Intel® Workstation Board WX58BP
Technical Product Specification
Intel order number: E65585-004
Revision 1.2
October, 2011
Enterprise Platforms and Services Division - Marketing
Revision History Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
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Revision History
Date
Revision
Number
Modifications
February 2009
0.9
Initial release of the Intel® Workstation Board WX58BP Technical Product
Specification.
April 2009
1.0
Minor edits and grammatical corrections.
March 2010
1.1
Updated PCI Express details in Add-in Card Connectors section.
October 2011
1.2
Minor edits.
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Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or
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that you have the latest datasheet before finalizing a design.
The Intel® Workstation Board WX58BP Technical Product Specification may contain design defects or errors known
as errata which may cause the product to deviate from published specifications. Current characterized errata are
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*Other brands and names may be claimed as the property of others.
Copyright © 2011 Intel Corporation
Intel® Workstation Board WX58BP TPS Table of Contents
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Table of Contents
1. Product Description ............................................................................................................. 1
1.1 Overview .................................................................................................................. 1
1.1.1 Feature Summary .................................................................................................... 1
1.1.2 Board Layout ........................................................................................................... 2
1.1.3 Block Diagram ......................................................................................................... 4
1.2 Legacy Considerations ............................................................................................ 5
1.3 Online Support ......................................................................................................... 5
1.4 Processor ................................................................................................................. 5
1.5 System Memory ....................................................................................................... 5
1.5.1 Memory Configurations ............................................................................................ 6
1.6 Intel® X58 Chipset .................................................................................................... 8
1.6.1 USB ......................................................................................................................... 8
1.6.2 Serial ATA Interfaces ............................................................................................... 9
1.7 Real-Time Clock (RTC) Subsystem ......................................................................... 9
1.8 Legacy I/O Controller ............................................................................................. 10
1.9 Audio Subsystem ................................................................................................... 10
1.9.1 Audio Subsystem Software .................................................................................... 10
1.9.2 Audio Connectors and Headers ............................................................................. 10
1.9.3 8-Channel (7.1) Audio Subsystem ......................................................................... 11
1.10 Lan Subsystem ...................................................................................................... 12
1.10.1 Intel® 82567LM Gigabit Ethernet Controller ........................................................... 12
1.10.2 LAN Subsystem Software ...................................................................................... 13
1.10.3 RJ-45 LAN Connector with Integrated LEDs ......................................................... 13
1.11 Hardware Management Subsystem....................................................................... 14
1.11.1 Hardware Monitoring and Fan Control ................................................................... 14
1.11.2 Fan Monitoring ....................................................................................................... 14
1.11.3 Chassis Intrusion and Detection ............................................................................ 14
1.11.4 Thermal Monitoring ................................................................................................ 15
1.12 Power Management ............................................................................................... 16
1.12.1 ACPI ...................................................................................................................... 16
1.12.2 Hardware Support .................................................................................................. 19
1.12.3 ENERGY STAR* .................................................................................................... 23
Table of Contents Intel® Workstation Board WX58BP TPS
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2. Technical Reference .......................................................................................................... 24
2.1 Memory Resources ................................................................................................ 24
2.1.1 Addressable Memory ............................................................................................. 24
2.1.2 Memory Map .......................................................................................................... 26
2.2 Connectors and Headers ....................................................................................... 26
2.2.1 Back Panel Connectors ......................................................................................... 27
2.2.2 Component-side Connectors and Headers ........................................................... 28
2.3 BIOS Setup Configuration Jumper Block ............................................................... 36
2.4 Mechanical Considerations .................................................................................... 37
2.4.1 Form Factor ........................................................................................................... 37
2.5 Electrical Considerations ....................................................................................... 38
2.5.1 Power Supply Considerations ................................................................................ 38
2.5.2 Fan Header Current Capability .............................................................................. 39
2.5.3 Add-in Board Considerations ................................................................................. 39
2.6 Thermal Considerations ......................................................................................... 39
2.7 Reliability ............................................................................................................... 42
2.8 Environmental ........................................................................................................ 42
3. Overview of BIOS Features ............................................................................................... 43
3.1 Introduction ............................................................................................................ 43
3.2 BIOS Flash Memory Organization ......................................................................... 44
3.3 Resource Configuration ......................................................................................... 44
3.3.1 PCI Auto-configuration ........................................................................................... 44
3.4 System Management BIOS (SMBIOS) .................................................................. 45
3.5 Legacy USB Support ............................................................................................. 45
3.6 BIOS Updates ........................................................................................................ 46
3.6.1 Language Support ................................................................................................. 46
3.6.2 Custom Splash Screen .......................................................................................... 46
3.7 BIOS Recovery ...................................................................................................... 46
3.8 Boot Options .......................................................................................................... 47
3.8.1 CD-ROM Boot ........................................................................................................ 47
3.8.2 Network Boot ......................................................................................................... 47
3.8.3 Booting Without Attached Devices ........................................................................ 47
3.8.4 Changing the Default Boot Device During POST .................................................. 47
3.9 Adjusting Boot Speed ............................................................................................ 48
3.9.1 Peripheral Selection and Configuration ................................................................. 48
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3.9.2 BIOS Boot Optimizations ....................................................................................... 48
3.10 BIOS Security Features ......................................................................................... 49
4. Error Messages and Beep Codes ..................................................................................... 50
4.1 Speaker ................................................................................................................. 50
4.2 BIOS Beep Codes ................................................................................................. 50
4.3 BIOS Error Messages ............................................................................................ 50
4.4 Port 80h POST Codes ........................................................................................... 51
5. Regulatory Compliance and Battery Disposal Information ............................................ 55
5.1 Regulatory Compliance ......................................................................................... 55
5.1.1 Safety Standards ................................................................................................... 55
5.1.2 European Union Declaration of Conformity Statement .......................................... 56
5.1.3 Product Ecology Statements ................................................................................. 57
5.1.4 EMC Regulations ................................................................................................... 61
5.1.5 Product Certification Markings (Board Level) ........................................................ 62
5.2 Battery Disposal Information .................................................................................. 63
Glossary ..................................................................................................................................... 67
List of Figures Intel® Workstation Board WX58BP TPS
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List of Figures
Figure 1. Major Board Components .............................................................................................. 2
Figure 2. Block Diagram ............................................................................................................... 4
Figure 3. Memory Channel and DIMM Configuration.................................................................... 7
Figure 4. Back Panel Audio Connector Options ......................................................................... 11
Figure 5. LAN Connector LED Locations .................................................................................... 13
Figure 6. Thermal Sensors and Fan Headers ............................................................................. 15
Figure 7. Locations of Indicator LEDs ......................................................................................... 22
Figure 8. Detailed System Memory Address Map....................................................................... 25
Figure 9. Back Panel Connectors ............................................................................................... 27
Figure 10. Component-side Connectors and Headers ............................................................... 28
Figure 11. Connection Diagram for Front Panel Header ............................................................ 33
Figure 12. Connection Diagram for Front Panel USB Headers .................................................. 35
Figure 13. Connection Diagram for IEEE 1394a Header ............................................................ 35
Figure 14. Location of the BIOS Setup Configuration Jumper Block .......................................... 36
Figure 15. Board Dimensions ..................................................................................................... 37
Figure 16. Localized High Temperature Zones ........................................................................... 40
Intel® Workstation Board WX58BP TPS List of Tables
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List of Tables
Table 1. Feature Summary ........................................................................................................... 1
Table 2. Components Shown in Figure 1 ...................................................................................... 3
Table 3. Online Support ................................................................................................................ 5
Table 4. Supported Memory Configurations ................................................................................. 6
Table 5. Intel® X58 Chipset Information ........................................................................................ 8
