Low Distortion, 1.5 W Audio Power Amplifier SSM2211 Data Sheet FEATURES FUNCTIONAL BLOCK DIAGRAM 1.5 W output with THD + N < 1% Differential bridge-tied load output Single-supply operation: 2.7 V to 5.5 V Functions down to 1.75 V Wide bandwidth: 4 MHz Highly stable phase margin: >80 Low distortion: 0.2% THD + N at 1 W output Excellent power supply rejection IN- VOUTA IN+ VOUTB BYPASS SHUTDOWN Portable computers Personal wireless communicators Hands-free telephones Speaker phones Intercoms Musical toys and talking games BIAS SSM2211 V- (GND) 00358-001 APPLICATIONS Figure 1. GENERAL DESCRIPTION The SSM22111 is a high performance audio amplifier that delivers 1 W rms of low distortion audio power into a bridgeconnected 8 speaker load (or 1.5 W rms into a 4 load). The SSM2211 operates over a wide temperature range and is specified for single-supply voltages between 2.7 V and 5.5 V. When operating from batteries, it continues to operate down to 1.75 V. This makes the SSM2211 the best choice for unregulated applications, such as toys and games. Featuring a 4 MHz bandwidth and distortion below 0.2% total harmonic distortion plus noise (THD + N) at 1 W, superior performance is delivered at higher power or lower speaker load impedance than competitive units. Furthermore, when the ambient temperature is at 25C, THD + N < 1%, and VS = 5 V on a 4-layer printed circuit board (PCB), the SSM2211 delivers a 1.5 W output. 1 The low differential dc output voltage results in negligible losses in the speaker winding and makes high value dc blocking capacitors unnecessary. The battery life is extended by using shutdown mode, which typically reduces quiescent current drain to 100 nA. The SSM2211 is designed to operate over the -40C to +85C temperature range. The SSM2211 is available in 8-lead SOIC (narrow body) and LFCSP (lead frame chip scale) surfacemount packages. The advanced mechanical packaging of the LFCSP models ensures lower chip temperature and enhanced performance relative to standard packaging options. Applications include personal portable computers, hands-free telephones and transceivers, talking toys, intercom systems, and other low voltage audio systems requiring 1 W output power. Protected by U.S. Patent No. 5,519,576. Rev. G Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. 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Technical Support www.analog.com SSM2211 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Bridged Output vs. Single-Ended Output Configurations ... 16 Applications ....................................................................................... 1 Speaker Efficiency and Loudness ............................................. 16 Functional Block Diagram .............................................................. 1 Power Dissipation....................................................................... 16 General Description ......................................................................... 1 Output Voltage Headroom........................................................ 18 Revision History ............................................................................... 2 Automatic Shutdown-Sensing Circuit ..................................... 18 Specifications..................................................................................... 4 Shutdown-Circuit Design Example ......................................... 19 Absolute Maximum Ratings ............................................................ 6 Start-Up Popping Noise............................................................. 19 Thermal Resistance ...................................................................... 6 SSM2211 Amplifier Design Example .................................. 19 ESD Caution .................................................................................. 6 Single-Ended Applications ........................................................ 20 Pin Configurations and Function Descriptions ........................... 7 Driving Two Speakers Single-Endedly .................................... 20 Typical Performance Characteristics ............................................. 8 LFCSP PCB Considerations ...................................................... 21 Theory of Operation ...................................................................... 15 Outline Dimensions ....................................................................... 22 Thermal Performance--LFCSP ................................................ 15 Ordering Guide .......................................................................... 22 Applications Information .............................................................. 16 REVISION HISTORY 5/16--Rev. F to Rev. G Changed Electrical Characteristics Section Heading to Specifications Section Heading....................................................... 4 Changes to Table 5 ............................................................................ 6 Changes to Figure 3 .......................................................................... 7 Changed Product Overview Section Heading to Theory of Operation Section Heading ........................................................... 15 Changed Typical Applications Section Heading to Applications Information Section Heading ....................................................... 16 Updated Outline Dimensions ....................................................... 22 Changes to Ordering Guide .......................................................... 22 Changes to Driving Two Speakers Single Endedly Section ...... 20 Changes to Figure 50...................................................................... 20 Changes to Evaluation Board Section.......................................... 20 Changes to Figure 51...................................................................... 20 Changes to Ordering Guide .......................................................... 22 12/13--Rev. E to Rev. F Changes to Table 5 ............................................................................ 5 Added Exposed Pad Notation, Pin Configurations and Function Descriptions Section ........................................................................ 6 Deleted Evaluation Board Section ................................................ 20 Updated Outline Dimensions ....................................................... 21 Changes to Ordering Guide .......................................................... 22 11/06--Rev. C to Rev. D Updated Format .................................................................. Universal Changes to General Description .....................................................1 Changes to Electrical Characteristics .............................................3 Changes to Absolute Maximum Ratings ........................................5 Added Table 6 ....................................................................................6 Changes to Figure 32...................................................................... 11 Changes to the Product Overview Section ................................. 14 Changes to the Output Voltage Headroom Section................... 17 Changes to the Start-Up Popping Noise Section........................ 18 Changes to the Evaluation Board Section ................................... 20 Updated Outline Dimensions ....................................................... 21 Changes to Ordering Guide .......................................................... 21 4/08--Rev. D to Rev. E Changes to Features.......................................................................... 1 Changes to General Description .................................................... 1 Changes to Supply Current in Table 1 and Table 2 ...................... 3 Changes to Supply Current in Table 3 ........................................... 4 Changes to Absolute Maximum Ratings ....................................... 5 Changes to Figure 41 ...................................................................... 14 Changes to Equation 7, Equation 8, and Equation 10 ............... 16 Changes to Figure 47 ...................................................................... 17 Changes to Automatic Shutdown-Sensing Circuit Section ...... 18 Changes to SSM2211Amplifier Design Example Section ......... 19 10/04--Rev. B to Rev. C Updated Format .................................................................. Universal Changes to General Description .....................................................1 Changes to Table 5.............................................................................4 Deleted Thermal Performance--SOIC Section ...........................8 Changes to Figure 31...................................................................... 10 Changes to Figure 40...................................................................... 12 Changes to Thermal Performance--LFCSP Section ................. 13 Deleted Figure 52, Renumbered Successive Figures .................. 14 Deleted Printed Circuit Board Layout--SOIC Section ............. 14 Changes to Output Voltage Headroom Section ......................... 16 Rev. G | Page 2 of 24 Data Sheet SSM2211 Changes to Start-Up Popping Noise Section ...............................17 Changes to Ordering Guide ...........................................................20 10/02--Rev. A to Rev. B Deleted 8-Lead PDIP ......................................................... Universal Updated Outline Dimensions ........................................................15 5/02--Rev. 0 to Rev. A Edits to General Description ........................................................... 1 Edits to Package Type ....................................................................... 3 Edits to Ordering Guide ................................................................... 3 Edits to Product Overview............................................................... 8 Edits to Printed Circuit Board Layout Considerations .............. 13 Added section Printed Circuit Board Layout Considerations--LFCSP ................................................................ 