or rising edge clock for convenient
with a variety of LCD panel controllers.
In Single Link, data transmit clock frequency of
135MHz, 48bits of RGB data are transmitted at an
effective rate of 945Mbps per LVDS channel. Using a
135MHz clock, the data throughput is 472Mbytes per
second.
In Dual Link, data transmit clock frequency of 85MHz,
48bits of RGB data are transmitted at an effective rate
of 595Mbps per LVDS channel. Using a 85MHz clock,
the data throughput is 595Mbytes per second.
Features
Wide dot clock range: 25-170MHz suited for VGA,
SVGA, XGA, SXGA, SXGA+ and UXGA
PLL requires No external components
Supports Single Link up to 135MHz dot clock for
SXGA+
Supports Dual Link up to 170MHz dot clock for
UXGA
50% output clock duty cycle
TTL clock edge programmable
TTL output driverbility selectable for lower EMI
Power down mode
Low power single 3.3V CMOS design
100pin TQFP
THC63LVDF 84A compatible
THC63LVD814 pin compatible
Block Diagram
SERIAL TO PARALLEL
PLL
SERIAL TO PARALLEL
PLL
28
28
DEMUX
RA1 +/-
RB1 +/-
RC1 +/-
RD1 +/-
RCLK1 +/-
RA2 +/-
RB2 +/-
RC2 +/-
RD2 +/-
R/F
/PDWN
(25 to 135MHz)
RCLK2 +/-
(25 to 85MHz)
1st Link
8
8
8
8
8
8
RED1
GREEN1
BLUE1
HSYNC
VSYNC
DE
RED2
GREEN2
BLUE2
RECEIVER CLOCK OUT
(25 to 85MHz)
1st DATA
2nd DATA
CMOS/TTL OUTPUT
2nd Link
LVDS INPUT
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THC63L VD824 Rev.1.03
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Pin Out
LVDS GND
RA1-
RA1+
RB1-
RB1+
LVDS VCC
RC1-
RC1+
RCLK1-
RCLK1+
RD1-
RD1+
LVDS GND
RA2-
RA2+
RB2-
RB2+
LVDS VCC
RC2-
RC2+
RCLK2-
RCLK2+
RD2-
RD2+
LVDS GND
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
R15
GND
VCC
R14
R13
R12
R11
R10
GND
VCC
CLKOUT
B27
B26
B25
B24
B23
GND
VCC
B22
B21
B20
G27
GND
VCC
G26
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
PLL GND
PLL VCC
GND
/PDWN
MODE0
MODE1
GND
R/F
DRVSEL
R20
R21
R22
R23
R24
VCC
GND
R25
R26
R27
G20
G21
G22
G23
G24
G25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
DE
VSYNC
HSYNC
B17
B16
GND
VCC
B15
B14
B13
B12
B11
B10
G17
G16
G15
G14
G13
GND
VCC
G12
G11
G10
R17
R16
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
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THC63L VD824 Rev.1.03
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Pin Description
Pin Name Pin # Type Description
RA1+, RA1- 78, 77 LVDS IN
The 1st Link. The 1st pixel input data when Dual Link.
RB1+, RB1- 80, 79 LVDS IN
RC1+, RC1- 83, 82 LVDS IN
RD1+, RD1- 87, 86 LVDS IN
RCLK1+, RCLK1- 85, 84 LVDS IN LVDS Clock Input for 1st Link.
RA2+, RA2- 90, 89 LVDS IN
The 2nd Link. These pins are disabled when Single Link.
RB2+, RB2- 92, 91 LVDS IN
RC2+, RC2- 95, 94 LVDS IN
RD2+, RD2- 99, 98 LVDS IN
RCLK2+, RCLK2- 97, 96 LVDS IN LVDS Clock Input for 2nd Link.
R17 ~ R10 52, 51, 50, 47,
46, 45, 44, 43 OUT
The 1st Pixel Data Outputs.G17 ~ G10 62, 61, 60, 59,
58, 55, 54, 53 OUT
B17 ~ B10 72, 71, 68, 67,
66, 65, 64, 63 OUT
R27 ~ R20 19, 18, 17, 14,
13, 12, 11, 10 OUT
The 2nd Pixel Data Outputs.G27 ~ G20 29, 26, 25, 24,
23, 22, 21, 20 OUT
B27 ~ B20 39, 38, 37, 36,
35, 32, 31, 30 OUT
DE 75 OUT Data Enable Output.
VSYNC 74 OUT Vsync Output.
HSYNC 73 OUT Hsync Output.
CLKOUT 40 OUT Clock Output.
DRVSEL 9 IN Output Driverbility Select.
H: High power, L: Low power.
R/F 8 IN Output Clock Triggering Edge Select.
H: Rising edge, L: Falling edge.