Table 6. USB Information .............................................................................................................. 8
Table 7. Audio Connectors and Headers Information ................................................................. 11
Table 8. LAN Connector LED States .......................................................................................... 13
Table 9. Effects of Pressing the Power Switch ........................................................................... 16
Table 10. Power States and Targeted System Power ................................................................ 17
Table 11. Wake-up Devices and Events ..................................................................................... 18
Table 12. Power Connector Information ..................................................................................... 19
Table 13. Fan Headers Information ............................................................................................ 20
Table 14. System Memory Map .................................................................................................. 26
Table 15. Component-side Connectors and Headers Shown in Figure 10 ................................. 29
Table 16. HD Audio Link Header ................................................................................................ 30
Table 17. Front Panel Audio Header .......................................................................................... 30
Table 18. Serial ATA Connectors ............................................................................................... 30
Table 19. Chassis Intrusion Header ............................................................................................ 31
Table 20. Front and Rear Chassis (3-Pin) Fan Headers ............................................................ 31
Table 21. Processor and Rear Chassis 2 (4-Pin) Fan Headers .................................................. 31
Table 22. Processor Core Power Connector .............................................................................. 32
Table 23. Main Power Connector ............................................................................................... 32
Table 24. Front Panel Header ..................................................................................................... 33
Table 25. States for a One-Color Power LED ............................................................................. 34
Table 26. States for a Two-Color Power LED ............................................................................. 34
Table 27. BIOS Setup Configuration Jumper Settings ................................................................ 37
Table 28. Recommended Power Supply Current Values ........................................................... 38
Table 29. Fan Header Current Capability ................................................................................... 39
Table 30. Thermal Considerations for Components ................................................................... 41
Table 31. Environmental Specifications ...................................................................................... 42
Table 32. BIOS Setup Program Menu Bar .................................................................................. 43
List of Tables Intel® Workstation Board WX58BP TPS
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Table 33. BIOS Setup Program Function Keys .......................................................................... 44
Table 34. Acceptable Drives/Media Types for BIOS Recovery................................................... 46
Table 35. Boot Device Menu Options ......................................................................................... 47
Table 36. Supervisor and User Password Functions .................................................................. 49
Table 37. Beep Codes ................................................................................................................ 50
Table 38. BIOS Error Messages ................................................................................................. 50
Table 39. Port 80h POST Code Ranges ..................................................................................... 51
Table 40. Port 80h POST Codes ................................................................................................ 52
Table 41. Typical Port 80h POST Sequence .............................................................................. 54
Table 42. Safety Standards ........................................................................................................ 55
Table 43. Lead-Free Board Markings ......................................................................................... 60
Table 44. EMC Regulations ........................................................................................................ 61
Table 45. Product Certification Markings .................................................................................... 62
Intel® Workstation Board WX58BP TPS List of Tables
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Intel® Workstation Board WX58BP TPS Product Description
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1. Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Feature
Description
Form Factor
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Form Factor
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Processor
Intel® Xeon® W3500/W3600 series Processor in an LGA1366 socket
Memory
Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR3 1333 MHz, DDR3 1066 MHz, and DDR3 800 MHz DIMMs
Support for up to 16 GB of system memory
Support for non-ECC memory and ECC memory
Chipset
Intel® X58 Chipset, consisting of:
Intel® X58 I/O Hub (IOH)
Intel® 82801IJR I/O Controller Hub (ICH10R)
Audio
Intel® High Definition Audio subsystem using the Realtek* ALC889 audio codec
Legacy I/O Control
Winbond legacy I/O controller
Peripheral Interfaces
12 USB 2.0 ports
Six internal Serial ATA interfaces with RAID support
Two IEEE 1394a ports (one on back panel, one front-panel header)
BIOS
Intel® BIOS resident in the SPI Flash device
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available PC
Technology
Support for PCI Local Bus Specification Revision 2.2
Support for PCI Express* Revision 2.0
Suspend to RAM support
Wake on PCI, front panel, and USB ports
LAN Support
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82567LM Gigabit
Ethernet Controller
Expansion
Capabilities
One PCI Conventional bus add-in card connector (SMBus routed to PCI
Conventional bus add-in card connector)
Two PCI Express* 2.0 x16 bus add-in card connectors
One PCI Express* 2.0 x4 bus add-in card connector
Two PCI Express* 1.1 x1 bus add-in card connectors
Hardware Monitor
Subsystem
Hardware monitoring and fan control ASIC
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Three fan headers using PWM control
Three fan sense inputs used to monitor fan activity
Fan speed control using voltage control (3-pin fan headers front and rear)
Product Description Intel® Workstation Board WX58BP TPS
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Feature
Description
Support for Product Environmental Control Interface (PECI)
1.1.2 Board Layout
Figure 1 shows the location of the major components on the Intel® Workstation Board WX58BP.
Figure 1. Major Board Components
Table 2 lists the components identified in the figure above.
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Table 2. Components Shown in Figure 1
Item
Description
A
Auxiliary fan
B
PCI Express* x1 connector
C
PCI Express* x16 bus add-in card connector (Secondary)
D
Front panel audio header
E
PCI Conventional bus add-in card connector
F
PCI Express* x1 bus add-in card connector
G
PCI Express* x16 bus add-in card connector (Primary)
H
PCI Express* x4 bus add-in card connector
I
Back panel connectors
J
Processor fan header
K
Rear fan header
L
LGA1366 processor socket
M
DIMM Channel A sockets [2]
N
DIMM Channel B socket
O
DIMM Channel C socket
P
Main power connector
Q
Intel® 82X58 IO Hub (IOH)
R
Processor core power connector (2 X 4)
S
Chassis intrusion header
T
Front chassis fan header
U
Serial ATA connectors [6]
V
Front panel USB headers [2]
W
Battery
X
Intel® 82801IJR I/O Controller Hub (ICH10R)
Y
IEEE 1394a front panel header
Z
BIOS Setup configuration jumper block
AA
Auxiliary front panel power LED header
BB
Front panel header
CC
High Definition Audio Link header
DD
S/PDIF connector
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1.2 Legacy Considerations
This board differs from other Intel Board products with specific changes including (but not
limited to) the following:
No parallel port
No floppy drive connector
No serial port
No PS/2 connectors
1.3 Online Support
Table 3. Online Support
To find information about
Website
Intel® Workstation Board WX58BP
http://www.intel.com/products/motherboard/WX58BP/index.htm
Server Board Support
http://www.intel.com/p/en_US/support/highlights/server/wx58bp
BIOS and driver updates
http://downloadcenter.intel.com/
1.4 Processor
The board is designed to support the following processor:
Intel® Xeon® W3500 series Processor in an LGA1366 socket
Intel® Xeon® W3600 series Processor in an LGA1366 socket
In the future, this board may support other processors. This board is designed to support
processors with a maximum wattage of 130 W. The processor listed previously is only
supported when falling within the wattage requirements of the Intel® Workstation Board
WX58BP. For the most up-to-date list of supported processors, refer to the following Intel
web site: http://www.intel.com/products/motherboard/WX58BP/index.htm
CAUTION
Use only the processors listed on the website mentioned previously. Use of unsupported processors can
damage the board, processor, and power supply.
Integrator’s Note
This board has specific requirements for providing power to the processor. For information on power
supply requirements for this board, refer to Section 2.5.1.
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
1.5-V DDR3 SDRAM DIMMs
Three independent memory channels with interleaved mode support
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Unbuffered, single-sided or double-sided DIMMs with the following restriction: This board
does not support double-sided DIMMs with x16 organization.
16 GB maximum total system memory. For information on the total amount of
addressable memory, refer to Section 2.1.1.
Minimum total system memory: 1 GB
Non-ECC DIMMs and ECC DIMMs
Serial Presence Detect
DDR3 1333 MHz, DDR3 1066 MHz, and DDR3 800 MHz SDRAM DIMMs
Note: To be fully compliant with all applicable DDR SDRAM memory specifications, you should
populate the board with DIMMs that support the Serial Presence Detect (SPD) data structure.
This allows the BIOS to read the SPD data and program the chipset to accurately configure
memory settings for optimum performance. If non-SPD memory is installed, the BIOS will
attempt to correctly configure the memory settings, but this may impact the performance and
reliability or the DIMMs may not function under the determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity
Configuration
(Note 1)
SDRAM Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices (Note 2)
1024 MB
SS
1 Gb
128 M x 8/empty
8 [9]
2048 MB
DS
1 Gb
128 M x 8/128 M x 8
16 [18]
Notes:
1. -sided memory modules (containing two rows of SDRAM) and
-sided memory modules (containing one row of SDRAM).
2. In the fifth column, the number in brackets specifies the number of SDRAM devices on an ECC DIMM.
1.5.1 Memory Configurations
The Intel® Xeon® W3500/W3600 series Processor supports the following types of memory
organization:
Tri/Dual channel (Interleaved) mode
memory sequentially. Data is spread amongst the memory modules in an alternating
pattern.
Three independent memory channels give two possible modes of interleaving:
o Tri-Channel Mode: Enabled when identical matched memory modules are installed
in each of the three memory channels (blue connectors).
o Dual-Channel Mode: Enabled when two of the blue memory connectors are
populated with matched DIMMs.
Single-Channel (Asymmetric) Mode: Equivalent to single-channel bandwidth operation
for real world applications. This mode is used when only a single DIMM is installed or the
installed memory modules are not matched. Technology and device width can vary from
one channel to the other.
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1.6 Intel® X58 Chipset
The Intel® X58 chipset consists of the following devices:
Intel® 82X58 IOH with Direct Media Interface (DMI) interconnect
Intel® 82801IJR I/O Controller Hub (ICH10R)
The IOH component provides interfaces to the processor and the PCI Express* graphics
connectors. The ICH10R
Table 5. Intel® X58 Chipset Information
For information about
Refer to
Intel® X58 chipset
http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset
Chapter 2
1.6.1 USB
The board supports up to 12 USB 2.0 ports; supports UHCI and EHCI; and uses UHCI- and
EHCI-compatible drivers.
The ICH10R provides the USB controller for all ports. The port arrangement is as follows:
Eight ports are implemented with dual, stacked back panel connectors adjacent to the
audio connectors.
Four ports are routed to two separate front panel USB headers.
Table 6. USB Information
For information about
Refer to
The location of the USB connectors on the back panel
Figure 9
The location of the front panel USB headers
Figure 10
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1.6.2 Serial ATA Interfaces
The board provides six Serial ATA (SATA) connectors, which support one device per connector.
1.6.2.1 Serial ATA Support
maximum transfer rate of 3 Gb/s per port. You can install one device on each port for a
maximum of six Serial ATA devices. Unlike a Parallel ATA IDE, which supports a master/slave
configuration and two devices per channel, a point-to-point interface is used for host to device
connections.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In Legacy mode,
standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard
PCI Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using Microsoft Windows XP* and Microsoft Windows Vista* operating systems.
