www.latticesemi.com
1
pkg_28
Package Diagrams
November 2003
16-Pin Plastic DIP Package
Dimensions in Inches
.000
-
eC
eB
eA
-
-
.300 BSC
7
.060 7
.430 6
OF LEAD , WHERE LEAD EXITS BODY
11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010
8. N IS THE MAXIMUM NUMBER OF LEAD
2. DIMENSIONING AND TOLERANCING PER
3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR
THE PACKAGE SEATED IN JEDEC SEATING
4. DIMENSIONS A, A1 & L ARE MEASURED WITH
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
6. E AND eA MEASURED WITH THE LEADS CONSTRAINED
TO BE PERPENDICULAR TO DATUM -C-
7. eB AND eC ARE MEASURED AT THE LEAD TIPS
9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED
PROTRUSIONS SHALL NOT EXCEED .010
INCLUDE DAMBAR PROTRUSIONS. DAMBAR
10. b1 MAXIMUM DIMENSION DOES NOT
TO EASE INSERTION
WITH THE LEADS UNCONSTRAINED.
POSITIONS.
5. DIMENSIONS D, D1 AND E1
1. CONTROLLING DIMENSION: INCH.
PLANE GAUGE GS-3.
PROTRUSIONS TO BE .005 MINIMUM.
ANSI Y14.5M
10
.045
.039.030
b3
D.005
.300
.240
1
E
1
E
e
.310
-
.100 BSC
.250
.008
.735
.008
c1
D
c.010
.755
.010
-6
5
.280
.325 5
.011
.775
.014
5
.115 .130
A2
.014
.014
.045
b1
b2
b.018
.018
.060
MIN.
.015
-
1
L
O
A
A-
-
NOM.
.195
10
.020
.022
.070
-4
4
MAX.
.210
TE
N = 16
INCHES
S
B
M
Y
NO
eC
PLANE
GAGE
b2
PLANE
SEATING
4X
10 .010
b
b3
A1
BASE PLANE
D
ZZ
-A- 5
-C-
4x
C
MD1
5
L
e-H-
.015
AA2 4
c
N
N/2 1
E1 (c)
(b)
c1
5
-B- b1
BASE METAL
WITH
LEAD FINISH
eB
7
6
eA
DETAIL
SEE
A
6
E
DETAIL A
NOTES:
SECTION Z-Z
C
L
C
L
Lattice Semiconductor Package Diagrams
2
16-Pin SOIC Package
Dimensions in Inches
10.10
10.00
7.40
1.27 BSC
7. "N" IS THE NUMBER OF TERMINAL POSITIONS.
PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED
TO A SUBSTRATE
6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING
PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED
5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT
SHALL NOT EXCEED .25mm PER SIDE
OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION
4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH
EXCEED .15mm PER SIDE
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH
8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY
9. THE LEAD WIDTH "B" AS MEASURED .36mm OR
WITHIN THE CROSSHATCHED AREA.
GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED
A MAX VALUE OF .61mm.
2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982
1. CONTROLLING DIMENSION: MILLIMETER
NOTES:
.40
L
N
C
OC0∞
e
H
h.25
D
C
E
.23
1.27
8∞
16
10.65
.75
10.50
.32
7.60
MIN.
2.35
- A -
e
hx45∞3
D
SEATING PLANE
A
D
A1
- C -
+.25 M C
BSBA M
.10
B
A
A.10
1.33
C
C
OL
Pin1 Identifier
EM.25 BM
H
N
6
- B -
1
2
+
MAX.
.51
2.65
.30
C
hx45∞
TOP VIEW
SIDE VIEW
END VIEW
SEE DETAIL A
DETAIL A
Lattice Semiconductor Package Diagrams
3
20-Pin (300-Mil) CERDIP Package
Dimensions in Inches
.100 BSC
.300 REF
BASE METAL
INCHES
DIMENSIONS A, A1 AND L ARE MEASURED WITH THE
5. .280E1
ALLOWED LEAD TIP POSITION RANGE.
E3 IS TO BE MEASURED AT THE LEAD TIPS.
PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-003.
6.
7. N
L
e
.125
E3
E2 .325
OVERRUN AND MENISCUS, AND LID TO BASE MISMATCH.
DIMENSIONS D AND E1 INCLUDE ALLOWANCE FOR GLASS
.060 INCHES FROM THE LEAD TIP.
MEASUREMENTS TO BE TAKEN AT A MINIMUM OF
ALL DIMENSIONS ARE IN INCHES.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M.
4.
3.
2.
1. .015A1
.023b3
E
D.308
.942
c1
c.008
.008
b2
b1 .045
.015
A2
b.015
.140
b34X
B
A
L
O
-
MIN.
S
M
Y
(b)
3
.296.288
20 .200-
.410-
.045
.325
.970
-
.950 .012
.014-
-
.010
.065
.021
-
.018 .023
.175
-
-
--
MAX.
.200
NOM.
-
E2
LEAD FINISH
WITH
E3
b2
M
.010
b
C
BASE PLANE
SEATING PLANE
A1
Z Z
BAC
(c) c1
b1
A
e
4
D
L7
A2
A
e/2
DETAIL A
E
N/2
N
1
4
E1
B
(DATUM A)
c
(DATUM B)
E
NOTES:
DETAIL A SECTION Z-Z
Lattice Semiconductor Package Diagrams
4
20-Pin LCC Package
Dimensions in Inches
OF .010 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN
D2
D4
D
L (19 PLACES)
FLATNESS TOLERANCE IS .004 INCHES PER INCH.
NOT TO EXCEED .005 INCHES MAXIMUM PER SIDE.
DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION
ALL DIMENSIONS ARE IN INCHES.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5.
3
4.
3.
2.
1.
3
E
B
(3 PLACES)
X 45∞
X 45∞
.030
.050
.020
.010
A
.075
.042
.270
.342
.270
.342
.022
.007
.054
.064
MIN.
E4
L1
L
e
A2
e
L1
A
E2
E
D4
D2
D
B
A2
A1
S
B
M
Y
L
O
.315
.095
.058
.050 BSC
(TYPICAL)
.200
.050
.030 RADIUS
MAX.
.358
.315
.358
.028
.015
.200
.089
.074
INCHES
E2 E4
4
A1
NOTES:
Lattice Semiconductor Package Diagrams
5
20-Pin PLCC Package
Dimensions in Inches
.020 MAX 3 PLCS
A-B
//
.007 SH
.002 S
A-B S SD
DETAIL B
.020 MAX 3 PLCS
9
9
3
.007 S A-BHSDS
-A-
EE
1
7
.042
.048
45∞ X 13
MAX
.075
DETAIL B
see
-B- 3
(N-4PLACES)
.050
A-B S.002
321
-D-
N
3
A-B
.007 S H
1
D
.007 SH
D
S
7
SD
DSA-B S
8
MAX
.150
Lattice Semiconductor Package Diagrams
6
20-Pin PLCC Package (cont.)
ADJACENT LEADS IS 0.08.
MINIMUM SPACE BETWEEN
DETAIL
TYP ALL SIDES
M
TO BE .007 MAX/LEAD
OPTIONAL FEATURE. IF PRESENT,
.025 MIN.
.013
TYP ALL SIDES
10
.065
D2
A
E2
A
.020
10
DE
MAX.
.010 .020
D2
E2
R.045
.025
E
MAX.
10
D
.010
.020
14
.065 .0125
.018
.013
.0075
.013
.021
.045 MIN.
- C -
2
- H -
N-4 PLACES
.050
1
A
A
SEE
"J"
DETAIL
.042
45∞x
.056
.020
MIN
2
A
24
.045 MIN.
.007 MAX.
SEATING PLANE
MIN.
.025
E
6
2
X
SEATING PLANE
.021
5
.007
Y
Y
.026
.032
X
.007
-A-B-
D
-D-
E
2
D4
2
E
D
DETAIL
.004 C
BASE PLANE
"A"
SEE
BASE PLANE
.020 MIN.
-C- 7
.0075 15
.0105
A-BCSDS
HS A-B SDS
.025/.045 R.
"L"
SEE
SECTION A-A
DETAIL "J"
DETAIL "L"
DETAIL "A"
Lattice Semiconductor Package Diagrams
7
20-Pin PLCC Package (cont.)
DIMENSION APPLIES TO BASE METAL ONLY
DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
PIN NUMBERS ARE FOR REFERENCE ONLY
TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
ALL DIMENSIONS IN INCHES
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
OR LOWER PARTING LINE.
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
15
THE SOCKET VENDOR
14
13
12
11
8
10
9
BOTTOM POINT OF
-H-
LOCATED AT TOP OF MOLD PARTING LINE AND
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
SHAPE OF TRANSITION IS OPTIONAL
TO BE MEASURED AT SEATING PLANE
EXIT PLASTIC BODY AT DATUM PLANE
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
DATUMS
2. DATUM PLANE
7
6
5
4
3AND
A-B -D-
-H-
N
NOTES:
20
.062
A
D
E
E
E
E
D
D
D
3
-
.141
1
2
.350
.385
3.075
.155
.353
.390
2
.141
2
1.350
.385
.075
-
.390
.353
.155
B
M
A
A
Y
S
.090
.165
MIN.
1
OL.172
.105
NOM.
CONTACT POINT
TO BE DETERMINED WHERE CENTER LEADS
-H-
-H-
D3 D3
12
.083
-
.169
.395
.356
.169
.356
.395 -A-B-
12
.120
.180
MAX.
-D-
E3 12
E3
Lattice Semiconductor Package Diagrams
8
20-Pin Plastic DIP Package
Dimensions in Inches
.000
.115
-
eC
eB
L-
-
.130 4
7
.060 7
.430
.150
OF LEAD , WHERE LEAD EXITS BODY
11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010
8. N IS THE MAXIMUM NUMBER OF LEAD
2. DIMENSIONING AND TOLERANCING PER
3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR
THE PACKAGE SEATED IN JEDEC SEATING
4. DIMENSIONS A, A1 & L ARE MEASURED WITH
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
6. E AND eA MEASURED WITH THE LEADS CONSTRAINED
TO BE PERPENDICULAR TO DATUM -C-
7. eB AND eC ARE MEASURED AT THE LEAD TIPS
9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED
PROTRUSIONS SHALL NOT EXCEED .010
INCLUDE DAMBAR PROTRUSIONS. DAMBAR
10. b2 MAXIMUM DIMENSION DOES NOT
TO EASE INSERTION
WITH THE LEADS UNCONSTRAINED.
POSITIONS.
5. DIMENSIONS D, D1 AND E1
1. CONTROLLING DIMENSION: INCH.
PLANE GAUGE GS-3.
