© Semiconductor Components Industries, LLC, 2014
November, 2014 − Rev. 1
1Publication Order Number:
NTST40100CT/D
NTST40100CTG,
NTSB40100CT-1G,
NTSB40100CTG,
NTSJ40100CTG
Very Low Forward Voltage
Trench-based Schottky
Rectifier
Exceptionally Low VF = 0.38 V at IF = 5 A
Features
•Fine Lithography Trench−based Schottky Technology for Very Low
Forward Voltage and Low Leakage
•Fast Switching with Exceptional Temperature Stability
•Low Power Loss and Lower Operating Temperature
•Higher Efficiency for Achieving Regulatory Compliance
•Low Thermal Resistance
•High Surge Capability
•Pb−Free and Halide−Free Packages are Available
Typical Applications
•Switching Power Supplies including Notebook / Netbook Adapters,
ATX and Flat Panel Display
•High Frequency and DC−DC Converters
•Freewheeling and OR−ing diodes
•Reverse Battery Protection
•Instrumentation
Mechanical Characteristics
•Case: Epoxy, Molded
•Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead Temperature for Soldering Purposes: 260°C Maximum for
10 sec
1
3
2, 4
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See detailed ordering and shipping information on page 5 of
this data sheet.
ORDERING INFORMATION
PIN CONNECTIONS
TO−220AB
CASE 221A
STYLE 6
3
4
123
4
12
I2PAK
CASE 418D
STYLE 3
D2PAK
CASE 418B
TO−220FP
CASE 221AH
3
4
12
NTST40100CTG, NTSB40100CT−1G, NTSB40100CTG, NTSJ40100CTG
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
100 V
Average Rectified Forward Current
(Rated VR, TC = 120°C) Per device
Per diode
IF(AV) 40
20
A
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC = 125°C) Per device
Per diode
IFRM 60
30
A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM 250 A
Operating Junction Temperature TJ−40 to +150 °C
Storage Temperature Tstg −40 to +150 °C
Voltage Rate of Change (Rated VR) dv/dt 10,000 V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Rating Symbol
NTST40100CTG,
NTSB40100CT−1G NTSB40100CTG NTSJ40100CTG Unit
Maximum Thermal Resistance per Diode
Junction−to−Case
Junction−to−Ambient
RqJC
RqJA
1.3
70
0.79
46.3
4.0
105
°C/W
°C/W
ELECTRICAL CHARACTERISTICS (Per Leg unless otherwise noted)
Rating Symbol Typ Max Unit
Maximum Instantaneous Forward Voltage (Note 1)
(IF = 5 A, TJ = 25°C)
(IF = 10 A, TJ = 25°C)
(IF = 20 A, TJ = 25°C)
(IF = 5 A, TJ = 125°C)
(IF = 10 A, TJ = 125°C)
(IF = 20 A, TJ = 125°C)
vF0.46
0.56
0.71
0.41
0.52
0.63
−
−
0.80
−
−
0.68
V
Maximum Instantaneous Reverse Current (Note 1)
(VR = 70 V, TJ = 25°C)
(VR = 70 V, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 125°C)
IR12
8.0
20
20
1000
45
mA
mA
mA
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%
NTST40100CTG, NTSB40100CT−1G, NTSB40100CTG, NTSJ40100CTG
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3
TYPICAL CHARACTERISTICS
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Typical Reverse Characteristics
VF
, INSTANTANEOUS FORWARD VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)
0.70.60.50.40.30.20.10
0.1
1
10
100
9080706050403020
0.001
0.01
0.1
1
10
100
Figure 3. Typical Junction Capacitance Figure 4. Current Derating per Leg
VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C)
1001010.1
10
100
1000
10,000
140120100806040200
0
5
10
15
20
30
35
40
Figure 5. Current Derating Figure 6. Forward Power Dissipation
TC, CASE TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (A)
140120100806040200
0
10
20
30
50
60
70
80
2218 24106420
0
2
4
8
10
12
16
18
iF
, INSTANTANEOUS FORWARD
CURRENT (A)
IR, INSTANTANEOUS REVERSE
CURRENT (mA)
C, JUNCTION CAPACITANCE (pF)
IF(AV), AVERAGE FORWARD CURRENT (A)
IF(AV), AVERAGE FORWARD CURRENT (A)
PF(AV), AVERAGE FORWARD POW-
ER DISSIPATION (W)
1.11.00.90.8 100
25
40
812141620
6
14
TA = 125°C
TA = 150°C
TA = 25°CTA = 125°C
TA = 150°C
TA = 25°C
TJ = 25°C
Square Wave
DC
RqJC = 1.3°C/W
Square Wave
DC
RqJC = 1.3°C/W
Square Wave
DC
TJ = 150°C
IPK/IAV = 5
1020
NTST40100CTG, NTSB40100CT−1G, NTSB40100CTG, NTSJ40100CTG
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4
TYPICAL CHARACTERISITICS
0.01
0.1
1
10
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 100
0
10%
5%
2%
20%
1%
50% Duty Cycle
Single Pulse
t, Pulse Time (sec)
R(t), TYPICAL TRANSIENT THERMAL
RESISTANCE (°C/W)
Figure 7. Typical Transient Thermal Response for NTST40100CT and NTSB40100CT−1G
10%
5%
2%
20%
1%
50% Duty Cycle
Single Pulse
t, Pulse Time (sec)
R(t), TYPICAL TRANSIENT THERMAL
RESISTANCE (°C/W)
0.001
0.01
0.1
1
10