MODE1, MODE0 6, 5 IN
/PDWN 4 IN H: Normal operation,
L: Power down (all outputs are pulled to ground)
VCC 15, 27, 33, 41,
48, 56, 69 Power Power Supply Pins for TTL outputs and digital circuitry.
GND 3, 7, 16, 28, 34,
42, 49, 57, 70 Ground Ground Pins for TTL outputs and digital circuitry.
LVDS VCC 81,93 Power Power Supply Pins for LVDS inputs.
LVDS GND 76, 88, 100 Ground Ground Pins for LVDS inputs.
Pix e l Da t a Mo de .
MODE1 MODE0 Mode
LL Dual Link
L H Single Link
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THC63L VD824 Rev.1.03
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Absolute Maximum Ratings 1
Electrical Characteristics
CMOS/TTL DC Specifications VCC = 3.0V ~ 3.6V, Ta = -10 ~ +70
LVDS Receiver DC Specifications VCC = 3.0V ~ 3.6V, Ta = -10 ~ +70
PLL VCC 2 Power Power Supply Pin for PLL circuitry.
PLL GND 1 Ground Ground Pin for PLL circuitry.
Supply Voltage (VCC)-0.3V ~ +4.0V
CMOS/TTL Input Voltage -0.3V ~ (VCC + 0.3V)
CMOS/TTL Output Voltage -0.3V ~ (VCC + 0.3V)
LVDS R eceiver Input Voltage -0.3V ~ (VCC + 0.3V)
Output Current -30mA ~ 30 mA
Junction Temperature +125
Storage Temperature Range -55 ~ +125
Lead Temperature (Soldering, 10sec) +230
Maximum Power Dissipation @+25 1.0W
1. “Absolute Maximum Ratings” are those valued beyond which the safety of the device can not be guaranteed. They
are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics”
specify conditions for device operation.
Symbol Parameter Conditions Min. Typ. Max. Units
VIH High Level Input Voltage 2.0 VCC V
VIL Low Level Input Voltage GND 0.8 V
VOH High Level Output Voltage IOH= -2mA, -4mA (data)
IOH= -4mA, -8mA (clock) 2.4 V
VOL Low Level Output Voltage IOH= -2mA, -4mA (data)
IOH= -4mA, -8mA (clock) 0.4 V
IINC Input Current µA
Symbol Parameter Conditions Min. Typ. Max. Units
VTH Differential Input High Threshold VOC= 1.2V 100 mV
VTL Differential Input Low Threshold VOC= 1.2V -100 mV
IINL Input Current VIN= 2.4V / 0V
VCC= 3.6V µA
Pin Name Pin # Type Description
°C
°C°C
°C
°C
°C°C
0V VIN VCC
≤≤ 10±
°C°C
20±
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THC63L VD824 Rev.1.03
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Supply Current VCC = 3.0V ~ 3.6V, Ta = -10 ~ +70
(*) VESA is a trademark of the Video Electronic s Standards Associ ation.
Symbol Parameter Condition(*) Typ. Max. Units
IRCCG
Receiver Supply
Current
(256 Gray Scale Pattern)
VESA SXGA (60Hz),
fCLKOUT = 54MHz
MODE<1:0>=LH
CL=8pF,
Vcc=3.3V 57 66 mA
VESA UXGA (60Hz),
fCLKOUT = 81MHz
MODE<1:0>=LL
CL=8pF,
Vcc=3.3V 85 97 mA
IRCCW
Receiver Supply
Current
(Double Checker Pattern)
VESA SXGA (60Hz),
fCLKOUT = 54MHz
MODE<1:0>=LH
CL=8pF,
Vcc=3.3V 87 99 mA
VESA UXGA (60Hz),
fCLKOUT = 81MHz
MODE<1:0>=LL
CL=8pF,
Vcc=3.3V 148 173 mA
IRCCS Receiver Power Down
Supply Current /PDWN = L 10 µA
°C°C
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THC63L VD824 Rev.1.03
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256 Gray Scale Pattern
Double Checker Pattern
CLKOUT
Rx0/Gx0/Bx0
Rx1/Gx1/Bx1
Rx2/Gx2/Bx2
Rx3/Gx3/Bx3
Rx4/Gx4/Bx4
Rx5/Gx5/Bx5
Rx6/Gx6/Bx6
Rx7/Gx7/Bx7
x=1,2
DE
CLKOUT
R1n/G1n/B1n
R2n/G2n/B2n
n=0~7
DE
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THC63L VD824 Rev.1.03
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Switching Characteristics VCC = 3.0V ~ 3.6V, Ta = -10 ~ +70
Symbol Parameter Min. Typ. Max. Units
tRCP CLKOUT Period Dual-in / Dual-out 11.76 tRCIP 40.0 ns
Single-in / Dual-out 14.8 2tRCIP 80.0 ns
tRCH CLKOUT High Time ns
tRCL CKLOUT Low Time ns
tRS TTL Data Setup to CLKOUT 0.3tRCP ns
