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PI6C49006
Block Diagram
Description
The new PI6C49006 is a high performance clock generator
intended for all kinds of embedded applications, which include
Wireless AP & Femtocell BTS, Multi Function Printer, and other
PCIe/Networking applications. It is the most cost effective way
to generate a high quality, high frequency clock output from a
crystal and reference clock. The device can generate 100/125MHz
HCSL outputs for PCIe, selectable 33/50/66/100/133 LVMOS
clock for network processor and DSP and 25MHz Ethernet clock
combination.
Features
3.3V supply voltage
25MHz XTAL or reference clock input
Output
4 x PCIe 2.0 100MHz/125MHz clock with spread
spectrum support
(2+2) x selectable 33/50/66/100/133MHz LVCMOS
clock with ±10% frequency margin
1 x 125MHz LVCMOS clock
2 x 25MHz LVCMOS clock
1 x 25MHz Dierential clock (HCSL type)
Packaging (Pb free and Green)
48-pin TSSOP (A)
Embedded Clock Generator
PLL Clock Synthesis
& Spread Spectrum
& Control Circuit
Crystal
Oscillator
X1/ICL
K
X2
125MHz_Out 0
FS0
SCLK
FS2
FS3
OutB_(2~3)
OutB_(0~1)
FS1
25MHz_Out Diff
PCIE(0~3)
25MHz_Out (1~2)
FS4
4
I2C Control
Circuit
SDATA
RESET#
2
2
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PI6C49006
Embedded Clock Generator
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Pin Description
Pin# Pin Name Pin Ty pe Pin Description
1VDD Power 3.3V Supply Pin
2IREF Output Connect to 475 ohm resistor to set HCSL output drive
current
3PCIE0N Output 100/125MHz HCSL output
4PCIE0 Output 100/125MHz HCSL output
5GND Power Ground
6GND Power Ground
7VDD Power 3.3V Supply Pin
8OutB_0 Output 33/50/66 MHz selectable LVCMOS output
9OutB_1 Output 33/50/66MHz selectable LVCMOS output
10 SCLK Input I2C compatible clock
11 SDATA Input I2C compatible data
12 GND Power Ground
13 OutB_2 Output 50/66/100/133 MHz selectable LVCMOS output
14 OutB_3 Output 50/66/100/133 MHz selectable LVCMOS output
15 VDD Power 3.3V Supply Pin
Pin List
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VDD
IREF
PCIE0N
PCIE0
GND
GND
VDD
OutB_0
OutB_1
SCLK
SDATA
GND
OutB_2
OutB_3
VDD
VDD
GND
25M_Out1
25M_Out2
VDD
25M_Out Diff+
25M_Out Diff-
GND
RESET#
GND
VDDA
PCIE1N
PCIE2
PCIE2N
VDD
PCIE3N
PCIE3
NC
NC
GND
FS0
FS1
FS2
FS3
FS4
GND
125M_Out0
VDD
GND_XTAL
VDD_XTAL
X2
X1
PCIE1
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PI6C49006
Embedded Clock Generator
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Pin List
Pin# Pin Name Pin Ty pe Pin Description
16 VDD Power 3.3V Supply Pin
17 GND Power Ground
18 25M_Out1 Output 25.MHz LVCMOS output
19 25M_Out2 Output 25MHz LVCMOS output
20 VDD Power 3.3V Supply Pin
21 25M_Out Di+ Output 25MHz HCSL output, follow matching circuit in Figure 4
22 25M_Out Di- Output 25MHz HCSL output, follow matching circuit in Figure 4
23 GND Power Ground
24 RESET# Input
Power down reset - When low all PLLs are powered down
and outputs tristated. SMBus registers are reset to default
values
25 X1 Input Crystal input. Integrated 6pF capacitance
26 X2 Output Crystal output. Integrated 6pF capacitance
27 VDD_XTAL Power 3.3V Supply Pin for XTAL
28 GND_XTAL Power Ground for XTAL
29 VDD Power 3.3V Supply Pin
30 125M_Out0 Output 125MHz LVCMOS output
