Kyocera’s series of Multilayer Ceramic Chip Capacitors
are designed to meet a wide variety of needs. We offer
a complete range of products for both general and
specialized applications, including general−purpose CM
series, high−voltage CF series, low profile CT series, DM
series for automotive uses, and CA series for arrays.
Features
• We have factories worldwide in order to supply our global customer
bases quickly and efficiently and to maintain our reputation as one of
the highest−volume producers in the industry.
• All our products are highly reliable due to their monolithic structure of
high−purity and superfine uniform ceramics and their integral internal
electrodes.
• By combining superior manufacturing technology and materials
with high dielectric constants, we produce extremely compact
components with exceptional specifications.
• Our stringent quality control in every phase of production from
material procurement to shipping ensures consistent manufacturing
and super quality.
• Kyocera components are available in a wide choice of dimensions,
temperature characteristics, rated voltages, and terminations to meet
specific configurational requirements.
Pb Free
RoHS Compliant
CM
series
DM
series
CT
series
CF
series
CA
series
General
Automotive
Arrays
High-Voltage
Low Profile
Multilayer
Ceramic Chip
Capacitors
Structure
External Termination
Electrodes
Internal Electrodes
(Pd, Pd/ Ag or Ni)
Dielectric Ceramic Layer
Temperature compensation: Titanate family
Zirconate family
High dielectric constant:
Barium Titanate family
Nickel Barrier Termination Products
Ag or Cu or
CuNi
Ni Plating
Sn Plating
Tape and Reel Bulk Cassette
Please contact your local AVX, Kyocera sales office or distributor for
specifications not covered in this catalog.
Our products are continually being improved. As a result, the
capacitance range of each series is subject to change without notice.
Please contact an sales representative to confirm compatibility with
your application.
Multilayer Ceramic Chip Capacitors
Kyocera Ceramic Chip Capacitors are available for different applications as classified below:
Series Dieletric Options Typical Applications Features Terminations Available Size
CM
C0G (NP0)
X5R
X7R
*X6S
*X7S
Y5V
General Purpose Wide Cap Range Nickel Barrier
0201, 0402, 0603
0805, 1206, 1210
1812
CF C0G (NP0)
X7R
High Voltage
&
Power Circuits
High Voltage
250VDC, 630VDC
1000VDC, 2000VDC
3000VDC, 4000VDC
Nickel Barrier
0805, 1206, 1210
1812, 2208, 1808
2220
CT
C0G (NP0)
X5R
X7R
Y5V
PLCC
(Decoupling) Low Profile Nickel Barrier 0201, 0402, 0603
0805, 1206, 1210
DM X7R Automotive
Thermal shock
Resistivity
High Reliability
Nickel Barrier 0603, 0805, 1206
CA C0G (NP0)
X5R, X7R
Digital Signal
Pass line
Reduction in
Placing Costs Nickel Barrier 0405, 0508
* option
Multilayer Ceramic Chip Capacitors
Dimensions
External
Electrode
Dimensions
P
P
T
W
L
P to P
Tape & Reel
Size EIA CODE JIS CODE
Dimensions (mm)
L W T max. P min. P max. P to P min.
03 0201 0603 0.6±0.03 0.3±0.03 0.33 0.13 0.23 0.20
05 0402 1005 1.0±0.05 0.5±0.05 0.55 0.15 0.35 0.30
105 0603 1608 1.6±0.10 0.8±0.10 0.90 0.20 0.60 0.50
21 0805 2012 2.0±0.10 1.25±0.10 1.35 0.20 0.75 0.70
316 1206 3216 3.2±0.20 1.60±0.15 1.75 0.30 0.85 1.40
32 1210 3225 3.2±0.20 2.50±0.20 2.70 0.30 1.00 1.40
42 1808 4520 4.5±0.20 2.00±0.20 2.20 0.15 0.85 2.60
43 1812 4532 4.5±0.30 3.20±0.20 3.00 0.30 1.10 2.00
52 2208 5720 5.7±0.40 2.00±0.20 2.20 0.15 0.85 4.20
55 2220 5750 5.7±0.40 5.00±0.40 2.70 0.30 1.40 2.50
• T (Thickness) depends on capacitance value.
