Package Diagrams November 2003 16-Pin Plastic DIP Package Dimensions in Inches -BN/2 b1 1 WITH LEAD FINISH E 5 6 CL E1 c1 (c) N SEE DETAIL A BASE METAL (b) SECTION Z-Z CL BASE PLANE c 5 -A- D 6 eA Z Z 4 A2 A eB 7 -C.015 SEATING PLANE A1 L b2 10 b .010 GAGE PLANE -H- e b3 4X D1 4x M C 5 eC DETAIL A NOTES: 1. CONTROLLING DIMENSION: INCH. 2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M 3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR PROTRUSIONS TO BE .005 MINIMUM. 4. DIMENSIONS A, A1 & L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-3. 5. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 6. E AND eA MEASURED WITH THE LEADS CONSTRAINED TO BE PERPENDICULAR TO DATUM -C7. eB AND eC ARE MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 8. N IS THE MAXIMUM NUMBER OF LEAD POSITIONS. 9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED TO EASE INSERTION 10. b1 MAXIMUM DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSIONS. DAMBAR PROTRUSIONS SHALL NOT EXCEED .010 11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM OF LEAD , WHERE LEAD EXITS BODY www.latticesemi.com N = 16 1 S Y M B O L MIN. NOM. MAX. A A1 A2 b b1 b2 b3 c c1 D D1 E E1 e eA eB eC .015 .115 .130 .014 .018 .014 .018 .045 .060 .030 .039 .008 .010 .008 .010 .735 .755 .005 .300 .310 .240 .250 .100 BSC .300 BSC .000 - .210 .195 .022 .020 .070 .045 .014 .011 .775 .325 .280 INCHES N O .430 .060 T E 4 4 10 10 5 5 6 5 6 7 7 pkg_28 Lattice Semiconductor Package Diagrams 16-Pin SOIC Package Dimensions in Inches D hx45 3 Pin1 Identifier 2 1 hx45 SEE DETAIL A C - B - E H + .25 M B M END VIEW N 6 TOP VIEW B + .25 M C A M B S e L C OC DETAIL A A - C - - A - D MIN. SEATING PLANE SIDE VIEW A1 .10 NOTES: 1. CONTROLLING DIMENSION: MILLIMETER 2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982 3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED EXCEED .15mm PER SIDE 4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION SHALL NOT EXCEED .25mm PER SIDE 5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED WITHIN THE CROSSHATCHED AREA. 6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING TO A SUBSTRATE 7. "N" IS THE NUMBER OF TERMINAL POSITIONS. 8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY 9. THE LEAD WIDTH "B" AS MEASURED .36mm OR GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED A MAX VALUE OF .61mm. A A1 B C D E e H h L NC OC 2 MAX. 2.65 2.35 .10 .30 .33 .51 .23 .32 10.10 10.50 7.40 7.60 1.27 BSC 10.00 10.65 .75 .25 1.27 .40 16 8 0 Lattice Semiconductor Package Diagrams 20-Pin (300-Mil) CERDIP Package Dimensions in Inches (DATUM A) B 1 N/2 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL (b) b3 SECTION Z-Z DETAIL A S Y M B O L NOTES: 1. c 7 Z A DIMENSIONING AND TOLERANCING PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN INCHES. 3. MEASUREMENTS TO BE TAKEN AT A MINIMUM OF .060 INCHES FROM THE LEAD TIP. 4. DIMENSIONS D AND E1 INCLUDE ALLOWANCE FOR GLASS OVERRUN AND MENISCUS, AND LID TO BASE MISMATCH. 5. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-003. 6. E3 IS TO BE MEASURED AT THE LEAD TIPS. 7. ALLOWED LEAD TIP POSITION RANGE. 3 A1 A2 b b1 b2 b3 c c1 D E E1 E2 E3 e L N 3 INCHES MIN. NOM. .015 .140 .015 .015 .018 .045 .023 .008 .008 .010 .942 .950 .308 .280 .288 .300 REF .325 .100 BSC .125 20 MAX. .200 .175 .023 .021 .065 .045 .014 .012 .970 .325 .296 .410 .200 Lattice Semiconductor Package Diagrams 20-Pin LCC Package Dimensions in Inches D4 D2 .010 X 45 .020 E2 E4 4 .030 X 45 .050 (3 PLACES) A1 L (19 PLACES) A B 3 e E .030 .050 D L1 RADIUS (TYPICAL) A2 3 NOTES: S Y M B O L 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5. 2. ALL DIMENSIONS ARE IN INCHES. 3. DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF .010 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN NOT TO EXCEED .005 INCHES MAXIMUM PER SIDE. 4. FLATNESS TOLERANCE IS .004 INCHES PER INCH. 4 INCHES MAX. MIN. A .054 .074 A1 .064 .089 A2 .007 .015 B .022 .028 D .342 .358 D2 .200 D4 .270 .315 .342 E .358 E2 .200 E4 .270 .315 e .050 BSC L .058 .042 L1 .075 .095 Lattice Semiconductor Package Diagrams 20-Pin PLCC Package Dimensions in Inches .007 S H A-B S D S D D .007 S H A-B .002 A-B 45 X .048 .042 7 1 S D S S -D- 13 3 2 1 3 8 N .150 MAX .050 (N-4PLACES) E E1 -B- .075 MAX 7 3 -A3 see DETAIL B .007 S H A-B // .002 A-B .007 S H S D S S A-B S D S 9 .020 MAX 3 PLCS .020 MAX 3 PLCS 9 DETAIL B 5 Lattice Semiconductor Package Diagrams 20-Pin PLCC Package (cont.) -C.045 MIN. 7 .025 MIN. BASE PLANE .020 MIN .025/.045 R. SEE DETAIL "A" A2 45x .056 .042 .004 C D2 E2 SEE DETAIL "J" SEE DETAIL "L" 4 D E -A-B-D- BASE PLANE .020 MIN. D2 E2 .050 N-4 PLACES 4 DETAIL "A" 6 X .032 .026 .007 MAX. A1 .007 S D S Y A X TO BE .007 MAX/LEAD Y OPTIONAL FEATURE. IF PRESENT, MINIMUM SPACE BETWEEN ADJACENT LEADS IS 0.08. - C - H - H A-B S 2 SEATING PLANE .045 MIN. 5 .025 MIN. SEATING PLANE .021 .013 D D E .010 MAX. 10 10 C A-B S TYP ALL SIDES .010 MAX. .021 .013 10 .065 .065 .0125 .0075 A A .020 D2 R D2 E2 D S DETAIL "J" .020 E .020 .007 M .045 .025 14 .018 .013 E2 SECTION A-A DETAIL "L" TYP ALL SIDES 6 .0105 15 .0075 Lattice Semiconductor Package Diagrams 20-Pin PLCC Package (cont.) -D- S Y M B O L A A1 A2 D D1 D2 D3 E E1 E2 E3 N MIN. NOM. MAX. .165 .090 .062 .385 .350 .141 .385 .350 .141 - .172 .105 .390 .353 .155 .075 .390 .353 .155 .075 20 .180 .120 .083 .395 .356 .169 E3 -A-B12 E3 12 .395 .356 .169 - D3 12 NOTES: 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982. -HLOCATED AT TOP OF MOLD PARTING LINE AND 2. DATUM PLANE CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY 3 DATUMS A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS EXIT PLASTIC BODY AT DATUM PLANE -H- 4 TO BE MEASURED AT SEATING PLANE 5 SHAPE OF TRANSITION IS OPTIONAL 6 PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL 7 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER OR LOWER PARTING LINE. -H- CONTACT POINT 8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED DETAILS OF THE IDENTIFIER ARE OPTIONAL. 9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL. 10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH THE SOCKET VENDOR 11 ALL DIMENSIONS IN INCHES -H- BOTTOM POINT OF 12 TOP POINT OF MEASUREMENT IS DATUM MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE (SOCKET SEATING PLANE) DEFINED BY D3/E3 13 PIN NUMBERS ARE FOR REFERENCE ONLY 14 DIMENSION R REQUIRED FOR 120 MINIMUM BEND 15 D3 DIMENSION APPLIES TO BASE METAL ONLY 7 Lattice Semiconductor Package Diagrams 20-Pin Plastic DIP Package Dimensions in Inches -BN/2 E b1 1 WITH LEAD FINISH 6 5 CL E1 (c) c1 SEE DETAIL A N (b) BASE METAL CL SECTION Z-Z c BASE PLANE 6 eA 5 -A- D eB Z Z 4 7 A2 A -C.015 EATING PLANE A1 10 b .010 GAGE PLANE -H- e b2 L D1 4x M C 5 eC DETAIL A NOTES: 1. CONTROLLING DIMENSION: INCH. 2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M 3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR PROTRUSIONS TO BE .005 MINIMUM. 4. DIMENSIONS A, A1 & L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-3. 5. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 6. E AND eA MEASURED WITH THE LEADS CONSTRAINED TO BE PERPENDICULAR TO DATUM -C7. eB AND eC ARE MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 8. N IS THE MAXIMUM NUMBER OF LEAD POSITIONS. 