PROTRUSIONS TO BE .005 MINIMUM.
ANSI Y14.5M
c.008 .014
.010
E.300
.240
1
E
eA
e
.310
.100 BSC
.300 BSC
.250
.005
.008
.980
D1
c1
D-
.010
1.030
.325
6
6
.280 5
-5
.011
1.060 5
.115 .130
A2
.014
.014
.045
b1
2
b
b.018
.018
.060
MIN.
.015
-
1
L
O
A
A-
-
NOM.
.195
10
.020
.022
.070
-4
4
MAX.
.210
TE
N = 20
INCHES
S
B
M
Y
NO
eC
PLANE
GAGE
P
LANE
E
ATING
.010
b
A1
10
b2
BASE PLANE
D
Z
-A- 5
-C-
4x
C
MD1
5
L
e-H-
.015
A
Z
A2 4
c
N
N/2 1
E1 (c)
(b)
c1
5
-B- b1
BASE METAL
WITH
LEAD FINISH
eB
7
6
eA
DETAI
L
SEE
A
6
E
DETAIL A
NOTES:
SECTION Z-Z
C
L
C
L
Lattice Semiconductor Package Diagrams
9
20-Pin SOIC Package
Dimensions in Millimeters
12.6
10.00
7.40
1.27 BSC
7. "N" IS THE NUMBER OF TERMINAL POSITIONS.
PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED
TO A SUBSTRATE
6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING
PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED
5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT
SHALL NOT EXCEED .25mm PER SIDE
OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION
4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH
EXCEED .15mm PER SIDE
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH
8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY
9. THE LEAD WIDTH "B" AS MEASURED .36mm OR
WITHIN THE CROSSHATCHED AREA.
GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED
A MAX VALUE OF .61mm.
2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982
1. CONTROLLING DIMENSION: MILLIMETER
NOTES:
.40
L
N
C
OC0∞
e
H
h.25
D
C
E
.23
1.27
8∞
20
10.65
.75
13.0
.32
7.60
MIN.
2.35
- A -
e
hx45∞3
D
SEATING PLANE
A
D
A1
- C -
+.25 M C
BSBA M
.10
B
A
A.10
1.33
C
C
OL
Pin1 Identifier
EM.25 BM
H
N
6
- B -
1
2
+
MAX.
.51
2.65
.30
C
hx45∞
TOP VIEW
SIDE VIEW
END VIEW
SEE DETAIL A
DETAIL A
Lattice Semiconductor Package Diagrams
10
24-Pin (300-Mil) CERDIP
Dimensions in Inches
BASE METAL
.100 BSC
.300 REF
INCHES
DIMENSIONS A, A1 AND L ARE MEASURED WITH THE
5. E2
ALLOWED LEAD TIP POSITION RANGE.
E3 IS TO BE MEASURED AT THE LEAD TIPS.
PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-003.
6.
7. N
L.125
E3
e.325
OVERRUN AND MENISCUS, AND LID TO BASE MISMATCH.
DIMENSIONS D AND E1 INCLUDE ALLOWANCE FOR GLASS
.060 INCHES FROM THE LEAD TIP.
MEASUREMENTS TO BE TAKEN AT A MINIMUM OF
ALL DIMENSIONS ARE IN INCHES.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M.
4.
3.
2.
1. .015A1
.008c
E1
E.280
.308
D
c1 1.242
.008
b2
b1 .045
.015
A2
b.015
.140
(b)
A
L
O
-
MIN.
S
B
M
Y
3
.200-
24
.410
-
.014
.296
.325-
.288
1.270
.012
1.250
.010
.065
.021
-
-
.018 .023
.175
-
-
MAX.
.200
NOM.
-
--
b
.010
BASE PLANE
SEATING PLANE
C
b2
A1
7
L
(c)
C
MBA b1
Z Z
LEAD FINISH
c1
WITH
4
D
e
A2
A
A
E
N/2
e/2 N
B
E1
1
4
(DATUM A)
E2
c
(DATUM B)
E
E3
NOTES:
SECTION Z-Z
Lattice Semiconductor Package Diagrams
11
24-Pin Plastic DIP
Dimensions in Inches
.130
eC
L
eB -
-
-
.000
.115 .060
.150
.430 7
7
OF LEAD , WHERE LEAD EXITS BODY
11. DATUM PLANE -H- COINCIDENT WITH THE BOTTOM
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010
8. N IS THE MAXIMUM NUMBER OF LEAD
2. DIMENSIONING AND TOLERANCING PER
3. DISTANCE BETWEEN LEADS INCLUDING DAMBAR
THE PACKAGE SEATED IN JEDEC SEATING
4. DIMENSIONS A, A1 & L ARE MEASURED WITH
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
6. E AND eA MEASURED WITH THE LEADS CONSTRAINED
TO BE PERPENDICULAR TO DATUM -C-
7. eB AND eC ARE MEASURED AT THE LEAD TIPS
9. POINTED OR ROUNDED LEAD TIPS ARE PREFERRED
PROTRUSIONS SHALL NOT EXCEED .010
INCLUDE DAMBAR PROTRUSIONS. DAMBAR
10. b2 MAXIMUM DIMENSIONS DOES NOT
TO EASE INSERTION
WITH THE LEADS UNCONSTRAINED.
POSITIONS.
5. DIMENSIONS D, D1 AND E1
1. CONTROLLING DIMENSION: INCH.
PLANE GAUGE GS-3.
PROTRUSIONS TO BE .005 MINIMUM.
ANSI Y14.5M
.010
c.008 .014
1.250
.300 BSC
.100 BSC
.310
.250
E1
E
e
eA
.300
.240
1
1
D
c
D-
.010.008
1.230
.005 .325
.280
6
6
5
-
.011
1.280 5
5
NOM.
.018
.060
.018
.130
A.115
2
1
2
b
b
b.014
.014
.045
1
L
O
A
A-
--
.015
MIN.
.195
.022
.020
.070 10
-
.210
MAX. 4
4
TE
INCHES
N = 24
B
Y
S
MO
N
eC
6
PLANE
GAGE
eA
eB
c
E
PLANE
SEATING
.010
b
A1
10
b2
BASE PLANE
D
Z
-A- 5
-C-
4x
C
MD1
5
L
e-H-
.015
A
Z
A2 4
N
N/2 1
E1 (c)
(b)
c1
5
-B- b1
BASE METAL
WITH
LEAD FINISH
7
DETAIL
SEE
A
6
DETAIL A
NOTES:
C
SECTION Z-Z
C
L
L
Lattice Semiconductor Package Diagrams
12
24-Pin SOIC Package
Dimensions in Inches
15.20
10.00
7.40
1.27 BSC
7. "N" IS THE NUMBER OF TERMINAL POSITIONS.
PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED
TO A SUBSTRATE
6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING
PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED
5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT
SHALL NOT EXCEED .25mm PER SIDE
OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION
4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH
EXCEED .15mm PER SIDE
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH
8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY
9. THE LEAD WIDTH "B" AS MEASURED .36mm OR
WITHIN THE CROSSHATCHED AREA.
GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED
A MAX VALUE OF .61mm.
2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982
1. CONTROLLING DIMENSION: MILLIMETER
NOTES:
.40
L
N
C
OC0∞
e
H
h.25
D
C
E
.23
1.27
8∞
24
10.65
.75
15.60
.32
7.60
MIN.
2.35
- A -
e
hx45∞3
D
SEATING PLANE
A
D
A1
- C -
+.25 M C
BSBA M
.10
B
A
A.10
1.33
C
C
OL
Pin1 Identifier
EM.25 BM
H
N
6
- B -
1
2
+
MAX.
.51
2.65
.30
C
hx45∞
TOP VIEW
SIDE VIEW
END VIEW
SEE DETAIL A
DETAIL A
Lattice Semiconductor Package Diagrams
13
28-Pin LCC Package
Dimensions in Inches
OF .010 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN
L (27 PLACES)
FLATNESS TOLERANCE IS .004 INCHES PER INCH.
NOT TO EXCEED .005 INCHES MAXIMUM PER SIDE.
DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION
ALL DIMENSIONS ARE IN INCHES.
DIMENSIONING AND TOLERANCING PER
4.
3
ANSI Y14.5.
3.
2.
1.
E
B
(3 PLACES)
X 45∞
X 45∞
.030
.050
.020
.010
A
.075
.042
.370
.440
.370
.440
.022
.007
.054
.064
MIN.
E4
L1
L
e
3
e
D
L1
A
A2
E2
E
D4
D2
D
B
A2
A1
S
B
M
Y
L
O
.403
.095
.058
.050 BSC
(TYPICAL)
.300
.050
.030 RADIUS
MAX.
.460
.403
.460
.028
.015
.300
.089
.074
INCHES
4
E2
D2
D4
E4
A1
NOTES:
Lattice Semiconductor Package Diagrams
14
28-Pin PLCC Package
Dimensions in Inches
.020 MAX 3 PLCS
A-B
//
.007 SH
.002 S
A-B S SD
DETAIL B
.020 MAX 3 PLCS
9
9
3
.007 S A-BHSDS
-A-
EE
1
7
.042
.048
45∞ X 13
MAX
.075
DETAIL B
see
-B- 3
(N-4PLACES)
.050
A-B S.002
321
-D-
N
3
A-B
.007 S H
1
D
.007 SH
D
S
7
SD
DSA-B S
8
MAX
.150
Lattice Semiconductor Package Diagrams
15
28-Pin PLCC Package (cont.)
ADJACENT LEADS IS 0.08.
MINIMUM SPACE BETWEEN
DETAIL
SECTION A-A
TYP ALL SIDES
DETAIL "J"
M
TO BE .007 MAX/LEAD
OPTIONAL FEATURE. IF PRESENT,
.025 MIN.
.013
TYP ALL SIDES
10
.065
DETAIL "L"
D2
A
E2
A
.020
10
DE
MAX.
.010 .020
D2
E2
R.045
.025
E
MAX.
10
D
.010
.020
14
.065 .0125
.018
.013
.0075
.013
.021
.045 MIN.
- C -
2
- H -
N-4 PLACES
.050
1
A
A
SEE
"J"
DETAIL
.042
45∞x
.056
.020
MIN
2
A
24
.045 MIN.
.007 MAX.
SEATING PLANE
MIN.
.025
E
6
2
X
SEATING PLANE
.021
5
.007
Y
DETAIL "A"
Y
.026
.032
X
.007
-A-B-
D
-D-
E
2
D4
2
E
D
DETAIL
.004 C
BASE PLANE
"A"
SEE
BASE PLANE
.020 MIN.
-C- 7
.0075 15
.0105
A-BCSDS
HS A-B SDS
.025/.045 R.
