© Semiconductor Components Industries, LLC, 2006
April, 2006 − Rev. 5 1Publication Order Number:
MC33039/D
MC33039, NCV33039
Closed Loop Brushless
Motor Adapter
The MC33039 is a high performance closed−loop speed control
adapter specifically designed for use in brushless DC motor control
systems. Implementation will allow precise speed regulation without
the need for a magnetic or optical tachometer. This device contains
three input buffers each with hysteresis for noise immunity, three
digital edge detectors, a programmable monostable, and an internal
shunt regulator. Also included is an inverter output for use in systems
that require conversion of sensor phasing. Although this device is
primarily intended for use with the MC33035 brushless motor
controller, it can be used cost effectively in many other closed−loop
speed control applications.
Features
•Digital Detection of Each Input Transition for Improved Low Speed
Motor Operation
•TTL Compatible Inputs With Hysteresis
•Operation Down to 5.5 V for Direct Powering from MC33035
Reference
•Internal Shunt Regulator Allows Operation from a Non−Regulated
Voltage Source
•Inverter Output for Easy Conversion between 60°/300° and
120°/240° Sensor Phasing Conventions
•Pb−Free Packages are Available
Representative Block Diagram
15 k
−
+
To Rotor
Position
Sensors
VCC
7
GND
φC
4
φA
+
20 k
0.3 V
+
−
+
8.25 V
8
RT
fout
5
2R
R
+
R
Delay
QS
1
φA
φB
6
3
2
CT
Delay
Delay
+
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MARKING
DIAGRAMS
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G= Pb−Free Package
1
1
1
PDIP−8
N SUFFIX
CASE 626
MC33039P
AWL
YYWWG
SOIC−8
D SUFFIX
CASE 751
PIN CONNECTIONS
fout
RT/CT
GND
Inputs
φB
φA
φA
4
3
2
8
7
6
5
φC1
(Top View)
VCC
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
33039
ALYW
G
1
MC33039, NCV33039
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
VCC Zener Current IZ(VCC)30 mA
Logic Input Current (Pins 1, 2, 3) IIH 5.0 mA
Output Current (Pins 4, 5), Sink or Source IDRV 20 mA
Power Dissipation and Thermal Characteristics
Maximum Power Dissipation @ TA = + 85°C
Thermal Resistance, Junction−to−Air PD
RqJA
650
100 mW
°C/W
Operating Junction Temperature TJ+150 °C
Operating Ambient Temperature Range
MC33039
NCV33039
TA−40 to +85
−40 to +125
°C
Storage Temperature Range Tstg −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended O p e r a t i n g Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (VCC = 6.25 V, RT = 10 k, CT = 22 nF, TA = 25°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
LOGIC INPUTS
Input Threshold Voltage
High State
Low State
Hysteresis
VIH
VIL
VH
2.4
−
0.4
2.1
1.4
0.7
−
1.0
0.9
V
Input Current
High State (VIH = 5.0 V)
φA
φB, φC
Low State (VIL = 0 V)
φA
φB, φC
IIH
IIL
− 40
−
− 190
−
− 60
− 0.3
− 300
− 0.3
− 80
− 5.0
− 380
− 5.0
mA
MONOSTABLE AND OUTPUT SECTIONS
Output Voltage
High State
fout (Isource = 5.0 mA)
φA (Isource = 2.0 mA)
Low State
fout (Isink = 10 mA)
φA (Isink = 10 mA)
VOH
VOL
3.60
4.20
−
−
3.95
4.75
0.25
0.25
4.20
−
0.50
0.50
V
Capacitor CT Discharge Current Idischg 20 35 60 mA
Output Pulse Width (Pin 5) tPW 205 225 245 ms
POWER SUPPLY SECTION
Power Supply Operating Voltage Range
MC33039 (TA = −40° to +85°C)
NCV33039 (TA = −40° to +125°C)
VCC 5.5 − VZV
Power Supply Current ICC 1.8 3.9 5.0 mA
Zener Voltage (IZ = 10 mA) VZ7.5 8.25 9.0 V
Zener Dynamic Impedance (DIZ = 10 mA to 20 mA, f p 1.0 kHz) ⎥Zka⎥− 2.0 5.0 W
MC33039, NCV33039
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3
Figure 1. Typical Three Phase, Six Step Motor Application
fout Output
Latch ISetI Input
φA Output
φC
120° Sensor
Electrical
Phasing
Input
φB
RT/CT
φC
60° Sensor
Electrical
Phasing
Input
φB
φA
φA
Vout (AVG)
Constant Motor Speed Increasing Motor
Speed
Vth ≈ 0.67 VCC
24060 120 300 7206000
Rotor Electrical Position (Degrees)
180 360 480
OPERATING DESCRIPTION
The MC33039 provides an economical method of
implementing closed−loop speed control of brushless DC
motors by eliminating the need for a magnetic or optical
tachometer. Shown in the timing diagram of Figure 1, the
three inputs (Pins 1, 2, 3) monitor the brushless motor rotor
position sensors. Each sensor signal transition is digitally
detected, ORied at the Latch iSeti Input, and causes CT to
discharge. A corresponding output pulse is generated at fout
(Pin 5) of a defined amplitude, and programmable width
determined b y the values selected for RT and CT (Pin 6). The
average voltage of the output pulse train increases with
motor speed. When fed through a low pass filter or
integrator, a DC voltage proportional to speed is generated.
Figure 2 shows the proper connections for a typical closed
loop application using the MC33035 brushless motor
controller. Constant speed operation down to 100 RPM is
possible with economical three phase four pole motors.
The φA inverter output (Pin 4) is used in systems where the
controller and motor sensor phasing conventions are not
compatible. A method of converting from either convention
to the other is shown in Figure 3. For a more detailed
explanation of this subject, refer to the text above Figure 39
on the MC33035 data sheet.
The output pulse amplitude VOH is constant with
temperature and controlled by the supply voltage on VCC
(Pin 8). Operation down to 5.5 V is guaranteed over
temperature. For systems without a regulated power supply,
an internal 8.25 V shunt regulator is provided.
MC33039, NCV33039
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4
3
2
1
Delay
Delay
Delay
48
8.25V
7
SQ
R
0.3V
+
−
+
−
+
R
2R 15k
6
5
MC33039P
RT
CT
Enable
Speed
Set
MC33035P
OSC
PWM
EA
−
+
−
+
S
Q
R
R
S
Q
Thermal
REF
UVLO
+
+
+
Fwd/
Rev
VCC
POS
DEC
Brake
ILIMIT
−
+
Output Buffers
Motor
φA
Fault
VM
NS
SN
Assy
Rotor
Figure 2. Typical Closed Loop Speed Control Application
20 k
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5
Figure 3. fout, Pulse Width
versus Timing Resistor Figure 4. fout, Pulse Width Change
versus Temperature
TA , AMBIENT TEMPERATURE (°C)
RT , TIMING RESISTOR (kW)
0
1.0
10
2.0
0.1
100
20 200
0.01
− 55
−0.8
0
− 25 + 25 + 50 + 125+ 100+ 75
−1.6
+0.8
+1.6
tPW, OUTPUT PULSE WIDTH (ms)
tPW, OUTPUT PULSE WIDTH CHANGE (%)Δ
VCC = 6.25 V
TA = 25°C
CT = 220 nF
CT = 22 nF
CT = 2.2 nF
VCC = 6.25 V
RT = 10 k
CT = 22 nF
Figure 5. fout, Pulse Width Change
versus Supply Voltage Figure 6. Supply Current versus
Supply Voltage
0
VCC , SUPPLY VOLTAGE (V)
4.0
4.5
+ 4.0
+ 2.0
0
− 2.0
− 4.0
5.5 6.5 7.5 8.5
VCC , SUPPLY VOLTAGE (V)
2.0 6.04.0 8.0 10
8.0
0
12
16
20
ICC , SUPPLY CURRENT (mA)
tPW, OUTPUT PULSE WIDTH CHANGE (%)Δ
TA = 25°CPins 1, 2, 3
Connected
together
TA = 25°C
TA = 125°C
TA = −40°C
+ 0.4 0
0
TA , AMBIENT TEMPERATURE (°C)
0 + 125
+ 0.6
+ 0.4
+ 0.2
IO , OUTPUT LOAD CURRENT (mA)
4.0 8.0 12 16
+ 0.2
− 4.0
− 2.0
0
0
0
+ 25− 25− 55
−16
− 8.0
+8.0
+ 50
+16
+ 75 + 100
− 0.2
Vsat , OUTPUT SATURATION VOLTAGE (V)
Vsat (sink), SINK SATURATION CHANGE (%)
Δ
Vsat (SOURCE), SOURCE SATURATION CHANGE (%)
Δ
Figure 7. fout, Saturation
versus Load Current Figure 8. fout, Saturation Change
versus Temperature
VCC = 6.25 V
TA = 25°C
Source Saturation
(Load to Ground)
VCC
GND
Sink Saturation
(Load to VCC)
VCC = 6.25 V
IO = 5.0 mA
DSink Saturation
(Load to VCC)DSource Saturation
(Load to Ground)
MC33039, NCV33039
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6
ORDERING INFORMATION
Device Operating Temperature Range Package Shipping†
MC33039D
TA = −40°C to +85°C
SOIC−8
98 Units / Rail
MC33039DG
MC33039DR2 2500 / Tape & Reel
MC33039DR2G
MC33039P PDIP−8 50 Units / Rail
MC33039PG
NCV33039DR2* TA = −40°C to +125°C SOIC−8 2500 / Tape & Reel
NCV33039DR2G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33039: Tlow = −40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring
site and change control.
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7
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 626−05
ISSUE L
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14
58
F
NOTE 2 −A−
−B−
−T−
SEATING
PLANE
H
J
GDK
N
C
L
M
M
A
M
0.13 (0.005) B M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.40 10.16 0.370 0.400
B6.10 6.60 0.240 0.260
C3.94 4.45 0.155 0.175
D0.38 0.51 0.015 0.020
F1.02 1.78 0.040 0.070
G2.54 BSC 0.100 BSC
H0.76 1.27 0.030 0.050
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L7.62 BSC 0.300 BSC
M−−− 10 −−− 10
N0.76 1.01 0.030 0.040
__
MC33039, NCV33039
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8
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
SEATING
PLANE
1
4
58
N
J
X 45_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
AMIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024 1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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Phone: 81−3−5773−3850
MC33039/D
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