9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED TO EASE INSERTION 10. b2 MAXIMUM DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSIONS. DAMBAR PROTRUSIONS SHALL NOT EXCEED .010 11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM OF LEAD , WHERE LEAD EXITS BODY N = 20 8 S Y M B O L MIN. NOM. MAX. A A1 A2 b b1 b2 c c1 D D1 E E1 e eA eB eC L .015 .115 .130 .014 .018 .014 .018 .045 .060 .008 .010 .008 .010 .980 1.030 .005 .300 .310 .240 .250 .100 BSC .300 BSC .000 .115 .130 .210 .195 .022 .020 .070 .014 .011 1.060 .325 .280 INCHES N O .430 .060 .150 T E 4 4 10 5 5 6 5 6 7 7 4 Lattice Semiconductor Package Diagrams 20-Pin SOIC Package Dimensions in Millimeters D hx45 3 Pin1 Identifier 2 1 hx45 SEE DETAIL A C - B - E H + .25 M B M END VIEW N 6 TOP VIEW B + .25 M C A M B S e L C OC DETAIL A A - C - - A - D MIN. SEATING PLANE SIDE VIEW A1 .10 NOTES: 1. CONTROLLING DIMENSION: MILLIMETER 2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982 3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED EXCEED .15mm PER SIDE 4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION SHALL NOT EXCEED .25mm PER SIDE 5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED WITHIN THE CROSSHATCHED AREA. 6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING TO A SUBSTRATE 7. "N" IS THE NUMBER OF TERMINAL POSITIONS. 8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY 9. THE LEAD WIDTH "B" AS MEASURED .36mm OR GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED A MAX VALUE OF .61mm. A A1 B C D E e H h L NC OC 9 MAX. 2.65 2.35 .10 .30 .33 .51 .23 .32 12.6 13.0 7.40 7.60 1.27 BSC 10.00 10.65 .75 .25 1.27 .40 20 8 0 Lattice Semiconductor Package Diagrams 24-Pin (300-Mil) CERDIP Dimensions in Inches (DATUM A) B N/2 1 4 E1 E N E3 e/2 E D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE b2 e Z b .010 M L Z c E2 C A B b1 (c) WITH LEAD FINISH c1 (b) SECTION Z-Z BASE METAL 3 S Y M B O L NOTES: 1. 7 A DIMENSIONING AND TOLERANCING PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN INCHES. 3. MEASUREMENTS TO BE TAKEN AT A MINIMUM OF .060 INCHES FROM THE LEAD TIP. 4. DIMENSIONS D AND E1 INCLUDE ALLOWANCE FOR GLASS OVERRUN AND MENISCUS, AND LID TO BASE MISMATCH. 5. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-003. 6. E3 IS TO BE MEASURED AT THE LEAD TIPS. 7. ALLOWED LEAD TIP POSITION RANGE. 10 A1 A2 b b1 b2 c c1 D E E1 E2 E3 e L N INCHES MIN. NOM. MAX. .200 .015 .175 .140 .023 .015 .015 .018 .021 .065 .045 .014 .008 .008 .010 .012 1.242 1.250 1.270 .325 .308 .280 .288 .296 .300 REF .410 .325 .100 BSC .125 .200 24 Lattice Semiconductor Package Diagrams 24-Pin Plastic DIP Dimensions in Inches -BN/2 b1 1 E WITH LEAD FINISH 6 5 CL E1 (c) c1 N (b) SEE DETAIL A BASE METAL SECTION Z-Z CL c BASE PLANE -A- 6 5 eA D eB Z Z 4 A2 A 7 -C.015 SEATING PLANE A1 10 b .010 GAGE PLANE -H- e b2 L D1 4x M C 5 eC DETAIL A NOTES: 1. CONTROLLING DIMENSION: INCH. 2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M 3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR PROTRUSIONS TO BE .005 MINIMUM. 4. DIMENSIONS A, A1 & L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-3. 5. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 6. E AND eA MEASURED WITH THE LEADS CONSTRAINED TO BE PERPENDICULAR TO DATUM -C7. eB AND eC ARE MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 8. N IS THE MAXIMUM NUMBER OF LEAD POSITIONS. 9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED TO EASE INSERTION 10. b2 MAXIMUM DIMENSIONS DOES NOT INCLUDE DAMBAR PROTRUSIONS. DAMBAR PROTRUSIONS SHALL NOT EXCEED .010 11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM OF LEAD , WHERE LEAD EXITS BODY N = 24 11 S Y M B O L MIN. NOM. MAX. A A1 A2 b b1 b2 c c1 D D1 E E1 e eA eB eC L .015 .115 .130 .014 .018 .014 .018 .045 .060 .008 .010 .008 .010 1.230 1.250 .005 .300 .310 .240 .250 .100 BSC .300 BSC .000 .115 .130 .210 .195 .022 .020 .070 .014 .011 1.280 .325 .280 INCHES N O .430 .060 .150 T E 4 4 10 5 5 6 5 6 7 7 Lattice Semiconductor Package Diagrams 24-Pin SOIC Package Dimensions in Inches D hx45 3 Pin1 Identifier 2 1 hx45 SEE DETAIL A C - B - E H + .25 M B M END VIEW N 6 TOP VIEW B + .25 M C A M B S e L C OC DETAIL A A - C - - A - D MIN. SEATING PLANE SIDE VIEW A1 .10 NOTES: 1. CONTROLLING DIMENSION: MILLIMETER 2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982 3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED EXCEED .15mm PER SIDE 4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION SHALL NOT EXCEED .25mm PER SIDE 5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED WITHIN THE CROSSHATCHED AREA. 6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING TO A SUBSTRATE 7. "N" IS THE NUMBER OF TERMINAL POSITIONS. 8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY 9. THE LEAD WIDTH "B" AS MEASURED .36mm OR GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED A MAX VALUE OF .61mm. A A1 B C D E e H h L NC OC 12 MAX. 2.65 2.35 .10 .30 .33 .51 .23 .32 15.20 15.60 7.40 7.60 1.27 BSC 10.00 10.65 .75 .25 1.27 .40 24 8 0 Lattice Semiconductor Package Diagrams 28-Pin LCC Package Dimensions in Inches D4 D2 .010 X 45 .020 E2 E4 4 .030 X 45 .050 (3 PLACES) A1 L (27 PLACES) A B e .030 3 E .050 D RADIUS (TYPICAL) A2 L1 S Y M B O L 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5. 2. ALL DIMENSIONS ARE IN INCHES. 3. DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF .010 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN NOT TO EXCEED .005 INCHES MAXIMUM PER SIDE. 4. FLATNESS TOLERANCE IS .004 INCHES PER INCH. 13 INCHES MIN. MAX. .074 A .054 .089 A1 .064 .015 A2 .007 .022 .028 B .440 .460 D D2 .300 .403 D4 .370 .440 .460 E .300 E2 E4 .370 .403 e .050 BSC L .058 .042 L1 .075 .095 Lattice Semiconductor Package Diagrams 28-Pin PLCC Package Dimensions in Inches .007 S H A-B S D S D D .007 S H A-B .002 A-B .048 45 X .042 7 1 S D S S -D- 13 3 2 1 3 8 N .150 MAX .050 (N-4PLACES) E E1 -B- .075 MAX 7 3 -A3 see DETAIL B .007 S H A-B // .002 A-B .007 S H S D S S A-B S D S 9 .020 MAX 3 PLCS .020 MAX 3 PLCS 9 DETAIL B 14 Lattice Semiconductor Package Diagrams 28-Pin PLCC Package (cont.) -C.045 MIN. 7 .025 MIN. BASE PLANE .020 MIN .025/.045 R. SEE DETAIL "A" A2 45x .056 .042 .004 C D2 E2 SEE DETAIL "J" SEE DETAIL "L" 4 D E -A-B-D- BASE PLANE .020 MIN. D2 E2 .050 N-4 PLACES 4 DETAIL "A" 6 X .032 .026 .007 MAX. A1 .007 S A D S X TO BE .007 MAX/LEAD Y OPTIONAL FEATURE. IF PRESENT, MINIMUM SPACE BETWEEN ADJACENT LEADS IS 0.08. - C - H - H A-B S Y 2 SEATING PLANE .045 MIN. 5 .025 MIN. SEATING PLANE .021 .013 D D E .010 MAX. 10 E .020 10 .007 M C A-B S DETAIL "J" .020 TYP ALL SIDES .010 MAX. .021 .013 10 .065 .065 .0125 .0075 A A .020 D2 R D2 E2 D S .045 .025 14 .018 .013 E2 SECTION A-A DETAIL "L" TYP ALL SIDES 15 .0105 15 .0075 Lattice Semiconductor Package Diagrams 28-Pin PLCC Package (cont.) -D- S Y M B O L A A1 A2 D D1 D2 D3 E E1 E2 E3 N MIN. NOM. MAX. .165 .090 .062 .485 .450 .191 .485 .450 .191 - .172 .105 .490 .453 .205 .125 .490 .453 .205 .125 28 .180 .120 .083 .495 .456 .219 E3 -A-B12 E3 12 .495 .456 .219 - D3 12 NOTES: 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982. -HLOCATED AT TOP OF MOLD PARTING LINE AND 2. DATUM PLANE CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY 3 DATUMS A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS EXIT PLASTIC BODY AT DATUM PLANE -H- 4 TO BE MEASURED AT SEATING PLANE 5 SHAPE OF TRANSITION IS OPTIONAL 6 PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL 7 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER OR LOWER PARTING LINE. -H- CONTACT POINT 8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED DETAILS OF THE IDENTIFIER ARE OPTIONAL. 