"L"
SEE
Lattice Semiconductor Package Diagrams
16
28-Pin PLCC Package (cont.)
DIMENSION APPLIES TO BASE METAL ONLY
DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
PIN NUMBERS ARE FOR REFERENCE ONLY
TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
ALL DIMENSIONS IN INCHES
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
OR LOWER PARTING LINE.
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
15
THE SOCKET VENDOR
14
13
12
11
8
10
9
BOTTOM POINT OF
-H-
LOCATED AT TOP OF MOLD PARTING LINE AND
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
SHAPE OF TRANSITION IS OPTIONAL
TO BE MEASURED AT SEATING PLANE
EXIT PLASTIC BODY AT DATUM PLANE
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
DATUMS
2. DATUM PLANE
7
6
5
4
3AND
A-B -D-
-H-
N
NOTES:
28
.062
A
D
E
E
E
E
D
D
D
3
-
.191
1
2
.450
.485
3.125
.205
.453
.490
2
.191
2
1.450
.485
.125
-
.490
.453
.205
B
M
A
A
Y
S
.090
.165
MIN.
1
OL.172
.105
NOM.
CONTACT POINT
TO BE DETERMINED WHERE CENTER LEADS
-H-
-H-
D3 D3
12
.083
-
.219
.495
.456
.219
.456
.495 -A-B-
12
.120
.180
MAX.
-D-
E3 12
E3
Lattice Semiconductor Package Diagrams
17
28-Pin Plastic DIP Package
Dimensions in Inches
+0.010 AM
0.015 AM BC
1.300 BSC
INCHES
.100 BSC
.300 BSC
NOM.
1.365
N
L28
.110 .130
C
B
A
e
e
e
.000 -
-
-
1
E
e
E.275 .285
.300 .310
B.014 .018
C.008 .010
D1
D1.345
2
1
B
B.030 .040
.045 .050
A
1
2
A
A.120 .135
.015 -
-
O
B
M
Y
MIN.
-
L
.150
.430
.060
.295
.325
.022
.015
1.385
.045
.060
.180
.150
-
MAX.
S
e
B1
B
4x
B2
A
A1
A2
-A-
SEATING PLANE
D1 L
C
-B-
B
e
D
eA
e
C
LC
PER ANSI Y14.5M-1982
DAMBAR PROTRUSIONS. DAMBAR PROTRUSIONS
9 B1 AND B2 MAXIMUM DIMENSIONS DO NOT INCLUDE
6 E AND eA MEASURED WITH THE LEADS
CONSTRAINED TO BE PERPENDICULAR TO PLANE A
8 N IS THE NUMBER OF TERMINAL POSITIONS
WITH THE LEADS UNCONSTRAINED. eC MUST BE
7 eB AND eC ARE MEASURED AT THE LEAD TIPS
FLASH OR PROTRUSION. MOLD FLASH AND
5 D AND E1 DIMENSIONS DO NOT INCLUDE MOLD
PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS-3
4 DIMENSION A, A1, AND L ARE MEASURED WITH THE
3 ALL END LEADS IN THIS FAMILY ARE 1/2 LEADS
N
E SHALL NOT EXCEED 0.010
E
-C-
N/2 1
PROTRUSION SHALL NOT EXCEED 0.010
ZERO OR GREATER
1
2 DIMENSIONING AND TOLERANCING
1 CONTROLLING DIMENSION: INCHES
NOTE:
Lattice Semiconductor Package Diagrams
18
28-Pin SOIC Package
Dimensions in Millimeters
17.70
10.00
7.40
1.27 BSC
7. "N" IS THE NUMBER OF TERMINAL POSITIONS.
PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED
TO A SUBSTRATE
6. "L" IS THE LENGTH OF THE TERMINAL FOR SOLDERING
PRESENT , A VISUAL INDEX FEATURE MUST BE LOCATED
5. THE CHAMFER ON THE BODY IS OPTIONAL , IF IT IS NOT
SHALL NOT EXCEED .25mm PER SIDE
OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSION
4. DIMENSION "E" DOES NOT INCLUDE INTER LEAD FLASH
EXCEED .15mm PER SIDE
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
3. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH
8. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY
9. THE LEAD WIDTH "B" AS MEASURED .36mm OR
WITHIN THE CROSSHATCHED AREA.
GREATER ABOVE THE SEATING PLANE, SHALL NOT EXCEED
A MAX VALUE OF .61mm.
2. DIMENSIONING & TOLERANCES PER ANSI. Y14.5M-1982
1. CONTROLLING DIMENSION: MILLIMETER
NOTES:
.40
L
N
C
OC0∞
e
H
h.25
D
C
E
.23
1.27
8∞
28
10.65
.75
18.10
.32
7.60
MIN.
2.35
- A -
e
hx45∞3
D
SEATING PLANE
A
D
A1
- C -
+.25 M C
BSBA M
.10
B
A
A.10
1.33
C
C
OL
Pin1 Identifier
EM.25 BM
H
N
6
- B -
1
2
+
MAX.
.51
2.65
.30
C
hx45∞
TOP VIEW
SIDE VIEW
END VIEW
SEE DETAIL A
DETAIL A
Lattice Semiconductor Package Diagrams
19
28-Pin SSOP Package
Dimensions in Millimeters
0.55
L0.75 0.95
DIMENSIONING & TOLERANCES PER ANSI.Y14.5M-1982.
"D" & "E1" DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS, BUT DO INCLUDE MOLD MISMATCH
AND ARE MEASURED AT THE PARTING LINE.
MOLD FLASH OR PROTRUSIONS SHALL NOT
TO BE DETERMINED AT THE SEATING PLANE
CONTROLLING DIMENSION: MILLIMETERS.
4.
EXCEED 0.20mm PER SIDE.
2.
3.
1.
0.09
0∞
R1
L1
N
OC4∞
--
1.25 REF.
28
DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION b BY MORE
EXCESS OF b DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13mm TOTAL IN
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
THAN 0.07mm AT LEAST MATERIAL CONDITION.
BETWEEN 0.10 & 0.25mm FROM THE LEAD TIP
"N" IS THE NUMBER OF TERMINAL POSITIONS
7.
6.
5.
8∞
--
6
c
(b)
5
b1
c1
BASE METAL
10.50
DIMENSIONS
-B-
SCOMMON
0.22
b0.30
7.40
5.00
9.90
0.09
0.09
E1
e
E
D
c1
c1
10.20
0.65 BSC
7.80
5.30
--
0.15
0.22
1.65
0.05
--
MIN.
2
A
b
A1
Y
OL
A
B
M
1.75
--
-
NOM.
--
N
3
E1
321
D
3
-A-
SEATING PLANE
GAUGE PLANE
PARTING LINE
WITH LEAD FINISH
2 NX R R1
C
0.33
8.20
5.60
0.21
0.25
1.85
0.38
--
MAX.
2.0 O
L
L1
4
A
A
0.25 BSC
DETAIL "A"
B
M+ 0.20 C A SS
SEE
2
A
0.10
S
PLANE
SEATING
Pin 1 Identifier
E
- C -
1
A
A
e 5
0.15
b
+MAC
C
BS
NOTES: SECTION A-A
TOP VIEW
DETAIL 'A'
END VIEW
SIDE VIEW
Lattice Semiconductor Package Diagrams
20
32-Pin QFN Package
Dimensions in Millimeters
3.5
0.20 AC
2X
SEATING
PLANE
2X
0.20 BC
PIN 1 ID
3
N
1
B
A5.00 0.25
2X
CA
b
0.25
2X
CB
A
A1
A3
A2
L
e
0.08
5
C
E2
B
0.10 A
MC
N
1
D2
3
4
4X
32X
C
PIN #1 ID FIDUCIAL
LOCATED IN THIS ARE
A
5.00
3
4
5
4.75
4.75
0
0
TOP VIEW
BOTTOM VIEW
SIDE VIEW
ALL DIMENSIONS ARE IN MILLIMETERS.
NOTES: UNLESS OTHERWISE SPECIFIED
2.
1.
1.00
1.00
0.50
0.05
MAX.
PER ANSI Y14.5M.
0.20 AND 0.25 mm FROM TERMINAL TIP.
TERMINAL AND IS MEASURED BETWEEN
DIMENSION b APPLIES TO PLATED
FEATURE IS OPTIONAL.
EXACT SHAPE AND SIZE OF THIS
0.20 REF
e
L
D2
A3
A2
0.50 BSC
0.400.30
0.65
DIMENSIONS AND TOLERANCES
-
0.00
MIN.SYMBOL
A1
A0.85
0.01
NOM.
APPLIES TO EXPOSED PORTION OF TERMINALS.
2.701.25 3.25
2.70
E2 1.25 3.25
12--
0.00
b0.18 0.24 0.30
Lattice Semiconductor Package Diagrams
21
44-Pin JLCC Package
Dimensions in Inches
CORNER CHAMFERS AND/OR NOTCHES ARE OPTIONAL.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.
3.
.050
ALL DIMENSIONS ARE IN INCHES.
-A-.004
PLANE
SEATING
2.
1.
E4
D4
DETAIL A
D
D1
D2
E2
SECTION B-B
N
R
Q
L2
L1
L
.020 MIN.
A1
L
O
B
M
Y
D4/E4
A
B1
C
B
A
D2/E2
D1/E1
D/E
C1
C
B2
B1
B
A1
S
-
-
-
-
-
-
-
-
-
44 .040.020
.003
.025
.020
.005
-
-
-
-
-
-
-
.500 BSC.660.620 .690
.013.007
.065 REF
C1
WITH
LEAD FINISH
BASE METAL
MAX.
.700
.010
.035
.020
.023
.630 BSC
.675
.007
.022
.013
.013
.115 .190
MIN.
INCHES
(N PLACES)
DETAIL A
E1 E
M
.011
B2
B
R
L2
L1
Q
A
L
C
B
B
NOTES:
Lattice Semiconductor Package Diagrams
22
44-Pin PLCC Package
Dimensions in Inches
.020 MAX 3 PLCS
A-B
//
.007 SH
.002 S
A-B S SD
DETAIL B
.020 MAX 3 PLCS
9
9
3
.007 S A-BHSDS
-A-
EE
1
7
.042
.048
45∞ X 13
MAX
.075
DETAIL B
see
-B- 3
(N-4PLACES)
.050
A-B S.002
321
-D-
N
3
A-B
.007 S H
1
D
.007 SH
D
S
7
SD
DSA-B S
8
MAX
.150
Lattice Semiconductor Package Diagrams
23
44-Pin PLCC Package (cont.)
ADJACENT LEADS IS 0.08.