Note: Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/.
For information about the location of the Serial ATA connectors, refer to Figure 10.
1.6.2.2 Serial ATA RAID
The board supports the following RAID (Redundant Array of Independent Drives) levels via the
ICH10R:
RAID 0 - Data striping
RAID 1 - Data mirroring
RAID 0+1 (or RAID 10) - Data striping and mirroring
RAID 5 - Distributed parity
Note: In order to use supported RAID features, you must first enable RAID in the BIOS. Also,
during Microsoft Windows XP* installation, you must press F6 to install the RAID drivers. For
more information about installing drivers during installation, refer to your Microsoft Windows XP*
documentation.
1.7 Real-Time Clock (RTC) Subsystem
A coin-cell battery (CR2032) powers the real-time clock (RTC) and CMOS memory. When the
computer is not plugged into a w
computer is plugged in, the standby current from the power supply extends the life of the
battery. The clock is accurate to 13 minutes/year at 25º C with 3.3 VSB applied.
Product Description Intel® Workstation Board WX58BP TPS
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Note: If the battery and AC power fail, the Date and Time values will reset and the user is
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS
RAM (for example, the date and time) might not be accurate. Replace the battery with an
equivalent one.
1.8 Legacy I/O Controller
The I/O controller provides the following features:
Serial IRQ interface compatible with serialized IRQ support for PCI systems
Intelligent power management, including a programmable wake-up event interface
PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9 Audio Subsystem
This board supports the Intel® High Definition Audio subsystem based on the Realtek* ALC889
audio codec. The audio subsystem supports the following features:
Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device connected to an audio port. The back panel audio jacks are
nition, or can be automatically switched
depending on the recognized device type.
Stereo input and output for all back panel jacks
Line out and Mic in functions for front panel audio jacks
A signal-to-noise (S/N) ratio of 90 dB
1.9.1 Audio Subsystem Software
A
software and drivers, refer to Section 1.3.
1.9.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the component
side of the board. The component-side audio headers include the following:
Front panel audio (a 2 x 5-pin header that provides a mic in and line out signals for front
panel audio connectors)
High Definition (HD) Audio Link header (a 2 x 8-pin header for S/PDIF) used for HDMI
Video cards
S/PDIF audio connector (1 x 3-pin connector) can be used for HDMI Video cards that do
not work with the HD Audio header
S/PDIF output between the back panel Optical connector and the internal S/PDIF header
can be selected in BIOS setup
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Table 7. Audio Connectors and Headers Information
For information about…
Refer to
Locations of the front panel audio header, HD Audio Link header, and S/PDIF
audio connector
Figure 10
Signal names of the front panel audio header
Table 17
Back panel audio connectors
Section 2.2.1
1.9.3 8-Channel (7.1) Audio Subsystem
The 8-channel (7.1) audio subsystem includes the following:
Intel® 82801IJR (ICH10R)
Realtek* ALC889 audio codec
Microphone input that supports a single dynamic, condenser, or electric microphone
You can configure the back panel audio connectors through the audio device drivers. Figure 4
shows the available configurable audio ports.
Item
Description
A
Surround left/right channel audio out/Retasking Jack
B
Center channel and LFE (subwoofer) audio out
C
Line in (Side Channel Surround) audio out/Retasking Jack)
D
Line out/Headphone (Stereo)
E
Mic in
F
S/PDIF Digital Audio Out (Optical)
Figure 4. Back Panel Audio Connector Options
For information about back panel audio connectors, refer to Section 2.2.1.
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1.10 Lan Subsystem
The LAN subsystem consists of the following:
Intel® 82567LM Gigabit Ethernet Controller (10/100/1000 Mbits/sec)
Intel® 82801IJR (ICH10R)
RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
CSMA/CD protocol engine
LAN connect interface between ICH10R and the LAN controller
PCI Conventional bus power management
o ACPI technology support
o LAN wake capabilities
LAN subsystem software
For information about LAN software and drivers, refer to: http://downloadcenter.intel.com.
1.10.1 Intel® 82567LM Gigabit Ethernet Controller
The Intel® 82567LM Gigabit Ethernet Controller supports the following features:
PCI Express* link
10/100/1000 IEEE 802.3 compliant
Compliant to IEEE 802.3x flow control support
802.1p and 802.1q
TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
Transmit TCP segmentation
Full device driver compatibility
PCI Express* power management support
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1.10.2 LAN Subsystem Software
website. For information on obtaining LAN
software and drivers, refer to: http://downloadcenter.intel.com.
1.10.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (Figure 5).
Item
Description
A
Link LED (Green)
B
Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 8 describes the LED states when the board is powered up and the LAN subsystem is
operating.
Table 8. LAN Connector LED States
LED
LED Color
LED State
Condition
Link
Green
Off
LAN link is not established.
On
LAN link is established.
Blinking
LAN activity is occurring.
Data Rate
Green/Yellow
Off
10 Mbits/sec data rate is selected.
Green
100 Mbits/sec data rate is selected.
Yellow
1000 Mbits/sec data rate is selected.
Product Description Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
14
1.11 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for
Management (WfM) specification. The board has several hardware management features
including the following:
Fan monitoring and control
Thermal and voltage monitoring
Chassis intrusion detection
1.11.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
Fan speed control controllers and sensors provided by the Hardware Monitoring and Fan
Control ASIC
Thermal sensors in the processor, 82X58 IOH, and 82801IJR ICH10R
Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.1 V, and +VCCP)
to detect levels above or below acceptable values
Thermally-monitored, closed-loop fan control for all three fans that can adjust the fan
speed or switch the fans on/off as needed
1.11.2 Fan Monitoring
You can use software to implement fan monitoring. For more information on the functions of the
fan headers, refer to Section 1.12.2.2.
1.11.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is removed. The
security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion
header. When the chassis cover is removed, the mechanical switch is in the closed position.
For more information about the location of the chassis intrusion header, refer to Figure 10.
Intel® Workstation Board WX58BP TPS Product Description
Revision 1.2
Intel order number: E65585-004
15
1.11.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Item
Description
A
Auxiliary rear chassis fan
B
Processor fan
C
Rear fan
D
Thermal diode located on processor die
E
Thermal diode located on the IOH die
F
Front chassis fan
G
Thermal diode located on the ICH10R die
Figure 6. Thermal Sensors and Fan Headers
Product Description Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
16
1.12 Power Management
Power management is implemented at several levels, including:
Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
o Power connector
o Fan headers
o LAN wake capabilities
o Instantly Available PC technology
o Wake from USB
o Power Management Event signal (PME#) wake-up support
o PCI Express* WAKE# signal support
1.12.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with this board requires an operating system that
provides full ACPI support. ACPI features include:
Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in boards
may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-W system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (Table 11)
Support for a front panel power and sleep mode switch
Table 9 lists the system states based on how long the power switch is pressed, depending on
how ACPI is configured with an ACPI-aware operating system.
Table 9. Effects of Pressing the Power Switch
If the system is in this state…
…and the power switch is pressed
for
…the system enters this state
Off
(ACPI G2/G5 Soft off)
Less than four seconds
Power-on
(ACPI G0 working state)
On
(ACPI G0 working state)
Less than four seconds
Soft-off/Standby
(ACPI G1 sleeping state)
On
(ACPI G0 working state)
More than six seconds
Fail safe power-off
(ACPI G2/G5 Soft off)
Sleep
(ACPI G1 sleeping state)
Less than four seconds
Wake-up
(ACPI G0 working state)
Sleep
(ACPI G1 sleeping state)
More than six seconds
Power-off
(ACPI G2/G5 Soft off)
Intel® Workstation Board WX58BP TPS Product Description
Revision 1.2
Intel order number: E65585-004
17
1.12.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. You can turn-off devices that are not
being used. The operating system uses information from applications and user settings to put
the system as a whole into a low-power state.
Table 10 lists the power states supported by the board along with the associated system power
targets. For a complete description of the various system and power states, refer to the ACPI
specification.
Table 10. Power States and Targeted System Power
Global States
Sleeping States
Processor
States
Device States
Targeted System
Power (Note 1)
G0 working
state
S0 working
C0 working
D0 working
state.
Full power > 30 W
G1 sleeping
state
S1 Processor
stopped
C1 stop
grant
D1, D2, D3
device
specification
specific.
5 W < power < 52.5 W
G1 sleeping
state
S3 Suspend to
RAM. Context
saved to RAM.
No power
D3 no power
except for
wake-up logic.
Power < 5 W (Note 2)
G1 sleeping
state
S4 Suspend to
disk. Context saved
to disk.
No power
D3 no power
except for
wake-up logic.
Power < 5 W (Note 2)
G2/S5
S5 Soft off.
Context not saved.
Cold boot is
required.
No power
D3 no power
except for
wake-up logic.
Power < 5 W (Note 2)
G3
mechanical off
AC power is
disconnected
from the
computer.
No power to the
system.
No power
D3 no power for
wake-up logic,
except when
provided by
battery or external
source.
No power to the system.
Service can be performed
safely.
Notes:
1. Total system power is dependent on the system configuration including add-in boards and peripherals
p
2. Dependent on the standby power consumption of wake-up devices used in the system.
Product Description Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
18
1.12.1.2 Wake-up Devices and Events
Table 11 lists the devices or specific events that can wake the computer from specific states.