Standard thickness is shown on the appropriate product pages.
• CA series (please refer applicable page)
• As for the size of the product specified individually, please contact us.
Bulk Cassette
Size EIA CODE JIS CODE L W T
P P to P
min. max. min.
05 0402 1005 1.0±0.05 0.5±0.05 0.5±0.05 0.15 0.35 0.30
105 0603 1608 1.6±0.07 0.8±0.07 0.8±0.07 0.20 0.60 0.50
21 0805 2012 2.0±0.1 1.25±0.1 1.25±0.1 0.20 0.75 0.70
Note) Regarding support for Bulk cases, please contact us for further information.
Multilayer Ceramic Chip Capacitors
KYOCERA PART NUMBER: CM 21 X7R 104 K 50 A T □□□
SERIES CODE
CM = General Purpose
CF = High Voltage
CT = Low Profile
DM = Automotive
CA = Capacitor Arrays
SIZE CODE
SIZE EIA (JIS)
03 = 0201 (0603)
05 = 0402 (1005)
105 = 0603 (1608)
F12 = 0508 (1220)/ 4cap
SIZE EIA (JIS)
21 = 0805 (2012)
316 = 1206 (3216)
32 = 1210 (3225)
42 = 1808 (4520)
43 = 1812 (4532)
SIZE EIA (JIS)
52 = 2208 (5720)
55 = 2220 (5750)
D11 = 0405 (1012)/ 2cap
D12 = 0508 (1220)/ 2cap
DIELECTRIC CODE
CODE EIA CODE
CG = C0G (NPO)
X5R = X5R
X7R = X7R
X7S = X7S (Option)
X6S = X6S (Option)
Y5V = Y5V
Negative temperature coefficient dielectric types are available on request.
CAPACITANCE CODE
Capacitance expressed in pF. 2 significant digits plus
number of zeros.
For Values < 10pF, Letter R denotes decimal point,
eg. 100000pF = 104
0.1mF = 104
4700pF = 472
1.5pF = 1R5
0.5pF = R50
100mF = 107
TOLERANCE CODE
A = ±0.05pF (option)
B = ±0.1pF (option)
C = ±0.25pF
D = ±0.5pF
F = ±1pF
G = ±2% (option)
J = ±5%
K = ±10%
M = ±20%
Z = −20 to +80%
VOLTAGE CODE
04 = 4VDC
06 = 6.3VDC
10 = 10VDC
16 = 16VDC
25 = 25VDC
35 = 35VDC
50 = 50VDC
100 = 100VDC
250 = 250VDC
400 = 400VDC
630 = 630VDC
1000 = 1000VDC
2000 = 2000VDC
3000 = 3000VDC
4000 = 4000VDC
TERMINATION CODE
A = Nickel Barrier
PACKAGING CODE
B = Bulk
C = Bulk Cassette (option)
T = 7" Reel Taping & 4mm Cavity pitch
L = 13" Reel Taping & 4mm Cavity pitch
H = 7" Reel Taping & 2mm Cavity pitch
N = 13" Reel Taping & 2mm Cavity pitch
OPTION
Thickness max. value is indicated in CT series
EX. 125 → 1.25mm max.
095 → 0.95mm max.
Multilayer Ceramic Chip Capacitors
Ordering Information
High Dielectric Constant
EIA Dielectric Temperature Range DC max.
X5R −55 to 85°C±15%
X7R −55 to 125°C
*X7S −55 to 125°C±22%
*X6S −55 to 105°C
Y5V −30 to 85°C−82 to +22%
* option
Temperature Compensation Type
Dielectric C0G (NPO)
0 ppm/ °C
UD (N750)
−750 ppm/ °C
SL
+350 to −1000ppm/ °C
Value (pF)
0.5 to 2.7 CK UK SL
3.0 to 3.9 CJ UJ SL
4.0 to 9.0 CH UJ SL
≥10 CG UJ SL
K =±250ppm/ °C, J =±120ppm/ °C, H =±60ppm/ °C, G =±30ppm/ °C
e.g. CG = 0±30ppm/ °C
Note: All parts of C0G will be marked as “CG” but will conform to the above table.