MINIMUM SPACE BETWEEN
DETAIL
SECTION A-A
TYP ALL SIDES
DETAIL "J"
M
TO BE .007 MAX/LEAD
OPTIONAL FEATURE. IF PRESENT,
.025 MIN.
.013
TYP ALL SIDES
10
.065
DETAIL "L"
D2
A
E2
A
.020
10
DE
MAX.
.010 .020
D2
E2
R.045
.025
E
MAX.
10
D
.010
.020
14
.065 .0125
.018
.013
.0075
.013
.021
.045 MIN.
- C -
2
- H -
N-4 PLACES
.050
1
A
A
SEE
"J"
DETAIL
.042
45∞x
.056
.020
MIN
2
A
24
.045 MIN.
.007 MAX.
SEATING PLANE
MIN.
.025
E
6
2
X
SEATING PLANE
.021
5
.007
Y
DETAIL "A"
Y
.026
.032
X
.007
-A-B-
D
-D-
E
2
D4
2
E
D
DETAIL
.004 C
BASE PLANE
"A"
SEE
BASE PLANE
.020 MIN.
-C- 7
.0075 15
.0105
A-BCSDS
HS A-B SDS
.025/.045 R.
"L"
SEE
Lattice Semiconductor Package Diagrams
24
44-Pin PLCC Package (cont.)
DIMENSION APPLIES TO BASE METAL ONLY
DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
PIN NUMBERS ARE FOR REFERENCE ONLY
TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
ALL DIMENSIONS IN INCHES
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
OR LOWER PARTING LINE.
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
15
THE SOCKET VENDOR
14
13
12
11
8
10
9
BOTTOM POINT OF
-H-
LOCATED AT TOP OF MOLD PARTING LINE AND
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
SHAPE OF TRANSITION IS OPTIONAL
TO BE MEASURED AT SEATING PLANE
EXIT PLASTIC BODY AT DATUM PLANE
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
DATUMS
2. DATUM PLANE
7
6
5
4
3AND
A-B -D-
-H-
N
NOTES:
44
.062
A
D
E
E
E
E
D
D
D
3
-
.291
1
2
.650
.685
3.225
.305
.653
.690
2
.291
2
1.650
.685
.225
-
.690
.653
.305
B
M
A
A
Y
S
.090
.165
MIN.
1
OL.172
.105
NOM.
CONTACT POINT
TO BE DETERMINED WHERE CENTER LEADS
-H-
-H-
D3 D3
12
.083
-
.319
.695
.656
.319
.656
.695 -A-B-
12
.120
.180
MAX.
-D-
E3 12
E3
Lattice Semiconductor Package Diagrams
25
44-Pin TQFP Package (1.0mm thick)
Dimensions in Millimeters
0.10 C
BASE METAL
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
2. ALL DIMENSIONS ARE IN MILLIMETERS.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
6. SECTION B-B:
3.
SECTION B-B
b1
c 1
c
0.45
0.40
0.16
0.20
c1 0.09 0.13
c
b1
0.09
0.30
b
e
0.30
0.35
0.15
0.37
0.80 BSC
MAX.
1.20
0.15
1.05
0.75
E12.00 BSC
0.45L
N
E1
0.60
44
10.00 BSC
D
D1
A2 .95
12.00 BSC
10.00 BSC
1.00
DETAIL 'A'
A1
A1
A
0.05
-
SYMBOL MIN.
-
-
NOM.
1.00 REF.
0.20 MIN.
B
L
0-7∞
SEATING PLANE
LEAD FINISH
0.20
b
b
A-BC
MD
SIDE VIEW
e
TOP VIEW
8D3
A
3
D
GAUGE PLANE
DHA-B4X 0.20 BOTTOM VIEW
A2
C
A
SEE DETAIL 'A'
H
B
3
E
B
E1
D1
0.25
A-B0.20 C44XD
NOTES:
PIN 1 INDICATOR
Lattice Semiconductor Package Diagrams
26
44-Pin TQFP Package (1.4mm thick)
Dimensions in Millimeters
0.10 C
BASE METAL
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
2. ALL DIMENSIONS ARE IN MILLIMETERS.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
6. SECTION B-B:
3.
SECTION B-B
b1
c 1
c
0.45
0.40
0.16
0.20
c1 0.09 0.13
c
b1
0.09
0.30
b
e
0.30
0.35
0.15
0.37
0.80 BSC
MAX.
1.60
0.15
1.45
0.75
E12.00 BSC
0.45L
N
E1
0.60
44
10.00 BSC
D
D1
A2 1.35
12.00 BSC
10.00 BSC
1.40
DETAIL 'A'
A1
A1
A
0.05
-
SYMBOL MIN.
-
-
NOM.
1.00 REF.
0.20 MIN.
B
L
0-7∞
SEATING PLANE
LEAD FINISH
0.20
b
b
A-BC
MD
SIDE VIEW
e
TOP VIEW
8D3
A
3
D
GAUGE PLANE
DH A-B4X 0.20 BOTTOM VIEW
A2
C
A
SEE DETAIL 'A'
H
B
3
E
B
E1
D1
0.25
A-B0.20 C44XD
NOTES:
PIN 1 INDICATOR
Lattice Semiconductor Package Diagrams
27
48-Pin TQFP Package (1.0mm thick)
Dimensions in Millimeters
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
TO THE LOWEST POINT ON THE PACKAGE BODY.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
8.
OF THE PACKAGE BY 0.15 MM.
DIMENSIONS.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
6. SECTION B-B:
3.
0.220.17b0.27
0.16
0.23
0.200.09c
c1 0.09
b1 0.17
0.15
0.13
0.20
MAX.
1.20
0.15
0.75
1.05
e
N
L0.45
0.50 BSC
0.60
48
E1
E
D1
D
9.00 BSC
7.00 BSC
9.00 BSC
7.00 BSC
A2
A1
.95
0.05
SYMBOL
A-
MIN.
1.00
-
NOM.
-
C
0.08
BASE METAL
SECTION B-B
b1
c 1
c
DETAIL 'A'
A1
1.00 REF.
0.20 MIN.
B
L
0-7°
LEAD FINISH
b
e
TOP VIEW
8D3
A
3
D
GAUGE PLANE
DH A-B4X 0.20 BOTTOM VIEW
A2
A H
B
3
E
B
E1
D1
0.25
A-B0.20 C48XD
C
A-BMC
0.08 D
b
SEATING PLANE
SEE DETAIL 'A'
NOTES:
PIN 1 INDICATOR
Lattice Semiconductor Package Diagrams
28
48-Pin TQFP Package (1.4mm thick)
Dimensions in Millimeters
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
TO THE LOWEST POINT ON THE PACKAGE BODY.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
BASE METAL
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
8.
OF THE PACKAGE BY 0.15 MM.
DIMENSIONS.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
6. SECTION B-B:
3.
1
b
0.220.17b0.27
0.16
0.23
0.200.09c
c1 0.09
b1 0.17
0.15
0.13
0.20
MAX.
1.60
0.15
0.75
1.45
e
N
L0.45
0.50 BSC
0.60
48
E1
E
D1
D
9.00 BSC
7.00 BSC
9.00 BSC
7.00 BSC
A2
A1
1.35
0.05
SYMBOL
A-
MIN.
1.40
-
NOM.
-
C A-B D
SEE DETAIL "A"
LEAD FINISH
C SEATING PLANE
A
3.
0.08
c
b
1
c
MC
b
A-B D
3.
D
4X
8.
e
B3.
E
D0.20
GAUGE PLANE
A1
0.08 C
AA2
1.00 REF.
L
0.20 MIN.
B
0-7∞
B
H
E1
0.25
0.20 DA-BHD1
SECTION B - B
DETAIL "A"
NOTES:
PIN 1 INDICATOR
1
N
Lattice Semiconductor Package Diagrams
29
49-Ball caBGA Package
Dimensions in Millimeters
IDENTIFIER
A1 BALL I.D.
TO EACH SIDE OF THE PACKAGE BODY.
DIMENSION "b" IS MEASURED AT THE
EXACT SHAPE AND SIZE OF THIS FEATURE
PLANE ARE DEFINED BY THE SPHERICAL
BILATERAL TOLERANCE ZONE IS APPLIED
ALL DIMENSIONS ARE IN MILLIMETERS.
C
b
PRIMARY DATUM C AND SEATING
CROWNS OF THE SOLDER BALLS.
IS OPTIONAL.
6
5
4
.15
.08
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C
DIMENSIONS AND TOLERANCES
NOTES: UNLESS OTHERWISE SPECIFIED
PER ANSI Y14.5M.
3
1.
2.
3A
C
C
M
MB
ddd
4
5
e
S
76
D
N
S
G
F
E
e
4213
M
B
C
A
0.52b0.460.40
0.80 BSC
bbb
ddd
aaa
e
-
-
-0.10
0.12
0.10-
-
-
7.00 BSC
4.80 BSC
0 BSC
NOM.
0.36
1.04
1.40
SYMBOL MIN.
M/N
D/E
A1
A2
S
A
0.31
0.99
1.30
C
C
bbb
MAX.
0.41
1.09
1.50
A1
aaa
4X 6
D
E
A2
A
A
B
(4X) 5
Lattice Semiconductor Package Diagrams
30
56-Ball csBGA Package
Dimensions in Millimeters
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
EXACT SHAPE AND SIZE OF THIS FEATURE
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
PRIMARY DATUM C AND SEATING
IS OPTIONAL.
CROWNS OF THE SOLDER BALLS.
4
5
6
PER ANSI Y14.5M.
NOTES: UNLESS OTHERWISE SPECIFIED
DIMENSIONS AND TOLERANCES
PARALLEL TO PRIMARY DATUM C
MAXIMUM SOLDER BALL DIAMETER,
2.
1.
3
0.25 0.30b0.35
0.50 BSC
aaa
ddd
bbb
e
-
-
-
-
-
-0.10
0.08
0.10
1.23
NOM.
0.25 BSC
4.50 BSC
6.00 BSC
MIN.SYMBOL
A2
A1
D/E
M/N
A
S
1.10
0.15
MAX.
1.35
1.10
--
--
C
4
ddd
bbb C
C
1
A
A2
A
b
.05
.15
3B
M
MC
CA
e
S
N
S
e
M
1
A
2345678910
B
C
D
E
F
G
H
J
K
A1 BALL I.D.
IDENTIFIER
aaa
4X 6
D
E
B
A
5
(4X)
Lattice Semiconductor Package Diagrams
31
68-Pin JLCC Package
Dimensions in Inches
CORNER CHAMFERS AND/OR NOTCHES ARE OPTIONAL.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.
3.
2.
1.
-A-.004
PLANE
SEATING
ALL DIMENSIONS ARE IN INCHES.