14 Rev. G | Page 3 of 24 SSM2211 Data Sheet SPECIFICATIONS VDD = 5.0 V, TA = 25C, RL = 8 , CB = 0.1 F, VCM = VDD/2, unless otherwise noted. Table 1. Parameter GENERAL CHARACTERISTICS Differential Output Offset Voltage Output Impedance SHUTDOWN CONTROL Input Voltage High Input Voltage Low POWER SUPPLY Power Supply Rejection Ratio Supply Current Supply Current, Shutdown Mode DYNAMIC PERFORMANCE Gain Bandwidth Product Phase Margin AUDIO PERFORMANCE Total Harmonic Distortion Total Harmonic Distortion Voltage Noise Density Symbol Conditions VOOS ZOUT AVD = 2, -40C TA +85C VIH VIL ISY = <100 mA ISY = normal PSRR ISY ISD VS = 4.75 V to 5.25 V VOUTA = VOUTB = 2.5 V, -40C TA +85C Pin 1 = VDD (see Figure 32), -40C TA +85C Min Max Unit 4 0.1 50 mV 3.0 66 9.5 0.1 GBP M THD + N THD + N en Typ P = 0.5 W into 8 , f = 1 kHz P = 1.0 W into 8 , f = 1 kHz f = 1 kHz 1.3 V V 20 1 dB mA A 4 86 MHz Degrees 0.15 0.2 85 % % nVHz VDD = 3.3 V, TA = 25C, RL = 8 , CB = 0.1 F, VCM = VDD/2, unless otherwise noted. Table 2. Parameter GENERAL CHARACTERISTICS Differential Output Offset Voltage Output Impedance SHUTDOWN CONTROL Input Voltage High Input Voltage Low POWER SUPPLY Supply Current Supply Current, Shutdown Mode AUDIO PERFORMANCE Total Harmonic Distortion Symbol Conditions VOOS ZOUT AVD = 2, -40C TA +85C VIH VIL ISY = <100 A ISY = normal ISY ISD VOUTA = VOUTB = 1.65 V, -40C TA +85C Pin 1 = VDD (see Figure 32), -40C TA +85C 5.2 0.1 THD + N P = 0.35 W into 8 , f = 1 kHz 0.1 Rev. G | Page 4 of 24 Min Typ Max Unit 5 0.1 50 mV 1.7 1 V V 20 1 mA A % Data Sheet SSM2211 VDD = 2.7 V, TA = 25C, RL = 8 , CB = 0.1 F, VCM = VDD/2, unless otherwise noted. Table 3. Parameter GENERAL CHARACTERISTICS Differential Output Offset Voltage Output Impedance SHUTDOWN CONTROL Input Voltage High Input Voltage Low POWER SUPPLY Supply Current Supply Current, Shutdown Mode AUDIO PERFORMANCE Total Harmonic Distortion Symbol Conditions VOOS ZOUT AVD = 2 VIH VIL ISY = <100 mA ISY = normal ISY ISD VOUTA = VOUTB = 1.35 V, -40C TA +85C Pin 1 = VDD (see Figure 32), -40C TA +85C 4.2 0.1 THD + N P = 0.25 W into 8 , f = 1 kHz 0.1 Rev. G | Page 5 of 24 Min Typ Max Unit 5 0.1 50 mV 1.5 0.8 V V 20 1 mA A % SSM2211 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Absolute maximum ratings apply at TA = 25C, unless otherwise noted. JA is specified for the worst case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Parameter Supply Voltage Input Voltage Common-Mode Input Voltage ESD Susceptibility Storage Temperature Range Operating Temperature Range Junction Temperature Range Lead Temperature, Soldering (60 sec) Rating 6V VDD VDD 2000 V -65C to +150C -40C to +85C -65C to +165C 300C Table 5. Thermal Resistance Package Type 8-Lead LFCSP (CP-Suffix)1 8-Lead SOIC_N (S-Suffix)2 1 2 JA 50 121 JC 75 43 Unit C/W C/W For the LFCSP, JA is measured with exposed lead frame soldered to the PCB. For the SOIC_N, JA is measured with the device soldered to a 4-layer PCB. ESD CAUTION Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. G | Page 6 of 24 Data Sheet SSM2211 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS SHUTDOWN 1 BYPASS 2 SSM2211 IN+ 3 8 VOUTB 7 V- 6 V+ TOP VIEW (Not to Scale) IN- 4 5 VOUTA IN+ 3 IN- 4 00358-002 SHUTDOWN 1 TOP VIEW (Not to Scale) 7 V- 6 V+ 5 VOUTA Figure 3. 8-Lead LFCSP Pin Configuration (CP-8-13) Table 6. Pin Function Descriptions Mnemonic SHUTDOWN BYPASS IN+ IN- VOUTA V+ V- VOUTB EPAD SSM2211 NOTES 1. CONNECT THE EXPOSED PAD TO V-. Figure 2. 8-Lead SOIC_N Pin Configuration (R-8) Pin No. 1 2 3 4 5 6 7 8 8 VOUTB 00358-003 BYPASS 2 Description Shutdown Enable. Bypass Capacitor. Noninverting Input. Inverting Input. Output A. Positive Supply. Negative Supply. Output B. Exposed Pad. Connect the exposed pad to V-. Rev. G | Page 7 of 24 SSM2211 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 10 10 TA = 25C VDD = 5V AVD = 2 (BTL) RL = 8 PL = 500mW TA = 25C VDD = 5V AVD = 2 (BTL) RL = 8 PL = 1W CB = 0 CB = 0 1 THD + N (%) THD + N (%) 1 CB = 0.1F CB = 1F 0.1 CB = 0.1F 0.01 20 100 1k 10k CB = 1F 00358-007 00358-004 0.1 0.01 20k 20 100 1k FREQUENCY (Hz) FREQUENCY (Hz) Figure 4. THD + N vs. Frequency Figure 7. THD + N vs. Frequency 10k 20k 10k 20k 10k 20k 10 10 CB = 0 CB = 0 THD + N (%) 0.1 00358-005 TA = 25C VDD = 5V AVD = 10 (BTL) RL = 8 PL = 500mW 0.01 20 CB = 1F 100 1k 10k TA = 25C VDD = 5V AVD = 10 (BTL) RL = 8 PL = 1W 0.01 20 20k 100 FREQUENCY (Hz) Figure 5. THD + N vs. Frequency Figure 8. THD + N vs. Frequency 10 10 CB = 0.1F CB = 0.1F 1 THD + N (%) THD + N (%) 1 CB = 1F 0.01 20 CB = 1F 0.1 TA = 25C VDD = 5V AVD = 20 (BTL) RL = 8 PL = 500mW 100 00358-006 0.1 1k FREQUENCY (Hz) 1k 10k 20k 0.01 TA = 25C VDD = 5V AVD = 20 (BTL) RL = 8 PL = 1W 20 100 00358-009 THD + N (%) CB = 1F 0.1 CB = 0.1F 1 00358-008 CB = 0.1F 1 1k FREQUENCY (Hz) FREQUENCY (Hz) Figure 6. THD + N vs. Frequency Figure 9. THD + N vs. Frequency Rev. G | Page 8 of 24 Data Sheet 10 SSM2211 10 TA = 25C VDD = 5V AVD = 2 (BTL) RL = 8 FREQUENCY = 20Hz CB = 0.1F TA = 25C VDD = 3.3V AVD = 2 (BTL) RL = 8 PL = 350mW 1 CB = 0 THD + N (%) THD + N (%) 1 0.1 CB = 0.1F 0.1 1 00358-013 0.01 2 20 FREQUENCY (Hz) Figure 10. THD + N vs. POUTPUT Figure 13. THD + N vs. Frequency 10k 20k 10k 20k CB = 0.1F 1 THD + N (%) THD + N (%) CB = 1F 0.1 00358-011 0.1 0.1 1 TA = 25C VDD = 3.3V AVD = 10 (BTL) RL = 8 PL = 350mW 0.01 2 20 100 1k POUTPUT (W) FREQUENCY (Hz) Figure 11. THD + N vs. POUTPUT Figure 14. THD + N vs. Frequency 10 TA = 25C VDD = 5V AVD = 2 (BTL) RL = 8 FREQUENCY = 20kHz CB = 0.1F CB = 0.1F 1 THD + N (%) THD + N (%) 1 CB = 1F 0.1 00358-012 0.1 0.01 20n 20k CB = 0 1 10 10k 10 TA = 25C VDD = 5V AVD = 2 (BTL) RL = 8 FREQUENCY = 1kHz CB = 0.1F 0.01 20n 1k 100 POUTPUT (W) 00358-014 10 0.1 1 0.1 2 TA = 25C VDD = 3.3V AVD = 20 (BTL) RL = 8 PL = 350mW 00358-015 0.01 20n 00358-010 CB = 1F 0.01 20 100 1k POUTPUT (W) FREQUENCY (Hz) Figure 12. THD + N vs. POUTPUT Figure 15. THD + N vs. Frequency Rev. G | Page 9 of 24 SSM2211 10 Data Sheet 10 TA = 25C VDD = 3.3V AVD = 2 (BTL) RL = 8 FREQUENCY = 20Hz CB = 0.1F 1 TA = 25C VDD = 2.7V AVD = 2 (BTL) RL = 8 PL = 250mW CB = 0 THD + N (%) THD + N (%) 1 0.1 CB = 0.1F 0.1 0.1 1 00358-019 0.01 20n 00358-016 CB = 1F 0.01 2 20 POUTPUT (W) 10k 20k Figure 19. THD + N vs. Frequency 10 TA = 25C VDD = 3.3V AVD = 2 (BTL) RL = 8 FREQUENCY = 1kHz CB = 0.1F CB = 0 CB = 0.1F 1 THD + N (%) THD + N (%) 1 CB = 1F 0.1 0.1 0.1 1 0.01 2 20 100 POUTPUT (W) 1k 10k 20k 10k 20k FREQUENCY (Hz) Figure 17. THD + N vs. POUTPUT Figure 20. THD + N vs. Frequency 10 TA = 25C VDD = 3.3V AVD = 2 (BTL) RL = 8 FREQUENCY = 20kHz CB = 0.1F CB = 0.1F 1 THD + N (%) CB = 1F 0.1 00358-018 0.1 1 0.1 2 TA = 25C VDD = 2.7V AVD = 20 (BTL) RL = 8 PL = 250mW 00358-021 THD + N (%) 1 0.01 20n 00358-020 TA = 25C VDD = 2.7V AVD = 10 (BTL) RL = 8 PL = 250mW 00358-017 0.01 20n 10 1k FREQUENCY (Hz) Figure 16. THD + N vs. POUTPUT 10 100 0.01 20 100 1k POUTPUT (W) FREQUENCY (Hz) Figure 18. THD + N vs. POUTPUT Figure 21. THD + N vs. Frequency Rev. G | Page 10 of 24 Data Sheet 10 SSM2211 10 TA = 25C VDD = 2.7V AVD = 2 (BTL) RL = 8 FREQUENCY = 20Hz 1 TA = 25C VDD = 5V AVD = 10 SINGLE ENDED CB = 0.1F CC = 1000F THD + N (%) THD + N (%) 1 0.1 RL = 8 PO = 250mW 0.1 10 0.1 1 0.01 2 20 100 1k POUTPUT (W) FREQUENCY (Hz) Figure 22. THD + N vs. POUTPUT Figure 25. THD + N vs. Frequency 10k 20k 10k 20k 10k 20k 10 TA = 25C VDD = 2.7V AVD = 2 (BTL) RL = 8 FREQUENCY = 1kHz TA = 25C VDD = 3.3V AVD = 10 SINGLE ENDED CB = 0.1F CC = 1000F 1 THD + N (%) THD + N (%) 1 0.1 RL = 8 PO = 85mW 0.1 1 0.1 0.01 2 20 POUTPUT (W) 100 1k FREQUENCY (Hz) Figure 23. THD + N vs. POUTPUT Figure 26. THD + N vs. Frequency 10 TA = 25C VDD = 2.7V AVD = 2 (BTL) RL = 8 FREQUENCY = 20kHz TA = 25C VDD = 2.7V AVD = 10 SINGLE ENDED CB = 0.1F CC = 1000F 1 THD + N (%) THD + N (%) 1 RL = 8 PO = 65mW 0.1 1 0.1 2 RL = 32 PO = 15mW 00358-027 00358-024 0.1 0.01 20n 00358-026 RL = 32 PO = 20mW 00358-023 0.01 20n 10 00358-025 00358-022 0.01 20n RL = 32 PO = 60mW 0.01 20 100 1k POUTPUT (W) FREQUENCY (Hz) Figure 24. THD + N vs. POUTPUT Figure 27. THD + N vs. Frequency Rev. G | Page 11 of 24 SSM2211 4.0 VDD = 2.7V THD + N (%) 1 VDD = 3.3V VDD = 5V 1 1.0 8-LEAD SOIC 0.5 0 10 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) Figure 28. THD + N vs. POUTPUT Figure 31. Maximum Power Dissipation vs. Ambient Temperature 10k VDD = 2.7V TA = 25C VDD = 5V 8k THD + N (%) VDD = 5V VDD = 3.3V 6k 4k 2k 1 0 2 00358-032 00358-029 0.1 0 1 2 3 5 4 POUTPUT (W) SHUTDOWN VOLTAGE AT PIN 1 (V) Figure 29. THD + N vs. POUTPUT Figure 32. Supply Current vs. Shutdown Voltage at Pin 1 14 TA = 25C AVD = 2 (BTL) RL = 8 FREQUENCY = 20kHz CB = 0.1F VDD = 3.3V TA = 25C RL = OPEN SUPPLY CURRENT (mA) 12 1 THD + N (%) 1.5 -40 -30 -20 -10 0.1 VDD = 2.7V 00358-030 0.1 VDD = 5V 0.01 20n 2.0 0 2 1 10 8-LEAD LFCSP 2.5 POUTPUT (W) TA = 25C AVD = 2 (BTL) RL = 8 FREQUENCY = 1kHz CB = 0.1F 0.01 20n 3.0 0.1 1 2 10 8 6 4 2 00358-033 10 0.1 SUPPLY CURRENT (A) 0.01 20n 00358-028 0.1 TJ,MAX = 150C FREE AIR, NO HEAT SINK SOIC JA = 121C/W LFCSP JA = 50C/W 3.5 00358-031 TA = 25C AVD = 2 (BTL) RL = 8 FREQUENCY = 20Hz CB = 0.1F MAXIMUM POWER DISSIPATION (W) 10 Data Sheet 0 0 1 2 3 4 5 POUTPUT (W) SUPPLY VOLTAGE (V) Figure 30. THD + N vs. POUTPUT Figure 33. Supply Current vs. Supply Voltage Rev. G | Page 12 of 24 6 Data Sheet SSM2211 25 1.6 VDD = 2.7V SAMPLE SIZE = 300 1.4 20 NUMBER OF UNITS 1.0 0.8 0.6 5V 00358-034 2.7V 8 12 16 20 24 28 32 36 40 44 0 -20 48 -15 -10 -5 0 5 10 15 20 LOAD RESISTANCE () OUTPUT OFFSET VOLTAGE (mV) Figure 34. POUTPUT vs. Load Resistance Figure 36. Output Offset Voltage Distribution 80 180 60 135 40 90 20 45 0 0 25 20 VDD = 3.3V SAMPLE SIZE = 300 16 -20 -45 -40 -90 -60 -135 NUMBER OF UNITS 4 PHASE SHIFT (Degrees) 12 8 4 -80 100 1k 10k 100k 1M 10M -180 100M 0 -30 00358-037 GAIN (dB) 0 10 5 3.3V 0.2 15 00358-036 0.4 00358-035 OUTPUT POWER (W) 1.2 -20 -10 0 10 20 FREQUENCY (Hz) OUTPUT OFFSET VOLTAGE (mV) Figure 35. Gain and Phase Shift vs. Frequency (Single Amplifier) Figure 37. Output Offset Voltage Distribution Rev. G | Page 13 of 24 30 SSM2211 Data Sheet 20 -50 VDD DD= =5V3.3V SAMPLE SIZE SIZE = = 300 300 SAMPLE TA = 25C VDD = 5V 100mV CB = 15F AVD = 2 -55 12 PSRR (dB) 8 -65 00358-038 4 0 -30 -20 -10 0 10 -70 30 20 20 OUTPUT OFFSET VOLTAGE (mV) VDD = 5V SAMPLE SIZE = 1,700 400 300 200 100 00358-039 NUMBER OF UNITS 500 7 8 9 10 11 12 13 1k Figure 40. PSRR vs. Frequency 600 6 100 FREQUENCY (Hz) Figure 38. Output Offset Voltage Distribution 0 -60 00358-040 NUMBER OF UNITS 16 14 15 SUPPLY CURRENT (mA) Figure 39. Supply Current Distribution Rev. G | Page 14 of 24 10k 30k Data Sheet SSM2211 THEORY OF OPERATION The SSM2211 is a low distortion speaker amplifier that can run from a 2.7 V to 5.5 V supply. It consists of a rail-to-rail input and a differential output that can be driven within 400 mV of either supply rail while supplying a sustained output current of 350 mA. The SSM2211 is unity-gain stable, requiring no external compensation capacitors, and can be configured for gains of up to 40 dB. Figure 41 shows the simplified schematic. 