Available Tolerances
Dielectric materials, capacitance values and tolerances are
available in the following combinations only:
EIA Dielectric Tolerance Capacitance
COG
C=±0.25pF
D=±0.50pF
F=±1pF
*1 <10pF
*3 A=±0.05pF
B=±0.1pF
<0.5pF
≤5pF
*3 G=±2%
J=±5%
K=±10%
≥10pF
E12 Series
*2 K=±10%
M=±20% E6 Series
*3 X6S
*3 X7S
X5R
X7R
Y5V Z=−20% to +80% E3 Series
Note:
*1 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF,
2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF
*2 J = ±5% for X7R (X5R) is available on request.
*3 option
E Standard Number
E3 E6 E12 E24 (Option)
1.0
1.0
1.0 1.0 1.1
1.2 1.2 1.3
1.5
1.5 1.5 1.6
1.8 1.8 2.0
2.2
2.2
2.2 2.2 2.4
2.7 2.7 3.0
3.3
3.3 3.3 3.6
3.9 3.9 4.3
4.7
4.7
4.7 4.7 5.1
5.6 5.6 6.2
6.8
6.8 6.8 7.5
8.2 8.2 9.1
Multilayer Ceramic Chip Capacitors
Temperature Characteristics and Tolerance
Features
• Reduction in assemble costs
• Reflow solderable
• First class auto placement
Applications
• Digital Signal Pass Line for CPU
•
High Frequency Noise Reduction for I/ O Cable etc.
• PC • Printer
• Hard Disk Drive • CD−ROM
• Mobile Telecommunication Equipment
• Down Sizing of Digital Circuit
How to Order
CA F12 X7R 103 K 25 A T
① ② ③ ④ ⑤ ⑥ ⑦ ⑧
①Series
② Size
F12 = 0508
③ Dielectric
④Capacitance Value
⑤Tolerance
⑥Voltage
⑦Termination
⑧Packaging
Capacitance Range
Numbers of
elements 2 elements 4 elements
Size D11
(0405)
D12
(0508)
F12
(0508)
Temperature
Characteristics
CDX5R X7R X5R CDX5R X7R Y5V
Rated Voltage (VDC)
25 10 16 10 50 10 25 16
Capacitance (pF)
100 10
15
22
33
47
68
101 100
220
470
102 1000
2200
4700
103 10000
22000
47000
104 100000
220000
470000
105 1000000
2200000
4700000
• Capacitances other than indicated in the above chart are optional.
Size D11, D12, F12
Thickness
(mm)
A B C D
0.66 max. 0.9 max. 0.95 max. 1.0 max.
Taping (180 dia reel)
4kp (P8) 4kp (P8) 4kp (P8) 4kp (E8)
Taping (330 dia reel)
10kp (P8) 10kp (P8) 10kp (E8) 10kp (E8)
Note: E8 = 8mm width plastic tape
Dimensions (Unit: mm)
L
F12
T
P
A
W
B
L
D11, D12
T
P
A
W
B
L W P A B
F12 1.25±0.15 2.00±0.15 0.1 min. 0.50±0.10 0.25±0.10
D11 1.00±0.15 1.37±0.15 0.1 min. 0.64±0.10 0.36±0.10
D12 1.25±0.15 2.00±0.15 0.1 min. 1.00±0.10 0.60±0.20
Recommended Land Pattern (Unit: mm)
F12 D11, D12
c c c c
d
a
b
a
c c
d
a
b
a
a b c d
F12 0.5 0.5 0.3 0.5
D11 0.69 0.28 0.3 0.64
D12 0.68 0.64 0.46 1.0
A
A
A
A
D
C
C
C
C
C
B
CA Series
Capacitor Arrays
[RoHS Compliant Products]
Test Circuit
507
507
Sweep Frequency
300kHz to 3GHz
507
507
Measured with:
NETWORK ANALYZER YOKOGAWA HEWLETT PACKARD model: 8753C
S • PARAMETER TEST SET YOKOGAWA HEWLETT PACKARD model: 85047
X7R Dielectric
X7R 10nF
40db
Hld
CH1 S 21
1 10 100 1000 MHz
log MAG 10 db/ REF 1 db 1: 46. 922 db
CAP. ARRAY CROSS-TALK 100.080 474 MHz
COG Dielectric
1: 46. 459 db
COG 100pF
40db
Hld
CH1 S 21
1000100101 MHz
log MAG 10 db/ REF 1 db
CAP. ARRAY CROSS-TALK 100.080 474 MHz
* Less than −40dB cross talk up to 100MHz.