9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL. 10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH THE SOCKET VENDOR 11 ALL DIMENSIONS IN INCHES -H- BOTTOM POINT OF 12 TOP POINT OF MEASUREMENT IS DATUM MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE (SOCKET SEATING PLANE) DEFINED BY D3/E3 13 PIN NUMBERS ARE FOR REFERENCE ONLY 14 DIMENSION R REQUIRED FOR 120 MINIMUM BEND 15 D3 DIMENSION APPLIES TO BASE METAL ONLY 16 Lattice Semiconductor Package Diagrams 28-Pin Plastic DIP Package Dimensions in Inches 1 N/2 NOTE: 1 CONTROLLING DIMENSION: INCHES 2 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M-1982 3 ALL END LEADS IN THIS FAMILY ARE 1/2 LEADS 4 DIMENSION A, A1, AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-3 5 D AND E1 DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION. MOLD FLASH AND PROTRUSION SHALL NOT EXCEED 0.010 6 E AND eA MEASURED WITH THE LEADS CONSTRAINED TO BE PERPENDICULAR TO PLANE A 7 eB AND eC ARE MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. eC MUST BE ZERO OR GREATER 8 N IS THE NUMBER OF TERMINAL POSITIONS 9 B1 AND B2 MAXIMUM DIMENSIONS DO NOT INCLUDE DAMBAR PROTRUSIONS. DAMBAR PROTRUSIONS SHALL NOT EXCEED 0.010 -C- E1 N E S Y M B O L CL eA eC A A1 A2 B B1 B2 C D D1 E E1 e eA eB eC L N C eB -B- D D1 L SEATING PLANE A2 -AA1 B2 4x A e B + B1 17 0.015 M 0.010 M A B A C INCHES MIN. NOM. MAX. .180 .015 .150 .120 .135 .022 .014 .018 .060 .045 .050 .030 .040 .045 .008 .010 .015 1.345 1.365 1.385 1.300 BSC .300 .310 .325 .275 .285 .295 .100 BSC .300 BSC .430 .060 .000 .110 .130 .150 28 Lattice Semiconductor Package Diagrams 28-Pin SOIC Package Dimensions in Millimeters D hx45 3 Pin1 Identifier 2 1 hx45 SEE DETAIL A C - B - E H + .25 M B M END VIEW N 6 TOP VIEW B + .25 M C A M B S e L C OC DETAIL A A - C - - A - D MIN. SEATING PLANE SIDE VIEW A1 .10 NOTES: 1. CONTROLLING DIMENSION: MILLIMETER 2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982 3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED EXCEED .15mm PER SIDE 4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION SHALL NOT EXCEED .25mm PER SIDE 5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED WITHIN THE CROSSHATCHED AREA. 6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING TO A SUBSTRATE 7. "N" IS THE NUMBER OF TERMINAL POSITIONS. 8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY 9. THE LEAD WIDTH "B" AS MEASURED .36mm OR GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED A MAX VALUE OF .61mm. A A1 B C D E e H h L NC OC 18 MAX. 2.65 2.35 .10 .30 .33 .51 .23 .32 18.10 17.70 7.60 7.40 1.27 BSC 10.00 10.65 .75 .25 1.27 .40 28 8 0 Lattice Semiconductor Package Diagrams 28-Pin SSOP Package Dimensions in Millimeters + 3 D 0.15 M C A S B S 5 e b -AA Pin 1 Identifier 3 2 - C - 1 0.10 A1 SEATING PLANE E C SIDE VIEW -BE1 A2 3 N + 0.20 M C A S B S PARTING LINE TOP VIEW SEE DETAIL "A" S Y M B O L COMMON DIMENSIONS MIN. NOM. MAX. A A1 A2 b b1 c c1 D E1 -0.05 1.65 0.22 0.22 0.09 0.09 9.90 5.00 e E L L1 N OC R1 7.40 0.55 0 0.09 2 NX R R1 GAUGE PLANE OC -2.0 --1.85 1.75 0.38 0.30 0.33 0.25 -0.21 0.15 10.20 10.50 5.60 5.30 0.65 BSC 8.20 7.80 0.75 0.95 1.25 REF. 28 4 -- END VIEW A 0.25 BSC A L 4 SEATING PLANE L1 DETAIL 'A' WITH LEAD FINISH b1 8 -- c c1 (b) 5 SECTION A-A BASE METAL 6 NOTES: 1. CONTROLLING DIMENSION: MILLIMETERS. 2. DIMENSIONING & TOLERANCES PER ANSI.Y14.5M-1982. 3. "D" & "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS, BUT DO INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.20mm PER SIDE. 5. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13mm TOTAL IN EXCESS OF b DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION b BY MORE THAN 0.07mm AT LEAST MATERIAL CONDITION. 6. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 & 0.25mm FROM THE LEAD TIP 4. TO BE DETERMINED AT THE SEATING PLANE 7. "N" IS THE NUMBER OF TERMINAL POSITIONS 19 Lattice Semiconductor Package Diagrams 32-Pin QFN Package Dimensions in Millimeters 2X 0.25 C A 4 5.00 A b 4.75 0.10 M C A B D2 PIN #1 ID FIDUCIAL LOCATED IN THIS AREA 2X 0.25 C N N B 1 3 1 PIN 1 ID 4.75 E2 5.00 L 0.20 C 32X B 2X e B 3 TOP VIEW 0.20 C A 3.5 2X 4X 0 BOTTOM VIEW A2 A 5 C 0.08 C SIDE VIEW A3 A1 SEATING PLANE SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. MIN. 3 4 5 MAX. - 0.85 1.00 A1 0.00 0.01 0.05 A2 0.00 0.65 1.00 0.20 REF A3 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. NOM. A D2 1.25 E2 1.25 2.70 3.25 2.70 3.25 DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20 AND 0.25 mm FROM TERMINAL TIP. b 0.18 0.24 0.30 APPLIES TO EXPOSED PORTION OF TERMINALS. L 0.30 0.40 0.50 0 - e 20 0.50 BSC - 12 Lattice Semiconductor Package Diagrams 44-Pin JLCC Package Dimensions in Inches (N PLACES) D .011 M D1 A B L B2 D2 E2 C L1 Q L2 B B R E1 E DETAIL A B1 C1 C BASE METAL B DETAIL A A1 SECTION B-B A -A.004 SEATING PLANE WITH LEAD FINISH .050 .020 MIN. D4 E4 S Y INCHES M B O L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN INCHES. 3. CORNER CHAMFERS AND/OR NOTCHES ARE OPTIONAL. 21 A A1 B B1 B2 C C1 D/E D1/E1 D2/E2 D4/E4 L L1 L2 Q R N MIN. MAX. .115 .190 .065 REF .013 .023 .013 .020 .022 .035 .007 .013 .007 .010 .675 .690 .700 .620 .660 .500 BSC .630 BSC .005 .020 .025 .003 .020 .040 44 Lattice Semiconductor Package Diagrams 44-Pin PLCC Package Dimensions in Inches .007 S H A-B S D S D D .007 S H A-B .002 A-B 45 X .048 .042 7 1 S D S S -D- 13 3 2 1 3 8 N .150 MAX .050 (N-4PLACES) E E1 -B- .075 MAX 7 3 -A3 see DETAIL B .007 S H A-B // .002 A-B .007 S H S D S S A-B S D S 9 .020 MAX 3 PLCS .020 MAX 3 PLCS 9 DETAIL B 22 Lattice Semiconductor Package Diagrams 44-Pin PLCC Package (cont.) -C.045 MIN. 7 .025 MIN. BASE PLANE .020 MIN .025/.045 R. SEE DETAIL "A" A2 45x .056 .042 .004 C D2 E2 SEE DETAIL "J" SEE DETAIL "L" 4 D E -A-B-D- BASE PLANE .020 MIN. D2 E2 .050 N-4 PLACES 4 DETAIL "A" 6 X .032 .026 .007 MAX. A1 .007 S A D S X TO BE .007 MAX/LEAD Y OPTIONAL FEATURE. IF PRESENT, MINIMUM SPACE BETWEEN ADJACENT LEADS IS 0.08. - C - H - H A-B S Y 2 SEATING PLANE .045 MIN. 5 .025 MIN. SEATING PLANE .021 .013 D D E .010 MAX. 10 E .020 10 .007 M C A-B S DETAIL "J" .020 TYP ALL SIDES .010 MAX. .021 .013 10 .065 .065 .0125 .0075 A A .020 D2 R D2 E2 D S .045 .025 14 .018 .013 E2 SECTION A-A DETAIL "L" TYP ALL SIDES 23 .0105 15 .0075 Lattice Semiconductor Package Diagrams 44-Pin PLCC Package (cont.) -D- S Y M B O L A A1 A2 D D1 D2 D3 E E1 E2 E3 N MIN. NOM. MAX. .165 .090 .062 .685 .650 .291 .685 .650 .291 - .172 .105 .690 .653 .305 .225 .690 .653 .305 .225 44 .180 .120 .083 .695 .656 .319 E3 -A-B12 E3 12 .695 .656 .319 - D3 12 NOTES: 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982. -H2. DATUM PLANE LOCATED AT TOP OF MOLD PARTING LINE AND CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY 3 DATUMS A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS EXIT PLASTIC BODY AT DATUM PLANE -H- 4 TO BE MEASURED AT SEATING PLANE 5 SHAPE OF TRANSITION IS OPTIONAL 6 PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL 7 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER OR LOWER PARTING LINE. -H- CONTACT POINT 8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED DETAILS OF THE IDENTIFIER ARE OPTIONAL. 9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL. 10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH THE SOCKET VENDOR 11 ALL DIMENSIONS IN INCHES -H- BOTTOM POINT OF 12 TOP POINT OF MEASUREMENT IS DATUM MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE (SOCKET SEATING PLANE) DEFINED BY D3/E3 13 PIN NUMBERS ARE FOR REFERENCE ONLY 14 DIMENSION R REQUIRED FOR 120 MINIMUM BEND 15 D3 DIMENSION APPLIES TO BASE METAL ONLY 24 Lattice Semiconductor Package Diagrams 44-Pin TQFP Package (1.0mm thick) Dimensions in Millimeters PIN 1 INDICATOR 0.20 C A-B D 44X D 3 A E1 E B e 3 D 8 D1 3 TOP VIEW 4X 0.20 H A-B D BOTTOM VIEW SIDE VIEW SEE DETAIL 'A' b 0.20 M C A-B SEATING PLANE C GAUGE PLANE H D A A2 0.25 B LEAD FINISH b 0.10 C B 0.20 MIN. A1 c1 c 0-7 L 1.00 REF. b DETAIL 'A' 1 BASE METAL SECTION B-B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. 7. 8. MIN. NOM. MAX. A - - 1.20 A1 0.05 - 0.15 A2 .95 1.00 1.05 D 12.00 BSC D1 10.00 BSC E 12.00 BSC E1 10.00 BSC L 5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. 