20k V+ 6 20k SSM2211 4 3 5 A1 50k VOUTA THERMAL PERFORMANCE--LFCSP 50k The LFCSP offers the SSM2211 user even greater choices when considering thermal performance criteria. For the 8-lead, 3 mm x 3 mm LFCSP, the JA is 50C/W. This rating is a significant performance improvement over most other packaging options. 50k 0.1F 8 A2 2 50k VOUTB BIAS CONTROL 7 1 SHUTDOWN 00358-041 IN- Pin 4 and Pin 3 are the inverting and noninverting terminals to A1. An offset voltage is provided at Pin 2, which must be connected to Pin 3 for use in single-supply applications. The output of A1 appears at Pin 5. A second operational amplifier, A2, is configured with a fixed gain of AV = -1 and produces an inverted replica of Pin 5 at Pin 8. The SSM2211 outputs at Pin 5 and Pin 8 produce a bridged configuration output to which a speaker can be connected. This bridge configuration offers the advantage of a more efficient power transfer from the input to the speaker. Because both outputs are symmetric, the dc bias at Pin 5 and Pin 8 are exactly equal, resulting in zero dc differential voltage across the outputs. This configuration eliminates the need for a coupling capacitor at the output. Figure 41. Simplified Schematic Rev. G | Page 15 of 24 SSM2211 Data Sheet APPLICATIONS INFORMATION RF driving this speaker with a bridged output, 1 W of power can be delivered. This power translates to a 12 dB increase in sound pressure level from the speaker. 5V CC AUDIO INPUT RI CS 6 4 - 5 SSM2211 3 + 1 8 - Driving a speaker differentially from a BTL offers another advantage in that it eliminates the need for an output coupling capacitor to the load. In a single-supply application, the quiescent voltage at the output is half of the supply voltage. If a speaker is connected in a single-ended configuration, a coupling capacitor is needed to prevent dc current from flowing through the speaker. This capacitor also must be large enough to prevent low frequency roll-off. The corner frequency is given by SPEAKER 8V + 7 00358-042 2 CB Figure 42. Typical Configuration Figure 42 shows how the SSM2211 is connected in a typical application. The SSM2211 can be configured for gain much like a standard operational amplifier. The gain from the audio input to the speaker is AV 2 RF RI (1) The 2x factor results from Pin 8 having an opposite polarity of Pin 5, providing twice the voltage swing to the speaker from the bridged-output (BTL) configuration. CS is a supply bypass capacitor used to provide power supply filtering. Pin 2 is connected to Pin 3 to provide an offset voltage for single-supply use, with CB providing a low ac impedance to ground to enhance power-supply rejection. Because Pin 4 is a virtual ac ground, the input impedance is equal to RI. CC is the input coupling capacitor, which also creates a high-pass filter with a corner frequency of f HP 1 2 R I C C (2) Because the SSM2211 has an excellent phase margin, a feedback capacitor in parallel with RF to band limit the amplifier is not required, as it is in some competitor products. BRIDGED OUTPUT VS. SINGLE-ENDED OUTPUT CONFIGURATIONS The power delivered to a load with a sinusoidal signal can be expressed in terms of the peak voltage of the signal and the resistance of the load as PL V PK 2 2 RL f 3dB 1 2 R L C C (4) where RL is the speaker resistance and CC is the coupling capacitance. For an 8 speaker and a corner frequency of 20 Hz, a 1000 F capacitor is needed, which is physically large and costly. By connecting a speaker in a BTL configuration, the quiescent differential voltage across the speaker becomes nearly zero, eliminating the need for the coupling capacitor. SPEAKER EFFICIENCY AND LOUDNESS The effective loudness of 1 W of power delivered into an 8 speaker is a function of speaker efficiency. The efficiency is typically rated as the sound pressure level (SPL) at 1 meter in front of the speaker with 1 W of power applied to the speaker. Most speakers are between 85 dB and 95 dB SPL at 1 meter at 1 W. Table 7 shows a comparison of the relative loudness of different sounds. Table 7. Typical Sound Pressure Levels (SPLs) Source of Sound Threshold of Pain Heavy Street Traffic Cabin of Jet Aircraft Average Conversation Average Home at Night Quiet Recording Studio Threshold of Hearing SPL (dB) 120 95 80 65 50 30 0 Consequently, Table 7 demonstrates that 1 W of power into a speaker can produce quite a bit of acoustic energy. (3) By driving a load from a BTL configuration, the voltage swing across the load doubles. Therefore, an advantage in using a BTL configuration becomes apparent from Equation 3, as doubling the peak voltage results in four times the power delivered to the load. In a typical application operating from a 5 V supply, the maximum power that can be delivered by the SSM2211 to an 8 speaker in a single-ended configuration is 250 mW. By Rev. G | Page 16 of 24 Data Sheet SSM2211 POWER DISSIPATION Another important advantage in using a BTL configuration is the fact that bridged-output amplifiers are more efficient than single-ended amplifiers in delivering power to a load. Efficiency is defined as the ratio of