31 GND Power Ground
32 FS4 Input Frequency select pin for Bank C 25/125MHz LVCMOS
output
33 FS3 Input Frequency select pin for Bank B 33/50/66/100/133MHz
LVCMOS output
34 FS2 Input Frequency select pin for Bank B 33/50/66/100/133MHz
LVCMOS output
35 FS1 Input Frequency select pin for Bank B 33/50/66/100/133MHz
LVCMOS output
36 FS0 Input Frequency select pin for Bank A 100/125MHz HCSL
output
37 GND Power Ground
38 NC -Do Not Connect
39 NC -Do Not Connect
40 PCIE3 Output 100/125MHz HCSL output
41 PCIE3N Output 100/125MHz HCSL output
42 VDD Power 3.3V Supply Pin
43 PCIE2N Output 100/125MHz HCSL output
44 PCIE2 Output 100/125MHz HCSL output
45 PCIE1 Output 100/125MHz HCSL output
46 PCIE1N Output 100/125MHz HCSL output
47 VDDA Power Analog Power Supply Pin. See Application Circuit in
Figure 5
48 GND Power Ground
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PI6C49006
Embedded Clock Generator
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Selection Table 1 – 100MHz/125MHz PCIe clock in
bank A
FS0 PCIE(0~3)
0 100MHz
1 125MHz
Selection Table 2 – Spread Spectrum
SS1 SS0 SSC
0 0 No spread
0 1 Down -0.75%
1 0 Down -0.5%
1 1 No spread
Selection Table 3 – 33/50/66/100/133MHz LVCMOS clock in bank B
FS1 FS2 FS3 OutB_0/1 OutB_2/3
0 0 0 1. Output disable in hardware control
mode, internal pull-down
2. Output = 50MHz in software control
mode
1. Output disable in hardware control
mode, internal pull-down
2. Output = 133MHz in software control
mode
0 0 1 33M 66M
0 1 0 50M 100M
0 1 1 66M 133M
1 0 0 33M 50M
1 0 1 33M 100M
1 1 0 66M 50M
1 1 1 66M 100M
Selection Table 4 – 25/125MHz LVCMOS/25MHz Diff clock in bank C
FS4 125M_Out0 25M_Out1 25M_Out2 25M_Out Diff
0 Output disable, internal
pull-down
25MHz 25MHz Output disable, internal
pull-down
1 125MHz 25MHz 25MHz Output disable, internal
pull-down
NC Output disable, internal
pull-down
Output disable, internal
pull-down
Output disable, internal
pull-down
25MHz Diff
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Embedded Clock Generator
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OutB_1 Frequency Margining Table
FM3 FM2 FM1 FM0 OutB_(2~3)
0 0 0 0 nominal
0 0 0 1 nominal + 1%
0 0 1 0 nominal + 2%
0 0 1 1 nominal + 3%
0 1 0 0 nominal + 4%
0 1 0 1 nominal + 5%
0 1 1 0 nominal + 6%
0 1 1 1 nominal + 8%
1 0 0 0 nominal + 10%
1 0 0 1 nominal - 1%
1 0 1 0 nominal - 2%
1 0 1 1 nominal - 3%
1 1 0 0 nominal - 4%
1 1 0 1 nominal - 6%
1 1 1 0 nominal - 8%
1 1 1 1 nominal - 10%
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PI6C49006
Embedded Clock Generator
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Serial Data Interface (SMBus)
PI6C49006 is a slave only SMBus device that supports indexed block read and indexed block write protocol using a single 7-bit ad-
dress and read/write bit as shown below.
Address Assignment
A6 A5 A4 A3 A2 A1 A0 R/W
1 1 0 1 0 0 1 0/1
How to Write
1 bit 8 bits 1 8 bits 1 8 bits 1 8 bits 1 8 bits 1 1 bit
Start
bit D2H Ack Register
offset Ack Byte
Count = N Ack Data Byte
0Ack Data Byte
N - 1 Ack Stop bit
Note:
1. Register offset for indicating the starting register for indexed block write and indexed block read. Byte Count in write mode cannot be 0.