6. SYMBOL SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 25 0.45 0.60 N 44 e 0.80 BSC b 0.30 b1 c c1 0.75 0.37 0.45 0.30 0.35 0.40 0.09 0.15 0.20 0.09 0.13 0.16 Lattice Semiconductor Package Diagrams 44-Pin TQFP Package (1.4mm thick) Dimensions in Millimeters PIN 1 INDICATOR 0.20 C A-B D 44X D 3 A E1 E B e 3 D 8 D1 3 TOP VIEW 4X 0.20 H A-B D BOTTOM VIEW SIDE VIEW SEE DETAIL 'A' b 0.20 M C A-B SEATING PLANE C GAUGE PLANE H D A A2 0.25 B LEAD FINISH b 0.10 C c B 0.20 MIN. A1 c1 0-7 L 1.00 REF. b DETAIL 'A' 1 BASE METAL SECTION B-B NOTES: 1. SYMBOL MIN. NOM. MAX. A - - 1.60 A1 0.05 - 0.15 A2 1.35 1.40 1.45 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. 5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. D 12.00 BSC D1 10.00 BSC E 12.00 BSC E1 10.00 BSC L 0.45 0.60 0.75 N 44 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. e 0.80 BSC b 0.30 0.37 0.45 7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. b1 0.30 0.35 0.40 c 0.09 0.15 0.20 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. c1 0.09 0.13 0.16 6. 26 Lattice Semiconductor Package Diagrams 48-Pin TQFP Package (1.0mm thick) Dimensions in Millimeters PIN 1 INDICATOR 0.20 C A-B D 48X D 3 A E1 E B e 3 D 8 D1 3 TOP VIEW 4X 0.20 H A-B D BOTTOM VIEW SEE DETAIL 'A' SEATING PLANE b C 0.08 M C A-B D GAUGE PLANE H A A2 0.25 B LEAD FINISH b 0.08 C B A1 0.20 MIN. 0-7 c1 c L 1.00 REF. b DETAIL 'A' 1 BASE METAL SECTION B-B SYMBOL MIN. NOM. MAX. A - - 1.20 NOTES: A1 0.05 - 0.15 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. A2 .95 1.00 1.05 2. ALL DIMENSIONS ARE IN MILLIMETERS. D 9.00 BSC 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. D1 7.00 BSC 4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. E 9.00 BSC E1 7.00 BSC L 5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. 6. 0.45 N SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 0.60 0.75 48 e 0.50 BSC b 0.17 0.22 0.27 7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. b1 0.17 0.20 0.23 c 0.09 0.15 0.20 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. c1 0.09 0.13 0.16 27 Lattice Semiconductor Package Diagrams 48-Pin TQFP Package (1.4mm thick) Dimensions in Millimeters PIN 1 INDICATOR 0.20 H A-B D 0.20 C A-B D D1 D N 3. A 1 E1 E B e D 3. 3. 8. 4X SEE DETAIL "A" H A b 0.08 C GAUGE PLANE 0.25 A2 SEATING PLANE B M C A -B D 0.08 C LEAD FINISH B A1 0.20 MIN. 0-7 b L 1.00 REF. c c1 b DETAIL "A" 1 BASE METAL SECTION B - B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. MIN. NOM. MAX. A - - 1.60 A1 0.05 - 0.15 A2 1.35 1.40 1.45 D 9.00 BSC D1 7.00 BSC E 9.00 BSC E1 7.00 BSC L 5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. 6. SYMBOL 28 0.45 0.60 N 48 e 0.50 BSC 0.22 0.75 b 0.17 0.27 b1 0.17 0.20 0.23 c 0.09 0.15 0.20 c1 0.09 0.13 0.16 Lattice Semiconductor Package Diagrams 49-Ball caBGA Package Dimensions in Millimeters 5 (4X) aaa A1 BALL I.D. IDENTIFIER M A D B 7 6 5 4 3 2 1 A B S C D E N E F G e e S 6 4X 3 A2 A b .15 M C A B .08 M C bbb ddd C C 4 C A1 SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. MAX. A 1.30 1.40 1.50 A1 0.31 0.36 0.41 A2 0.99 1.04 1.09 D/E 7.00 BSC M/N 4.80 BSC S 0 BSC b 0.40 e 29 NOM. 0.46 0.52 0.80 BSC aaa - - 0.10 bbb - - 0.10 ddd - - 0.12 Lattice Semiconductor Package Diagrams 56-Ball csBGA Package Dimensions in Millimeters 5 (4X) aaa A1 BALL I.D. IDENTIFIER M D A B 10 9 8 7 6 5 4 3 2 1 A B C S D E N F E G H J K e e 4X S 6 b 3 A2 A .15 M C A B .05 M C bbb ddd C C C 4 A1 SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. 1.23 A 1.10 A1 0.15 - A2 - - D/E 6.00 BSC M/N 4.50 BSC S 0.25 BSC b 0.25 0.30 MAX. 1.35 1.10 0.35 0.50 BSC e 30 NOM. aaa - - 0.10 bbb - - 0.10 ddd - - 0.08 Lattice Semiconductor Package Diagrams 68-Pin JLCC Package Dimensions in Inches D (N PLACES) D1 .011 M D2 E2 A B B2 L C L1 Q L2 B B R DETAIL A E1 E B1 WITH LEAD FINISH C C1 BASE METAL B SECTION B-B DETAIL A A1 S Y INCHES M A -A.004 B O L SEATING PLANE .050 .020 MIN. D4 E4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN INCHES. 3. CORNER CHAMFERS AND/OR NOTCHES ARE OPTIONAL. 31 A A1 B B1 B2 C C1 D/E D1/E1 D2/E2 D4/E4 L L1 L2 Q R N MIN. MAX. .115 .190 .080 REF .013 .023 .013 .020 .022 .035 .007 .013 .007 .010 .975 .990 1.000 .920 .960 .800 BSC .930 BSC .005 .020 .025 .003 .020 .040 68 Lattice Semiconductor Package Diagrams 68-Pin PLCC Package Dimensions in Inches .007 S H A-B S D S D D .007 S H A-B .002 A-B 45 X .048 .042 7 1 S D S S -D- 13 3 2 1 3 8 N .150 MAX .050 (N-4PLACES) E E1 -B- .075 MAX 7 3 -A3 see DETAIL B .007 S H A-B // .002 A-B .007 S H S D S S A-B S D S 9 .020 MAX 3 PLCS .020 MAX 3 PLCS 9 DETAIL B 32 Lattice Semiconductor Package Diagrams 68-Pin PLCC Package (cont.) -C.045 MIN. 7 .025 MIN. BASE PLANE .020 MIN .025/.045 R. SEE DETAIL "A" A2 45x .056 .042 .004 C D2 E2 SEE DETAIL "J" SEE DETAIL "L" 4 D E -A-B-D- BASE PLANE .020 MIN. D2 E2 .050 N-4 PLACES 4 DETAIL "A" 6 X .032 .026 .007 MAX. A1 .007 S D S Y A X TO BE .007 MAX/LEAD Y OPTIONAL FEATURE. IF PRESENT, MINIMUM SPACE BETWEEN ADJACENT LEADS IS 0.08. - C - H - H A-B S 2 SEATING PLANE .045 MIN. 5 .025 MIN. SEATING PLANE .021 .013 D D E .010 MAX. 10 E .020 10 .007 M C A-B S DETAIL "J" .020 TYP ALL SIDES .010 MAX. .021 .013 10 .065 .065 .0125 .0075 A A .020 D2 R D2 E2 D S .045 .025 14 .018 .013 E2 SECTION A-A DETAIL "L" TYP ALL SIDES 33 .0105 15 .0075 Lattice Semiconductor Package Diagrams 68-Pin PLCC Package (cont.) -D- S Y M B O L A A1 A2 D D1 D2 D3 E E1 E2 E3 N MIN. NOM. MAX. .165 .090 .062 .985 .950 .441 .985 .950 .441 - .172 .105 .990 .954 .455 .375 .990 .954 .455 .375 68 .180 .120 .083 .995 .958 .469 E3 -A-B12 E3 12 .995 .958 .469 - D3 12 NOTES: 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982. -HLOCATED AT TOP OF MOLD PARTING LINE AND 2. DATUM PLANE CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY 3 DATUMS A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS EXIT PLASTIC BODY AT DATUM PLANE -H- 4 TO BE MEASURED AT SEATING PLANE 5 SHAPE OF TRANSITION IS OPTIONAL 6 PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL 7 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER OR LOWER PARTING LINE. -H- CONTACT POINT 8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED DETAILS OF THE IDENTIFIER ARE OPTIONAL. 9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL. 10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH THE SOCKET VENDOR 11 ALL DIMENSIONS IN INCHES -H- BOTTOM POINT OF 12 TOP POINT OF MEASUREMENT IS DATUM MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE (SOCKET SEATING PLANE) DEFINED BY D3/E3 13 PIN NUMBERS ARE FOR REFERENCE ONLY 14 DIMENSION R REQUIRED FOR 120 MINIMUM BEND 15 D3 DIMENSION APPLIES TO BASE METAL ONLY 34 Lattice Semiconductor Package Diagrams 84-Pin CPGA Package Dimensions in Inches .145 .070 -AD 1.180 1.140 .008 3 .30 M C A M B M .10 M C E 1.180 1.140 3 X X .100 .200 .100 -B- .100 .075 .045 .080 MAX. -C- .020 .016 BASE METAL .0215 .0165 SECTION X-X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN INCHES. 3. DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF .006 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN NOT TO EXCEED .003 INCHES MAXIMUM PER SIDE. 35 SEATING PLANE Lattice Semiconductor Package Diagrams 84-Pin PLCC Package Dimensions in Inches .007 S H A-B S D S D D .007 S H A-B .002 A-B 45 X .048 .042 7 1 S D S S -D- 13 3 2 1 3 8 N .150 MAX .050 (N-4PLACES) E E1 -B- .075 MAX 7 3 -A3 see DETAIL B .007 S H A-B // .002 A-B .007 S H S D S S A-B S D S 9 .020 MAX 3 PLCS .020 MAX 3 PLCS 9 DETAIL B 36 Lattice Semiconductor Package Diagrams 84-Pin PLCC Package (cont.) -C.045 MIN. 7 .025 MIN. BASE PLANE .020 MIN .025/.045 R. SEE DETAIL "A" A2 45x .056 .042 .004 C D2 E2 SEE DETAIL "J" SEE DETAIL "L" 4 D E -A-B-D- BASE PLANE .020 MIN. D2 E2 .050 N-4 PLACES 4 DETAIL "A" 6 X .032 .026 .007 MAX. A1 .007 S A D S X TO BE .007 MAX/LEAD Y OPTIONAL FEATURE. IF PRESENT, MINIMUM SPACE BETWEEN ADJACENT LEADS IS 0.08. - C - H - H A-B S Y 2 SEATING PLANE .045 MIN. 5 .025 MIN. SEATING PLANE .021 .013 D D E .010 MAX. 10 E .020 10 .007 M C A-B S DETAIL "J" .020 TYP ALL SIDES .010 MAX. .021 .013 10 .065 .065 .0125 .0075 A A .020 D2 R D2 E2 D S .045 .025 14 .018 .013 E2 SECTION A-A DETAIL "L" TYP ALL SIDES 37 .0105 15 .0075 Lattice Semiconductor Package Diagrams 84-Pin PLCC Package (cont.) -D- S Y M B O L MIN. NOM. MAX. A A1 A2 D D1 D2 D3 E E1 E2 E3 N .172 .180 .105 .120 .080 1.190 1.195 1.154 1.158 .569 .555 .475 1.185 1.190 1.195 1.150 1.154 1.158 .541 .555 .569 .475 84 .165 .090 .059 1.185 1.150 .541 E3 -A-B12 E3 12 D3 12 NOTES: 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982. -HLOCATED AT TOP OF MOLD PARTING LINE AND 2. DATUM PLANE CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY 3 DATUMS A-B AND -D- TO BE DETERMINED WHERE CENTER LEADS EXIT PLASTIC BODY AT DATUM PLANE -H- 4 TO BE MEASURED AT SEATING PLANE 5 SHAPE OF TRANSITION IS OPTIONAL 6 PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL 7 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER OR LOWER PARTING LINE. -H- CONTACT POINT 8 PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED DETAILS OF THE IDENTIFIER ARE OPTIONAL. 