.050
E4
D4
DETAIL A
D
D1
D2
E2
O
SECTION B-B
D4/E4
D2/E2
D1/E1
N
R
Q
L2
L1
L
.020 MIN.
A1
SYMB
A
B1
C
B
A
D/E
C1
C
B2
B1
B
A1
-
-
-
--
-
-
-
-
68 .040.020
.003
.025
.020
.005
.930 BSC
-
-
-
-
-
-
-
L
.800 BSC.960.920 .990
.013.007
.080 REF
C1
WITH
LEAD FINISH
BASE METAL
MAX.
1.000
.010
.035
.020
.023
.975
.007
.022
.013
.013
.115 .190
MIN.
INCHES
(N PLACES)
DETAIL A
E1 E
M
.011
B2
B
R
L2
L1
A
Q
L
C
B
B
NOTES:
Lattice Semiconductor Package Diagrams
32
68-Pin PLCC Package
Dimensions in Inches
.020 MAX 3 PLCS
A-B
//
.007 SH
.002 S
A-B S SD
DETAIL B
.020 MAX 3 PLCS
9
9
3
.007 S A-BHSDS
-A-
EE
1
7
.042
.048
45∞ X 13
MAX
.075
DETAIL B
see
-B- 3
(N-4PLACES)
.050
A-B S.002
321
-D-
N
3
A-B
.007 S H
1
D
.007 SH
D
S
7
SD
DSA-B S
8
MAX
.150
Lattice Semiconductor Package Diagrams
33
68-Pin PLCC Package (cont.)
ADJACENT LEADS IS 0.08.
MINIMUM SPACE BETWEEN
DETAIL
SECTION A-A
TYP ALL SIDES
DETAIL "J"
M
TO BE .007 MAX/LEAD
OPTIONAL FEATURE. IF PRESENT,
.025 MIN.
.013
TYP ALL SIDES
10
.065
DETAIL "L"
D2
A
E2
A
.020
10
DE
MAX.
.010 .020
D2
E2
R.045
.025
E
MAX.
10
D
.010
.020
14
.065 .0125
.018
.013
.0075
.013
.021
.045 MIN.
- C -
2
- H -
N-4 PLACES
.050
1
A
A
SEE
"J"
DETAIL
.042
45∞x
.056
.020
MIN
2
A
24
.045 MIN.
.007 MAX.
SEATING PLANE
MIN.
.025
E
6
2
X
SEATING PLANE
.021
5
.007
Y
DETAIL "A"
Y
.026
.032
X
.007
-A-B-
D
-D-
E
2
D4
2
E
D
DETAIL
.004 C
BASE PLANE
"A"
SEE
BASE PLANE
.020 MIN.
-C- 7
.0075 15
.0105
A-BCSDS
HS A-B SDS
.025/.045 R.
"L"
SEE
Lattice Semiconductor Package Diagrams
34
68-Pin PLCC Package (cont.)
DIMENSION APPLIES TO BASE METAL ONLY
DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
PIN NUMBERS ARE FOR REFERENCE ONLY
TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
ALL DIMENSIONS IN INCHES
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
OR LOWER PARTING LINE.
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
15
THE SOCKET VENDOR
14
13
12
11
8
10
9
BOTTOM POINT OF
-H-
LOCATED AT TOP OF MOLD PARTING LINE AND
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
SHAPE OF TRANSITION IS OPTIONAL
TO BE MEASURED AT SEATING PLANE
EXIT PLASTIC BODY AT DATUM PLANE
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
DATUMS
2. DATUM PLANE
7
6
5
4
3AND
A-B -D-
-H-
N
NOTES:
68
.062
A
D
E
E
E
E
D
D
D
3
-
.441
1
2
.950
.985
3.375
.455
.954
.990
2
.441
2
1.950
.985
.375
-
.990
.954
.455
B
M
A
A
Y
S
.090
.165
MIN.
1
OL.172
.105
NOM.
CONTACT POINT
TO BE DETERMINED WHERE CENTER LEADS
-H-
-H-
D3 D3
12
.083
-
.469
.995
.958
.469
.958
.995 -A-B-
12
.120
.180
MAX.
-D-
E3 12
E3
Lattice Semiconductor Package Diagrams
35
84-Pin CPGA Package
Dimensions in Inches
NOT TO EXCEED .003 INCHES MAXIMUM PER SIDE.
.006 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN
DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF
3.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.
.080 MAX.
SECTION X-X
ALL DIMENSIONS ARE IN INCHES.
NOTES:
2.
1.
BASE METAL
.020
.016 .0215
.0165
3
.100
.100
1.180
1.140
D
E1.180
1.140
-B-
3
-A-
.145
.045
SEATING PLANE
-C-
.200
.100
.075
X
X
.10
.30
.008
.070
M
M
MA
C
CM
B
Lattice Semiconductor Package Diagrams
36
84-Pin PLCC Package
Dimensions in Inches
.020 MAX 3 PLCS
A-B
//
.007 SH
.002 S
A-B S SD
DETAIL B
.020 MAX 3 PLCS
9
9
3
.007 S A-BHSDS
-A-
EE
1
7
.042
.048
45∞ X 13
MAX
.075
DETAIL B
see
-B- 3
(N-4PLACES)
.050
A-B S.002
321
-D-
N
3
A-B
.007 S H
1
D
.007 SH
D
S
7
SD
DSA-B S
8
MAX
.150
Lattice Semiconductor Package Diagrams
37
84-Pin PLCC Package (cont.)
ADJACENT LEADS IS 0.08.
MINIMUM SPACE BETWEEN
DETAIL
SECTION A-A
TYP ALL SIDES
DETAIL "J"
M
TO BE .007 MAX/LEAD
OPTIONAL FEATURE. IF PRESENT,
.025 MIN.
.013
TYP ALL SIDES
10
.065
DETAIL "L"
D2
A
E2
A
.020
10
DE
MAX.
.010 .020
D2
E2
R.045
.025
E
MAX.
10
D
.010
.020
14
.065 .0125
.018
.013
.0075
.013
.021
.045 MIN.
- C -
2
- H -
N-4 PLACES
.050
1
A
A
SEE
"J"
DETAIL
.042
45∞x
.056
.020
MIN
2
A
24
.045 MIN.
.007 MAX.
SEATING PLANE
MIN.
.025
E
6
2
X
SEATING PLANE
.021
5
.007
Y
DETAIL "A"
Y
.026
.032
X
.007
-A-B-
D
-D-
E
2
D4
2
E
D
DETAIL
.004 C
BASE PLANE
"A"
SEE
BASE PLANE
.020 MIN.
-C- 7
.0075 15
.0105
A-BCSDS
HS A-B SDS
.025/.045 R.
"L"
SEE
Lattice Semiconductor Package Diagrams
38
84-Pin PLCC Package (cont.)
DIMENSION APPLIES TO BASE METAL ONLY
DIMENSION R REQUIRED FOR 120∞ MINIMUM BEND
PIN NUMBERS ARE FOR REFERENCE ONLY
TOP POINT OF MEASUREMENT IS DATUM
MEASUREMENT IS AT MAJOR FLAT AREA OF LOWER PLASTIC SURFACE
(SOCKET SEATING PLANE) DEFINED BY D3/E3
ALL DIMENSIONS IN INCHES
SOCKETED . IT IS ADVISABLE TO REVIEW THESE DIMENSION WITH
EXACT SHAPE OF THIS FEATURE IS OPTIONAL.
LEAD FOR CERTAIN SOCKET APPLICATIONS. IF UNIT IS INTENDED TO BE
THESE TWO DIMENSIONS DETERMINE MAXIMUM ANGLE OF THE
PROTRUSION IS .010 PER SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD
DETAILS OF THE IDENTIFIER ARE OPTIONAL.
PIN 1 IDENTIFIER MUST BE LOCATED WITHIN HE ZONE INDICATED
OR LOWER PARTING LINE.
E1 ARE MEASURED AT THE EXTREME MATERIAL CONDITION AT THE UPPER
MISMATCH AND ARE DETERMINED AT THE PARTING LINE; THAT IS D1 AND
15
THE SOCKET VENDOR
14
13
12
11
8
10
9
BOTTOM POINT OF
-H-
LOCATED AT TOP OF MOLD PARTING LINE AND
PLASTIC BODY DETAILS BETWEEN LEADS ARE OPTI0NAL
SHAPE OF TRANSITION IS OPTIONAL
TO BE MEASURED AT SEATING PLANE
EXIT PLASTIC BODY AT DATUM PLANE
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
CONINCIDENT WITH TOP OF LEAD WHERE LEAD EXIST PLASTIC BODY
1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y14.5M-1982.
DATUMS
2. DATUM PLANE
7
6
5
4
3AND
A-B -D-
-H-
N
NOTES:
84
.059
A
D
E
E
E
E
D
D
D
3
-
.541
1
2
1.150
1.185
3.475
.555
1.154
1.190
2
.541
2
11.150
1.185
.475
-
1.190
1.154
.555
B
M
A
A
Y
S
.090
.165
MIN.
1
OL.172
.105
NOM.
CONTACT POINT
TO BE DETERMINED WHERE CENTER LEADS
-H-
-H-
D3 D3
12
.080
-
.569
1.195
1.158
.569
1.158
1.195 -A-B-
12
.120
.180
MAX.
-D-
E3 12
E3
Lattice Semiconductor Package Diagrams
39
100-Ball caBGA Package
Dimensions in Millimeters
MIN.SYMBOL MAX.NOM.
CROWNS OF THE SOLDER BALLS.
BILATERAL TOLERANCE ZONE IS APPLIED
EXACT SHAPE AND SIZE OF THIS FEATURE
TO EACH SIDE OF THE PACKAGE BODY.
IS OPTIONAL.
ALL DIMENSIONS ARE IN MILLIMETERS.
PARALLEL TO PRIMARY DATUM C
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
NOTES: UNLESS OTHERWISE SPECIFIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
6
5
4
3
1.
2.
bbb
ddd
-
-
0.10
0.12
-
-
7.20 BSC
10.00 BSC
0.46
0.80 BSC
0.40 BSC
0.36
1.04
1.40
M/N
b
aaa
e
S
0.40
-
D/E
A1
A2
A
0.31
0.99
1.30
0.52
0.10
-
0.41
1.09
1.50
b
3
e
S
10
A1 BALL I.D.
4X
.08
.15 C
C
M
M
S
AB
C
ddd
4C
e
C
bbb
5
98761
2
34
N
E
K
J
H
G
F
IDENTIFIER
B
D
C
A
6
A
1
A
A2
E
B
M
aaa (4X)
D
5
A
Lattice Semiconductor Package Diagrams
40
100-Ball fpBGA Package
Dimensions in Millimeters
bbb
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
DIMENSION!"b"!IS!MEASURED!AT!THE
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
IDENTIFIER
A1!BALL!I.D.
