Lattice Semiconductor Package Diagrams
7
20-Pin PLCC Package (cont.)
DIMENSION APPLIES TO BASE METAL ONLY
DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
PIN NUMBERS ARE FOR REFERENCE ONLY
TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
ALL DIMENSIONS IN INCHES
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
OR LOWER PARTING LINE.
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
15
THE SOCKET VENDOR
14
13
12
11
8
10
9
BOTTOM POINT OF
-H-
LOCATED AT TOP OF MOLD PARTING LINE AND
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
SHAPE OF TRANSITION IS OPTIONAL
TO BE MEASURED AT SEATING PLANE
EXIT PLASTIC BODY AT DATUM PLANE
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
DATUMS
2. DATUM PLANE
7
6
5
4
3AND
A-B -D-
-H-
N
NOTES:
20
.062
A
D
E
E
E
E
D
D
D
3
-
.141
1
2
.350
.385
3.075
.155
.353
.390
2
.141
2
1.350
.385
.075
-
.390
.353
.155
B
M
A
A
Y
S
.090
.165
MIN.
1
OL.172
.105
NOM.
CONTACT POINT
TO BE DETERMINED WHERE CENTER LEADS
-H-
-H-
D3 D3
12
.083
-
.169
.395
.356
.169
.356
.395 -A-B-
12
.120
.180
MAX.
-D-
E3 12
E3