9 EXACT SHAPE OF THIS FEATURE IS OPTIONAL. 10 THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH THE SOCKET VENDOR 11 ALL DIMENSIONS IN INCHES -H- BOTTOM POINT OF 12 TOP POINT OF MEASUREMENT IS DATUM MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE (SOCKET SEATING PLANE) DEFINED BY D3/E3 13 PIN NUMBERS ARE FOR REFERENCE ONLY 14 DIMENSION R REQUIRED FOR 120 MINIMUM BEND 15 D3 DIMENSION APPLIES TO BASE METAL ONLY 38 Lattice Semiconductor Package Diagrams 100-Ball caBGA Package Dimensions in Millimeters 5 (4X) aaa A D M A1 BALL I.D. IDENTIFIER 10 9 8 7 6 5 4 3 2 B 1 A B C S D E F e E N G H J K e S 4X b 6 A2 A 3 .15 M C A B .08 M C A1 bbb ddd C 4 C SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. C MIN. MAX. A 1.30 1.40 1.50 A1 0.31 0.36 0.41 A2 0.99 1.04 1.09 D/E 10.00 BSC M/N 7.20 BSC S 0.40 BSC b 0.40 0.46 0.52 0.80 BSC e 39 NOM. aaa - - 0.10 bbb - - 0.10 ddd - - 0.12 Lattice Semiconductor Package Diagrams 100-Ball fpBGA Package Dimensions in Millimeters (4X) aaa 10 9 8 7 6 A D M e 5 5 4 3 2 A1BALLI.D. IDENTIFIER 1 B A B C D E N F E G S H J K e S 4X b 3 6 A2 A .25 M C A B .10 M C bbb ddd C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. C C 4 1. A1 MIN. 3 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. A 1.30 1.50 1.70 0.30 0.50 0.70 1.10REF D/E 11.00BSC M/N 9.00BSC S 0.50BSC b 0.40 0.55 0.70 1.00BSC e 40 MAX. A1 A2 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC NOM. aaa - - 0.20 bbb - - 0.25 ddd - - 0.20 Lattice Semiconductor Package Diagrams 100-Pin PQFP Package Dimensions in Millimeters PIN 1 INDICATOR 0.25 C A-B D 4X E E1 -A- 3 N 1 3 -D- TOP VIEW BOTTOM VIEW D OPTIONAL FEATURE (HEAT SINK) D1 9 0.20 H A-B D 4X 8 3 -B- SEE DETAIL "A" 0.40 MIN. e (N-4)X 0 MIN. SEATING PLANE DETAIL "A" -H-CA 0.12 M C A-B D A2 0.13/0.30 R. b 0.13 R. MIN. GAGE PLANE B 0.25 b 0.10 C LEAD FINISH B A1 0-7 L SECTION B - B c 1.60 REF. c1 b1 BASE METAL NOTES: 1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. SYMBOL MIN. NOM. MAX. A - - 3.40 A1 0.25 - 0.50 A2 2.50 2.70 2.90 D 23.20 BSC D1 20.00 BSC E 17.20 BSC E1 5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. L 14.00 BSC 0.73 N 6.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL. 41 1.03 100 e 7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 0.88 0.65 BSC b 0.22 - 0.40 b1 0.22 0.30 0.36 c 0.11 - 0.23 c1 0.11 0.15 0.19 Lattice Semiconductor Package Diagrams 100-Pin TQFP Package Dimensions in Millimeters 0.20 C A-B PIN 1 INDICATOR D 100X D 3 A E E1 B 3 e D 8 D1 3 TOP VIEW 4X 0.20 H A-B D BOTTOM VIEW SIDE VIEW SEE DETAIL 'A' b 0.20 M C A-B SEATING PLANE C D GAUGE PLANE H A A2 0.25 B LEAD FINISH b 0.10 C c1 c B 0.20 MIN. A1 0-7 L 1.00 REF. b DETAIL 'A' 1 BASE METAL SECTION B-B SYMBOL MIN. NOM. MAX. A - - 1.60 A1 0.05 - 0.15 1.35 1.40 1.45 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. A2 2. ALL DIMENSIONS ARE IN MILLIMETERS. D 16.00 BSC 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. D1 14.00 BSC 4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. E 16.00 BSC E1 14.00 BSC 5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. L N 100 6. SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. e 0.50 BSC b 0.17 0.22 0.27 7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. b1 0.17 0.20 0.23 c 0.09 0.15 0.20 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. c1 0.09 0.13 0.16 42 0.45 0.60 0.75 Lattice Semiconductor Package Diagrams 120-Pin PQFP Package Dimensions in Millimeters PIN 1 INDICATOR 0.25 C A-B D 4X D D1 N 1 TOP VIEW 3 3 A BOTTOM VIEW B E E1 OPTIONAL FEATURE 9 (HEAT SINK) 0.20 H A-B D 8 3 SEE DETAIL "A" 0.20 MIN. SEATING PLANE 0 MIN. e (N-4)X C DETAIL "A" H A A2 0.13/0.30 R. b 0.20 M C A-B D 0.13 R. MIN. GAGE PLANE B 0.25 b LEAD FINISH 0.10 C B A1 0-7 L SECTION B - B D 4X c 1.60 REF. c1 b1 BASE METAL NOTES: 1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. SYMBOL MIN. NOM. MAX. A - - 4.10 A1 0.25 - 0.50 A2 3.20 3.40 3.60 D 31.20 BSC D1 28.00 BSC E 31.20 BSC E1 5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. L 6.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL. 43 28.00 BSC 0.73 0.88 N 120 e 0.80 BSC 1.03 b 0.29 - 0.45 b1 0.29 0.35 0.41 c 0.11 - 0.23 c1 0.11 0.15 0.19 Lattice Semiconductor Package Diagrams 128-Pin PQFP Package Dimensions in Millimeters PIN 1 INDICATOR D 4X 0.25 C A-B D D1 N 1 TOP VIEW 3 3 A BOTTOM VIEW B E E1 OPTIONAL FEATURE 9 (HEAT SINK) 0.20 H A-B D 8 3 SEE DETAIL "A" 0.20 MIN. SEATING PLANE 0 MIN. e (N-4)X C DETAIL "A" H A A2 0.13/0.30 R. b 0.20 M C A-B D 0.13 R. MIN. GAGE PLANE B 0.25 b LEAD FINISH 0.10 C B A1 0-7 L SECTION B - B D 4X c 1.60 REF. c1 b1 BASE METAL NOTES: 1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. SYMBOL MIN. NOM. MAX. A - - 4.10 A1 0.25 - 0.50 A2 3.20 3.40 3.60 D 31.20 BSC D1 28.00 BSC E 31.20 BSC E1 5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. L 28.00 BSC 0.73 N 6.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL. 44 1.03 128 e 7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 0.88 0.80 BSC b 0.29 - 0.45 b1 0.29 0.35 0.41 c 0.11 - 0.23 c1 0.11 0.15 0.19 Lattice Semiconductor Package Diagrams 128-Pin TQFP Package Dimensions in Millimeters PIN 1 INDICATOR 0.20 C A-B D D1 0.20 H A-B D D N 1 3. A E1 E e B D 3. 3. 8. 4X SEE DETAIL "A" H b 0.07 C A SEATING PLANE GAUGE PLANE 0.25 A2 B M C A -B D 0.08 C B A1 LEAD FINISH 0.20 MIN. 0-7 b L 1.00 REF. c c1 DETAIL "A" b 1 BASE METAL SECTION B - B SYMBOL MIN. NOM. MAX. A - - 1.60 NOTES: A1 0.05 - 0.15 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. A2 1.35 1.40 1.45 2. ALL DIMENSIONS ARE IN MILLIMETERS. D 16.00 BSC 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. D1 14.00 BSC 4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. E 16.00 BSC E1 14.00 BSC L 5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. 6. SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 45 0.45 0.60 N 128 e 0.40 BSC 0.18 0.75 b 0.13 b1 0.13 0.16 0.23 0.19 c 0.09 0.15 0.20 c1 0.09 0.13 0.16 Lattice Semiconductor Package Diagrams 132-Ball csBGA Package Dimensions in Millimeters 5 (4X) aaa A1 BALL I.D. IDENTIFIER M D A B 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E S F G N H E J K L M N P e e 6 4X S 3 A2 A b bbb .15 M C A B .05 M C ddd 4 C C C A1 SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. A 0.90 A1 0.15 - A2 - - 1.23 D/E 8.00 BSC M/N 6.50 BSC S 0.25 BSC b 0.25 e 46 NOM. 0.30 MAX. 1.35 1.10 0.35 0.50 BSC aaa - - 0.10 bbb - - 0.10 ddd - - 0.08 Lattice Semiconductor Package Diagrams 133-Pin CPGA Package Dimensions in Inches .145 .070 -A- D 1.480 1.440 .008 3 .30 M C A M B M .10 M C .050 E 1.480 1.440 3 X X .100 .200 .100 .050 -B.100 .075 .045 .080 MAX. SEATING PLANE -C- .020 .016 BASE METAL .0215 .0165 SECTION X-X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN INCHES. 3. DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF .006 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN NOT TO EXCEED .003 INCHES MAXIMUM PER SIDE. 47 Lattice Semiconductor Package Diagrams 144-Ball fpBGA Package Dimensions in Millimeters A1BALLI.D. IDENTIFIER 5 aaa (4X) A D M B B 12 11 10 9 8 7 6 5 4 3 2 1 A B S C D E F N G E C H J K L M e e S 3 A .25 M C A B .10 M C A1 bbb ddd ccc C 3 C C NOTES:UNLESSOTHERWISESPECIFIED 2. SYMBOL MIN. NOM. MAX. DIMENSIONSANDTOLERANCES PERANSIY14.5M. A 1.30 1.70 2.10 A1 0.30 0.50 0.70 ALLDIMENSIONSAREINMILLIMETERS. A2 0.30 0.50 0.70 B/C 11.00 11.60 12.20 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. D/E 13.00BSC M/N 11.00BSC S b 0.50BSC 0.50 e 6 A2 C 4 1. 6 4X b EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. 48 0.60 0.70 1.00BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 Lattice Semiconductor Package Diagrams 144-Pin PQFP Package Dimensions in Millimeters PIN 1 INDICATOR 0.25 C A-B D 4X D D1 N 1 TOP VIEW 3 3 BOTTOM VIEW B A E E1 OPTIONAL FEATURE 9 (HEAT SINK) 0.20 H A-B D 8 3 SEE DETAIL "A" 0.20 MIN. SEATING PLANE 0 MIN. e (N-4)X C DETAIL "A" H A A2 0.13/0.30 R. b 0.13 M C A-B D 0.13 R. MIN. GAGE PLANE B 0.25 b LEAD FINISH 0.10 C B A1 0-7 L SECTION B - B D 4X c 1.60 REF. c1 b1 BASE METAL NOTES: 1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. SYMBOL MIN. NOM. MAX. A - - 4.10 A1 0.25 - 0.50 A2 3.20 3.40 3.60 D 31.20 BSC D1 28.00 BSC E 31.20 BSC 28.00 BSC E1 5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. L 0.73 N 6.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL. 49 1.03 144 e 7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 0.88 0.65 BSC b 0.22 - 0.40 b1 0.22 0.30 0.36 c 0.11 - 0.23 c1 0.11 0.15 0.19 Lattice Semiconductor Package Diagrams 144-Pin TQFP Package Dimensions in Millimeters PIN 1 INDICATOR 0.20 C A-B D D1 0.20 H A-B D D N 1 3. A E1 E e B D 3. 3. 8. 4X SEE DETAIL "A" H b 0.08 C A SEATING PLANE GAUGE PLANE 0.25 A2 B M C A -B D 0.08 C B A1 LEAD FINISH 0.20 MIN. 0-7 b L 1.00 REF. c c1 DETAIL "A" b 1 BASE METAL SECTION B - B SYMBOL MIN. NOM. MAX. A - - 1.60 A1 0.05 - 0.15 A2 1.35 1.40 1.45 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. 4. D 22.00 BSC DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. D1 20.00 BSC DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. E 22.00 BSC E1 20.00 BSC L 5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. 6. SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 0.45 N 0.75 144 e 50 0.60 0.50 BSC b 0.17 0.22 0.27 b1 0.17 0.20 0.23 c 0.09 0.15 0.20 c1 0.09 0.13 0.16 Lattice Semiconductor Package Diagrams 160-Pin PQFP Package Dimensions in Millimeters PIN 1 INDICATOR 0.25 C A-B D 4X D D1 N 1 TOP VIEW 3 3 A BOTTOM VIEW B E E1 OPTIONAL FEATURE 9 (HEAT SINK) 0.20 H A-B D 8 3 SEE DETAIL "A" 0.20 MIN. SEATING PLANE 0 MIN. e (N-4)X C DETAIL "A" H A A2 0.13/0.30 R. b 0.13 M C A-B D 0.13 R. MIN. GAGE PLANE B 0.25 b LEAD FINISH 0.10 C B A1 0-7 L SECTION B - B D 4X c 1.60 REF. c1 b1 BASE METAL MIN. NOM. MAX. A - - 4.10 A1 0.25 - 0.50 A2 3.20 3.40 3.60 SYMBOL NOTES: 1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. D 31.20 BSC D1 28.00 BSC E 31.20 BSC 28.00 BSC E1 5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. L 0.73 6.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL. 51 1.03 0.65 BSC e 7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 0.88 160 N b 0.22 - 0.40 b1 0.22 0.30 0.36 c 0.11 - 0.23 c1 0.11 0.15 0.19 Lattice Semiconductor Package Diagrams 176-Pin TQFP Package Dimensions in Millimeters PIN 1 INDICATOR 0.20 C A-B D D1 0.20 H A-B D D N 1 3. A E1 E e B D 3. 3. 8. 4X SEE DETAIL "A" H b C 0.08 A SEATING PLANE GAUGE PLANE 0.25 A2 M C A -B D B 0.08 C B A1 LEAD FINISH 0.20 MIN. 0-7 b L 1.00 REF. c c1 DETAIL "A" b 1 BASE METAL SECTION B - B SYMBOL MIN. NOM. MAX. A - - 1.60 A1 0.05 - 0.15 1.35 1.40 1.45 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. A2 2. ALL DIMENSIONS ARE IN MILLIMETERS. D 26.00 BSC 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. D1 24.00 BSC 4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. E 26.00 BSC E1 L 5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. 6. 7. 8. SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 52 24.00 BSC 0.45 0.60 N 176 e 0.50 BSC 0.22 0.75 b 0.17 0.27 b1 0.17 0.20 0.23 c 0.09 0.15 0.20 c1 0.09 0.13 0.16 Lattice Semiconductor Package Diagrams 208-Ball fpBGA Package Dimensions in Millimeters A1BALLI.D. IDENTIFIER 5 aaa (4X) A D M B B 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D S E F G H E C N J K L M N P R T e e S 4X b 3 6 A .25 M C A B .10 M C A1 bbb ddd C ccc A2 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. MIN. MAX. A 1.30 1.70 2.10 A1 0.30 0.50 0.70 A2 0.30 0.50 0.70 B/C 14.80 15.30 15.80 D/E 17.00BSC M/N 15.00BSC S b 0.50BSC 0.50 e 53 NOM. 0.60 0.70 1.00BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 Lattice Semiconductor Package Diagrams 208-Pin PQFP Package (with or without Internal Heat Spreader) Dimensions in Millimeters PIN 1 INDICATOR D 4X 0.25 C A-B D D1 N 1 TOP VIEW 3 3 A BOTTOM VIEW B E E1 OPTIONAL FEATURE 9 (HEAT SINK) 0.20 H A-B D 8 3 SEE DETAIL "A" 0.20 MIN. SEATING PLANE 0 MIN. e (N-4)X C DETAIL "A" H A A2 0.08/0.25 R. b 0.08 M C A-B D 0.08 R. MIN. GAGE PLANE B 0.25 b LEAD FINISH 0.08 C B A1 0-8 L SECTION B - B D 4X c 1.30 REF. c1 b1 BASE METAL NOTES: 1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. SYMBOL MIN. NOM. MAX. A - - 4.10 A1 0.25 - 0.50 A2 3.20 3.40 3.60 D 30.60 BSC D1 28.00 BSC E 30.60 BSC E1 5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. L 28.00 BSC 0.45 N 6.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL. 54 0.75 208 e 7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 0.60 0.50 BSC b 0.17 - 0.27 b1 0.17 0.20 0.23 c 0.09 - 0.20 c1 0.09 0.12 0.16 Lattice Semiconductor Package Diagrams 240-Pin MQFP Package Dimensions in Millimeters PIN 1 INDICATOR D1 D N 1 TOP VIEW BOTTOM VIEW E E1 2.54 TYP. SEE DETAIL "A" 0.35 MIN. SEATING PLANE 0 MIN. e (N-4)X C DETAIL "A" A A2 0.08/0.25 R. b 0.08 M C 0.16R TYP. GAGE PLANE B 0.25 b 0.08 C LEAD FINISH B A1 0-8 L SECTION B - B c c1 b1 BASE METAL SYMBOL MIN. NOM. MAX. A - - 4.15 A1 0.25 - 0.65 NOTES: 1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. A2 3.10 3.35 3.60 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. D 34.40 34.60 34.80 3.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. D1 31.60 31.70 31.80 E 34.40 34.60 34.80 E1 31.60 31.70 31.80 L 0.45 0.60 0.75 N 240 e 55 0.50 BSC b 0.17 - 0.27 b1 0.17 0.20 0.23 c 0.09 - 0.20 c1 0.09 0.12 0.16 Lattice Semiconductor Package Diagrams 240-Pin PQFP Package Dimensions in Millimeters PIN 1 INDICATOR 0.25 C A-B D 4X D D1 N 1 TOP VIEW 3 3 BOTTOM VIEW B A E E1 OPTIONAL FEATURE 9 (HEAT SINK) 0.20 H A-B D 8 3 SEE DETAIL "A" 0.20 MIN. SEATING PLANE 0 MIN. e (N-4)X C DETAIL "A" H A A2 0.08/0.25 R. b 0.08 M C A-B D 0.08 R. MIN. GAGE PLANE B 0.25 b LEAD FINISH 0.08 C B A1 0-8 L SECTION B - B D 4X c 1.30 REF. c1 b1 BASE METAL NOTES: 1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. SYMBOL MIN. NOM. MAX. A - - 4.10 A1 0.25 - 0.50 A2 3.20 3.40 3.60 D 34.60 BSC D1 32.00 BSC E 34.60 BSC E1 5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. L 32.00 BSC 0.45 N 6.