2.
1.
3
4
NOTES:!UNLESS!OTHERWISE!SPECIFIED
5
6IS!OPTIONAL.
PRIMARY!DATUM!!C!!AND!SEATING
PER!ANSI!Y14.5M.
DIMENSIONS!AND!TOLERANCES!
MAXIMUM!SOLDER!BALL!DIAMETER,
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
4
ddd C
S
e
A
b
3
.25
.10 M
M
C
C
10 9 8765
M
B
S
e
J
K
H
G
4321
D
E
F
C
B
N
A
0.70
1.70
MAX.
0.20
0.20
0.25
0.70
D/E
e
aaa
ddd
bbb
S
M/N
b
C
A
A2
A1
SYMBOL
11.00!BSC
0.50!BSC
1.00!BSC
9.00!BSC
-
-
-
0.40
-
-
-
0.55
1.10!REF
1.501.30
0.30
MIN. NOM.
0.50
2
5
(4X)
4X
C
6
aaa
AA
1
A
DA
E
B
Lattice Semiconductor Package Diagrams
41
100-Pin PQFP Package
Dimensions in Millimeters
0.13/0.30 R.
23.20 BSC
17.20 BSC
20.00 BSC
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
TO THE LOWEST POINT ON THE PACKAGE BODY.
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
OF THE PACKAGE BY 0.15 MM.
8.
9.
6.0 SECTION B-B:
DIMENSIONS.
c
c1
b
b1
0.11
0.11 0.15
0.22
0.22
-
-
0.30
N
e
E
E1
L
0.65 BSC
100
14.00 BSC
0.73 0.88
BASE METAL
LEAD FINISH
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
c1
c
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
3.
1
b
b
A
D1
D
A1
A2
-
0.25
2.50
-
-
2.70
SYMBOL MIN. NOM.
1.60 REF.
L
B
R. MIN.
0.13
B
0.40 MIN.
0∞ MIN.
0.23
0.19
0.40
0.36
1.03
3.40
0.50
2.90
MAX.
GAGE PLANE
0-7∞
0.25
SECTION B - B
DETAIL "A"
TOP VIEW BOTTOM VIEW
NOTES:
PLANE
-C-
SEATING
b
M0.12 CA-B D
SEE DETAIL "A"
(N-4)X e
C0.10
A
A1
-H-
A2
-D-
83-B-
PIN 1 INDICATOR
3
N
1
E
-A-
DD1 (HEAT SINK)
OPTIONAL FEATURE
9
3
C0.25 DA-B 4X
E1
H0.20 DA-B 4X
Lattice Semiconductor Package Diagrams
42
100-Pin TQFP Package
Dimensions in Millimeters
B
LEAD FINISH
BASE METAL
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
2. ALL DIMENSIONS ARE IN MILLIMETERS.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
6. SECTION B-B:
3.
SECTION B-B
b1
c
b
c
1
0.160.130.09c1
0.50 BSC
0.17
0.09c
b1
0.17b
e
0.15
0.20
0.20
0.23
0.22 0.27
14.00 BSC
16.00 BSC
0.45
N
L
E1
E
100
0.60 0.75
14.00 BSC
16.00 BSC
D1
D
0.05
1.35A2
A1
1.40
-
1.45
0.15
SYMBOL
DETAIL 'A'
A1
0.10 C
MIN.
A--
NOM.
1.60
MAX.
0.20 MIN.
1.00 REF.
0-7∞
L
B
SIDE VIEW
SEATING PLANE
0.20 C
MDA-B
b
TOP VIEW
8
e
D
A
3
D
GAUGE PLANE
SEE DETAIL 'A'
C
A A2
0.204X A-BH D
H0.25
BOTTOM VIEW
3
3
B
E1
E
D1
0.20 A-BCD100X
NOTES:
PIN 1 INDICATOR
Lattice Semiconductor Package Diagrams
43
120-Pin PQFP Package
Dimensions in Millimeters
0∞ MIN.
0.20 MIN.
-
NOM.
-
3.40
31.20 BSC
0.88
31.20 BSC
28.00 BSC
28.00 BSC
120
0.80 BSC
-
0.35
0.15
-
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
9.
6.0 SECTION B-B:
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
c1 0.11
N
e
b
b1
c0.11
0.29
0.29
E
E1
L
D1
0.73
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
c
BASE METAL
1
b
c1
A
SYMBOL
A1
A2
D
0.25
3.20
-
MIN.
L
1.60 REF.
LEAD FINISH
b
B
R. MIN.
0.13
B
0.19
0.41
0.23
0.45
1.03
0-7∞
0.50
3.60
4.10
MAX.
GAGE PLANE
0.25
0.13/0.30 R.
SECTION B - B
DETAIL "A"
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
(N-4)X
NOTES:
0.20 M CDA-B
PLANE
C
SEATING
b
0.10
e
CA1
AA2
H
D
8
A
3
1
N
PIN 1 INDICATOR
3
D3
B
EE1 OPTIONAL FEATURE
(HEAT SINK)
9
0.25 C A-B D 4X
D1
A-BH0.20 D 4X
Lattice Semiconductor Package Diagrams
44
128-Pin PQFP Package
Dimensions in Millimeters
0∞ MIN.
0.20 MIN.
-
NOM.
-
3.40
31.20 BSC
0.88
31.20 BSC
28.00 BSC
28.00 BSC
128
0.80 BSC
-
0.35
0.15
-
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
9.
6.0 SECTION B-B:
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
c1 0.11
N
e
b
b1
c0.11
0.29
0.29
E
E1
L
D1
0.73
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
c
BASE METAL
1
b
c1
A
SYMBOL
A1
A2
D
0.25
3.20
-
MIN.
L
1.60 REF.
LEAD FINISH
b
B
R. MIN.
0.13
B
0.19
0.41
0.23
0.45
1.03
0-7∞
0.50
3.60
4.10
MAX.
GAGE PLANE
0.25
0.13/0.30 R.
SECTION B - B
DETAIL "A"
T
OP VIEW
BOTTOM VIEW
SEE DETAIL "A"
(N-4)X
NOTES:
0.20 M CDA-B
PLANE
C
SEATING
b
0.10
e
CA1
AA2
H
D
8
A
3
1
N
PIN 1 INDICATOR
3
D3
B
EE1 OPTIONAL FEATURE
(HEAT SINK)
9
0.25 C A-B D 4X
D1
A-BH0.20 D 4X
Lattice Semiconductor Package Diagrams
45
128-Pin TQFP Package
Dimensions in Millimeters
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
TO THE LOWEST POINT ON THE PACKAGE BODY.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
BASE METAL
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
8.
OF THE PACKAGE BY 0.15 MM.
DIMENSIONS.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
6. SECTION B-B:
3.
1
b
cc
1
c1
c
0.09
0.09
b1
b
0.13
0.13
0.13
0.15
0.16
0.20
0.16
0.18
0.19
0.23
16.00 BSCE
0.45L
N
e
E1
0.60 0.75
0.40 BSC
128
14.00 BSC
D1
D
A2
A1
1.35
0.05
16.00 BSC
14.00 BSC
1.40
-
1.45
0.15
SYMBOL
A-
MIN.
-
NOM.
1.60
MAX.
SEE DETAIL "A"
LEAD FINISH
C SEATING PLANE
8.
b
0.07
b
-BCMA D
4X
D3.
e
3. A
B
D
GAUGE PLANE
0.08 C A1
A A2
1.00 REF.
0.20 MIN.
L
0-7∞
B
H
B
0.25
E
3.
E1
A-B
C A-B 0.20 H0.20 D D1
D
SECTION B - B
DETAIL "A"
NOTES:
PIN 1 INDICATOR
1
N
Lattice Semiconductor Package Diagrams
46
132-Ball csBGA Package
Dimensions in Millimeters
PRIMARY DATUM C AND SEATING
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
EXACT SHAPE AND SIZE OF THIS FEATURE
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
IS OPTIONAL.
CROWNS OF THE SOLDER BALLS.
4
5
6
PER ANSI Y14.5M.
NOTES: UNLESS OTHERWISE SPECIFIED
DIMENSIONS AND TOLERANCES
PARALLEL TO PRIMARY DATUM C
MAXIMUM SOLDER BALL DIAMETER,
2.
1.
3
0.25 0.30b 0.35
0.50 BSC
aaa
ddd
bbb
e
-
-
-
-
-
-0.10
0.08
0.10
1.23
NOM.
0.25 BSC
6.50 BSC
8.00 BSC
MIN.SYMBOL
A2
A1
D/E
M/N
A
S
0.90
0.15
MAX.
1.35
1.10
--
--
C
4
ddd
bbb C
C
1
A
A2
A
b
.05
.15
3B
M
MC
CA
e
S
N
S
e
M
1
A
2345678910
B
C
D
E
F
G
H
J
K
11121314
L
M
N
P
A1 BALL I.D.
IDENTIFIER
aaa
4X 6
D
E
B
A
5
(4X)
Lattice Semiconductor Package Diagrams
47
133-Pin CPGA Package
Dimensions in Inches
ALL DIMENSIONS ARE IN INCHES.2.
NOT TO EXCEED .003 INCHES MAXIMUM PER SIDE.
.006 INCHES MAXIMUM ABOVE THE DIMENSION SHOWN
DIMENSIONS D AND E MAY HAVE MATERIAL PROTRUSION OF
3.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.
D-A-
-B-
.050
BASE METAL
SECTION X-X
NOTES:
1.
.100
.016
.020
.0165
.0215
.080 MAX.
.100
.050
1.440
1.480
1.480
1.440
E3
3
.070
.100
SEATING PLANE
-C-
.045
.075
.200
X
X
.008
A
.10
.30 M
MC
CMM B
.145
Lattice Semiconductor Package Diagrams
48
144-Ball fpBGA Package
Dimensions in Millimeters
A
E
0.50
1.70
0.60
0.50!BSC
1.00!BSC
11.00!BSC
11.60
13.00!BSC
0.50
NOM.
11.00B/C
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
IS!OPTIONAL.
6
5
4
3
ddd
ccc
bbb
aaa
e
b
S
M/N
D/E
-
-
-
-
-
-
-
-
0.50
C
DIMENSIONS!AND!TOLERANCES!
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
NOTES:!UNLESS!OTHERWISE!SPECIFIED
PER!ANSI!Y14.5M.
1.
2.
ddd
4C
C
bbb
.10
.25
3
b
e
S
A
M
M
C
CB
S
e
GN
K
J
H
M
L
E
D
C
B
F
C
ccc
A2
A1
A
SYMBOL
0.30
1.30
0.30
MIN.