Table 11. Wake-up Devices and Events
These devices/events can wake up the computer…
…from this state
LAN
S1, S3, S4, S5 (Note 1)
PME# signal
S1, S3, S4, S5 (Note 1)
Power switch
S1, S3, S4, S5
RTC alarm
S1, S3, S4, S5
USB
S1, S3
WAKE#
S1, S3, S4, S5
Note 1: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option
to Power On enables a wake-up event from LAN in the S5 state.
Note 2: Wake from S4 and S5 is optional by the specification.
Note: The use of these wake-up events from an ACPI state requires an operating system that
provides full ACPI support. In addition, software, drivers, and peripherals must fully support
ACPI wake events.
Intel® Workstation Board WX58BP TPS Product Description
Revision 1.2
Intel order number: E65585-004
19
1.12.2 Hardware Support
CAUTION
If LAN wake capabilities and Instantly Available PC technology features are used, ensure the
power supply provides adequate +5 V standby current. Failure to do so can damage the power
supply. The total amount of standby current required depends on the wake devices supported and
manufacturing options.
The board provides several power management hardware features including:
Power connector
Fan headers
LAN wake capabilities
Instantly Available PC technology
Wake from USB
PME# signal wake-up support
WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the +5 V
standby line.
Note: The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
1.12.2.1 Power Connector
ATX12V-compliant power supplies can turn-off the system power through system control. When
an ACPI-enabled system receives the correct command, the power supply removes all non-
standby voltages.
When resuming from an AC power failure, the computer returns to the power state it was in
Table 12. Power Connector Information
For information about
Refer to
Location of the main power connector
Figure 10
Signal names of the main power connector
Table 23
Product Description Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
20
1.12.2.2 Fan Headers
The function/operation of the fan headers is as follows:
The fans are on when the board is in the S0 or S1 state.
The fans are off when the board is off or in the S3, S4, or S5 state.
Each fan header is wired to a fan tachometer input of the hardware monitoring and fan
control ASIC except the fan header located at J7TH (item R in Figure 1)
All fan headers support closed-loop fan control that can adjust the fan speed or switch
the fan on or off as needed
All fan headers have a +12 V DC connection
4-pin fan headers are controlled by Pulse Width Modulation
3-pin fan headers (front and rear) are modulated by voltage control
Table 13. Fan Headers Information
For information about…
Refer to
Location of the fan headers
Figure 10
Location of the fan headers and sensors for thermal monitoring
Figure 6
Signal names of the fan headers
Section 2.2
1.12.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing
adequate +5 V standby current. Failure to provide adequate standby current when implementing
LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN
subsystem PCI bus network adapter monitors network traffic at the Media Independent
Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal
that powers up the computer. Depending on the LAN implementation, the board supports LAN
wake capabilities with ACPI in the following ways:
PCI Express* WAKE# signal
PCI bus PME# signal for PCI 2.3 compliant LAN designs
o By Ping
o Magic Packet
Onboard LAN subsystem
Intel® Workstation Board WX58BP TPS Product Description
Revision 1.2
Intel order number: E65585-004
21
1.12.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Instantly Available PC technology can damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM)
sleep-state. While in the S3 sleep-state, the computer appears to be off (the power supply is off
and the front panel LED is amber if dual-colored, or off if single-colored.) When signaled by a
wake-up device or event, the system quickly returns to its last known wake state. Table 11 lists
the devices and events that can wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in boards that
also support this specification can participate in power management and can be used to wake
the computer.
The use of Instantly Available PC technology requires operating system support and PCI 2.2
compliant add-in cards, PCI Express* add-in cards, and drivers.
1.12.2.5 Wake from USB
USB bus activity wakes the computer from ACPI S1 or S3 states.
Note: Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.12.2.6 PME# Signal Wake-up Support
When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an
ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS).
1.12.2.7 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an
ACPI S1, S3, S4, or S5 state.
Product Description Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
22
1.12.2.8 +5 V Standby Power Indicator LED and Additional LEDs
The +5 V standby power indicator LED shows power is still present even when the computer
appears to be off. Figure 7 shows the location of the standby power indicator LED on the board.
CAUTION
If AC power is switched off and the standby power indicators are still lit, disconnect the power cord
before installing or removing any devices connected to the board. Failure to do so could damage
the board and any attached devices.
In addition to the standby power indicator, the board contains two LEDs that indicate the
following:
The Processor LED indicates an elevated temperature on the processor that could affect
performance.
The Voltage Regulator LED indicates an elevated temperature in the processor voltage
regulator circuit that could affect performance.
Figure 7 shows the location of these additional LEDs.
Item
Description
A
Voltage Regulator LED (Red)
B
Standby power indicator LED (Green)
C
Processor LED (Red)
Figure 7. Locations of Indicator LEDs
Intel® Workstation Board WX58BP TPS Product Description
Revision 1.2
Intel order number: E65585-004
23
1.12.3 ENERGY STAR*
In 2007, the US Department of Energy and the US Environmental Protection Agency revised the
ENERGY STAR* requirements. Intel has worked directly with these two governmental agencies
to define the new requirements. Currently this Intel Workstation Board meets the new Category
C requirements when using the appropriate peripherals.
For information about ENERGY STAR requirements and recommended configurations, refer to:
http://www.intel.com/go/energystar.
Technical Reference Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
24
2. Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory
This board uses 16 GB of addressable system memory. Typically, the address space allocated
for PCI Conventional bus add-in cards, PCI Express* configuration space, BIOS (SPI Flash
device), and chipset overhead resides above the top of DRAM (total system memory). On a
system with 16 GB of system memory installed, it is not possible to use all of the installed
memory due to system address space being allocated for other system-critical functions. These
functions include the following:
1. BIOS/SPI Flash device (16 Mbit)
2. Local APIC (19 MB)
3. Direct Media Interface (40 MB)
4. Front side bus interrupts (17 MB)
5. PCI Express* configuration space (256 MB)
6. IOH base address registers PCI Express* ports (up to 256 MB)
7. Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express* add-in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the memory
mapped I/O logical address space. The board remaps physical memory from the top of usable
DRAM boundary to the 4 GB boundary to an equivalent-sized logical address range located just
above the 4 GB boundary. Figure 8 shows a schematic of the system memory map. You can
use all installed system memory when there is no overlap of system addresses.
Intel® Workstation Board WX58BP TPS Technical Reference
Revision 1.2
Intel order number: E65585-004
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Figure 8. Detailed System Memory Address Map
Technical Reference Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
26
2.1.2 Memory Map
Table 14 lists the system memory map.
Table 14. System Memory Map
Address Range (decimal)
Address Range (hex)
Size
Description
1024 K - 16777216 K
100000 - 3FFFFFFFF
16382 MB
Extended memory
960 K - 1024 K
F0000 - FFFFF
64 KB
Runtime BIOS
896 K - 960 K
E0000 - EFFFF
64 KB
Reserved
800 K - 896 K
C8000 - DFFFF
96 KB
Potential available high DOS
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
640 K - 800 K
A0000 - C7FFF
160 KB
Video memory and BIOS
639 K - 640 K
9FC00 - 9FFFF
1 KB
Extended BIOS data (movable by
memory manager software)
512 K - 639 K
80000 - 9FBFF
127 KB
Extended conventional memory
0 K - 512 K
00000 - 7FFFF
512 KB
Conventional memory
2.2 Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel and front panel
USB, and IEEE 1394a.
The other internal connectors and headers are not overcurrent protected and should connect only
to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these
connectors or headers to power devices external to the computer’s chassis. A fault in the load
presented by the external devices could cause damage to the computer, power cable, and external
devices themselves.
Furthermore, improper connection of USB or 1394 header single wire connectors may eventually
overload the overcurrent protection and cause damage to the board.
groups: Back panel I/O connectors
Component-side I/O connectors and headers (Section 2.2.2.2)
Intel® Workstation Board WX58BP TPS Technical Reference
Revision 1.2
Intel order number: E65585-004
27
2.2.1 Back Panel Connectors
Figure 9 shows the location of the back panel connectors for the board.
Item
Description
A
USB ports
B
USB ports
C
IEEE-1394a connector
D
USB ports
E
LAN
F
USB ports
G
Surround left/right channel audio out
H
Center channel and LFE (subwoofer) audio out
I
Audio line in
J
Line out/Headphone (Stereo)
K
Mic in
L
Digital audio out optical
Figure 9. Back Panel Connectors
Note: The back panel audio line out connector is designed to power headphones or amplified
speakers only. If passive (non-amplified) speakers are connected to this output, poor audio
quality results.
Technical Reference Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
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2.2.2 Component-side Connectors and Headers
Figure 10 shows the locations of the component-side connectors and headers.
Figure 10. Component-side Connectors and Headers
Table 15 lists the component-side connectors and headers identified in Figure 10.