CA Series
Capacitor Arrays Cross Talk Characteristics
10
10 60 40 20 0 20 40 60 80 100 120
5
0
5
DCapacitance (%)
Temperature (oC)
at 1MHz, 1Vrms
C∆
U∆
Capacitance-Temperature
(temperature compensation)
Aging
(change of capacitance over time)
10
30
10 100 1,000 100,00010,000
20
10
0
DCapacitance (%)
Duration (hrs.)
For temperature compensation: 1MHz, 1Vrms/ for high dielectric constant: 1kHZ, 1Vrms
C∆
X7R
Y5V
∗Initial value should be after 48hr. of Heat treatment.
Capacitance-Temperature
(high dielectric constant)
20
100 60 40 20 0 20 40 60 80 100 120
60
80
40
20
0
∆Capacitance (%)
at 1kHz, 1Vrms
X7R, Y5V
X7R at RV/ 2
X7R at 0VDC
Y5V at 0VDC
Y5V at RV/ 2
Temperature (oC)
Impedance-Frequency
100
0.001
0.1 1 10 100 1,000 10,000
0.01
0.1
10
1
Impedance (Ω)
Frequency (MHz)
at 1Vrms
X7R 10µF
X7R 1µF
X7R 0.1µF
X7R 0.01µF
X7R1000pF
C∆ 1000pF
C∆ 100pF
C∆ 10pF
C
∆
1pF
DC Bias
For temperature compensation at 1MHz, 1Vrms
For high dielectric constant at 1kHz, 1Vrms
Rated at 25V: C∆, X7R, Y5V
20
−1000 5 10 15 20 25
−60
−80
−40
−20
0
∆C/ C (%)
VDC
C∆
X7R
Y5V
AC Voltage
25
10 1 2 3 4 5
0
5
5
10
15
20
DCapacitance (%)
AC Voltage (Vrms)
For temperature compensation: 1MHz
For high dielectric constant: 1kHzRated at 25V: C∆, X7R, Y5V
Y5V X7R
C∆
Please verify individual characteristics at the design stage to ensure total suitability.
Multilayer Ceramic Chip Capacitors
Electrical Characteristics
Test Conditions and Specifications for Temperature Compensation type (CD to UD • SL Characteristics)
Test Items Specifications (C: nominal capacitance) Test Conditions
Capacitance Value Within tolerance
Capacitance
Fire Vol
C≤1000pF 1MHz±10% 0.5 to
5Vrms
C>1000pF 1kHz±10%
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
Insulation resistance (IR) (*1) 10,000MW or 500MW• mF min., whichever is less Measured after the rated voltage is applied for 1 minute
at normal room temperature and humidity. (*2)
Dielectric resistance (*1) No problem observed (*3)
Apply 3 times of the rated voltage for 1 to 5 seconds.
Appearance No problem observed Microscope (10×magnification)
Termination strength No problem observed Apply a sideward force of 500g (5N) (*4) to a PCB−
mounted sample.
Bending strength No mechanical damage at 1mm bent Glass epoxy PCB (t=1.6mm); fulcrum
Spacing: 90mm; for 10 seconds.
Vibration
test
Appearance No significant change is detected Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/ min.
In X, Y and Z directions:
2 hours each Total 6 hours
DCWithin tolerance
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
Soldering
heat
resistance
Appearance No significant change is detected Soak the sample in 260°C±5°C
solder for 10±0.5 seconds
and place in a room at normal temperature
and humidity; measure after 24±2 hours.