tRH TTL Data Hold from CKLOUT 0.3tRCP ns
tTLH TTL Low to High Transition Ti me 3.0 5.0 ns
tTHL TTL High to Low Transition Time 3.0 5.0 ns
tRIP1 Input Data Position0 (tRCIP = 7.4ns) -0.25 0.0 +0.25 ns
tRIP0 Input Data Position1 (tRCIP = 7.4ns) ns
tRIP6 Input Data Position2 (tRCIP = 7.4ns) ns
tRIP5 Input Data Position3 (tRCIP = 7.4ns) ns
tRIP4 Input Data Position4 (tRCIP = 7.4ns) ns
tRIP3 Input Data Position5 (tRCIP = 7.4ns) ns
tRIP2 Input Data Position6 (tRCIP = 7.4ns) ns
tRPLL Phase Lock Loop Set 10.0 ms
tRCIP CLKIN Period 7.4 40.0 ns
tCK12 Skew Time between RCLK1 and
RCLK2 ns
°C°C
tRCP
2
-----------
tRCP
2
-----------
tRCIP
7
-------------0.25tRCIP
7
-------------tRCIP
7
-------------0.25+
2tRCIP
7
-------------0.25–2
tRCIP
7
-------------2
tRCIP
7
-------------0.25+
3tRCIP
7
-------------0.25–3
tRCIP
7
-------------3
tRCIP
7
-------------0.25+
4tRCIP
7
-------------0.25–4
tRCIP
7
-------------4
tRCIP
7
-------------0.25+
5tRCIP
7
-------------0.25–5
tRCIP
7
-------------5
tRCIP
7
-------------0.25+
6tRCIP
7
-------------0.25–6
tRCIP
7
-------------6
tRCIP
7
-------------0.25+
0.3tRCIP
±
AC Timing Diagrams
TTL Outputs
8pF
TTL Output
TTL Output Load
20%
80%
20%
80%
tTLH tTHL
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THC63L VD824 Rev.1.03
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AC Timing Diagrams
TTL Outputs
2.0V 2.0V 2.0V
0.8V 0.8V
R/F = L
R/F = H
2.0V 2.0V
0.8V 0.8V
tRCP tRS
tRH
tRCH tRCL
CLKOUT
Rxn
Gxn
Bxn
x = 1,2
n = 0~ 7
Phase Lock Loop Set Time
VCC 3.0V
2.0V
2.0V
tRPLL
RCLKx+/-
/PDWN
CLKOUT
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THC63L VD824 Rev.1.03
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Pixel Map Table for Single/Dual Link
TFT Panel Data
LSB 24Bit 18Bit
824 TTL Output Pin
1st Pixel Data
R10 -
MSB
R11
R12
R13
R14
R15
R16
R17
-
R10
R11
R12
R13
R14
R15
LSB
MSB
G11
G12
G13
G14
G15
G16
G17
-
G10
G11
G12
G13
G14
G15
G10 -
LSB
MSB
B11
B12
B13
B14
B15
B16
B17
-
B10
B11
B12
B13
B14
B15
B10 -
R10
R11
R12
R13
R14
R15
R16
R17
G11
G12
G13
G14
G15
G16
G17
G10
B11
B12
B13
B14
B15
B16
B17
B10
TFT Panel D ata
LSB 24Bit 18Bit
824 TTL Output Pi n
2nd Pixel Data
R20 -
MSB
R21
R22
R23
R24
R25
R26
R27
-
R20
R21
R22
R23
R24
R25
LSB
MSB
G21
G22
G23
G24
G25
G26
G27
-
G20
G21
G22
G23
G24
G25
G20 -
LSB
MSB
B21
B22
B23
B24
B25
B26
B27
-
B20
B21
B22
B23
B24
B25
B20 -
R20
R21
R22
R23
R24
R25
R26
R27
G21
G22
G23
G24
G25
G26
G27
G20
B21
B22
B23
B24
B25
B26
B27
B20
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THC63L VD824 Rev.1.03
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TFT Pa nel
(1400 x 1050)
#1 #2 #1400#1399
HSYNC
DE
CLKOUT
R1x/G1x/B1x
R2x/G2x/B2x
#1
#2
#3
#4
#5
#6 #8
#1399
#1400
#1397
#1398
1395
1396
#7
n = 0~7
824 TTL Data Output Timing for Single/Dual Link
Example : SXGA+(1400 x 1050)
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THC63L VD824 Rev.1.03
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Vdiff = 0V
Ryx+/-
AC Timing D i agrams
LVDS Inputs
Ryx6 Ryx5 Ryx4 Ryx3 Ryx2 Ryx1 Ryx0 Ryx6 Ryx5 Ryx4 Ryx3 Ryx2 Ryx1
Vdiff = 0V
tRIP2
tRIP3
tRIP4
tRIP5
tRIP6
tRIP0
tRIP1
tRCIP
RCLKx+
x = 1,2
y = A,B,C,D
Vdiff = 0V
tCK12
RCLK1+
Vdiff = 0V
RCLK2+
Note:
Vdiff = (Ryx+) - (Ryx-), (RCLKx+) - (RCLKx-)
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THC63L VD824 Rev.1.03
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LVDS Data Inputs Timing Diagrams in Single Link
RA1+/- R26’ R25’ R24’ R23’ R22’ G12 R17 R16 R15 R14 R13 R12 G22’
RB1+/- G27’ G26’ G25’ G24’ G23’ B13 B12 G17 G16 G15 G14 G13 B23’
