LM137HVQML www.ti.com SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 LM137HVQML 3-Terminal Adjustable Negative Regulators (High Voltage) Check for Samples: LM137HVQML FEATURES 1 * * 2 * * * * * * * * * * Output Voltage Adjustable from -47V to -1.2V 1.5A Output Current Specified, -55C TJ +150C Line Regulation Typically 0.01%/V Load Regulation Typically 0.3% Excellent Thermal Regulation, 0.002%/W 77 dB Ripple Rejection Excellent Rejection of Thermal Transients 50 ppm/C Temperature Coefficient Temperature-Independent Current Limit Internal Thermal Overload Protection Standard 3-Lead Transistor Package Output Short Circuit Protected DESCRIPTION The LM137HV is an adjustable 3-terminal negative voltage regulator capable of supplying in excess of -1.5A over an output voltage range of -47V to -1.2V. This regulators is exceptionally easy to apply, requiring only 2 external resistors to set the output voltage and 1 output capacitor for frequency compensation. The circuit design has been optimized for excellent regulation and low thermal transients. Further, the LM137HV features internal current limiting, thermal shutdown and safe-area compensation, making them virtually blowout-proof against overloads. The LM137HV serves a wide variety of applications including local on-card regulation, programmableoutput voltage regulation or precision current regulation. The LM137HV is an ideal complement to the LM117HV adjustable positive regulator. Connection Diagrams See Physical Dimensions section for further information Figure 1. TO Package - Bottom View See Package Number NDT0003A Figure 2. TO-3 Package (Bottom View) See Package Number K 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2010-2013, Texas Instruments Incorporated LM137HVQML SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 www.ti.com Typical Applications C1 = 1 F solid tantalum or 10 F aluminum electrolytic required for stability. Output capacitors in the range of 1 F to 1000 F of aluminum or tantalum electrolytic are commonly used to provide improved output impedance and rejection of transients. * C2 = 1 F solid tantalum is required only if regulator is more than 4 from power-supply filter capacitor. Figure 3. Adjustable Negative Voltage Regulator These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Power Dissipation (2) Internally limited Input--Output Voltage Differential 50V -55C TA +125C Operating Ambient Temperature Range Maximum Junction Temperature Range +150C -65C TA +150C Storage Temperature Lead Temperature (Soldering, 10 sec.) Thermal Resistance JA JC 300C NDT0003A pkg. (Still Air @ 0.5W) 174C/W NDT0003A pkg. (500LF / Min Air Flow @ 0.5W) 64C/W K pkg. (Still Air @ 0.5W) 42C/W K pkg. (500LF / Min Air Flow @ 0.5W) 14C/W NDT0003A pkg. (@ 1.0W) 15C/W K pkg. 4C/W Package Weight (Typical) NDT0003A pkg K pkg ESD Rating (3) (1) (2) (3) 2 955mg 12,750mg 4000V "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), JA (package junction to ambient thermal resistance, and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax - TA) / JA or the number given in the Absolute Maximum Ratings, whichever is lower. Human body model, 100pF discharged through 1.5K Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML LM137HVQML www.ti.com SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 Table 1. Quality Conformance Inspection Mil-Std-883, Method 5004 and Method 5005 (1) Subgroup (1) Description 1 Static tests at +25C 2 Static tests at +125C Temp (C) 3 Static tests at -55C 4 Dynamic tests at +25C 5 Dynamic tests at +125C 6 Dynamic tests at -55C 7 Functional tests at +25C 8A Functional tests at +125C 8B Functional tests at -55C 9 Switching tests at +25C 10 Switching tests at +125C 11 Switching tests at -55C Group "A" sample only, test at all temperature. LM137HVH 883 Electrical Characteristics DC Parameters The following conditions apply, unless otherwise specified. VIN = -4.0V, IO = 0.53A, VO = VRef Symbol Parameter Conditions Notes VIN = -4.25V, IO = 8 mA VRef RLine Line Regulation IAdj Adjustment Pin Current IAdj Adjustment Pin Current Change RLoad Load Regulation VRth Thermal Regulation ICL (1) Current Limit Unit Subgroups -1.272 -1.23 V 1 2, 3 -1.28 -1.225 V -1.23 V 1 -1.28 -1.225 V 2, 3 VO = -1.7V, VIN = -4.25V 3.0 mA 1, 2, 3 VO = -1.7V, VIN = -11.75V 3.0 mA 1, 2, 3 VO = -1.7V, VIN = -42V 5.0 mA 1, 2, 3 -42V VIN -4.25V, IO = 8mA 9.4 mV 1, 2, 3 VIN = -42V, IO = 8mA 100 A 1, 2, 3 VIN = -4.25V, IO = 8mA 100 A 1, 2, 3 VIN = -54V, IO = 8mA 100 A 1 -42V VIN -4.25V, IL = 8mA 6.0 A 1, 2, 3 VIN = -6.25V, 8mA IO 0.53A 5.0 A 1, 2, 3 -54V VIN -4.25V, IO = 8mA 6.0 A 1 VIN = -54V, 10mA IO 60mA 25 mV 1 VIN = -6.25V, 8mA IO 0.53A 25 mV 1 IO = 0.53A, VIN = -14.5V 5 mV 1 VIN = -42V, IO = 8mA Minimum Load Current Max -1.272 Reference Voltage IQ Min VIN -14.25 VIN = -51.25V See (1) 0.5 1.6 A 1 (1) 0.1 0.5 A 1 See Specified parameter not tested. Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML 3 LM137HVQML SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 www.ti.com LM137HVH 883 Electrical Characteristics AC Parameters Symbol RR Parameter Ripple Rejection Conditions VIN = -6.25V, VO = VRef, f = 120Hz, eI = 1VRMS, IL = 125mA Notes Min See (1) (2) Max Unit Subgroups 66 dB 4, 5, 6 Tested at +25C, specified, but not tested at +125C and -55C Bench test per (SG)RPI-3-362 Use TDN 70256657 (NSSG) (1) (2) LM137HVK 883 Electrical Characteristics DC Parameters The following conditions apply, unless otherwise specified. VIN = -40V, IL = 8.0mA, VO = VRef = -1.25V (nominal) Symbol Parameter Conditions Notes VIN = -4.25V VRef Reference Voltage RLine Line Regulation RLoad Load Regulation VRth Thermal Regulation IAdj Adjustment Pin Current IAdj Adjustment Pin Current Change IQ Minimum Load Current ISC Short Circuit Subgroups Max Unit 1.272 -1.23 V 1 -1.28 -1.225 V 2, 3 VIN = -42V -1.272 -1.23 V 1 VIN = -41.3V -1.28 -1.225 V 2, 3 9.4 mV 1 2, 3 -42V VIN -4.25V -41.3V VIN -4.25V 9.4 mV VIN = -54V, 10mA IO 110mA -25 25 mV 1 VIN = -6.25V, 8mA IO 1.5A -25 25 mV 1, 2, 3 IO = 1.5A, VIN = -14.5V, t = 10mS -5.0 5.0 mV 1 VIN = -42V 100 A 1 VIN = -41.3V 100 A 2, 3 VIN = -4.25V 100 A 1, 2, 3 VIN = -54V 100 A 1 -42V VIN -4.25V -5.0 5.0 A 1 -41.3V VIN -4.25V -5.0 5.0 A 2, 3 -54V VIN -4.25V -6.0 6.0 A 1 VIN = -6.25V, 8mA IO 1.5A -5.0 5.0 A 1, 2, 3 VO = 1.7V, VIN = -4.25V 3.0 mA 1, 2, 3 VO = -1.7V, VIN = -11.75V 3.0 mA 1, 2, 3 VO = -1.7V, VIN = -42V 5.0 mA 1 VO = -1.7V, VIN = -41.3V 5.0 mA 2, 3 -2.85 -1.6 A 1 -3.5 -1.6 A 2, 3 -0.8 -0.2 A 1 VIN = -5V VIN = -51.25V (1) Min See (1) Specified parameter not tested. LM137HVK 883 Electrical Characteristics AC Parameters: The following conditions apply, unless otherwise specified. VIN = -40V, IL = 8.0mA, VO = VRef = -1.25V (nominal) Symbol RR (1) (2) 4 Parameter Ripple Rejection Conditions Notes Min VIN = -6.25V, VO = VRef, f = 120Hz, ein = 1V RMS, IL = 0.5A See (1) (2) 66 Max Unit Subgroups dB 4, 5, 6 Tested at +25C, specified, but not tested at +125C and -55C Bench test per (SG)RPI-3-362 Use TDN 70256657 (NSSG) Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML LM137HVQML www.ti.com SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 Schematic Diagram Thermal Regulation When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC circuit components. With an IC regulator, this gradient can be especially severe since power dissipation is large. Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output change) per Watt of power change in a specified time. Thermal regulation error is independent of electrical regulation or temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation. Thermal regulation depends on IC layout as well as electrical design. The thermal regulation of a voltage regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a step of power is applied. The LM137HV's specification is 0.02%/W, max. In Figure 4, a typical LM137HV's output drifts only 3 mV (or 0.03% of VOUT = -10V) when a 10W pulse is applied for 10 ms. This performance is thus well inside the specification limit of 0.02%/W x 10W = 0.2% max. When the 10W pulse is ended, the thermal regulation again shows a 3 mV step as the LM137HV chip cools off. Note that the load regulation error of about 8 mV (0.08%) is additional to the thermal regulation error. In Figure 5, when the 10W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first 10 ms, and the thermal error stays well within 0.1% (10 mV). Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML 5 LM137HVQML SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 www.ti.com When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC circuit components. With an IC regulator, this gradient can be especially severe since power dissipation is large. Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output change) per Watt of power change in a specified time. Thermal regulation error is independent of electrical regulation or temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation. Thermal regulation depends on IC layout as well as electrical design. The thermal regulation of a voltage regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a step of power is applied. The LM137HV's specification is 0.02%/W, max. In Figure 4, a typical LM137HV's output drifts only 3 mV (or 0.03% of VOUT = -10V) when a 10W pulse is applied for 10 ms. This performance is thus well inside the specification limit of 0.02%/W x 10W = 0.2% max. When the 10W pulse is ended, the thermal regulation again shows a 3 mV step as the LM137HV chip cools off. Note that the load regulation error of about 8 mV (0.08%) is additional to the thermal regulation error. In Figure 5, when the 10W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first 10 ms, and the thermal error stays well within 0.1% (10 mV). LM137HV, VOUT = -10V VIN-VOUT = -40V IL = 0A0.25A0A Vertical sensitivity, 5 mV/div Figure 4. LM137HV, VOUT = -10V VIN-VOUT = -40V IL = 0A0.25A0A Horizontal sensitivity, 20 ms/div Figure 5. 