Byte 0: Spread Spectrum Control Register
Bit Description Type Power Up
Condition
Output(s)
Affected Notes
7 OE for OutB_2 RW 1
50/66/100/133 MHz
selectable LVCMOS
output
0 = disabled
1 = enabled
6Enables hardware or software control of OE bits
(see Byte 0–Bit 6 and Bit 5 Functionality table) RW 0 RESET# pin, bit 5 0 = hardware cntl
1 = software ctrl
5
Software RESET# bit. Enables or disables all
outputs
(see Byte 0–Bit 6 and Bit 5 Functionality table)
RW 1 All outputs 0 = disabled
1 = enabled
4 Frequency margining select bit FM3 RW 1
OutB_2,3
See OutB_2,3 Fre-
quency Margining
Table on Page 5
3 Frequency margining select bit FM2 RW 0
2 Frequency margining select bit FM1 RW 1
1 Frequency margining select bit FM0 RW 0
0 OE for OutB_3 RW 1
50/66/100/133 MHz
selectable LVCMOS
output
0 = disabled
1 = enabled
How to Read (M: abbreviation for Master or Controller; S: abbreviation for slave/clock)
1 bit 8 bits 1 bit 8 bits 1 bit 1 bit 8 bits 1 bit 8 bits 1 bit 8 bits 1 bit 8 bits 1 bit 1 bit
M:
Start
bit
M:
Send
"D2h"
S:
sends
Ack
M: send
starting
databyte
location:
N
S:
sends
Ack
M:
Start
bit
M:
Send
"D3h"
S:
sends
Ack
S:
sends
# of
data
bytes
that
will
be
sent:
X
M:
sends
Ack
S:
sends
start-
ing
data
byte
N
M:
sends
Ack
S:
sends
data
byte
N+X-
1
M:
Not
Ac-
knowl-
edge
M:
Stop
bit
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PI6C49006
Embedded Clock Generator
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Byte 1: Control Register
Bit Description Type Power Up Condi-
tion Output(s) Affected Notes
7 OE for 25M_Out Diff RW 1 25M_Out Diff 0 = disabled
1 = enabled
6 OE for 25M_Out2 RW 1 25M_Out2 0 = disabled
1 = enabled
5 OE for 25M_Out1 RW 1 25M_Out1 0 = disabled
1 = enabled
4 OE for 125_Out0 RW 1 125_Out0 0 = disabled
1 = enabled
3 OE for OutB_1 RW 1 OutB_1 0 = disabled
1 = enabled
2 OE for OutB_0 RW 1 OutB_0 0 = disabled
1 = enabled
1Spread Spectrum Selection for
100MHz HCSL PCI Express clocks
Bit 1: SS1, Bit 0:SS0
RW 0
All 100MHz HCSL PCI
Express outputs
See Selection Table
2 - Spread Spec-
trum
0RW 0
Byte 2: Control Register
Bit Description Type Power Up Condi-
tion Output(s) Affected Notes
7 to 0 Reserved R Undened Not Applicable
Byte 0 - Bit 6 and Bit 5 Functionality
Bit 6 Bit 5 Description
0 X (RESET# = "H" will enable all outputs; SMBus cannot control each output.)
1 0 Disables all outputs and tri-states the outputs, RESET# HW pin/signal = DO NOT CARE
1 1 Enable outputs according to the SMBus default values; SMBus can control each output.
RESET# HW pin/signal, FS1, FS2, FS3 and FS4 = DON'T CARE
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Embedded Clock Generator
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Byte 4 & 5: Control Register
Bit Description Type Power Up Condi-
tion Output(s) Affected Notes
7 to 0 Reserved R Undened Not Applicable
Byte 6: Control Register
Bit Description Type Power Up Condi-
tion Output(s) Affected Notes
7 Revivsion ID bit 3 R 0 Not Applicable
6 Revivsion ID bit 2 R 0 Not Applicable
5 Revivsion ID bit 1 R 0 Not Applicable
4 Revivsion ID bit 0 R 0 Not Applicable
3 Vendor ID bit 3 R 0 Not Applicable
2 Vendor ID bit 2 R 0 Not Applicable
1 Vendor ID bit 1 R 1 Not Applicable
0 Vendor ID bit 0 R 1 Not Applicable
Byte 3: Control Register
Bit Description Type Power Up Con-
dition Output(s) Affected Notes
7 Reserved RW Undened Not Applicable
6 Reserved RW 1Not Applicable
5 Reserved RW 1Not Applicable
4 OE for 100M_Out3 HCSL Output RW 1 100M_Out3 0 = disabled
1 = enabled
3 OE for 100M_Out2 HCSL Output RW 1 100M_Out2 0 = disabled
1 = enabled
2 OE for 100M_Out1 HCSL Output RW 1 100M_Out1 0 = disabled
1 = enabled
1 OE for 100M_Out0 HCSL Output RW 1 100M_Out0 0 = disabled
1 = enabled
0 Reserved R Undened Not Applicable
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Embedded Clock Generator
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Recommended Operation Conditions1 (Over operating free-air temperature range)
Symbol Parameters Min. Max. Units
VDD 3.3V I/O Supply Voltage -0.5 4.6
VVIH Input High Voltage 4.6
VIL Input Low Voltage -0.5
Ts Storage Temperature -65 150 °C
VESD ESD Protection 2000 V
Maximum Supply Voltage, VDD .............................................................. 7V
All Inputs and Outputs ................................................ –0.5V to VDD +0.5V
Ambient Operating Temperature ........................................... 0°C to +70°C
Storage Temperature ........................................................ –65°C to +150°C
Junction Temperature ........................................................................125°C
Peak Soldering Temperature..............................................................260°C
Note:
Stresses greater than those listed under MAXIMUM RAT-
INGS may cause permanent damage to the device. This is
a stress rating only and functional operation of the device
at these or any other conditions above those indicated in
the operational sections of this specication is not implied.