(Preheating Conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
DC±2.5% or ±0.25pF max., whichever is larger
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
IR (*1) 10,000MW or 500MW• mF min., whichever is smaller
Withstand voltage
(*1) Resists without problem
Solderability Solder coverage: 90% min.
Soaking Condition
Sn63 Solder
235±5°C 2±0.5 sec.
Sn-3Ag-0.5Cu
245±5°C 3±0.5 sec.
Temperature
cycle
Appearance No significant change is detected (Cycle)
Normal room temperature (3 min.) →
Lowest operation temperature (30 min.) →
Normal room temperature (3 min.) →
Highest operation temperature (30 min.) →
After five cycles, measure after 24±2 hours.
DC±2.5% or ±0.25pF max., whichever is larger
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
IR (*1) 10,000MW or 500MW• mF min., whichever is smaller
Withstand voltage
(*1) Resists without problem
Load
humidity
test (*5)
Appearance No significant change is detected
After appling rated voltage for
500+24/ −0 hours in pre−condition at
40±2°C, humidity 90 to 95%RH allow parts
to stabilize for 48±4 hours, at room
temperature before making measurements.
DC±7.5% or ±0.75pF max., whichever is larger
QC≥30pF: Q≥200
C<30pF: Q≥100+10C/ 3
IR (*1) 500MW or 25MW• mF min., whichever is smaller
High−
temperature
with
loading
Appearance No significant change is detected
After applying (*3) twice of the rated voltage
at a temperature of 125±3°C for
1000+48/ −0 hours, measure the sample
after storing 24±2 hours.
DC±3% or ±0.3pF max., whichever is larger
Q
C≥30pF: Q≥350
10pF≤C<30pF: Q≥275+5C/ 2
C<10pF: Q≥200+10C
IR (*1) 1,000MW or 50MW• mF min., whichever is smaller
*1 The charge and discharge current of the capacitor must not exceed 50mA.
*2 Apply 500V for 1 minute in case the rated voltage is 630V or higher.
*3 For the CF series, use 1.5 times when the rated voltage is 250V; use/ 1.2 times
when the rated voltage exceeds 630V.
*4 2N at 0201 Size
*5 Except CF series.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Conditions and Specifications for High Dielectric Type (X5R, X7R, Y5V)
Test Items Specifications Test Conditions
X7R/ X5R Y5V
Capacitance Value Within tolerance Do previous treatment (*8, *10)
Capacitance
Fire Vol
C≤10mF 1kHz±10% 1.0±0.2Vrms
C>10mF 120Hz±10% 0.5±0.2Vrms
tand (%)
2.5% max., 3.5% max.
(*1)
, 5.0% max.
(*2)
7.0% max.
(*3)
, 7.5% max.
(*4)
5.0% max., 7.0% max. (*5)
9.0% max. (*6), 12.5% max. (*7)
Insulation resistance (IR) (*11) 10,000MW or 500MW• mF min., whichever is less Measured after the rated voltage is applied for 1 minute
at normal room temperature and humidity. (*12)
Dielectric resistance (*11) No problem observed (*13)
Apply 2.5 times of the rated voltage for 1 to 5 seconds.
Appearance No problem observed Microscope (10×magnification)
Termination strength (*14) No problem observed Apply a sideward force of 500g (5N) (*15) to a
PCB−mounted sample.
Bending strength test (*14) No problem observed at 1mm bent
Glass epoxy PCB (*03, 05 type and CA Series: T=0.8mm);
fulcrum Spacing: 90mm; for 10 seconds.
Vibration
test
Appearance No significant change is detected Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/ min.
In X, Y and Z directions:
2 hours each Total 6 hours
DCWithin tolerance
tand (%) Satisfies the initial value
Soldering
heat
resistance
Appearance No significant change is detected Do previous treatment (*8)
Soak the sample in 260°C±5°C
solder for 10±0.5 seconds
and place in a room at normal temperature
and humidity; measure after 48±4 hours.
(Preheating Conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
DCWithin ±7.5% Within ±20%
tand (%) Satisfies the initial value
IR (*11) 10,000MW or 500MW• mF min., whichever is smaller
Withstand voltage
(*11)
Resists without problem
Solderability Solder coverage: 90% min.