6 Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML LM137HVQML www.ti.com SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC circuit components. With an IC regulator, this gradient can be especially severe since power dissipation is large. Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output change) per Watt of power change in a specified time. Thermal regulation error is independent of electrical regulation or temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation. Thermal regulation depends on IC layout as well as electrical design. The thermal regulation of a voltage regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a step of power is applied. The LM137HV's specification is 0.02%/W, max. In Figure 4, a typical LM137HV's output drifts only 3 mV (or 0.03% of VOUT = -10V) when a 10W pulse is applied for 10 ms. This performance is thus well inside the specification limit of 0.02%/W x 10W = 0.2% max. When the 10W pulse is ended, the thermal regulation again shows a 3 mV step as the LM137HV chip cools off. Note that the load regulation error of about 8 mV (0.08%) is additional to the thermal regulation error. In Figure 5, when the 10W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first 10 ms, and the thermal error stays well within 0.1% (10 mV). Typical Applications Full output current not available at high input-output voltages *The 10 F capacitors are optional to improve ripple rejection Figure 6. Adjustable High Voltage Regulator Figure 7. Current Regulator Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML 7 LM137HVQML SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 www.ti.com When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC circuit components. With an IC regulator, this gradient can be especially severe since power dissipation is large. Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output change) per Watt of power change in a specified time. Thermal regulation error is independent of electrical regulation or temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation. Thermal regulation depends on IC layout as well as electrical design. The thermal regulation of a voltage regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a step of power is applied. The LM137HV's specification is 0.02%/W, max. In Figure 4, a typical LM137HV's output drifts only 3 mV (or 0.03% of VOUT = -10V) when a 10W pulse is applied for 10 ms. This performance is thus well inside the specification limit of 0.02%/W x 10W = 0.2% max. When the 10W pulse is ended, the thermal regulation again shows a 3 mV step as the LM137HV chip cools off. Note that the load regulation error of about 8 mV (0.08%) is additional to the thermal regulation error. In Figure 5, when the 10W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first 10 ms, and the thermal error stays well within 0.1% (10 mV). Figure 8. Adjustable Current Regulator *When CL is larger than 20 F, D1 protects the LM137HV in case the input supply is shorted **When C2 is larger than 10 F and -VOUT is larger than -25V, D2 protects the LM137HV is case the output is shorted Figure 9. Negative Regulator with Protection Diodes *Use resistors with good tracking TC < 25 ppm/C Figure 10. High Stability -40V Regulator 8 Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML LM137HVQML www.ti.com SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 Typical Performance Characteristics (H and K-STEEL Package) Load Regulation Current Limit Figure 11. Figure 12. Adjustment Current Dropout Voltage Figure 13. Figure 14. Temperature Stability Minimum Operating Current Figure 15. Figure 16. Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML 9 LM137HVQML SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) (H and K-STEEL Package) 10 Ripple Rejection Ripple Rejection Figure 17. Figure 18. Ripple Rejection Output Impedance Figure 19. Figure 20. Line Transient Response Load Transient Response Figure 21. Figure 22. Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML LM137HVQML www.ti.com SNVS314A - DECEMBER 2010 - REVISED APRIL 2013 REVISION HISTORY Date Released Revision 12/16/2010 A 04/17/2013 A Section New Release, Corporate format Changes 2 MDS data sheets converted into one Corp. Data sheet format. MNLM137HV-K rev 0A0, MNLM137HVH rev 2A0 MDS datasheets will be archived. Changed layout of National Data Sheet to TI format. Submit Documentation Feedback Copyright (c) 2010-2013, Texas Instruments Incorporated Product Folder Links: LM137HVQML 11 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) LM137HVH/883 ACTIVE Package Type Package Pins Package Drawing Qty TO NDT 3 20 Eco Plan Lead/Ball Finish (2) TBD MSL Peak Temp Op Temp (C) Top-Side Markings (3) Call TI Call TI (4) -55 to 150 LM137HVH/883 Q ACO LM137HVH/883 Q >T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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