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL. 56 0.75 240 e 7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 0.60 0.50 BSC b 0.17 - 0.27 b1 0.17 0.20 0.23 c 0.09 - 0.20 c1 0.09 0.12 0.16 Lattice Semiconductor Package Diagrams 256-Ball fpBGA Package Dimensions in Millimeters A1BALLI.D. IDENTIFIER 5 aaa (4X) A D M B B 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D S E F G H E C N J K L M N P R T e e S 3 6 4X b A .25 M C A B .10 M C A1 bbb ddd ccc C A2 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. MIN. MAX. A 1.30 1.70 2.10 A1 0.30 0.50 0.70 A2 0.30 0.50 0.70 B/C 14.80 15.30 15.80 D/E 17.00BSC M/N 15.00BSC S b 0.50BSC 0.50 e 57 NOM. 0.60 0.70 1.00BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 Lattice Semiconductor Package Diagrams 256-Ball SBGA Package Dimensions in Millimeters (4X) aaa A1 BALL I.D. IDENTIFIER M 5 A D B 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T U V W Y S A A N E e e S b 4X 6 .30 M C A B .15 M C 3 A1 A4 bbb C ddd Q A2 A 4 C C A-A SECTION VIEW SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. NOM. A - - 1.70 A1 0.50 0.65 0.80 A2 0.80 0.90 1.00 D/E 27.00 BSC M/N 24.13 BSC S 0.635 BSC b 0.60 e 58 0.75 MAX. 0.90 1.27 BSC Q 0.25 - - A4 0.10 - - aaa - - 0.20 bbb - - 0.25 ddd - - 0.20 Lattice Semiconductor Package Diagrams 269-Ball fcBGA Package Dimensions in Millimeters A1BALLI.D. IDENTIFIER 5 aaa M 17 16 15 14 13 12 11 10 9 (4X) A D 8 7 5 6 4 3 2 1 B A B C D E F B G H N J K E C L M N P R T 3.5x3.5mmareas forpassivecomponents U e e b .15 M C A B .08 M C 3 4X 6 A3 A2 bbb ddd C C 4 C A1 NOTES:UNLESSOTHERWISESPECIFIED SYMBOL 1. 2. 3 4 A MIN. NOM. MAX. 2.00 2.20 2.40 DIMENSIONSANDTOLERANCES PERANSIY14.5M. A1 0.30 0.40 0.50 ALLDIMENSIONSAREINMILLIMETERS. A2 0.80 0.90 1.00 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC A3 - B 5.00 C 5.00 D/E PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. 5.25 5.50 12.80BSC 0.35 e 59 0.70 5.50 15.00BSC M/N b 5.25 0.45 0.55 0.80BSC aaa - - 0.10 bbb - - 0.10 ddd - - 0.12 A Lattice Semiconductor Package Diagrams 272-Ball BGA Package Dimensions in Millimeters 5 (4X) aaa A D M 20 16 18 19 17 14 15 12 13 A1 BALL I.D. IDENTIFIER 10 11 6 8 9 7 4 5 B B 2 1 3 A B C D E F G S H J K N L C E M N P R T U V W Y e e S b 6 4X 3 .30 M C A B .15 M C A A2 A1 ccc bbb ddd 4 C C SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. C C MIN. MAX. A 1.90 2.25 2.80 A1 0.50 0.65 0.80 A2 0.28 0.54 0.80 B/C 23.80 24.30 24.80 D/E 27.00 BSC M/N 24.13 BSC S 0.635 BSC b 0.60 0.75 0.90 1.27 BSC e 60 NOM. aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 Lattice Semiconductor Package Diagrams 304-Pin MQFP Package Dimensions in Millimeters PIN 1 INDICATOR D1 D N 1 TOP VIEW BOTTOM VIEW E E1 2.54 TYP. SEE DETAIL "A" 0.35 MIN. SEATING PLANE 0 MIN. e (N-4)X C DETAIL "A" A A2 0.08/0.25 R. b 0.08 M C 0.16R TYP. GAGE PLANE B 0.25 b 0.08 C LEAD FINISH B A1 0-8 L SECTION B - B c c1 b1 BASE METAL NOTES: 1.0 SYMBOL MIN. NOM. MAX. A - - 4.55 A1 0.25 - 0.65 A2 3.60 3.80 4.00 D 42.40 42.60 42.80 D1 39.60 39.70 39.80 E 42.40 42.60 42.80 E1 39.60 39.70 39.80 L 0.45 0.60 0.75 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. 3.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. N 304 e 61 0.50 BSC b 0.17 - 0.27 b1 0.17 0.20 0.23 c 0.09 - 0.20 c1 0.09 0.12 0.16 Lattice Semiconductor Package Diagrams 304-Pin PQFP Package Dimensions in Millimeters PIN 1 INDICATOR D 4X 0.25 C A-B D D1 N 1 TOP VIEW 3 3 A BOTTOM VIEW B E E1 OPTIONAL FEATURE 9 (HEAT SINK) 0.20 H A-B D 8 3 SEE DETAIL "A" 0.20 MIN. SEATING PLANE 0 MIN. e (N-4)X C DETAIL "A" H A A2 0.08/0.25 R. b 0.08 M C A-B D 0.08 R. MIN. GAGE PLANE B 0.25 b LEAD FINISH 0.08 C B A1 0-8 L SECTION B - B D 4X c 1.30 REF. c1 b1 BASE METAL NOTES: 1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982. 2.0 ALL DIMENSIONS ARE IN MILLIMETERS. 3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. 4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1 DIMENSIONS. SYMBOL MIN. NOM. MAX. A - - 4.50 A1 0.25 - 0.50 A2 3.55 3.80 4.05 D 42.60 BSC D1 40.00 BSC E 42.60 BSC 40.00 BSC E1 5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF THE PACKAGE BY 0.15 MM. L 0.45 6.0 SECTION B-B: THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 9. EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL. 62 0.75 0.50 BSC e 7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 0.60 304 N b 0.17 - 0.27 b1 0.17 0.20 0.23 c 0.09 - 0.20 c1 0.09 0.12 0.16 Lattice Semiconductor Package Diagrams 320-Ball SBGA Package Dimensions in Millimeters 5 (4X) aaa A D A1 BALL I.D. IDENTIFIER M B 23 24 21 22 19 20 17 18 13 15 16 14 9 11 12 10 7 8 5 6 3 4 1 2 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD S A A N E e e S b 4X 6 .30 M C A B .15 M C 3 A1 A2 A A4 bbb ddd Q C C 4 C A-A SECTION VIEW SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. MAX. A - - 1.70 A1 0.50 0.65 0.80 A2 0.80 0.90 1.00 D/E 31.00 BSC M/N 29.21 BSC S 0.635 BSC b 0.60 e 63 NOM. 0.75 0.90 1.27 BSC Q 0.25 - - A4 0.10 - - aaa - - 0.20 bbb - - 0.25 ddd - - 0.20 Lattice Semiconductor Package Diagrams 352-Ball SBGA Package Dimensions in Millimeters 5 (4X) aaa A D A1 BALL I.D. IDENTIFIER M B 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H S J K L M N P R T U V W Y AA AB AC AD AE AF A e A N E e S 6 4X b .30 M C A B .15 M C 3 A1 A2 A A4 bbb ddd Q C C 4 C A-A SECTION VIEW 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. NOM. A - - 1.70 A1 0.50 0.65 0.80 A2 0.80 0.90 1.00 SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED D/E 35.00 BSC M/N 31.75 BSC S 0.635 BSC b 0.60 e 64 0.75 MAX. 0.90 1.27 BSC Q 0.25 - - A4 0.10 - - aaa - - 0.20 bbb - - 0.25 ddd - - 0.20 Lattice Semiconductor Package Diagrams 388-Ball BGA Package Dimensions in Millimeters 5 (4X) aaa A D A1 BALL I.D. IDENTIFIER M 26 24 25 22 23 20 21 18 19 16 17 12 14 15 13 10 11 8 9 6 7 4 5 B B 2 3 1 A B C D E F G H J S K L M N N P C E R T U V W Y AA AB AC AD AE AF e e S 3 A2 A .30 M C A B .15 M C A1 ccc bbb ddd C C C 4 C SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 6 4X b DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. MAX. 1.90 2.80 3.25 A1 0.50 0.65 0.80 A2 0.28 0.54 0.80 B/C 29.80 31.80 33.80 D/E 35.00 BSC M/N 31.75 BSC S 0.635 BSC b 0.60 e 65 NOM. A 0.75 0.90 1.27 BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 Lattice Semiconductor Package Diagrams 388-Ball fpBGA Package Dimensions in Millimeters 5 A1BALLI.D. IDENTIFIER (4X) aaa A D M B B 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G S H J K L N M C E N P R T U V W Y AA AB e e S 6 4X b 3 A .25 M C A B .10 M C A1 ccc bbb ddd C A2 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. MIN. MAX. A 1.70 2.15 2.60 A1 0.30 0.50 0.70 A2 0.30 0.50 0.70 B/C 19.30 19.80 20.30 D/E 23.00BSC M/N 21.00BSC S b 0.50BSC 0.50 e 66 NOM. 0.60 0.70 1.00BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 Lattice Semiconductor Package Diagrams 416-Ball fpBGA Package Dimensions in Millimeters 5 A1BALLI.D. IDENTIFIER aaa (4X) 25 20 22 24 23 21 16 18 19 17 14 15 A D M 26 10 12 13 11 8 9 4 6 7 5 2 3 B B 1 A B C D E F G H J S K L M N P N C E R T U V W Y AA AB AC AD AE AF e e S 3 6 4X b A .25 M C A B .10 M C ccc C bbb ddd A1 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. MIN. MAX. 1.70 2.15 2.60 A1 0.30 0.50 0.70 A2 0.30 0.50 0.70 B/C 23.80 24.80 25.80 D/E 27.00BSC M/N 25.00BSC S b 0.50BSC 0.50 e 67 NOM. A 0.60 0.70 1.00BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 A2 Lattice Semiconductor Package Diagrams 432-Ball SBGA Package Dimensions in Millimeters 5 (4X) aaa A1 BALL I.D. IDENTIFIER A D M B 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL S A N E e e S 6 4X b .30 M C A B .15 M C 3 A1 bbb A4 ddd A2 A C C 4 C Q A-A SECTION VIEW SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. MAX. A - - 1.70 A1 0.50 0.65 0.80 A2 0.80 0.90 1.00 D/E 40.00 BSC M/N 38.10 BSC S b 0.00 BSC 0.60 e 68 NOM. 0.75 0.90 1.27 BSC Q 0.25 - - A4 0.10 - - aaa - - 0.20 bbb - - 0.25 ddd - - 0.20 Lattice Semiconductor Package Diagrams 484-Ball fpBGA Package Dimensions in Millimeters A1BALLI.D. IDENTIFIER (4X) 5 aaa A D M B B 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G S H J K L N M C E N P R T U V W Y AA AB e e S 6 4X b 3 A .25 M C A B .10 M C A1 ccc bbb ddd C A2 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. MIN. MAX. A 1.70 2.15 2.60 A1 0.30 0.50 0.70 A2 0.30 0.50 0.70 B/C 19.30 19.80 20.30 D/E 23.00BSC M/N 21.00BSC S b 0.50BSC 0.50 0.60 