Soaking Condition
Sn63 Solder
235±5°C 2±0.5 sec.
Sn-3Ag-0.5Cu
245±5°C 3±0.5 sec.
Temperature
cycle
Appearance No significant change is detected Do previous treatment (*8)
(Cycle)
Normal room temperature (3 min.) →
Lowest operation temperature (30 min.) →
Normal room temperature (3 min.) →
Highest operation temperature (30 min.) →
After five cycles, measure after 48±4hours.
DCWithin ±7.5% Within ±20%
tand (%) Satisfies the initial value
IR (*11) 10,000MW or 500MW• mF min., whichever is smaller
Withstand voltage
(*11)
Resists without problem
Load
humidity
test (*16)
Appearance No significant change is detected Do previous treatment (*9)
After applying rated voltage at
40±2°C and humidty 90 to 95%RH,
for 500+24/ −0 hours and keep at room
condition for 48±4 hours then measure
and check the specification limits.
DCWithin ±12.5% Within ±30%
tand (%) 200% max. of initial value 150% max. of initial value
IR (*11) 500MW or 25MW• mF min., whichever is smaller
High−
temperature
with
loading
Appearance No significant change is detected Do previous treatment (*9)
After applying twice (*17) of the rated
voltage at the highest operating temperature
for 1000+48/ −0 hours, measure the sample
after storing 48±4 hours.
DCWithin ±12.5% Within ±30%
tand (%) 200% max. of initial value 150% max. of initial value
IR (*11) 1,000MW or 50MW• mF min., whichever is smaller
*1 X7R 16V/ 25V type.
*2 Apply to X5R16V/ 25V type, X7R 6.3V/ 10V type.
*3 Apply to X5R 10V type.
*4 Apply to X5R 4V and 6.3V type.
*5 Apply to 25V series of CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over.
*6 Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type).
*7 Apply to Y5V 6.3V/ 10V type. Apply 16% max. to CM21Y5V106/ CM316Y5V226.
*8 Keep specimen at 150°C+0/ −10°C for one hour, leave specimen at room ambient
for 48±4 hours.
*9 Apply the same test condition for one hour, then leave the specimen at room ambi-
ent for 48±4 hours.
*10 Measurement condition 1kHz, 1Vrms for Y5V, C<47mF type.
*11 The charge/ discharge current of the capacitor must not exceed 50mA.
*12 For the CF series over 630V, apply 500V for 1 minute at room ambient.
*13 Use 1.5 times when the rated voltage is 250V or over.
Use 1.2 times when the rated voltage is 630V or over.
*14 Exclude CT series with thickness of less than 0.66mm and CA series.
*15 2N at 0201 Size
*16 Except CF series.
*17 Use 1.5 times when the rated voltage is 4V/ 6.3V/ 10V/ 250V and 100V (32X7R474/
43X7R105/ 55X7R105).
Use 1.2 times when the rated voltage is 630V or over.
* The above test conditions and standards do not apply to products with optional specifications.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Tape and Reel
• Reel
A
R
E
C
D
W1
W2
B
Reel (Unit: mm)
Code ABCD
Reel
7−inch Reel
(CODE: T, H) 180 +0
−2.0 f60 min.
13±0.5 21±0.8
13−inch Reel
(CODE: L, N) 330±2.0 f100±1.0
Code E W1W2R
Reel
7−inch Reel
(CODE: T, H) 2.0±0.5
10.0±1.5
16.5 max. 1.0
13−inch Reel
(CODE: L, N) 9.5±1.0
*
Carrier tape width 8mm.
For size 42 (1808) or over, Tape width 12mm and W1: 14±1.5, W2: 18.4mm max.
F=2mm (03, 05, 105 Type)
Feed Hole Punched rectangular hole to hold capacitor
J
F H 03 Type: 0.5 max.
05 Type: 0.75 max.
105 Type: 1.1 max.
(Paper)
F
A
BC
E
D
F=4mm (105, D11, D12, F12, 21, 316, 32, 42, 52 Type)
(Paper)(Plastic)
0.6 max.
φ1.0 +0.2
−0
1.1 max.
H GF
A
B
2.8 max.