Exposure to absolute maximum rating conditions for ex-
tended periods may affect reliability.
Maximum Ratings
(Above which useful life may be impaired. For user guidelines, not tested.)
DC Electrical Characteristics
Unless otherwise specied, VDD=3.3V±5%, Ambient Temperature 0°C to +70°C
Parameter Symbol Conditions Min Typ Max Units
Operating Supply Volt-
age VDD 3.135 3.465
V
Analog Supply Voltage VDDA 3.135 3.465
Input High Voltage VIH 2 VDD
Input Low Voltage VIL –0.3 0.8
Input High Voltage VIH SDATA, SCLK, FS4 0.7VDD VDD
Input Low Voltage VIL SDATA, SCLK, FS4 0.3VDD
Operating Supply Cur-
rent IDD 197 230
mA
IDD at Output Disable
Condition
RESET# = 0 4.3
Internal Pull-Up/Pull-
Down Resistor RPU/RPD
RESET# 216 k–Ohm
All single-ended outputs 75
Input Capacitance CIN All input pins 6 pF
Pin FS4 External Pull-
Up/Pull-Down Resistor RFS4Ext 470 Ohm
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Electrical Characteristics - Single-Ended
Unless otherwise specied, VDD=3.3V±5%, Ambient Temperature 0°C to +70°C
Parameter Symbol Conditions Min Typ Max Units
Input Clock Frequency FIN 25 MHz
SCLK Frequency 100 400 kHz
Minimum Pulse Width
of RESET# Input 100 ns
Output Frequency
Error FM0, FM3 = 0 0 ppm
Output Rise/Fall Time tr, tf20% to 80% 1 2 ns
Output Clock Duty
Cycle Measured at VDD/2 45 50 57 %
High-Level Output
Voltage VOH IOH = -4mA VDD-0.4
High-Level Output
Voltage VOH IOH = -8mA 2.4
V
Low-Level Output
Voltage VOL IOL = 8mA 0.4
Peak-to-Peak Jitter
125MHz clock output 140 200
ps
33/50/66/100/133MHz clock
output 125 175
25MHz clock output 115 150
Cycle-to-Cycle Jitter
125MHz clock output 120 175
33/50/66/100/133MHz clock
output 120 160
25MHz clock output 120 160
Clock Stabilization
Time from Power Up 3 10 ms
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Embedded Clock Generator
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Electrical Characteristics - 100MHz Differential HCSL Outputs
Unless otherwise specied, VDD=3.3V±5%, Ambient Temperature 0°C to +70°C
Parameter Symbol Conditions Min Ty p Max Units
Output Frequency 100 MHz
Cycle-to-Cycle Jitter T
CC/Jitter
150
ps
Peak-to-Peak Phase
Jitter
Using PCIe jitter measure-
ment method 86
PCIe 2.0 RMS Phase
Jitter JRMS2.0
PCIe 2.0 Test Method @
100MHz Output 3.1 ps
Spread Modulation
Percentage -0.5 0 %
Spread Modulation
Frequency 32 kHz
Duty Cycle T
DC
45 50 55 %
SE Rise/Fall Time
Measured from 0.175V
to 0.525V
Tor , Tof
1. RL=50-Ohm with CL =
2pF
2. Single-ended waveform
175 700 ps
Output Skew TOSKEW
VT = 50%(measurement
threshold) 200 ps
High-Level Output
Voltage VOH
Note 2, (RS=33-Ohm,
R
T
=50-Ohm) 0.65 0.71 0.95
V
Low-Level Output
Voltage VOL 0.20 00.05
I
OH
@ 6*I
REF
I
OH
13 14.2 19 mA
Absolute Crossing
Point Voltage VCROSS Note 2, 5, 6 0.25 0.55 V
Variation of VCROSS
over all rising clock
edges
VCROSS Delta Note 2, 5, 8 140 mV
Average Clock Period
Accuracy TPE R IO D AVG Note 3, 9, 10 300 2800 ppm
Absolute Period
(including jitter and
spread spectrum)
TPERIOD ABS Note 3, 7 9.847 10.203 ns
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Embedded Clock Generator
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Notes:
1. Measured at the end of an 8-inch trace with a 5pF load.
2. Measurement taken from a single-ended waveform.
3. Measurement taken from a differential waveform.
4. Measured from -150 mV to +150 mV on the differential waveform. The signal is monotonic through the measurement region for rise and fall time.
