DISCRETE SEMICONDUCTORS DATA SHEET ook, halfpage M3D088 BAV199 Low-leakage double diode Product specification Supersedes data of 1999 May 11 2001 Oct 12 Philips Semiconductors Product specification Low-leakage double diode FEATURES BAV199 MARKING * Plastic SMD package * Low leakage current: typ. 3 pA TYPE NUMBER MARKING CODE(1) PIN 1 anode BAV199 JY 2 cathode 3 anode; cathode * Switching time: typ. 0.8 s * Continuous reverse voltage: max. 75 V * Repetitive peak reverse voltage: max. 85 V * Repetitive peak forward current: max. 500 mA. PINNING Note DESCRIPTION 1. = p: Made in Hong Kong. = t: Made in Malaysia. = W: Made in China. APPLICATION 2 handbook, 4 columns 1 * Low-leakage current applications in surface mounted circuits. 2 1 DESCRIPTION 3 Epitaxial, medium-speed switching, double diode in a small SOT23 plastic SMD package. The diodes are connected in series. 3 MAM107 Top view Fig.1 Simplified outline (SOT23) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode VRRM repetitive peak reverse voltage - 85 V VR continuous reverse voltage - 75 V IF continuous forward current single diode loaded; note 1; see Fig.2 - 160 mA double diode loaded; note 1; see Fig.2 - 140 mA IFRM repetitive peak forward current - 500 mA IFSM non-repetitive peak forward current square wave; Tj = 25 C prior to surge; see Fig.4 tp = 1 s - 4 A tp = 1 ms - 1 A tp = 1 s - 0.5 A Ptot total power dissipation - 250 mW Tstg storage temperature Tamb = 25 C; note 1 -65 +150 C Tj junction temperature - 150 C Note 1. Device mounted on a FR4 printed-circuit board. 2001 Oct 12 2 Philips Semiconductors Product specification Low-leakage double diode BAV199 ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT Per diode VF IR forward voltage see Fig.3 reverse current IF = 1 mA - 900 mV IF = 10 mA - 1000 mV IF = 50 mA - 1100 mV IF = 150 mA - 1250 mV VR = 75 V 0.003 5 nA VR = 75 V; Tj = 150 C 3 80 nA see Fig.5 Cd diode capacitance f = 1 MHz; VR = 0; see Fig.6 2 - pF trr reverse recovery time when switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA; see Fig.7 0.8 3 s THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth j-tp thermal resistance from junction to tie-point Rth j-a thermal resistance from junction to ambient CONDITIONS note 1 Note 1. Device mounted on a FR4 printed-circuit board. 2001 Oct 12 3 VALUE UNIT 360 K/W 500 K/W Philips Semiconductors Product specification Low-leakage double diode BAV199 GRAPHICAL DATA MLB756 300 MLB752 - 1 300 handbook, halfpage handbook, halfpage IF (mA) IF (mA) 200 200 (1) (2) (3) single diode loaded 100 100 double diode loaded 0 0 100 T amb ( oC) 0 200 0 0.8 1.2 V F (V) 1.6 (1) Tj = 150 C; typical values. (2) Tj = 25 C; typical values. (3) Tj = 25 C; maximum values. Device mounted on a FR4 printed-circuit board. Fig.2 0.4 Maximum permissible continuous forward current as a function of ambient temperature. Fig.3 Forward current as a function of forward voltage; per diode. MBG704 102 handbook, full pagewidth IFSM (A) 10 1 10-1 1 10 102 103 tp (s) 104 Based on square wave currents; Tj = 25 C prior to surge. Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration per diode. 2001 Oct 12 4 Philips Semiconductors Product specification Low-leakage double diode MLB754 2 10halfpage handbook, IR (nA) 10 BAV199 MBG526 2 handbook, halfpage (1) Cd (pF) 1 1 10 1 (2) 10 2 10 3 0 0 50 100 150 T j ( oC) 0 200 VR = 75 V. (1) Maximum values. (2) Typical values. Fig.5 5 10 15 VR (V) 20 f = 1 MHz; Tj = 25 C. Reverse current as a function of junction temperature; per diode. Fig.6 handbook, full pagewidth tr Diode capacitance as a function of reverse voltage; per diode; typical values. tp t D.U.T. RS = 50 V = VR I F x R S IF 10% IF SAMPLING OSCILLOSCOPE t R = 50 i MGA881 (1) 90% VR input signal Fig.7 Reverse recovery time test circuit and waveforms. 2001 Oct 12 t rr 5 output signal Philips Semiconductors Product specification Low-leakage double diode BAV199 PACKAGE OUTLINE Plastic surface mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.1 OUTLINE VERSION SOT23 2001 Oct 12 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-02-28 99-09-13 TO-236AB 6 Philips Semiconductors Product specification Low-leakage double diode BAV199 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2001 Oct 12 7 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA73 (c) Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/04/pp8 Date of release: 2001 Oct 12 Document order number: 9397 750 08764