Intel® Workstation Board WX58BP TPS Technical Reference
Revision 1.2
Intel order number: E65585-004
29
Table 15. Component-side Connectors and Headers Shown in Figure 10
Item
Description
A
Auxiliary fan header
B
PCI Express* x1 connector
C
PCI Express* x16 bus add-in card connector
D
Front panel audio header
E
PCI Conventional bus add-in card connector
F
PCI Express* x1 bus add-in card connector
G
PCI Express* x16 bus add-in card connector
H
PCI Express* x4 bus add-in card connector
I
Processor fan header
J
Rear fan header
K
Main power connector
L
Processor core power connector (2 X 4)
M
Chassis intrusion header
N
Front chassis fan header
O
Serial ATA connectors [6]
P
Front panel USB header
Q
Front panel USB header
R
IEEE 1394a front panel header
S
Auxiliary front panel power LED header
T
Front panel header
U
High Definition Audio Link header
V
S/PDIF connector
Technical Reference Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
30
2.2.2.1 Signal Tables for the Connectors and Headers
Table 16. HD Audio Link Header
Pin
Signal Name
Pin
Signal Name
1
BCLK
2
Ground
3
RST#
4
3.3 VCC
5
SYNC
6
Ground
7
SDO
8
3.3 VCC
9
SDI0
10
+12 V
11
SDI1
12
Key (no pin)
13
Aud RSVD
14
3.3 V STBY
15
Aud RSVD
16
Ground
Table 17. Front Panel Audio Header
Pin
Signal Name
Pin
Signal Name
1
[Port 2] Left channel
2
Ground
3
[Port 2] Right channel
4
PRESENCE# (Dongle present)
5
[Port 1] Right channel
6
[Port 1] SENSE_RETURN
7
SENSE_SEND (Jack detection)
8
Key (no pin)
9
[Port 2] Left channel
10
[Port 2] SENSE_RETURN
Table 18. Serial ATA Connectors
Pin
Signal Name
1
Ground
2
TXP
3
TXN
4
Ground
5
RXN
6
RXP
7
Ground
Intel® Workstation Board WX58BP TPS Technical Reference
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Intel order number: E65585-004
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Table 19. Chassis Intrusion Header
Pin
Signal Name
1
Intruder
2
Ground
Table 20. Front and Rear Chassis (3-Pin) Fan Headers
Pin
Signal Name
1
Control (Note)
2
+12 V
3
Tach
Note: These fan headers use voltage variance control for fan speed.
Table 21. Processor and Rear Chassis 2 (4-Pin) Fan Headers
Pin
Signal Name
1
Ground (Note)
2
+12 V
3
FAN_TACH
4
FAN_CONTROL
Note: These fan headers use Pulse Width Modulation control for fan speed.
2.2.2.2 Add-in Card Connectors
This board has the following add-in card connectors:
PCI Express* 2.0 x16: Two PCI Express* 2.0 x16 connectors supporting simultaneous
transfer speeds up to 8 GB/sec of peak bandwidth per direction and up to 16 GB/sec
concurrent bandwidth.
PCI Express* 2.0 x4: One PCI Express* 2.0 x4 connector. The x4 interface supports
simultaneous transfer speeds up to 250 MB/sec of peak bandwidth per direction and up
to 5 GB/sec concurrent bandwidth.
PCI Express* 1.1 x1: Two PCI Express* 1.1 x1 connectors. The x1 interface supports
simultaneous transfer speeds up to 250 MB/sec of peak bandwidth per direction and up
to 2 GB/sec concurrent bandwidth.
PCI Conventional (rev 2.3 compliant) bus: One PCI Conventional bus add-in card
connector. The SMBus is routed to the PCI Conventional bus connector. PCI
Conventional bus add-in cards with SMBus support can access sensor data and other
information residing on the board.
Note the following considerations for the PCI Conventional bus connector:
The PCI Conventional bus connector is bus master capable.
SMBus signals are routed to the PCI Conventional bus connector. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the
board. The specific SMBus signals are as follows:
o The SMBus clock line is connected to pin A40.
o The SMBus data line is connected to pin A41.
Technical Reference Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
32
2.2.2.3 Power Supply Connectors
The board has the following power supply connectors:
Main power A 2 x 12 connector. The board supports the use of ATX12V power
supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with
a 2 x 10 main power cable, attach that cable on the right-most pins of the main power
connector, leaving pins 11, 12, 23, and 24 unconnected.
Processor core power A 2 x 4 connector. This connector provides power directly to
the processor voltage regulator and must always be used. Failure to do so prevents the
board from booting.
CAUTION
If high power (75 W or greater) add-in cards are installed in either or both the Secondary PCI
Express* x16 and the PCI Express* x4 bus add-in card connectors, you must use the Auxiliary PCI
Express* graphics power connector. Failure to do so may cause damage to the board and the add-
in cards.
Table 22. Processor Core Power Connector
Pin
Signal Name
Pin
Signal Name
1
Ground
2
+12 V
3
Ground
4
+12 V
5
Ground
6
+12 V
7
Ground
8
+12 V
Table 23. Main Power Connector
Pin
Signal Name
Pin
Signal Name
1
+3.3 V
13
+3.3 V
2
+3.3 V
14
-12 V
3
Ground
15
Ground
4
+5 V
16
PS-ON# (power supply remote on/off)
5
Ground
17
Ground
6
+5 V
18
Ground
7
Ground
19
Ground
8
PWRGD (Power Good)
20
No connect
9
+5 V (Standby)
21
+5 V
10
+12 V
22
+5 V
11
+12 V (Note)
23
+5 V (Note)
12
2 x 12 connector detect (Note)
24
Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
For information about power supply considerations, refer to Section 2.5.1.
Intel® Workstation Board WX58BP TPS Technical Reference
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Intel order number: E65585-004
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2.2.2.4 Front Panel Header
This section describes the functions of the front panel header. Table 24 lists the signal names of
the front panel header. Figure 11 is a connection diagram for the front panel header.
Table 24. Front Panel Header
Pin
Signal
In/
Out
Description
Pin
Signal
In/
Out
Description
Hard Drive Activity LED
Power LED
1
HD_PWR
Out
Hard disk LED
pull-up to +5 V
2
HDR_BLNK_GR
N
Out
Front panel green
LED
3
HDA#
Out
Hard disk active
LED
4
HDR_BLNK_YE
L
Out
Front panel yellow
LED
Reset Switch
On/Off Switch
5
Ground
Ground
6
FPBUT_IN
In
Power switch
7
FP_RESET#
In
Reset switch
8
Ground
Ground
Power
Not Connected
9
+5 V
Power
10
N/C
Not connected
Figure 11. Connection Diagram for Front Panel Header
2.2.2.4.1 Hard Drive Activity LED Header
You can connect Pins 1 and 3 to an LED to provide a visual indicator that data is being read
from or written to a hard drive. Proper LED function requires one of the following:
A Serial ATA hard drive or optical drive connected to an onboard Serial ATA connector
A Parallel ATA IDE hard drive or optical drive connected to an onboard Parallel ATA IDE
connector
2.2.2.4.2 Reset Switch Header
You can connect Pins 5 and 7 to a momentary single pole, single throw (SPST) type switch that
is normally open. When the switch is closed, the board resets and runs the POST.
Technical Reference Intel® Workstation Board WX58BP TPS
Revision 1.2
Intel order number: E65585-004
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2.2.2.4.3 Power/Sleep LED Header
You can connect Pins 2 and 4 to a one- or two-color LED. Table 25 shows the possible states
for a one-color LED. Table 26 shows the possible states for a two-color LED.
Table 25. States for a One-Color Power LED
LED State
Description
Off
Power off/sleeping
Steady Green
Running
Table 26. States for a Two-Color Power LED
LED State
Description
Off
Power off
Steady Green
Running
Steady Yellow
Sleeping
Note: The colors listed in Table 25 and Table 26 are suggested colors only. Actual LED colors
are chassis-specific.
2.2.2.4.4 Power Switch Header
You can connect Pins 6 and 8 to a front panel momentary-contact power switch. The switch
must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on
or off. (The time requirement is due to internal debounce circuitry on the board.) You must wait
at least two seconds before the power supply recognizes another on/off signal.
Intel® Workstation Board WX58BP TPS Technical Reference
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Intel order number: E65585-004
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2.2.2.5 Front Panel USB Headers
Figure 12 is a connection diagram for the front panel USB headers.
INTEGRATOR’S NOTES
The +5 V DC power on the USB headers is fused.
Use only a front panel USB connector that conforms to the USB 2.0 specification for high-
speed USB devices.
Figure 12. Connection Diagram for Front Panel USB Headers
2.2.2.6 Front Panel IEEE 1394a Header
Figure 13 is a connection diagram for the IEEE 1394a header.
INTEGRATOR’S NOTES
The +12 V DC power on the IEEE 1394a header is fused.
The IEEE 1394a header provides one IEEE 1394a port.
Figure 13. Connection Diagram for IEEE 1394a Header
Technical Reference Intel® Workstation Board WX58BP TPS
Revision 1.2
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2.3 BIOS Setup Configuration Jumper Block
CAUTION
Do not move the jumper with the power on. Before changing a jumper setting, always turn off the
power and unplug the power cord from the computer. Otherwise, the board could be damaged.
Figure 14 shows the location of the jumper block. The 3-pin jumper block determines the BIOS
Table 27 describes the jumper settings for the three modes: normal,
configure, and recovery. When the jumper is set to configure mode and the computer is
powered-up, the BIOS compares the processor version and the microcode version in the BIOS
and reports if the two match.