4X 6
A2
1
A
A
C
12.20
0.25
0.35
0.20
0.20
0.70
0.70
0.70
2.10
MAX.
B
A1!BALL!I.D.
IDENTIFIER
10
11
12 1
M
96
7
834
52
aaa
(4X)
B
DA
5
Lattice Semiconductor Package Diagrams
49
144-Pin PQFP Package
Dimensions in Millimeters
0∞ MIN.
0.20 MIN.
-
NOM.
-
3.40
31.20 BSC
0.88
31.20 BSC
28.00 BSC
28.00 BSC
144
0.65 BSC
-
0.30
0.15
-
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
9.
6.0 SECTION B-B:
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
c1 0.11
N
e
b
b1
c 0.11
0.22
0.22
E
E1
L
D1
0.73
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
c
BASE METAL
1
b
c1
A
SYMBOL
A1
A2
D
0.25
3.20
-
MIN.
L
1.60 REF.
LEAD FINISH
b
B
R. MIN.
0.13
B
0.19
0.36
0.23
0.40
1.03
0-7∞
0.50
3.60
4.10
MAX.
GAGE PLANE
0.25
0.13/0.30 R.
SECTION B - B
DETAIL "A"
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
(N-4)X
NOTES:
0.13 M CDA-B
PLANE
C
SEATING
b
0.10
e
CA1
AA2
H
D
8
A
3
1
N
PIN 1 INDICATOR
3
D3
B
EE1 OPTIONAL FEATURE
(HEAT SINK)
9
0.25 C A-B D 4X
D1
A-BH0.20 D 4X
Lattice Semiconductor Package Diagrams
50
144-Pin TQFP Package
Dimensions in Millimeters
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
TO THE LOWEST POINT ON THE PACKAGE BODY.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
BASE METAL
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
8.
OF THE PACKAGE BY 0.15 MM.
DIMENSIONS.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
6. SECTION B-B:
3.
1
b
cc
1
c1
c
0.09
0.09
b1
b
0.17
0.17
0.13
0.15
0.16
0.20
0.20
0.22
0.23
0.27
22.00 BSCE
0.45L
N
e
E1
0.60 0.75
0.50 BSC
144
20.00 BSC
D1
D
A2
A1
1.35
0.05
22.00 BSC
20.00 BSC
1.40
-
1.45
0.15
SYMBOL
A-
MIN.
-
NOM.
1.60
MAX.
SEE DETAIL "A"
LEAD FINISH
C SEATING PLANE
8.
b
0.08
b
-BCMA D
4X
D3.
e
3. A
B
D
GAUGE PLANE
0.08 C A1
A2
A
1.00 REF.
0.20 MIN.
L
0-7∞
B
H
B
0.25
E
3.
E1
A-B
C A-B 0.20 H0.20 DD1
D
SECTION B - B
DETAIL "A"
NOTES:
PIN 1 INDICATOR
1
N
Lattice Semiconductor Package Diagrams
51
160-Pin PQFP Package
Dimensions in Millimeters
0∞ MIN.
0.20 MIN.
-
NOM.
-
3.40
31.20 BSC
0.88
31.20 BSC
28.00 BSC
28.00 BSC
160
0.65 BSC
-
0.30
0.15
-
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
9.
6.0 SECTION B-B:
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
c1 0.11
N
e
b
b1
c0.11
0.22
0.22
E
E1
L
D1
0.73
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
c
BASE METAL
1
b
c1
A
SYMBOL
A1
A2
D
0.25
3.20
-
MIN.
L
1.60 REF.
LEAD FINISH
b
B
R. MIN.
0.13
B
0.19
0.36
0.23
0.40
1.03
0-7∞
0.50
3.60
4.10
MAX.
GAGE PLANE
0.25
0.13/0.30 R.
SECTION B - B
DETAIL "A"
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
(N-4)X
NOTES:
0.13 M CDA-B
PLANE
C
SEATING
b
0.10
e
CA1
AA2
H
D
8
A
3
1
N
PIN 1 INDICATOR
3
D3
B
EE1 OPTIONAL FEATURE
(HEAT SINK)
9
0.25 C A-B D 4X
D1
A-BH0.20 D 4X
Lattice Semiconductor Package Diagrams
52
176-Pin TQFP Package
Dimensions in Millimeters
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
TO THE LOWEST POINT ON THE PACKAGE BODY.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
BASE METAL
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
8.
OF THE PACKAGE BY 0.15 MM.
DIMENSIONS.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
6. SECTION B-B:
3.
1
b
cc
1
c1
c
0.09
0.09
b1
b
0.17
0.17
0.13
0.15
0.16
0.20
0.20
0.22
0.23
0.27
26.00 BSCE
0.45L
N
e
E1
0.60 0.75
0.50 BSC
176
24.00 BSC
D1
D
A2
A1
1.35
0.05
26.00 BSC
24.00 BSC
1.40
-
1.45
0.15
SYMBOL
A-
MIN.
-
NOM.
1.60
MAX.
SEE DETAIL "A"
LEAD FINISH
C SEATING PLANE
8.
b
0.08
b
-BC
MA D
4X
D3.
e
3. A
B
D
GAUGE PLANE
0.08 C A1
AA2
1.00 REF.
0.20 MIN.
L
0-7∞
B
H
B
0.25
E
3.
E1
A-B
C A-B 0.20 H0.20 DD1
D
SECTION B - B
DETAIL "A"
NOTES:
PIN 1 INDICATOR
1
N
Lattice Semiconductor Package Diagrams
53
208-Ball fpBGA Package
Dimensions in Millimeters
S
1.
2.
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
4
5
3
0.50!BSC
1.00!BSC
15.00!BSC
15.30
17.00!BSC
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
IS!OPTIONAL.
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
--ccc
ddd - -
aaa
bbb
e
b
S
M/N
D/E
B/C
-
-
0.50
-
-
0.60
14.80
bbb
DIMENSIONS!AND!TOLERANCES!
PER!ANSI!Y14.5M.
ddd
4C
C
A
b
3
e
.10
.25
M
M
C
CB
S
e
L
T
R
P
N
M
K
J
H
G
F
N
C
ccc
SYMBOL
A
A2
A1
C
MIN.
1.30
0.30
0.30
1.70
0.50
0.50
NOM.
4X 6
A
C
0.35
0.20
0.20
0.25
0.70
15.80
2.10
0.70
0.70
MAX.
2
1
A
A
E
A1!BALL!I.D.
IDENTIFIER
14
15
16 10
11
12
13 1
934
5
6
7
82
M
E
D
C
B
A
aaa
(4X)
A
D
B
5
B
Lattice Semiconductor Package Diagrams
54
208-Pin PQFP Package
(with or without Internal Heat Spreader)
Dimensions in Millimeters
0∞ MIN.
0.20 MIN.
-
NOM.
-
3.40
30.60 BSC
0.60
30.60 BSC
28.00 BSC
28.00 BSC
208
0.50 BSC
-
0.20
0.12
-
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
9.
6.0 SECTION B-B:
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
c1 0.09
N
e
b
b1
c0.09
0.17
0.17
E
E1
L
D1
0.45
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
c
BASE METAL
1
b
c1
A
SYMBOL
A1
A2
D
0.25
3.20
-
MIN.
L
1.30 REF.
LEAD FINISH
b
B
R. MIN.
0.08
B
0.16
0.23
0.20
0.27
0.75
0-8∞
0.50
3.60
4.10
MAX.
GAGE PLANE
0.25
0.08/0.25 R.
SECTION B - B
DETAIL "A"
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
(N-4)X
NOTES:
0.08 M CDA-B
PLANE
C
SEATING
0.08
b
e
CA1
AA2
H
D
8
A
3
1
N
PIN 1 INDICATOR
3
D3
B
EE1 OPTIONAL FEATURE
(HEAT SINK)
9
0.25 C A-B D 4X
D1
A-BH0.20 D 4X
Lattice Semiconductor Package Diagrams
55
240-Pin MQFP Package
Dimensions in Millimeters
31.70
31.70
3.35
34.60
0∞ MIN.
0.35 MIN.
-
NOM.
-
34.60
0.60
240
0.50 BSC
-
0.20
0.12
-
BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
SECTION B-B:
3.0
c1 0.09
N
e
b
b1
c0.09
0.17
0.17
E
E1
L
D1
31.60
0.45
31.60
34.40
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0
1.0
c
BASE METAL
1
b
c1
A
SYMBOL
A1
A2
D
0.25
3.10
34.40
-
MIN.
L
LEAD FINISH
b
B
TYP.
0.16R
B
0.16
0.23
0.20
0.27
31.80
0.75
31.80
34.80
0-8∞
0.65
34.80
3.60
4.15
MAX.
GAGE PLANE
0.25
0.08/0.25 R.
SECTION B - B
DETAIL "A"
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
(N-4)X
NOTES:
0.08 M C
PLANE
C
SEATING
0.08
b
e
CA1
AA2
D
1
N
PIN 1 INDICATOR
2.54 TYP.
EE1
D1
Lattice Semiconductor Package Diagrams
56
240-Pin PQFP Package
Dimensions in Millimeters
0∞ MIN.
0.20 MIN.
-
NOM.
-
3.40
34.60 BSC
0.60
34.60 BSC
32.00 BSC
32.00 BSC
240
0.50 BSC
-
0.20
0.12
-
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
9.
6.0 SECTION B-B:
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
c1 0.09
N
e
b
b1
c0.09
0.17
0.17
E
E1
L
D1
0.45
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
c
BASE METAL
1
b
c1
A
SYMBOL
A1
A2
D
0.25
3.20
-
MIN.
L
1.30 REF.
LEAD FINISH
b
B
R. MIN.
0.08
B
0.16
0.23
0.20
0.27
0.75
0-8∞
0.50
3.60
4.10
MAX.
GAGE PLANE
0.25
0.08/0.25 R.
SECTION B - B
DETAIL "A"
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
(N-4)X
NOTES:
0.08 M CDA-B
PLANE
C
SEATING
0.08
b
e
CA1
AA2
H
D
8
A
3
1
N
PIN 1 INDICATOR
3
D3
B
EE1 OPTIONAL FEATURE
(HEAT SINK)
9
0.25 C A-B D 4X
D1
A-BH0.20 D 4X
Lattice Semiconductor Package Diagrams
57
256-Ball fpBGA Package
Dimensions in Millimeters
A
D
4X
ccc
ddd
aaa
bbb
M/N
D/E
B/C
SYMBOL
NOTES:!UNLESS!OTHERWISE!SPECIFIED
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
IS!OPTIONAL.
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
DIMENSIONS!AND!TOLERANCES!