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 100
0
Figure 8. Typical Transient Thermal Response for NTSJ40100CTG
Figure 9. Typical Transient Thermal Response for NTSB40100CTG
0.01
0.1
1
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 100
0
10%
5%
2%
20%
1%
50% Duty Cycle
Single Pulse
t, Pulse Time (sec)
R(t), TYPICAL TRANSIENT THERMAL
RESISTANCE (°C/W)
NTST40100CTG, NTSB40100CT−1G, NTSB40100CTG, NTSJ40100CTG
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5
ORDERING INFORMATION
Device Package Shipping†
NTST40100CTG TO−220AB
(Pb−Free)
50 Units / Rail
NTSB40100CT−1G I2PAK
(Pb−Free)
50 Units / Rail
NTSB40100CTG D2PAK
(Pb−Free)
50 Units / Rail
NTSB40100CTT4G D2PAK
(Pb−Free)
800 / Tape & Reel
NTSJ40100CTG TO−220FP
(Halide−Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MARKING DIAGRAMS
A = Assembly Location
Y = Year
WW = Work Week
AKA = Polarity Designator
x = G or H
G = Pb−Free Package
H = Halide−Free Package
AY WW
TS40100CG
AKA
AY WW
TS40100CG
AKA
AY WW
TS40100Cx
AKA
TO−220AB I2PAK D2PAKTO−220AB
AYWW
TS40100CG
AKA
TO−220FP
NTST40100CTG, NTSB40100CT−1G, NTSB40100CTG, NTSJ40100CTG
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6
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.570 0.620 14.48 15.75
B0.380 0.415 9.66 10.53
C0.160 0.190 4.07 4.83
D0.025 0.038 0.64 0.96
F0.142 0.161 3.61 4.09
G0.095 0.105 2.42 2.66
H0.110 0.161 2.80 4.10
J0.014 0.024 0.36 0.61
K0.500 0.562 12.70 14.27
L0.045 0.060 1.15 1.52
N0.190 0.210 4.83 5.33
Q0.100 0.120 2.54 3.04
R0.080 0.110 2.04 2.79
S0.045 0.055 1.15 1.39
T0.235 0.255 5.97 6.47
U0.000 0.050 0.00 1.27
V0.045 --- 1.15 ---
Z--- 0.080 --- 2.04
B
Q
H
Z
L
V
G
N
A
K
F
123
4
D
SEATING
PLANE
−T−
C
S
T
U
R
J
STYLE 6:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
I2PAK (TO−262)
CASE 418D
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
−T−
W
G
K
A
C
E
V
J
H
123
4
SEATING
PLANE
D3 PL
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.335 0.380 8.51 9.65
B0.380 0.406 9.65 10.31
C0.160 0.185 4.06 4.70
D0.026 0.035 0.66 0.89
E0.045 0.055 1.14 1.40
G0.100 BSC 2.54 BSC
H0.094 0.110 2.39 2.79
J0.013 0.025 0.33 0.64
S0.390 REF 9.90 REF
V0.045 0.070 1.14 1.78
W0.522 0.551 13.25 14.00
−B−
M
B
M
0.13 (0.005) T
S
F
F0.122 REF 3.10 REF
K0.500 0.562 12.70 14.27
NTST40100CTG, NTSB40100CT−1G, NTSB40100CTG, NTSJ40100CTG
www.onsemi.com
7
PACKAGE DIMENSIONS
SEATING
PLANE
S
G
D
−T−
M
0.13 (0.005) T
231
4
3 PL
K
J
H
V
E
C
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.340 0.380 8.64 9.65
B0.380 0.405 9.65 10.29
C0.160 0.190 4.06 4.83
D0.020 0.035 0.51 0.89
E0.045 0.055 1.14 1.40
G0.100 BSC 2.54 BSC
H0.080 0.110 2.03 2.79
J0.018 0.025 0.46 0.64
K0.090 0.110 2.29 2.79
S0.575 0.625 14.60 15.88
V0.045 0.055 1.14 1.40
−B−
M
B
W
W
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
F0.310 0.350 7.87 8.89
L0.052 0.072 1.32 1.83
M0.280 0.320 7.11 8.13
N0.197 REF 5.00 REF
P0.079 REF 2.00 REF
R0.039 REF 0.99 REF
M
L
F
M
L
F
M
L
F
VARIABLE
CONFIGURATION
ZONE RN P
U
VIEW W−W VIEW W−W VIEW W−W
123
D2PAK 3
CASE 418B−04
ISSUE K
NTST40100CTG, NTSB40100CT−1G, NTSB40100CTG, NTSJ40100CTG
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8
PACKAGE DIMENSIONS
TO−220 FULLPACK, 3−LEAD
CASE 221AH
ISSUE F
SCALE 1:1
DIM MIN MAX
MILLIMETERS
D14.70 15.30
E9.70 10.30
A4.30 4.70
b0.54 0.84
P3.00 3.40
e
L1 --- 2.80
c0.49 0.79
L12.50 14.73
b2 1.10 1.40
Q2.80 3.20
A2 2.50 2.90
A1 2.50 2.90
H1 6.60 7.10
E
Q
L1
b2
e
D
L
P
123
b
SEATING
PLANE
A
A1
H1
A2
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR UNCONTROLLED IN THIS AREA.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE
PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO
EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE
MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY.
5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION.
LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00.
6. CONTOURS AND FEATURES OF THE MOLDED PACKAGE BODY
MAY VARY WITHIN THE ENVELOP DEFINED BY DIMENSIONS A1
AND H1 FOR MANUFACTURING PURPOSES.
2.54 BSC
M
0.14 M
A
A
B
C
E/2
M
0.25 M
AB
3X
C
3X
B
NOTE 3
FRONT VIEW
SIDE VIEW
SECTION D−D
ALTERNATE CONSTRUCTION
SECTION A−A
A
NOTE 6
A
DD
NOTE 6
H1
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SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NTST40100CT/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
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