0.70 1.00BSC e 69 NOM. aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 Lattice Semiconductor Package Diagrams 492-Ball BGA Package Dimensions in Millimeters 5 (4X) aaa A D A1 BALL I.D. IDENTIFIER M 24 26 25 22 23 20 21 16 18 19 17 14 15 12 13 10 11 8 9 6 7 4 5 B B 2 3 1 A B C D E F G H J S K L M N N P C E R T U V W Y AA AB AC AD AE AF e e S 6 4X b A2 A 3 A1 .30 M C A B .15 M C ccc bbb ddd C C 4 C SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 C DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. MAX. A 1.90 2.80 3.25 A1 0.50 0.65 0.80 A2 0.28 0.54 0.80 B/C 29.80 30.30 30.80 D/E 35.00 BSC M/N 31.75 BSC 0.635 BSC S b 0.60 e 70 NOM. 0.75 0.90 1.27 BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 Lattice Semiconductor Package Diagrams 516-Ball fpBGA Package Dimensions in Millimeters 5 A1BALLI.D. IDENTIFIER aaa (4X) A D M 30 28 29 26 27 24 25 20 22 23 21 18 19 16 17 14 15 8 10 12 13 11 9 6 7 4 5 2 3 B B 1 A B C D E F G H J K L S M N OPTIONALFEATURE (HEATSINK) P R N T U E C 6 V W Y AA AB AC AD AE AF AG AH AJ e AK b e S 4X .25 M C A B .10 M C 3 A ccc C bbb ddd A1 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 6 MIN. A 1.70 2.15 2.60 0.30 0.50 0.70 A2 0.30 0.50 0.70 B/C 25.80 27.55 29.30 D/E 31.00BSC M/N 29.00BSC b 0.50BSC 0.50 e 71 MAX. A1 S EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. NOM. 0.60 0.70 1.00BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 A2 Lattice Semiconductor Package Diagrams 600-Ball SBGA Package Dimensions in Millimeters A1 BALL I.D. IDENTIFIER 5 aaa (4X) A D M B 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR S A e A N E S e 6 4X b .30 M C A B .15 M C 3 A1 bbb A4 ddd C C 4 C Q A-A SECTION VIEW SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. 2. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 6 MIN. A - - 1.70 0.50 0.65 0.80 A2 0.80 0.90 1.00 D/E 45.00 BSC M/N 43.18 BSC b 0.00 BSC 0.60 e EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. 72 MAX. A1 S BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. NOM. 0.75 0.90 1.27 BSC Q 0.25 - A4 - 0.10 - - aaa - - 0.20 bbb - - 0.25 ddd - - 0.20 A2 A Lattice Semiconductor Package Diagrams 672-Ball fpBGA Package Dimensions in Millimeters 5 A1BALLI.D. IDENTIFIER aaa (4X) 26 24 25 20 22 23 21 18 19 16 17 14 15 A D M 10 12 13 11 8 9 6 7 4 5 2 3 B B 1 A B C D E F G H J S K L M N P OPTIONALFEATURE (HEATSINK) N R C E 6 T U V W Y AA AB AC AD AE AF e e S 3 6 4X b A .25 M C A B .10 M C ccc C bbb ddd A1 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. MIN. MAX. A 1.70 2.15 2.60 A1 0.30 0.50 0.70 A2 0.30 0.50 0.70 B/C 23.80 24.80 25.80 D/E 27.00BSC M/N 25.00BSC S b 0.50BSC 0.50 e 73 NOM. 0.60 0.70 1.00BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 A2 Lattice Semiconductor Package Diagrams 676-Ball fpBGA Package Dimensions in Millimeters 5 A1BALLI.D. IDENTIFIER aaa (4X) A D M 30 26 28 29 27 24 25 20 22 23 21 18 19 16 17 14 15 10 12 13 11 6 8 9 7 4 5 2 3 B B 1 A B C D E F G H J K L S M N OPTIONALFEATURE (HEATSINK) P R N T U E C 6 V W Y AA AB AC AD AE AF AG AH AJ e AK b e S 4X .25 M C A B .10 M C 3 6 A ccc C bbb ddd A1 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. MIN. MAX. A 1.70 2.15 2.60 A1 0.30 0.50 0.70 A2 0.30 0.50 0.70 B/C 25.80 27.55 29.30 D/E 31.00BSC M/N 29.00BSC 0.50BSC S b 0.50 0.60 0.70 1.00BSC e 74 NOM. aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 A2 Lattice Semiconductor Package Diagrams 680-Ball fpBGA Package (with or without Internal Heat Spreader) Dimensions in Millimeters 34 32 33 30 31 28 29 26 27 24 25 22 23 20 21 18 19 16 17 14 15 12 13 10 11 8 9 6 7 4 5 B B 2 3 A D A1BALLI.D. IDENTIFIER M 5 (4X) aaa 1 A B C D E F G H J K L S M N P R OPTIONALFEATURE (HEATSINK) T N U V W C E 6 Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP e e S 6 4X b 3 A .30 M C A B .15 M C bbb ddd C ccc A1 A2 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. MIN. MAX. A 1.90 2.25 2.60 A1 0.30 0.50 0.70 A2 0.40 0.60 0.80 B/C 29.80 30.30 30.80 D/E 35.00BSC M/N 33.00BSC 0.50BSC S b 0.50 e 75 NOM. 0.60 0.70 1.00BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 Lattice Semiconductor Package Diagrams 680-Ball fpSBGA Package Dimensions in Millimeters A1 BALL I.D. IDENTIFIER aaa 5 (4X) M 38 39 36 37 34 35 32 33 30 31 28 29 26 27 24 25 18 19 21 A D 20 22 23 16 14 15 17 10 12 13 11 8 9 6 7 4 5 B 2 3 1 A B C D E F G H J K L M N P R T S U V W Y N E AA AB AC A AD AE e AF AG AH AJ AK AL AM AN AP AR AT AU AV AW S e b 3 4X .25 M C A B .10 M C 6 A A A2 bbb A4 C C Q A1 4 A-A SECTION VIEW SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. 2. 3 DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. NOM. - - MAX. A1 0.45 0.53 0.60 A2 0.90 0.98 1.05 1.70 ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 MIN. A D/E 40.00 BSC M/N 38.00 BSC S b 0.00 BSC 0.50 e EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. 76 0.65 0.80 1.00 BSC Q 0.25 - A4 0.10 - aaa - - 0.20 bbb - - 0.25 ddd - - 0.20 - SEATING PLANE ddd Lattice Semiconductor Package Diagrams 900-Ball fpBGA Package Dimensions in Millimeters 5 A1BALLI.D. IDENTIFIER aaa (4X) A D M 30 28 29 26 27 24 25 20 22 23 21 18 19 16 17 14 15 8 10 12 13 11 9 6 7 4 5 2 3 B B 1 A B C D E F G H J K L S M N OPTIONALFEATURE (HEATSINK) P R N T U E C 6 V W Y AA AB AC AD AE AF AG AH AJ e AK b e S 4X .25 M C A B .10 M C 3 6 A ccc C bbb ddd A1 C C 4 C SYMBOL NOTES:UNLESSOTHERWISESPECIFIED 1. DIMENSIONSANDTOLERANCES PERANSIY14.5M. 2. ALLDIMENSIONSAREINMILLIMETERS. 3 DIMENSION"b"ISMEASUREDATTHE MAXIMUMSOLDERBALLDIAMETER, PARALLELTOPRIMARYDATUMC 4 PRIMARYDATUMCANDSEATING PLANEAREDEFINEDBYTHESPHERICAL CROWNSOFTHESOLDERBALLS. 5 BILATERALTOLERANCEZONEISAPPLIED TOEACHSIDEOFTHEPACKAGEBODY. 6 EXACTSHAPEANDSIZEOFTHISFEATURE ISOPTIONAL. MIN. MAX. A 1.70 2.15 2.60 A1 0.30 0.50 0.70 A2 0.30 0.50 0.70 B/C 25.80 27.55 29.30 D/E 31.00BSC M/N 29.00BSC S b 0.50BSC 0.50 e 77 NOM. 0.60 0.70 1.00BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20 A2 Lattice Semiconductor Package Diagrams 1036-Ball fpSBGA Package Dimensions in Millimeters A1 BALL I.D. IDENTIFIER 5 aaa (4X) M A D B 44 42 43 40 41 38 39 36 37 34 35 32 33 30 31 28 29 26 27 24 25 22 23 20 21 18 19 16 17 14 15 12 13 10 11 8 9 6 7 4 5 2 3 1 A B C D E F G H J K L M N P R T S U V W Y AA AB N AC E AD AE AF AG AH AJ A AK AL AM AN AP AR e AT AU AV AW AY BA BB BC BD S e 6 4X b A .30 M C A B .10 M C 3 A1 bbb A4 ddd C C 4 C Q A-A SECTION VIEW SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. 2. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. ALL DIMENSIONS ARE IN MILLIMETERS. 3 DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 6 MIN. - 2.70 A1 0.40 0.55 0.70 A2 1.50 1.90 2.30 D/E 45.00 BSC M/N 43.00 BSC b 0.50 BSC 0.50 e EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. 78 MAX. 2.00 S BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. NOM. A 0.65 0.80 1.00 BSC Q 0.25 - - A4 0.10 - - aaa - - 0.20 bbb - - 0.35 ddd - - 0.20 A2 A Lattice Semiconductor Package Diagrams 1156-Ball fpBGA Package Dimensions in Millimeters 5 (4X) aaa A D A1 BALL I.D. IDENTIFIER M 34 32 33 30 31 28 29 26 27 24 25 22 23 20 21 18 19 16 17 14 15 12 13 10 11 8 9 6 7 4 5 B B 2 3 1 A B C D E F G H J K L M S N P R T U OPTIONAL FEATURE (HEAT SINK) N V C E W 6 Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP e e S 6 4X b A2 A 3 A1 .25 M C A B .10 M C ccc bbb ddd C C 4 C SYMBOL NOTES: UNLESS OTHERWISE SPECIFIED 1. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3 C DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C 4 PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 6 EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL. MIN. MAX. A 1.90 2.25 2.60 A1 0.30 0.50 0.70 A2 0.40 0.60 0.80 B/C 29.80 30.30 30.80 D/E 35.00 BSC M/N 33.00 BSC 0.50 BSC S b 0.50 e 79 NOM. 0.60 0.70 1.00 BSC aaa - - 0.20 bbb - - 0.25 ccc - - 0.35 ddd - - 0.20