Figure 14. Location of the BIOS Setup Configuration Jumper Block
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Table 27. BIOS Setup Configuration Jumper Settings
Function/Mode
Jumper Setting
Configuration
Normal
1-2
The BIOS uses current configuration information and
passwords for booting.
Configure
2-3
After the POST runs, Setup runs automatically. The
maintenance menu displays.
Note that this Configure mode is the only way to clear the
BIOS/CMOS settings. While in Configure mode, press F9
(restore defaults) to restore the BIOS/CMOS settings to their
default values.
Recovery
None
The BIOS attempts to recover the BIOS configuration. A
recovery CD or flash drive is required.
2.4 Mechanical Considerations
2.4.1 Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 15 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer
dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]. Location
of the I/O connectors and mounting holes are in compliance with the ATX specification.
Figure 15. Board Dimensions
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2.5 Electrical Considerations
2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate +5 V standby
current. Failure to do so can damage the power supply. The total amount of standby current
required depends on the wake devices supported and manufacturing options.
Additional power required depends on configurations selected by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
The potential relation between 3.3 VDC and +5 VDC power rails
The current capability of the +5 VSB line
All timing parameters
All voltage tolerances
For example, for a system consisting of a supported 130-W processor (Section 1.4 for a list of
supported processors), 1 GB DDR3 RAM, one high-end video card, one hard disk drive, one
optical drive, and all board peripherals enabled, the minimum recommended power supply is
460 W. Table 28 lists the recommended power supply current values.
Table 28. Recommended Power Supply Current Values
Output Voltage
3.3 V
5 V
12 V1
12 V2
-12 V
5 VSB
Current
22 A
20 A
16 A
16 A
0.3 A
1.5 A
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2.5.2 Fan Header Current Capability
CAUTION
You must connect the processor fan to the processor fan header—not to a chassis fan header.
Connecting the processor fan to a chassis fan header may result in onboard component damage
that will halt fan operation.
Table 29 lists the current capability of the fan headers.
Table 29. Fan Header Current Capability
Fan Header
Maximum Available Current
Processor fan
2.0 A
Front chassis fan
1.5 A
Rear chassis fan
1.5 A
Auxiliary rear chassis fan
2.0 A
2.5.3 Add-in Board Considerations
The board is designed to provide 2 A (average) of current for each add-in board from the +5 V
rail. The total +5 V current draw for add-in boards for a fully loaded board (all six expansion
slots filled) maximum current or 14 A in total.
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38o C at the processor fan inlet is a
requirement. Use a processor heatsink that provides omni-directional airflow to maintain required
airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board. All responsibility for
determining the adequacy of any thermal or system design remains solely with the reader. Intel
makes no warranties or representations that merely following the instructions presented in this
document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case temperature
and malfunction. For information about the maximum operating temperature, see the environmental
specifications in Section 2.8.
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CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so
may result in damage to the voltage regulator circuit. The processor voltage regulator area (Figure
16) can reach a temperature of up to 85°C in an open chassis.
Figure 16 shows the locations of the localized high temperature zones.
Item
Description
A
Processor voltage regulator area
B
Processor
C
Intel® 82X58 IOH
D
Intel® 82801IJR ICH10R
Figure 16. Localized High Temperature Zones
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Table 30 provides maximum case temperatures for the components sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to
cool the board.
Table 30. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel® 82X58 IOH
105o C (under bias)
Intel® 82801IJR (ICH10R)
105o C (under bias)
For information about processor datasheets and specification updates, refer to Section 1.3.
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2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is
used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is
84,330.82646 hours.
2.8 Environmental
Table 31 lists the environmental specifications for the board.
Table 31. Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-40 C to +70 C
Operating
0 C to +55 C
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged
Half sine 2 millisecond
Product Weight (pounds)
Free Fall (inches)
Velocity Change (inches/s²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged
5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Intel® Workstation Board WX58BP TPS Overview of BIOS Features
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3. Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS stored in the Serial Peripheral Interface Flash Memory (SPI
Flash) that you can update using a disk-based program. The SPI Flash contains the BIOS
Setup program, POST, PCI auto-configuration utility, LAN EEPROM information, and Plug and
Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision code.
The initial production BIOSs are identified as BPX5810J.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer is
powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and
reports if the two match.
You can use the BIOS Setup program to view and change the BIOS settings for the computer.
You access the BIOS Setup program by pressing the <F2> key after the Power-On Self-Test
(POST) memory test begins but before the operating system boot begins. The menu bar is
shown:
Note: The maintenance menu displays only when the board is in Configure mode. Section 2.3
shows how to put the board in Configure mode.
Table 32 lists the BIOS Setup program menu features.
Table 32. BIOS Setup Program Menu Bar
Main
Advanced
Performance
Security
Power
Boot
Exit
Displays
processor and
memory
configuration
Selects
system
options
Configures
ECC support
Sets
passwords
and
security
features
Configures
power
management
features and
power supply
controls
Selects
boot
options
Saves or
discards
changes to
Setup
program
options
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Table 33 lists the function keys available for menu screens.
Table 33. BIOS Setup Program Function Keys
BIOS Setup Program
Function Key
Description
< > or < >
Selects a different menu screen (moves the cursor left or right)
< > or < >
Selects an item (moves the cursor up or down)
<Tab>
Selects a field (not implemented)
<Enter>
Executes command or selects the submenu
<F9>
Load the default configuration values for the current menu
<F10>
Save the current values and exits the BIOS Setup program
<Esc>
Exits the menu
3.2 BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 16-Mbit (2048 KB) flash
memory device.
3.3 Resource Configuration
3.3.1 PCI Auto-configuration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in
cards. Auto-configuration lets a user insert or remove PCI cards without having to configure the
system. When a user turns on the system after adding a PCI card, the BIOS automatically
configures interrupts, I/O space, and other system resources. Any interrupts set to Available in
the Setup are considered to be available for use by the add-in card.
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3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers
in a managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates
for system components. The MIF database defines the data and provides the method for
accessing this information.
The BIOS enables applications such as third-party management software to use SMBIOS. The
BIOS stores and reports the following SMBIOS information:
BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS
information. The BIOS supports an SMBIOS table interface for such operating systems. Using
this support, an SMBIOS service-level application running on a non-Plug and Play operating
system can obtain the SMBIOS information. You can find additional board information in the
3.5 Legacy USB Support
drivers are not yet available. Legacy USB support is used to access the BIOS Setup program,
and to install an operating system that supports USB. By default, Legacy USB support is set to
Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB keyboards
and mice are recognized, which you can use to configure the operating system. (If
Legacy USB support was set to Disabled in the BIOS Setup program, keyboards and
mice are not recognized during this period.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system. Legacy USB support from the BIOS
is no longer used. You can access additional USB legacy feature options by using the
Intel® Integrator Toolkit.
To install an operating system that supports USB, verify Legacy USB support in the BIOS Setup
program is set to Enabled and follow the operatin
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3.6 BIOS Updates
You can update the BIOS using the following utility, which is available on the Intel website:
Intel® Flash Memory Update Utility: Requires booting from DOS. Using this utility, you can
update the BIOS from a file on a hard disk, USB drive (flash drive or USB hard drive), or CD-
ROM.
This utility verifies the updated BIOS matches the target system to prevent acciden tally installing
an incompatible BIOS.
3.6.1 Language Support
The BIOS Setup program and help messages are supported in US English. Additional
For details, check the Intel website.
3.6.2 Custom Splash Screen
During POST, an Intel® splash screen displays by default. You can augment this splash screen
with a custom splash screen. You can use the Intel®
create a custom splash screen.
Note: If you add a custom splash screen, it will share space with the Intel branded logo.
For information about…
Refer to
Intel® Integrator Toolkit
http://developer.intel.com/design/motherbd/software/itk/
3.7 BIOS Recovery
It is unlikely anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS
could be damaged. Table 34 lists the drives and media types you can and cannot use for BIOS
recovery. The BIOS recovery media does not need to be made bootable.
Table 34. Acceptable Drives/Media Types for BIOS Recovery
Media Type
Can be used for BIOS recovery?
CD-ROM drive connected to the Parallel ATA interface
Yes
CD-ROM drive connected to the Serial ATA interface
Yes
USB removable drive (a USB Flash Drive, for example)
Yes
USB diskette drive (with a 1.44 MB diskette)
No
USB hard disk drive
No
Legacy diskette drive (with a 1.44 MB diskette) connected to the
Legacy diskette drive interface
No
For information about BIOS recovery, refer to:
http://www.intel.com/support/motherboards/desktop/sb/cs-023360.htm
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3.8 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB
drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to
be the first boot device; the hard drive second; and the ATAPI CD-ROM third. If enabled, the
last default boot device is the network.
3.8.1 CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format
specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a
boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD
in the CD-ROM drive, the system attempts to boot from the next defined drive.
3.8.2 Network Boot
You can select the network as a boot device. This selection allows booting from the onboard
LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To use this
key during POST, you must set the User Access Level in the BIOS Setup program's Security
menu to Full.
3.8.3 Booting Without Attached Devices
For use in embedded applications, the BIOS was designed so that after passing the POST, the
operating system loader is invoked even if the following devices are not present:
Video adapter
Keyboard
Mouse
3.8.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to display. This menu
Priority Submenu). Table 35 lists the boot device menu options.