the power from the power supply to the power delivered to the load. PL PSY PDISS RL PL PL (7) 1.5 An amplifier with a higher efficiency has less internal power dissipation, which results in a lower die-to-case junction temperature compared with an amplifier that is less efficient. Efficiency is important when considering the amplifier maximum power dissipation rating vs. ambient temperature. An internal power dissipation vs. output power equation can be derived to fully understand efficiency of amplifier. The internal power dissipation of the amplifier is the internal voltage drop multiplied by the average value of the supply current. An easier way to find internal power dissipation is to measure the difference between the power delivered by the supply voltage source and the power delivered into the load. The waveform of the supply current for a bridged-output amplifier is shown in Figure 43. VDD = 5V 1.0 RL = 8 0.5 0 Because the efficiency of a bridged-output amplifier (Equation 3 divided by Equation 6) increases with the square root of PL, the power dissipated internally by the device stays relatively flat and actually decreases with higher output power. The maximum power dissipation of the device can be found by differentiating Equation 7 with respect to load power and setting the derivative equal to zero, which yields T PDISS IDD, PEAK PL 00358-043 IDD, AVG By integrating the supply current over a period, T, and then dividing the result by T, the IDD,AVG can be found. Expressed in terms of peak output voltage and load resistance 2V PEAK (5) R L Therefore, power delivered by the supply, neglecting the bias current for the device, is RL 2 V DD RL 1 1 0 PL (8) and occurs when PDISS , MAX Figure 43. Bridged Amplifier Output Voltage and Supply Current vs. Time 2 VDD VPEAK 1.5 Figure 44. Power Dissipation vs. Output Power with VDD = 5 V ISY TIME 1.0 OUTPUT POWER (W) TIME T 0.5 00358-044 0 VPEAK I DD , AVG RL = 4 RL = 16 VOUT PSY 2 2 V DD The graph of this equation is shown in Figure 44. POWER DISSIPATION (W) The power dissipated internally by the amplifier is simply the difference between Equation 6 and Equation 3. The equation for internal power dissipated, PDISS, expressed in terms of power delivered to the load and load resistance, is 2 V DD 2 2 RL (9) Using Equation 9 and the power derating curve in Figure 31, the maximum ambient temperature can be found easily. This ensures that the SSM2211 does not exceed its maximum junction temperature of 150C. The power dissipation for a singleended output application where the load is capacitively coupled is given by PDISS (6) 2 2 V DD RL PL PL The graph of Equation 10 is shown in Figure 45. Rev. G | Page 17 of 24 (10) SSM2211 Data Sheet 1.6 0.35 RL = 4 1.4 MAX POUT @ 1% THD (W) 0.25 0.20 0.15 RL = 8 0.10 RL = 16 0 0 0.1 0.2 0.3 RL = 4 1.0 RL = 8 0.8 0.6 RL = 16 0.4 0.2 00358-045 0.05 1.2 0 0.4 1.5 2.5 2.0 Figure 45. Power Dissipation vs. Single-Ended Output Power with VDD = 5 V 2 VDD 2 2 RL 3.5 4.0 4.5 5.0 Figure 46. Maximum Output Power vs. VSY Shutdown Feature The maximum power dissipation for a single-ended output is PDISS , MAX 3.0 SUPPLY VOLTAGE (V) OUTPUT POWER (W) (11) OUTPUT VOLTAGE HEADROOM The outputs of both amplifiers in the SSM2211 can come within 400 mV of either supply rail while driving an 8 load. As compared with equivalent competitor products, the SSM2211 has a higher output voltage headroom. This means that the SSM2211 can deliver an equivalent maximum output power while running from a lower supply voltage. By running at a lower supply voltage, the internal power dissipation of the device is reduced, as shown in Equation 9. This extended output headroom, along with the LFCSP, allows the SSM2211 to operate in higher ambient temperatures than competitor devices. The SSM2211 is also capable of providing amplification even at supply voltages as low as 2.7 V. The maximum power available at the output is a function of the supply voltage. Therefore, as the supply voltage decreases, so does the maximum power output from the device. The maximum output power vs. supply voltage at various BTL resistances is shown in Figure 46. The maximum output power is defined as the point at which the output has 1% total harmonic distortion (THD + N). To find the minimum supply voltage needed to achieve a specified maximum undistorted output power use Figure 46. The SSM2211 can be put into a low power consumption shutdown mode by connecting Pin 1 to 5 V. In shutdown mode, the SSM2211 has an extremely low supply current of less than 10 nA, which makes the SSM2211 ideal for battery-powered applications. Connect Pin 1 to ground for normal operation. Connecting Pin 1 to VDD mutes the outputs and puts the device into shutdown mode. A pull-up or pull-down resistor is not required. Pin 1 must always be connected to a fixed potential, either VDD or ground, and never be left floating. Leaving Pin 1 unconnected can produce unpredictable results. AUTOMATIC SHUTDOWN-SENSING CIRCUIT Figure 47 shows a circuit that can be used to take the SSM2211 in and out of shutdown mode automatically. This circuit can be set to turn the SSM2211 on when an input signal of a certain amplitude is detected. The circuit also puts the device into low power shutdown mode if