RC1+/- HSYNC’ B27’ B26’ B25’ B24’ DE VSYNC HSYNC B17 B16 B15 B14 DE’
RD1+/- B20’ G21’ G20’ R21’ R20’ xB11 B10 G11 G10 R11 R10 x’
RCLK1+
Previous Cycle Current Cycle
(2nd pi xel dat a ) (1st pixel data)
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THC63L VD824 Rev.1.03
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LVDS Data Inputs Timing Diagrams in Dual Link
RA1+/- R16’ R15’ R14’ R13’ R12’ G12 R17 R16 R15 R14 R13 R12 G12’
RB1+/- G17’ G16’ G15’ G14 G13’ B13 B12 G17 G16 G15 G14 G13 B13’
RC1+/- HSYNC’ B17’ B16’ B15’ B14’ DE VSYNC HSYNC B17 B16 B15 B14 DE’
RD1+/- B10’ G11’ G10’ R11’ R10’ xB11 B10 G11 G10 R11 R10 x’
RA2+/- R26’ R25’ R24’ R23’ R22’ G22 R27 R26 R25 R24 R23 R22 G22’
RB2+/- G27’ G26’ G25’ G24’ G23’ B23 B22 G27 G26 G25 G24 G23 B23’
RC2+/- B27’ B26’ B25’ B24’ B27 B26 B25 B24
RD2+/- B20’ G21’ G20’ R21’ R20’ xB21 B20 G21 G20 R21 R20 x’
RCLK1+
RCLK2+
x’xxxx’
Previous Cycle Current Cycle
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THC63L VD824 Rev.1.03
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Package
76100
5026
INDEX
PIN No.1
25 51
75
0.22
0.5TYP
1.2MAX
UNITS:mm
14.0SQ TYP
16.0SQ TYP
1.00 TYP
THine Electronics, Inc.
Matsuda Yaesudori Bldg. 6F
1-10-7, Hatchobori,
Chuo-ku, Tokyo, 104-0032 Japan
Tel: 81-3-3555-0666
Fax: 81-3-3555-0677
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THC63L VD824 Rev.1.03
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Notes to Users:
1. The contents of this data sheet are subject to change without prior notice.
2. Circuit diagrams shown in this data sheet are examples of application. Therefore, please pay sufficient attention
when designing circuits. Even if there are incorrect descriptions, we are not responsible for any problem due to
them. Please note that incorrect descriptions sometimes cannot be corrected immediately if found.
3. Our copyright and know-how are included in this data sheet. Duplication of the data sheet and disclosure to other
persons are strictly prohibited without our permission.
4. We are not responsible for any problems of industrial proprietorship occurring during THC63LVD824 use, except
for those directly related to THC63LVD824’s structure, manufacture or functions. THC63LV D824 is designed on
the premise that it should be used for ordinary electronic devices . Therefore, it shall not be used for application s that
require extremely high- reliability (space equipment, nuclear control equip ment, medical equipment that affects peo -
ple’s lives, etc.). In addition, when using THC63LVD824 for traffic signals, safety devices and control/safety units
in transportation equipment, etc., appropriate measures should be taken.
5. We are making the utmost effort to improve the quality and reliability of our products. However, there is a very
slight possib i lity of fai l ure in s emi cond uctor devices. To avoi d d amage to social or offici al org ani zati ons , m uch care
should be taken to provide sufficient redundancy and fail-safe design.
6. No radiation-hardened design is incorporated in THC63LVD824.
7. Judgmen t on whether THC63LVD824 come s un der s trat egi c pr oducts prescri b ed by th e Fo rei gn Ex chang e and F or -
eign Trade Control Law is the user’s responsibility.
8. This technical documen t was provisi onally created during development of THC 63LVD824, so there is a possibility
of differences between it and the product’s final specifications. When designing circuits using THC63LVD824, be
sure to refer to the final technical documents.