C
E
D
Feed Hole Punched rectangular hole to hold capacitor
Holes only for plastic carrier tape.
J
F=8mm (43, 55 Type)
0.6 max.
φ1.0 +0.2
−0
GHF
(Plastic)
2.8 max.
A
BC
E
D
Feed Hole Punched rectangular hole to hold capacitor
J
Bulk Cassette (Unit: mm)
Slider
Shutter
Connection Area
110
36
12
Carrier Tape (Unit: mm)
Type A B F
03 (0.6×0.3) 0.37±0.03 0.67±0.03 2.0±0.05
05 (1.0×0.5) 0.65±0.1 1.15±0.1 2.0±0.05
105 (1.6×0.8) 1.0±0.2 1.8±0.2 4.0±0.1
D11 (1.37×1.0) 1.15±0.2 1.55±0.2 4.0±0.1
D12 (1.25×2.0) 1.5±0.2 2.3±0.2 4.0±0.1
F12 (1.25×2.0) 1.5±0.2 2.3±0.2 4.0±0.1
21 (2.0×1.25) 1.5±0.2 2.3±0.2 4.0±0.1
316 (3.2×1.6) 2.0±0.2 3.6±0.2 4.0±0.1
32 (3.2×2.5) 2.9±0.2 3.6±0.2 4.0±0.1
42 (4.5×2.0) 2.4±0.2 4.9±0.2 4.0±0.1
43 (4.5×3.2) 3.6±0.2 4.9±0.2 8.0±0.1
52 (5.7×2.0) 2.4±0.2 6.0±0.2 4.0±0.1
55 (5.7×5.0) 5.3±0.2 6.0±0.2 8.0±0.1
(Unit: mm)
F Carrier Tape C D E G H J
2.0
±0.05 8mm
Paper 8.0
±0.3
3.5
±0.05
1.75
±0.1
2.0
±0.05
4.0
±0.1
1.5
+0.1/ −0
4.0
±0.1
8mm
Plastic
12mm
Plastic
12.0
±0.3
5.5
±0.05
8.0
±0.1
Multilayer Ceramic Chip Capacitors
Packaging Options
Circuit Design
1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance
which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or
cause a short, open, smoking, or flaming to occur, etc.
2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical
devices; devices which are highly public orientated; and devices which demand a high standard of liability.
Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate
grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high
reliability design different from that of general purpose capacitors.
3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications.
Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and
specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short−circuit may occur.
The capacitor has a loss, and may self−heat due to equivalent series resistance when alternating electric current is passed therethrough. As
this effect becomes especially pronounced in high frequency circuits, please exercise caution.
When using the capacitor in a (self−heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature
for usage. Also, please make certain temperature rises remain below 20°C.
4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the
rated voltage when AC voltage is super−imposed to the DC voltage.
In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage.
Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations,
may cause the capacitor to smoke or flame.
5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage,
even though it is within the rated voltage, please inquire to the manufacturer.
In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is
within the rated voltage, it is possible capacitor reliability will deteriorate.
6. It is a common phenomenon of high−dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.
Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load
voltage at the time of operation.
7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in
the catalog and specifications.
In addition, it is a common piezo phenomenon of high dielectric products to have some voltage due to vibration or to have noise due to voltage
change. Please contact sales in such case.
8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the
respective product in order that the assembled product function appropriately.
9. Please contact us upon using conductive adhesives.
Storage
1. If the component is stored in minimal packaging (a heat−sealed or chuck−type plastic bag), the bag should be kept closed. Once the bag has
been opened, reseal it or store it in a desiccator.
2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH.
3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product
is exposed to such atmospheres, the terminals will oxidize and solderability will be effected.
4. Precautions 1) to 3) apply to chip capacitors packaged in carrier tapes and bulk cases.
5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are
followed.
6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.