an input signal is not sensed within a certain amount of time. Shutdown mode can be useful in a variety of portable radio applications, where power conservation is critical. R8 VDD C2 R7 R5 VDD IN- For example, an application requires only 500 mW to be output for an 8 speaker. With the speaker connected in a bridgedoutput configuration, the minimum supply voltage required is 3.3 V. R6 R4 AD8500 + R1 5 VOUTA SSM2211 1 8 VOUTB A1 - VDD 4 D1 C1 R3 R2 NOTES 1. ADDITIONAL PINS OMITTED FOR CLARITY. Figure 47. Automatic Shutdown Circuit Rev. G | Page 18 of 24 00358-047 POWER DISSIPATION (W) 0.30 00358-046 VDD = 5V Data Sheet SSM2211 The input signal to the SSM2211 is also connected to the noninverting terminal of A2. R1, R2, and R3 set the threshold voltage at which the SSM2211 is to be taken out of shutdown mode. The diode, D1, half-wave rectifies the output of A2, discharging C1 to ground when an input signal greater than the set threshold voltage is detected. R4 controls the charge time of C1, which sets the time until the SSM2211 is put back into shutdown mode after the input signal is no longer detected. The minimum gain of the shutdown circuit, from Equation 12, is AV = 100. R1 is set to 100 k. Using Equation 13 and Equation 14, R2 = 98 k and R3 = 4.9 M. C1 is set to 0.01 F, and based on Equation 15, R4 is set to 10 M. To minimize power supply current, R5 and R6 are set to 10 M. The previous procedure provides an adequate starting point for the shutdown circuit. Some component values may need to be adjusted empirically to optimize performance. R5 and R6 establish a voltage reference point equal to half of the supply voltage. R7 and R8 set the gain of the SSM2211. A 1N914 or equivalent diode is required for D1, and A2 must be a rail-torail output amplifier, such as the AD8500 or equivalent. This ensures that C1 discharges sufficiently to bring the SSM2211 out of shutdown mode. START-UP POPPING NOISE To find the appropriate component values, the gain of A2 must be determined by AV,MIN V SY (12) VTHS CB x 25 k > CC x R1 where: VSY is the single supply voltage. VTHS is the threshold voltage. AV must be set to a minimum of 2 for the circuit to work properly. SSM2211 Amplifier Design Example (13) Find R3 as R3 R1 R2 AV 1 R2 R2 (14) C1 can be arbitrarily set but must be small enough to prevent A2 from becoming capacitively overloaded. R4 and C1 control the shutdown rate. To prevent intermittent shutdown with low frequency input signals, the minimum time constant must be R4 C1 10 f LOW (16) For an application where R1 = 10 k and CC = 0.22 F, CB must be at least 0.1 F to minimize start-up popping noise. Next, choose R1 and set R2 to 2 R2 R1 1 A V During power-up or release from shutdown mode, the midrail bypass capacitor, CB, determines the rate at which the SSM2211 starts up. By adjusting the charging time constant of CB, the startup pop noise can be pushed into the subaudible range, greatly reducing start-up popping noise. On power-up, the midrail bypass capacitor is charged through an effective resistance of 25 k. To minimize start-up popping, the charging time constant for CB must be greater than the charging time constant for the input coupling capacitor, CC. (15) where fLOW is the lowest input frequency expected. SHUTDOWN-CIRCUIT DESIGN EXAMPLE In this example, a portable radio application requires the SSM2211 to be turned on when an input signal greater than 50 mV is detected. The device must return to shutdown mode within 500 ms after the input signal is no longer detected. The lowest frequency of interest is 200 Hz, and a 5 V supply is used. Maximum output power: 1 W Input impedance: 20 k Load impedance: 8 Input level: 1 V rms Bandwidth: 20 Hz - 20 kHz 0.25 dB The configuration shown in Figure 42 is used. The first thing to determine is the minimum supply rail necessary to obtain the specified maximum output power. From Figure 46, for 1 W of output power into an 8 load, the supply voltage must be at least 4.6 V. A supply rail of 5 V can be easily obtained from a voltage reference. The extra supply voltage also allows the SSM2211 to reproduce peaks in excess of 1 W without clipping the signal. With VDD = 5 V and RL = 8 , Equation 9 shows that the maximum power dissipation for the SSM2211 is 633 mW. From the power derating curve in Figure 31, the ambient temperature must be less than 50C for the SOIC and 121C for the LFCSP. The required gain of the amplifier can be determined from Equation 17 as AV PL R L V IN, rms 2.8 (17) From Equation 1, RF AV RI 2 or RF = 1.4 x RI. Because the desired input impedance is 20 k, RI = 20 k and R2 = 28 k. Rev. G | Page 19 of 24 SSM2211 Data Sheet The final design step is to select the input capacitor. When adding an input capacitor, CC, to create a high-pass filter, the corner frequency must be far enough away for the design to meet the bandwidth criteria. For a first-order filter to achieve a pass-band response within 0.25 dB, the corner frequency must be at least 4.14x away from the pass-band frequency. Therefore, (4.14 x fHP) < 20 Hz. Using Equation 2, the minimum size of an input capacitor can be found. 1 (18) 20 Hz 2 x 20 k 4.14 DRIVING TWO SPEAKERS SINGLE-ENDEDLY It is possible to drive two speakers single-endedly with both outputs of the SSM2211. 