Table 35. Boot Device Menu Options
Boot Device Menu Function Keys
Description
< > or < >
Selects a default boot device
<Enter>
Exits the menu, saves changes, and boots from the selected
device
<Esc>
Exits the menu without saving changes
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3.9 Adjusting Boot Speed
These factors affect system boot speed:
Selecting and configuring peripherals properly
Optimized BIOS boot parameters
3.9.1 Peripheral Selection and Configuration
The following techniques help improve system boot speed:
-
seconds that minimize hard drive startup delays.
Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints,
or mode changes in POST. These features may add time to the boot process.
Try different monitors. Some monitors initialize and communicate with the BIOS more
quickly, which enables the system to boot more quickly.
3.9.2 BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
In the Boot Menu, set the hard disk drive as the first boot device. As a result, the POST
does not first seek a diskette drive, which saves about one second from the POST
execution time.
In the Peripheral Configuration submenu, disable the LAN device if it will not be used.
This can reduce up to four seconds of option ROM boot time.
Note: It is possible to optimize the boot process to the point where the system boots so quickly
that you do not see the Intel logo screen (or a custom logo splash screen). Monitors and hard
disk drives with minimum initialization times can also contribute to a boot time that might be so
fast that you cannot see necessary logo screens and POST messages. This boot time may be
so fast that some drives might be not be initialized at all. If this condition occurs, it is possible to
introduce a programmable delay ranging from zero to 30 seconds using 5-second increments
(using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration
Submenu of the BIOS Setup program).
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3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who
can boot the computer. You can set the supervisor password and a user password for the BIOS
Setup program and for booting the computer, with the following restrictions:
Supervisor Mode: The supervisor password gives unrestricted access to view and
change all the Setup options in the BIOS Setup program.
User Mode: The user password gives restricted access to view and change Setup
options in the BIOS Setup program.
If only the supervisor password is set, pressing the <Enter> key at the password prompt
of the BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the s upervisor
password or the user password to access Setup. Users have access to Setup respective
to which password is entered.
Setting the user password restricts who can boot the computer. Before the computer is
booted, the password prompt displays. If only the supervisor password is set, the
computer boots without asking for a password. If both passwords are set, the user can
enter either password to boot the computer.
For enhanced security, use different passwords for the supervisor and user passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters
in length.
Table 36 shows the effects of setting the supervisor password and user password. This table is
for reference only and does not display on the screen.
Table 36. Supervisor and User Password Functions
Password Set
Supervisor Mode
User Mode
Setup Options
Password to
Enter Setup
Password
During Boot
Neither
Can change all
options (Note)
Can change all
options (Note)
None
None
None
Supervisor
only
Can change all
options
Can change a
limited number
of options
Supervisor Password
Supervisor
None
User only
N/A
Can change all
options
Enter Password
Clear User Password
User
User
Supervisor
and user set
Can change all
options
Can change a
limited number
of options
Supervisor Password
Enter Password
Supervisor or
user
Supervisor or
user
Note: If no password is set, any user can change all Setup options.
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4. Error Messages and Beep Codes
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information during POST.
For information about the location of the onboard speaker, refer Figure 1.
4.2 BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS displays an error message
describing the problem (Table 37).
Table 37. Beep Codes
Type
Pattern
Frequency
Memory error
Three long beeps
1280 Hz
Thermal warning
Four alternating beeps:
High tone, low tone, high tone, low tone
High tone: 2000 Hz
Low tone: 1600 Hz
4.3 BIOS Error Messages
Table 38 lists the error messages and provides a brief description of each.
Table 38. BIOS Error Messages
Error Message
Explanation
CMOS Battery Low
The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad
The CMOS checksum is incorrect. CMOS memory may be corrupted. Run
Setup to reset values.
Memory Size Decreased
Memory size decreased since the last boot. If no memory was removed, then
the memory may be bad.
No Boot Device Available
System did not find a device to boot.
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4.4 Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h.
If the POST fails, execution stops and the last POST code generated is left at port 80h. This
code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The
POST card can decode the port and display the contents on a medium such as a seven-
segment display.
Note: You must install the POST card in PCI bus connector 1.
The following tables provide information about the POST codes generated by the BIOS:
Table 39 lists the Port 80h POST code ranges.
Table 40 lists the Port 80h POST codes themselves.
Table 41 lists the Port 80h POST sequence.
Note: In the tables listed previously, all POST codes and range values are listed in
hexadecimal.
Table 39. Port 80h POST Code Ranges
Range
Category/Subsystem
00 0F
Debug codes: Can be used by any PEIM/driver for debug.
10 1F
Host Processors: 1F is an unrecoverable CPU error.
20 2F
Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 3F
Recovery: 3F indicated recovery failure.
40 4F
Reserved for future use.
50 5F
I/O Buses: PCI, USB, ATA, and so forth. 5F is an unrecoverable error. Start with PCI.
60 6F
Reserved for future use (for new buses).
70 7F
Output Devices: All output consoles. 7F is an unrecoverable error.
80 8F
Reserved for future use (new output console codes).
90 9F
Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 AF
Reserved for future use (new input console codes).
B0 BF
Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 CF
Reserved for future use.
D0 DF
Boot device selection.
E0 FF
E0 EE: Miscellaneous codes. See Table 40.
EF: boot/S3 resume failure.
F0 FF: FF processor exception.
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Table 40. Port 80h POST Codes
POST Code
Description of POST Operation
Host Processor
10
Power-on initialization of the host processor (Boot Strap Processor)
11
Host processor cache initialization (including APs)
12
Starting Application processor initialization
13
SMM initialization
Chipset
21
Initializing a chipset component
Memory
22
Reading SPD from memory DIMMs
23
Detecting presence of memory DIMMs
24
Programming timing parameters in the memory controller and the DIMMs
25
Configuring memory
26
Optimizing memory settings
27
Initializing memory, such as ECC init
29
Memory testing completed
PCI Bus
50
Enumerating PCI buses
51
Allocating resources to PCI bus
52
Hot Plug PCI controller initialization
53 57
Reserved for PCI Bus
USB
58
Resetting USB bus
59
Reserved for USB
ATA/ATAPI/SATA
5A
Resetting PATA/SATA bus and all devices
5B
Reserved for ATA
SMBus
5C
Resetting SMBus
5D
Reserved for SMBus
Local Console
70
Resetting the VGA controller
71
Disabling the VGA controller
72
Enabling the VGA controller
Remote Console
78
Resetting the console controller
79
Disabling the console controller
7A
Enabling the console controller
Keyboard (USB)
90
Resetting keyboard
91
Disabling keyboard
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POST Code
Description of POST Operation
92
Detecting presence of keyboard
93
Enabling the keyboard
94
Clearing keyboard input buffer
95
Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (USB)
98
Resetting mouse
99
Disabling mouse
9A
Detecting presence of mouse
9B
Enabling mouse
Fixed Media
B0
Resetting fixed media
B1
Disabling fixed media
B2
Detecting presence of a fixed media (IDE hard drive detection etc.)
B3
Enabling/configuring a fixed media
BDS
Dy
Trying boot selection y (y=0 to 15)
PEI Core
E0
Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2
Permanent memory found
E1, E3
Reserved for PEI/PEIMs
DXE Core
E4
Entered DXE phase
E5
Started dispatching drivers
E6
Started connecting drivers
DXE Drivers
E7
Waiting for user input
E8
Checking password
E9
Entering BIOS setup
EB
Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
F4
Entering Sleep state
F5
Exiting Sleep state
F8
EFI boot service ExitBootServices ( ) was called
F9
EFI runtime service SetVirtualAddressMap ( ) was called
FA
EFI runtime service ResetSystem ( ) was called
PEIMs/Recovery
30
Crisis Recovery has initiated per user request
31
Crisis Recovery has initiated by software (corrupt flash)
34
Loading recovery capsule
35
Handing off control to the recovery capsule
3F
Unable to recover
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Table 41. Typical Port 80h POST Sequence
POST Code
Description
21
Initializing a chipset component
22
Reading SPD from memory DIMMs
23
Detecting presence of memory DIMMs
25
Configuring memory
28
Testing memory
34
Loading recovery capsule
E4
Entered DXE phase
12
Starting application processor initialization
13
SMM initialization
50
Enumerating PCI buses
51
Allocating resourced to PCI bus
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
Clearing keyboard input buffer
95
Keyboard Self Test
EB
Calling Video BIOS
58
Resetting USB bus
5A
Resetting PATA/SATA bus and all devices
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
Clearing keyboard input buffer
5A
Resetting PATA/SATA bus and all devices
28
Testing memory
90
Resetting keyboard
94
Clearing keyboard input buffer
E7
Waiting for user input
01
INT 19
00
Ready to boot
Intel® Workstation Board WX58BP TPS Regulatory Compliance and Battery Disposal Information
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5. Regulatory Compliance and Battery Disposal
Information
5.1 Regulatory Compliance
This section contains the following regulatory compliance information for Intel® Workstation
Board WX58BP:
Safety standards
European Union Declaration of Conformity statement
Product Ecology statements
Electromagnetic Compatibility (EMC) standards
Product certification markings
5.1.1 Safety Standards
Intel® Workstation Board WX58BP complies with the safety standards stated in Table 42 when
correctly installed in a compatible host system.
