CHEMTRONICS(R) TDS # SWPbFree Technical Data Sheet Soder-Wick(R) Lead-Free SD Desoldering Braid PRODUCT DESCRIPTION Soder-Wick(R) Lead-Free is the state of the art in desoldering technology. It is specially designed for removal of today's high temperature lead-free solders. The single layer weave used for Soder-Wick(R) LeadFree braid is lighter in mass than any other desoldering braid available and allows for lead-free solder removal at lower Lead-Free temperatures. Soder-Wick(R) responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less "contact" time thus preventing heat damage to the PCB and sensitive components. For Lead-Free rework, Soder-Wick(R) has the answer. Fastest wicking and heat transfer High capacity for solder uptake Halide free, no corrosive residues Minimizes risk of heat damage to pads, components and PBCs Can be used with Tin/Lead solders RoHS compliant TYPICAL APPLICATIONS Soder-Wick(R) Lead-Free desoldering braid safely removes solder from: Thru-hole Components SMT Pads and BGA Pads Micro Circuits Terminals, Lugs and Posts Identification Script TYPICAL PRODUCT DATA AND PHYSICAL PROPERTIES Flux Type High-Temperature No Clean Type ROL0 Specifications: ANSI/IPC J STD-004 MIL-F-14256 F No Clean Flux Spec: MIL-STD-883B Bellcore TR-NWT-000078 ANSI/IPC J SF818 Shelflife: RoHS/WEEE Status 2 years Size # 2 Width Inches .060" Color Yellow Width Metric 1.5 mm 3 .080" Green 2.0 mm 4 .110" Blue 2.8 mm STATIC DISSIPATIVE PACKAGING Soder-Wick(R) Lead-Free is packaged on Static Dissipative bobbins to minimize the risk of damage associated with static electricity. The static dissipative bobbins qualify as electrostatic discharge protective per MIL-STD-1686C and MIL-HDBK263B and meet the static delay rate provision of MIL-B-81705C. USAGE INSTRUCTIONS For industrial use only. Read MSDS carefully prior to use. 1) Choose a Soder-Wick(R) Lead-Free braid width equal to or slightly larger than the pad or connection. 2) Choose a solder iron tip equal to or slightly larger than the pad or connection. 3) Set temperature of iron between 650 and 750F 4) Place wick on solder joint or pad and place tip of hot iron on top of wick 5) As solder becomes molten, the color of the wick will change from copper to silver. 6) Remove wick and iron simultaneously once color change has stopped. 7) The component lead / pad is now clean and free from solder. 8) Clip and discard the used portion of the wick. 9) If needed, clean PCB with CircuitWorks(R) LeadFree Flux Remover Pen CW9400 and remove soils with a ControlWipesTM absorbent wipe. SODER-WICK(R) IS DESIGNED TO MEET OR EXCEED THE FOLLOWING: MIL-F-14256F, Type R NASA-STD-8739.3 DOD-STD-883E, Method 2022 ANSI/IPC J STD-004, Type ROL0 BELLCORE TR-NWT-000078 ANSI/IPC J SF-818 SODER-WICK(R) SD BOBBINS ARE DESIGNED TO MEET OR EXCEED: MIL-STD-2000A MIL-B-81705C MIL-STD-1686C MIL-HDBK-263B TECHNICAL & APPLICATION ASSISTANCE Chemtronics(R) provides a technical hotline to answer your technical and application related questions. The toll free number is: 1-800-TECH-401. AVAILABILITY 40 Series Lead-Free No Clean Flux 25 bobbins / bag Part # 5 feet 40-2-5 40-3-5 40-4-5 Size 10 feet 40-2-10 40-3-10 40-4-10 2 3 4 VacuPakTM Packaging The VacuPakTM Can contains ten five-foot bobbins in a vacuum sealed can. This package provides the highest level of cleanliness and freshness. Great for tool kit storage. Part # Size SW14025 2 SW14035 3 SW14045 4 NOTE: This information is believed to be accurate. It is intended for professional end users having the skills to evaluate and use the data properly. ITW CHEMTRONICS(R) does not guarantee the accuracy of the data and assumes no liability in connection with damages incurred while using it. MANUFACTURED BY: ITW Chemtronics(R) 8125 Cobb Center Drive Kennesaw, GA 30152 REV. B 1-770-424-4888 (06/06) Chemtronics(R), Soder-Wick(R) and CircuitWorks(R) are registered trademarks of ITW Chemtronics. All rights reserved. Vacu-PakTM and ControlWipesTM are trademarks of ITW Chemtronics. All rights reserved. DISTRIBUTED BY: