Absolute Maximum Ratings
Parameter Units
ID @ VGS = 10V, TC = 25°C Continuous Drain Current 2.25
ID @ VGS = 10V, TC = 100°C Continuous Drain Current 1.50
IDM Pulsed Drain Current 9.0
PD @ TC = 25°C Max. Power Dissipation 15 W
Linear Derating Factor 0.12 W/°C
VGS Gate-to-Source Voltage ±20 V
EAS Single Pulse Avalanche Energy 48 mJ
IAR Avalanche Current —A
EAR Repetitive Avalanche Energy —mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJOperating Junction -55 to 150
TSTG Storage Temperature Range
Lead Temperature 300 (0.063 in. (1.6mm) from case for 10s)
Weight 0.98(typical) g
PD - 90424C
The HEXFETtechnology is the key to International
Rectifiers advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state resis-
tance combined with high transconductance.
The HEXFET transistors also feature all of the well
established advantages of MOSFETs such as volt-
age control, very fast switching, ease of parelleling
and temperature stability of the electrical parameters.
They are well suited for applications such as switch-
ing power supplies, motor controls, inverters, chop-
pers, audio amplifiers and high energy pulse circuits.
oC
A
01/22/01
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TO-39
Product Summary
Part Number BVDSS RDS(on) ID
IRFF210 200V 1.5 2.25A
Features:
nRepetitive Avalanche Ratings
nDynamic dv/dt Rating
nHermetically Sealed
nSimple Drive Requirements
nEase of Paralleling
For footnotes refer to the last page
IRFF210
REPETITIVE A V ALANCHE AND dv/dt RATED
JANTX2N6784
HEXFETTRANSISTORS JANTXV2N6784
THRU-HOLE (TO-205AF) REF:MIL-PRF-19500/556
200V, N-CHANNEL
IRFF210
2www.irf.com
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
RthJC Junction-to-Case 8.3
RthJA Junction-to-Ambient — 175 Typical socket mount.
°C/W
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units Test Conditions
ISContinuous Source Current (Body Diode) 2.25
ISM Pulse Source Current (Body Diode) 9.0
VSD Diode Forward Voltage 1 . 5 V Tj = 25°C, IS =2.25A, VGS = 0V
trr Reverse Recovery Time 350 nS Tj = 25°C, IF = 2.25A, di/dt 100A/µs
QRR Reverse Recovery Charge 3.0 µC VDD 50V
ton Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
A
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BVDSS Drain-to-Source Breakdown Voltage 200 V VGS = 0V, ID = 1.0mA
BVDSS/TJTemperature Coefficient of Breakdown 0.25 V/°C Reference to 25°C, ID = 1.0mA
Voltage
RDS(on) Static Drain-to-Source On-State 1. 5 VGS = 10V, ID = 1.50A
Resistance 1.725 VGS =10V, ID = 2.25A
VGS(th) Gate Threshold Voltage 2.0 4.0 V VDS = VGS, ID = 250µA
gfs Forward Transconductance 0.9 S ( ) V
DS > 15V, IDS = 1.50A
IDSS Zero Gate Voltage Drain Current 25 VDS= 160V, VGS=0V
250 µA VDS = 160V
VGS = 0V, TJ = 125°C
IGSS Gate-to-Source Leakage Forward 100 VGS = 20V
IGSS Gate-to-Source Leakage Reverse -100 nA VGS = -20V
QgTotal Gate Charge 4.3 6.2 VGS =10V, ID = 2.25A
Qgs Gate-to-Source Charge 0.7 1.2 nC VDS=100V
Qgd Gate-to-Drain (‘Miller’) Charge 0.5 5.0
td(on) Turn-On Delay Time 15 VDD = 100V, ID = 2.25A,
trRise Time 20 RG = 7.5
td(off) Turn-Off Delay Time 30
tfFall Time 20
LS + LDTotal Inductance 7.0
Ciss Input Capacitance 140 VGS = 0V, VDS = 25V
Coss Output Capacitance 5 5 pF f = 1.0MHz
Crss Reverse Transfer Capacitance 8.6
nH
ns
Measured from drain lead (6mm/0.25in. from
package) to source lead (6mm/0.25in. from
package)
www.irf.com 3
IRFF210
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
IRFF210
4www.irf.com
Fig 8. Maximum Safe Operating Area
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
13 a& b
13 a& b
13 a& b
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IRFF210
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
Fig 10a. Switching Time Test Circuit
V
DS
90%
10%
V
GS t
d(on)
t
r
t
d(off)
t
f
Fig 10b. Switching Time Waveforms
VDS
Pulse Width 1 µs
Duty Factor 0.1 %
RD
VGS
RGD.U.T.
10V
+
-
VDD
IRFF210
6www.irf.com
Q
G
Q
GS
Q
GD
V
G
Charge
D.U.T. V
DS
I
D
I
G
3mA
V
GS
.3µF
50K
.2µF
12V
Current Regulator
Same Type as D.U.T.
Current Sampling Resistors
+
-
10 V
Fig 13b. Gate Charge Test Circuit
Fig 13a. Basic Gate Charge Waveform
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
Fig 12b. Unclamped Inductive Waveforms
Fig 12a. Unclamped Inductive Test Circuit
tp
V
(BR)DSS
I
AS
R
G
I
AS
0.01
t
p
D.U.T
L
VDS
+
-V
DD
DRIVER
A
15V
20V
10V
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IRFF210
Foot Notes:
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936
Data and specifications subject to change without notice. 01/01
ISD 2.25A, di/dt 70A/µs,
VDD 200V, TJ 150°C
Suggested RG =7.5
Repetitive Rating; Pulse width limited by
maximum junction temperature.
VDD = 50V, starting TJ = 25°C,
Peak IL =2.25A,
Case Outline and Dimensions —TO-205AF
Pulse width 300 µs; Duty Cycle 2%
LEGEND
1- SOURCE
2- GATE
3- DRAIN