Table 42. Safety Standards
Standard
Title
CSA/UL 60950-1, First Edition
Information Technology Equipment Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second
Edition
Information Technology Equipment Safety - Part 1: General
Requirements (European Union)
IEC 60950-1:2005, Second
Edition
Information Technology Equipment Safety - Part 1: General
Requirements (International)
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5.1.2 European Union Declaration of Conformity Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel® Workstation
Board WX58BP is in conformity with all applicable essential requirements necessary for CE
marking, following the provisions of the European Council Directive 2004/108/EC (EMC
Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for distribution within all
member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and 2006/95/EC.
Čeština 2004/108/EC a 2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC &
2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC &
2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC kehtestatud
nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC &
2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC & 2006/95/EC.
Ελληνικά 2004/108/EC
2006/95/EC.
Magyar
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 2004/108/EC &
2006/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC & 2006/95/EC.
Latviešu
Lietuvių /108/EC ir 2006/95/EC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC u
2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC &
2006/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC &
2006/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC a
2006/95/EC.
Slovenščina 2004/108/EC in 2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC & 2006/95/EC.
Türkçe
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5.1.3 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and
regulations.
5.1.3.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder
on the printed wiring board assembly.
5.1.3.2 Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the Intel
used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this
program, including the scope of covered products, available locations, shipping instructions,
terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点
作恰当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-
Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten
ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling
zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren
Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
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Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el
programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los
productos Intel devuelvan los productos usados en los lugares seleccionados para su
correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del
programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de
envío, términos y condiciones, etc.
Français
le programme Intel Product Recycling Program (Programme de recyclage des produits Intel)
pour permettre aux consommateurs de produits Intel de recycler les produits usés en les
retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus
sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions
d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/inte
l/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah
melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit
produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan
semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir
program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan
penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa
de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel
usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para obter os
detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis,
as instruções de envio, os termos e condições, etc.
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Russian
-http://www.intel.com/intel/other/ehs/product_ecology
Türkçe
Intel, çevre sorumlulu
Bu programtalimatlarkaytlar ve lar v.s dahil
bütün ayrntlarhttp://www.intel.com/intel/other/ehs/product_ecology
Web sayfas
5.1.3.3 Lead Free Workstation Board
This Intel® Workstation Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six materials. One
of the six restricted materials is lead.
This Intel® Workstation Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance and/or
reliability. This Intel® Workstation B-
The board substrate and the solder connections from the board to the components (second-
level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it requires
different product marking and controlled substance information. The required mark shows the
Environmental Friendly Usage Period (EFUP). The EFUP is defined as the number of years for
which controlled listed substances will not leak or chemically deteriorate while in the product.
-Free 2nd
on the board and accompanying collateral.
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Table 43. Lead-Free Board Markings
Description
Mark
Lead-Free 2nd Level Interconnect:
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the board substrate and
the solder connections from the
board to the components (second-
level interconnect) is not greater
than 0.1% by weight (1000 ppm).
or
or
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5.1.4 EMC Regulations
Intel® Workstation Board WX58BP complies with the EMC regulations stated in Table 44 when
correctly installed in a compatible host system.
Table 44. EMC Regulations
Regulation
Title
FCC 47 CFR Part 15,
Subpart B
Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio
Frequency Devices. (USA)
ICES-003 Issue 4
(Class B)
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022:2006
(Class B)
Limits and methods of measurement of Radio Interference Characteristics of
Information Technology Equipment. (European Union)
EN55024:1998
(Class B)
Information Technology Equipment Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022:2006
(Class B)
Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22:2005
+A1:2005 +A2:2006
(Class B)
Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
CISPR 24:1997
+A1:2001 +A2:2002
(Class B)
Information Technology Equipment Immunity Characteristics Limits and
Methods of Measurement. (International)
VCCI V-3/2007.04,
V-4/2007.04, Class B
Voluntary Control for Interference by Information Technology Equipment.
(Japan)
Japanese Kanji statement translation: this is a Class B product based on the standard of the
Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If
this is used near a radio or television receiver in a domestic environment, it may cause radio
interference. Install and use the equipment according to the instruction manual.
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Korean Class B statement translation: this is household equipment that is certified to comply
with EMC requirements. You may use this equipment in residential environments and other non-
residential environments.
5.1.5 Product Certification Markings (Board Level)
Intel® Workstation Board WX58BP has the product certification markings shown in Table 45:
Table 45. Product Certification Markings
Description
Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel® boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes Intel
name and WX58BP model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive and
Low Voltage directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum
Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code
number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark. Includes
adjacent MIC certification number: CPU-WX58BP (B)
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes
adjacent Intel company number, D33025.
Consists of a unique UL
V-0
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Boards and associated collateral. The color of the
mark may vary depending upon the application. The Environmental Friendly
Usage Period (EFUP) for Intel Boards has been determined to be 10 years.
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5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør
om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse
med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des
Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
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PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚ CIAROŽ ZNAŚ Ć
, .
, , .
.
UPOZORNÌNÍ
Je-
Π ρ ο σ ο χ ή
VIGYAZAT
ípusú telepre cseréli, az felrobbanhat. A telepeket
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AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻ ENIE
PRECAUŢ IE
Risc de explo
В Н И М А Н И Е
UPOZORNENIE
súlade s miestnymi pre
POZOR
okoljevarstvenimi predpisi.
UYARI
.
OС Т О Р О Г А
, .
, .
, .
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Intel® Workstation Board WX58BP TPS Glossary
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Glossary
This appendix contains important terms used in the preceding chapters. For ease of use,
Acronyms are then entered in their respective place, with non-acronyms following.
Term
Definition
ACPI
Advanced Configuration and Power Interface
AP
Application Processor
APIC
Advanced Programmable Interrupt Control
ASIC
Application Specific Integrated Circuit
BIOS
Basic Input/Output System
BIST
Built-In Self Test
BMC
Baseboard Management Controller
Bridge
Circuitry connecting one computer bus to another, allowing an agent on one to access the other
BSP
Bootstrap Processor
byte
8-bit quantity.
CBC
Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis.
CEK
Common Enabling Kit
CHAP
Challenge Handshake Authentication Protocol
CMOS
In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the server board.
DPC
Direct Platform Control
EEPROM
Electrically Erasable Programmable Read-Only Memory
EHCI
Enhanced Host Controller Interface
EMP
Emergency Management Port
EPS
External Product Specification
FMB
Flexible Mother Board
FMC
Flex Management Connector
FMM
Flex Management Module
FRB
Fault Resilient Booting
FRU
Field Replaceable Unit
FSB
Front Side Bus
GB
1024MB
GPIO
General Purpose I/O
GTL
Gunning Transceiver Logic
HSC
Hot-Swap Controller
Hz
Hertz (1 cycle/second)
I2C
Inter-Integrated Circuit Bus
IA
Intel® Architecture
IBF
Input Buffer
ICH
I/O Controller Hub
ICMB
Intelligent Chassis Management Bus
IERR
Internal Error
IFB
I/O and Firmware Bridge
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Term
Definition
INTR
Interrupt
IP
Internet Protocol
IPMB
Intelligent Platform Management Bus
IPMI
Intelligent Platform Management Interface
IR
Infrared
ITP
In-Target Probe
KB
1024 bytes
KCS
Keyboard Controller Style
LAN
Local Area Network
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LPC
Low Pin Count
LUN
Logical Unit Number
MAC
Media Access Control
MB
1024KB
mBMC
National Semiconductor© PC87431x mini BMC
MCH
Memory Controller Hub
MD2
Message Digest 2 Hashing Algorithm
MD5
Message Digest 5 Hashing Algorithm Higher Security
ms
milliseconds
MTTR
Memory Tpe Range Register
Mux
Multiplexor
NIC
Network Interface Controller
NMI
Nonmaskable Interrupt
OBF
Output Buffer
OEM
Original Equipment Manufacturer
Ohm
Unit of electrical resistance
PEF
Platform Event Filtering
PEP
Platform Event Paging
PIA
Platform Information Area (This feature configures the firmware for the platform hardware)
PLD
Programmable Logic Device
PMI
Platform Management Interrupt
POST
Power-On Self Test
PSMI
Power Supply Management Interface
PWM
Pulse-Width Modulation
RAM
Random Access Memory
RASUM
Reliability, Availability, Serviceability, Usability, and Manageability
RISC
Reduced Instruction Set Computing
ROM
Read Only Memory
RTC
Real-Time Clock (Component of ICH peripheral chip on the server board)
SDR
Sensor Data Record
SECC
Single Edge Connector Cartridge
SEEPROM
Serial Electrically Erasable Programmable Read-Only Memory
SEL
System Event Log
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Term
Definition
SIO
Server Input/Output
SMI
Server Management Interrupt (SMI is the highest priority nonmaskable interrupt)
SMM
Server Management Mode
SMS
Server Management Software
SNMP
Simple Network Management Protocol
TBD
To Be Determined
TIM
Thermal Interface Material
UART
Universal Asynchronous Receiver/Transmitter
UDP
User Datagram Protocol
UHCI
Universal Host Controller Interface
UTC
Universal time coordinare
VID
Voltage Identification
VRD
Voltage Regulator Down
Word
16-bit quantity
ZIF
Zero Insertion Force