Multilayer Ceramic Chip Capacitors
Precautions
Dimensions for recommended typical land
Land Pattern
Sample capacitor
Soldering resist
b a
c
When mounting the capacitor to the substrate, it is important to
consider carefully that the amount of solder (size of fillet) used has a
direct effect upon the capacitor once it is mounted.
a) The greater the amount of solder, the greater the stress to the
elements. As this may cause the substrate to break or crack, it is
important to establish the appropriate dimensions with regard to the
amount of solder when designing the land of the substrate.
b) In the situation where two or more devices are mounted onto a
common land, separate the device into exclusive pads by using
soldering resist.
Standard (Unit: mm)
Size L×W a b c
03 0.6×0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40
05 1.0×0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60
105 1.6×0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80
21 2.0×1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10
316 3.2×1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30
32 3.2×2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30
42 4.5×2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80
43 4.5×3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00
52 5.7×2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80
55 5.7×5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70
*
CA series: Please refer applicable page.
Automotive Series (Unit: mm)
Size L×W a b c
105 1.6×0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00
21 2.0×1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40
316 3.2×1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80
Ideal Solder Thickness
Chip Capacitor
PCB
Solder
T/ 3 to T/ 2
T
Typical mounting problems
Item Not recommended example Recommended example/ Separated by solder
Multiple parts mount
Solder resist
Mount with
leaded parts
Wire soldering
after mounting
Overview
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Mounting Design
The chip could crack if the PCB warps during processing after the chip has been soldered.
Recommended chip position on PCB to minimize stress from PCB warpage
(Not recommended) (Ideal)
Actual Mounting
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
Crack
Support pin
4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.
Resin Mold
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a
low shrinkage resin.
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage.
Such gases may crack the chip capacitor or damage the device itself.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference
(Delta T) to within 130 degree Celsius.
2) The product size 1.0×0.5mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of over 3.2×2.5mm, 0.6×0.3mm,
and capacitor arrays can be used in reflow.
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.
3) Please see our recommended soldering conditions.
4) In case of using Sn-Zn Solder, please contact us in advance.
Recommended Temperature Profile (62Sn Solder) Recommended Temperature Profile (Sn−3Ag−0.5Cu)
Reflow Reflow
∆T
300
250
200
150
100
50
0
Preheat
60 seconds
Temperature
Peak temperature
230°C±5°C
15 seconds maximum
60 seconds
More than180°C,
40 seconds maximum
Cool at normal room
temperature after
removing from
furnace.
① Minimize soldering time.
② Ensure that the temperature difference (∆T) does not exceed 150°C.
③ Ensure that the temperature difference (∆T) does not exceed 130°C for 3.2×2.5mm size or larger.
④MLCC can withstand the above reflow conditions up to 3 times.
300
250
200
150
100
50
0
Preheat
Temperature
250°C±5°C
5 to 10 sec. max.
90±30 sec.
220°C max.
90 sec. max.
170 to 180°C1 to 3°C/ sec.
① Minimize soldering time.
② Ensure that allowable temperature difference does not exceed 150°C.
③ Ensure that allowable temperature difference does not exceed 130°C for 3.2×2.5mm size or larger.
Wave Wave
① Ensure that the chip capacitor is preheated adequately.
② Ensure that the temperature difference (∆T) does not exceed 150°C.
③ Cool naturally after soldering.
④ Wave soldering is not applicable for chips with size of 3.2x2.5mm or larger.
300
250
200
150
100
50
0
Preheat
Temperature
60 to 120 sec.
5 sec. max.
Cool at normal
room temperature
∆T
230°C
to
260°C
① Ensure that the chip capacitor is preheated adequately.
② Ensure that the temperature difference (∆T) does not exceed 150°C.
③ Cool naturally after soldering.
④ Wave soldering is not applicabel for chips with size of 3.2s2.5mm or larger.
Cool at normal
room temperature
Preheat
5 sec. max.
300
250
200
150
100
Temperature
60 to 120 sec.
∆T
245°C
to
260°C
Sodering iron
1) Temperature of iron chip
2) Wattage
3) Tip shape of soldering iron
4) Soldering Time
380°C max.
80W max.
f3.0mm max.
3 sec. max.
5) Cautions
a) Pre−heating is necessary Rapid heating must be avoided.
Delta T≤150°C
b) Avoid direct touching to capacitors.
c) Avoid rapid cooling after soldering. Natural cooling is recommended.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information