20k 5V 470F Therefore, CC > 1.65 F. Using a 2.2 F is a practical choice for CC. The gain bandwidth product for each internal amplifier in the SSM2211 is 4 MHz. Because 4 MHz is much greater than 4.14 x 20 kHz, the design meets the upper frequency bandwidth criteria. The SSM2211 can also be configured for higher differential gains without running into bandwidth limitations. Equation 16 shows an appropriate value for CB to reduce start-up popping noise. CB > (2.2 F)(20 k) 25 k = 1.76 F 20k AUDIO INPUT 4 1F + - LEFT SPEAKER (8) 5 SSM2211 3 1 + 7 2 0.1F (19) 8 470F + RIGHT SPEAKER (8) - Figure 49. SSM2211 Used as a Dual-Speaker Amplifier Each speaker is driven by a single-ended output. The trade-off is that only 250 mW of sustained power can be put into each speaker. In addition, a coupling capacitor must be connected in series with each of the speakers to prevent large dc currents from flowing through the 8 speakers. These coupling capacitors produce a high-pass filter with a corner frequency given by Equation 4. For a speaker load of 8 and a coupling capacitor of 470 F, this results in a -3 dB frequency of 42 Hz. Selecting CB to be 2.2 F for a practical value of capacitor minimizes start-up popping noise. To summarize the final design, * * * * * * 6 - 00358-049 CC > It is not necessary to connect a dummy load to the unused output to help stabilize the output. The 470 F coupling capacitor creates a high-pass frequency cutoff of 42 Hz, as given in Equation 4, which is acceptable for most computer speaker applications. The overall gain for a single-ended output configuration is AV = RF/R1, which for this example is equal to 1. VDD = 5 V R1 = 20 k RF = 28 k CC = 2.2 F CB = 2.2 F TA, MAX = 85C SINGLE-ENDED APPLICATIONS Because the power of a single-ended output is one-quarter that of a BTL, both speakers together are still half as loud (-6 dB SPL) as a single speaker driven with a BTL. There are applications in which driving a speaker differentially is not practical, for example, a pair of stereo speakers where the negative terminal of both speakers is connected to ground. Figure 48 shows how this application can be accomplished. The polarity of the speakers is important because each output is 180 out of phase with the other. By connecting the negative terminal of Speaker 1 to Pin 5 and the positive terminal of Speaker 2 to Pin 8, proper speaker phase can be established. 10k 5V 6 10k 4 0.47F - 5 SSM2211 3 1 + 7 2 0.1F 8 470F + 250mW SPEAKER (8) - 00358-048 AUDIO INPUT The maximum power dissipation of the device, assuming both loads are equal, can be found by doubling Equation 11. If the loads are different, use Equation 11 to find the power dissipation caused by each load, and then take the sum to find the total power dissipated by the SSM2211. Figure 48. Single-Ended Output Application Rev. G | Page 20 of 24 Data Sheet SSM2211 LFCSP PCB CONSIDERATIONS The LFCSP is a plastic encapsulated package with a copper lead frame substrate. The LFCSP is a leadless package with solder lands on the bottom surface of the package, instead of conventional formed perimeter leads. A key feature that allows the user to reach the quoted JA performance is the exposed die attach paddle (DAP) on the bottom surface of the package. When soldered to the PCB, the DAP can provide efficient conduction of heat from the die to the PCB. To achieve optimum package performance, consideration must be given to the PCB pad design for both the solder lands and the DAP. For further information, see the AN-772 Application Note. Rev. G | Page 21 of 24 SSM2211 Data Sheet OUTLINE DIMENSIONS 5.00 (0.1968) 4.80 (0.1890) 8 4.00 (0.1574) 3.80 (0.1497) 1 5 6.20 (0.2441) 5.80 (0.2284) 4 1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0040) COPLANARITY 0.10 SEATING PLANE 1.75 (0.0688) 1.35 (0.0532) 0.51 (0.0201) 0.31 (0.0122) 0.50 (0.0196) 0.25 (0.0099) 45 8 0 0.25 (0.0098) 0.17 (0.0067) 1.27 (0.0500) 0.40 (0.0157) 012407-A COMPLIANT TO JEDEC STANDARDS MS-012-AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Figure 50. 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body, S-Suffix (R-8) Dimensions shown in millimeters and (inches) 1.84 1.74 1.64 3.10 3.00 SQ 2.90 1.55 1.45 1.35 EXPOSED PAD 0.50 0.40 0.30 0.80 0.75 0.70 0.30 0.25 0.20 1 4 BOTTOM VIEW TOP VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.203 REF PIN 1 INDICATOR (R 0.15) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-229-WEED 12-07-2010-A PIN 1 INDEX AREA SEATING PLANE 0.50 BSC 8 5 Figure 51. 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm x 3 mm Body and 0.75 mm Package Height (CP-8-13) Dimensions shown in millimeters ORDERING GUIDE Model 1 SSM2211CPZ-REEL SSM2211CPZ-REEL7 SSM2211SZ SSM2211SZ-REEL SSM2211SZ-REEL7 1 Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C Package Description 8-Lead LFCSP 8-Lead LFCSP 8-Lead SOIC_N 8-Lead SOIC_N 8-Lead SOIC_N Z = RoHS Compliant Part; # denotes RoHS compliant product may be top or bottom marked. Rev. G | Page 22 of 24 Package Option CP-8-13 CP-8-13 R-8 (S-Suffix) R-8 (S-Suffix) R-8 (S-Suffix) Branding B5A# B5A# Data Sheet SSM2211 NOTES Rev. G | Page 23 of 24 SSM2211 Data Sheet NOTES (c)2002-2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D00358-0-5/16(G) Rev. G | Page 24 of 24