The 300 mV measurement window is centered on the differential zero crossing.
5. Measured at crossing point where the instantaneous voltage value of the rising edge of 100M+ equals the falling edge 100M.
6. Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing.
Refers to all crossing points for this measurement.
7. Denes as the absolute minimum or maximum instantaneous period. This includes cycle-to-cycle jitter, relative PPM tolerance,
and spread spectrum modulation.
8. Dened as the total variation of all crossing voltages of rising 100M+ and falling 100M.
9. Refer to section 4.3.2.1 of the PCI Express Base Specication, Revision 1.1 for information regarding PPM considerations.
10. 10) PPM refers to parts per million and is a DC absolute period accuracy specication. 1 PPM is 1/1,000,000th of 100 MHz exactly or 100 Hz. For 300 PPM
there is an error budget of 100Hz/PPM * 300 PPM = 30 kHz. The period is measured with a frequency counter with measurement window set at 100 ms or
greater. With spread spectrum turned off the error is less than ±300 ppm. With spread spectrum turned on there is an additional +2500 PPM nominal shift in
maximum period resulting from the -0.5% down spread.
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Embedded Clock Generator
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C1
18pF
Crystal(CL=18pF)
C2
18pF
XTAL_IN
XTAL_OUT
SaRonix-eCera
CG2500003
Application Notes
Crystal circuit connection
e following diagram shows PI6C49006 crystal circuit connection with a parallel crystal. For the CL=18pF
crystal, it is suggested to use C1= 18pF, C2= 18pF. C1 and C2 can be adjusted to ne tune to the target ppm of
crystal oscillator according to dierent board layouts.
Crystal Oscillator Circuit
Recommended Crystal Specification
Pericom recommends:
a) GC2500003 XTAL 49S/SMD(4.0 mm), 25M, CL=18pF, +/-30ppm, http://www.pericom.com/pdf/datasheets/se/GC_GF.pdf
b) FY2500081, SMD 5x3.2(4P), 25M, CL=18pF, +/-30ppm, http://www.pericom.com/pdf/datasheets/se/FY_F9.pdf
c) FL2500047, SMD 3.2x2.5(4P), 25M, CL=18pF, +/-20ppm, http://www.pericom.com/pdf/datasheets/se/FL.pdf
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Conguration test load board termination for HCSL Outputs
Rs
33Ω
5%
Rs
33Ω
5%
Rp
49.9Ω
1%
475Ω
1%
Rp
49.9Ω
1%
2pF
5%
2pF
5%
Clock#
Clock
TLA
TLB
PI6C49006
Figure 4. Conguration Test Load Board Termination
3.3V ± 5%
0.1μF
10μF
0.1μF
5.1ohm
VDDA
VDD
Figure 5. Power Supply Filter
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Embedded Clock Generator
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Ordering Information(1-3)
Ordering Code Package Code Package Description
PI6C49006AE A 48-pin, Pb-free & Green, TSSOP, (A48)
Notes:
1. Thermal characteristics can be found on the company web site at www.pericom.com/packaging/
2. E = Pb-free and Green
3. Adding an X sufx = Tape/Reel
Pericom Semiconductor Corporation • 1-800-435-2336 www.pericom.com
1
.236
.244
.488
.496
.002
.006
SEATING PLANE
.007
.010
.0197
BSC
.004
.008
.319
1
48
12.4
12.6
6.0
6.2
0.50 0.17
0.27
8.1
0.05
0.15
0.09
0.20
X.XX
X.XX
DENOTES DIMENSIONS
IN MILLIMETERS
.018
.030
0.45
0.75
.047
1.20 Max
BSC
DOCUMENT CONTROL NO.
PD - 1501
REVISION: G
DATE: 03/09/05
Note:
1. Controlling dimensions in millimeters.
2. Ref: JEDEC MO-153F/ED
3. Dimension does not include mold ash, protrusions or gate burrs. Mold ash, protru-
sions and gate burrs shall not exceed 0.15mm per side.
4. Dimension does not include interlead ash or protrusion. Interlead ash or protrusion
shall not exceed 0.25mm per side. DESCRIPTION: 48-Pin 240-Mil Wide TSSOP
PACKAGE CODE: A
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 • www.pericom.com
See Note 3
See Note 4
Note:
For latest package info, please check: http://www.pericom.com/products/packaging/mechanicals.php
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