PER!ANSI!Y14.5M.
4
6
5
2.
3
1.
12
M
M
b
3.10
.25
S
e
14
15
16 13
4
ddd C
BA
C
C
S
e
C
ccc
C
C
bbb
L
T
R
P
N
M
K
J
H
G
F
N
10 9 4
5
6
7
8
11
M
1
2
3
E
D
C
B
A
-
-
-
-
1.00!BSC
0.60
-
-
-
-
0.50
e
b
0.35
0.20
0.20
0.25
0.70
0.50!BSC
15.00!BSC
15.30
17.00!BSC
1.70
0.50
0.50
NOM.
14.80
S
MIN.
1.30
0.30
0.30
A
A2
A1
15.80
2.10
0.70
0.70
MAX.
6
1
A
A
2
A
C
B
E
B
A1!BALL!I.D.
IDENTIFIER
(4X) aaa
5
Lattice Semiconductor Package Diagrams
58
256-Ball SBGA Package
Dimensions in Millimeters
A-A SECTION VIEW
Y
W
20 19 151718 16 121314
P
R
T
U
V
K
L
M
N
E
F
G
H
J
A
B
C
D
89
1011
5672341
DIMENSIONS AND TOLERANCES
IS OPTIONAL.
PARALLEL TO PRIMARY DATUM C
PER ANSI Y14.5M.
CROWNS OF THE SOLDER BALLS.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
NOTES: UNLESS OTHERWISE SPECIFIED
4
6
5
3
2.
1.
0.20
1.00
1.70
0.90
0.20
0.25
0.80
--
A
1.27 BSCe
-
0.25
0.10
-
-
aaa
ddd
bbb
A4
Q
-
-
-
-
-
0.80
0.60
0.50
M/N
S
b
D/E
A2
A1
0.75
0.635 BSC
24.13 BSC
0.90
27.00 BSC
0.65
MIN.SYMBOL NOM.
-
-
MAX.
Q
1
C
ddd
bbb
4C
C
4
AAA
2
A
b
3.15
.30 M
MC
C
eS
BA
e
S
AA
N
M
4X 6
A1 BALL I.D.
IDENTIFIER
5
(4X)
aaa
D
E
AB
Lattice Semiconductor Package Diagrams
59
269-Ball fcBGA Package
Dimensions in Millimeters
R
E
C
N
.08
.15
IS!OPTIONAL.
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
5
4
3
2.
3
1.
b
e
1.00
2.40
0.10
0.55
0.12
0.10
0.50
MAX.
PER!ANSI!Y14.5M.
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
--bbb
ddd --
0.80
0.35
e
aaa
b
M/N
D/E
C
A2
0.45
0.80!BSC
--
0.90
12.80!BSC
15.00!BSC
MC
DIMENSIONS!AND!TOLERANCES!
4
ddd C
C
AM CB
e
U
T
2.00
0.30
MIN.SYMBOL
A1
A
C
bbb
2.20
0.40
NOM.
4X 6
A
1
AA
2
IDENTIFIER
16 14 12 10
17 15 13 11
M
C
J
P
N
M
L
K
H
G
F
E
D
864 2
5
9731
A
B
A1!BALL!I.D.
aaa (4X)
B
D
5
B
A
3.5x3.5mm!areas
for!passive!components
A3
A3 -0.70-
B5.00 5.25 5.50
5.00 5.25 5.50
Lattice Semiconductor Package Diagrams
60
272-Ball BGA Package
Dimensions in Millimeters
1.
NOTES: UNLESS OTHERWISE SPECIFIED
6
5
4
3
2.
0.635 BSC
1.27 BSC
24.13 BSC
27.00 BSC
0.650.50A1
PER ANSI Y14.5M.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
IS OPTIONAL.
PARALLEL TO PRIMARY DATUM C
CROWNS OF THE SOLDER BALLS.
ddd
ccc
bbb
-
-
-
-
-
-
M/N
aaa
e
b
S
B/C
D/E
A2
-
0.60
-
0.75
23.80
0.28
24.30
0.54
DIMENSIONS AND TOLERANCES
SYMBOL
A
MIN.
1.90
NOM.
2.25
0.80
0.20
0.35
0.25
0.20
0.90
24.80
0.80
MAX.
2.80
4ddd C
bbb
C
C
Cccc
1
A
A2
A
SG
b
3
e
M
M
.15
.30 B
A
C
C
Se
U
Y
W
V
M
P
N
R
T
J
H
L
KN
81820 19 15
16
17 11
12
13
14 9
10
M
57 62
3
4
C
F
E
D
1
B
A
4X 6
CE
A1 BALL I.D.
IDENTIFIER
aaa
B
D
(4X) 5
B
A
Lattice Semiconductor Package Diagrams
61
304-Pin MQFP Package
Dimensions in Millimeters
0∞ MIN.
0.35 MIN.
39.60D1
BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
SECTION B-B:
3.0
0.09c1
c
b1 0.17
0.09
b
e
0.17
39.60
E1
L
N
0.45
E42.40
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.0
1.0
c
BASE METAL
1
b
c1
D
A2 3.60
42.40
A1
A-
0.25
SYMBOL MIN.
L
LEAD FINISH
b
B
TYP.
0.16R
B
39.70 39.80
0.160.12
-
0.20
0.20
0.23
0.50 BSC
-0.27
39.70 39.80
304
0.60 0.75
42.60 42.80
0-8∞
3.80
42.60
4.00
42.80
-
-
0.65
4.55
NOM. MAX.
GAGE PLANE
0.25
0.08/0.25 R.
SECTION B - B
DETAIL "A"
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
(N-4)X
NOTES:
0.08 M C
PLANE
C
SEATING
0.08
b
e
CA1
AA2
D
1
N
PIN 1 INDICATOR
2.54 TYP.
EE1
D1
Lattice Semiconductor Package Diagrams
62
304-Pin PQFP Package
Dimensions in Millimeters
0∞ MIN.
0.20 MIN.
-
NOM.
-
3.80
42.60 BSC
0.60
42.60 BSC
40.00 BSC
40.00 BSC
304
0.50 BSC
-
0.20
0.12
-
3. DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
4.0 DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
5.0 THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.0 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
EXACT SHAPE OF EXPOSED HEATSINK IS OPTIONAL.
9.
6.0 SECTION B-B:
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
c1 0.09
N
e
b
b1
c0.09
0.17
0.17
E
E1
L
D1
0.45
2.0 ALL DIMENSIONS ARE IN MILLIMETERS.
1.0 DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
c
BASE METAL
1
b
c1
A
SYMBOL
A1
A2
D
0.25
3.55
-
MIN.
L
1.30 REF.
LEAD FINISH
b
B
R. MIN.
0.08
B
0.16
0.23
0.20
0.27
0.75
0-8∞
0.50
4.05
4.50
MAX.
GAGE PLANE
0.25
0.08/0.25 R.
SECTION B - B
DETAIL "A"
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
(N-4)X
NOTES:
0.08 M CDA-B
PLANE
C
SEATING
0.08
b
e
CA1
AA2
H
D
8
A
3
1
N
PIN 1 INDICATOR
3
D3
B
EE1 OPTIONAL FEATURE
(HEAT SINK)
9
0.25 C A-B D 4X
D1
A-BH0.20 D 4X
Lattice Semiconductor Package Diagrams
63
320-Ball SBGA Package
Dimensions in Millimeters
4
A
2
C
ddd
4C
bbb C
A1AA
e
b
M
.15
3C
.30 MC
S
BA
e
2
S
A
15192123 17
2224 1820 16
5793
1113
1214 10 68 4
M
G
T
U
AA
AD
AB
AC
V
W
Y
N
M
P
N
R
H
K
J
LA
1
C
D
F
E
A
B
4X 6
5
(4X)
aaa
A1 BALL I.D.
IDENTIFIER
DA
E
B
DIMENSIONS AND TOLERANCES
PARALLEL TO PRIMARY DATUM C
CROWNS OF THE SOLDER BALLS.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
NOTES: UNLESS OTHERWISE SPECIFIED
PER ANSI Y14.5M.
6
5
3
4
2.
IS OPTIONAL.
1.
MAX.
Q
bbb
ddd
A4
aaa
b
e
S
D/E
M/N
A2
--0.25
-
-
0.10
-
0.25-
-0.20
-
-
-
0.20
0.75
0.90
0.635 BSC
1.27 BSC
29.21 BSC
31.00 BSC
0.60
0.80
0.90
1.00
SYMBOL
A
A1 0.65
-
0.50
MIN.
-
NOM.
1.70
0.80
A-A SECTION VIEW
Q
Lattice Semiconductor Package Diagrams
64
352-Ball SBGA Package
Dimensions in Millimeters
C
ddd
Q4C
A4
A
bbb C
1
A2A
AD
AC
AB
AL
e
3
b
B
M
.15 C
S
.30 MCA
Y
AF
AE
AA
W
T
U
V
M
N
P
R
26
S
192425 23 2122 20 1718 16 131415
M
B
G
H
J
K
C
D
E
F
9
101112
678 2345
A
1
A
e
N
4X 6
aaa
A1 BALL I.D.
IDENTIFIER
(4X) 5
DA
E
B
DIMENSIONS AND TOLERANCES
PARALLEL TO PRIMARY DATUM C
CROWNS OF THE SOLDER BALLS.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
NOTES: UNLESS OTHERWISE SPECIFIED
4
5
6IS OPTIONAL.
A-A SECTION VIEW
1.
3
2.
PER ANSI Y14.5M. 1.00
1.70
0.20
0.90
0.25
0.20
0.80
MAX.
A4
Q
ddd
bbb
aaa
e
--
0.10
-
-
0.25
-
-
-
1.27 BSC
-
b
S
M/N
D/E
A2
A1
A
SYMBOL
0.650.50
0.635 BSC
31.75 BSC
35.00 BSC
0.60
0.80
0.75
0.90
-
MIN. NOM.
-
-
-
Lattice Semiconductor Package Diagrams
65
388-Ball BGA Package
Dimensions in Millimeters
ddd
4
1
C
C
bbb CC
ccc
AA2
A
S
J
3
b
e
AM
.30 C
.15 C
M
S
B
e
V
AC
AD
AE
AF
W
Y
AA
AB
P
N
R
T
U
K
L
M
N
13
M
2024
25
26 2123 22 17
18
19 1416 15 1012 11 879 3
46 521
F
E
G
H
B
C
D
A
4X 6
CE
aaa
A1 BALL I.D.
IDENTIFIER
A
D
B
(4X) 5
B
DIMENSIONS AND TOLERANCES
PARALLEL TO PRIMARY DATUM C
CROWNS OF THE SOLDER BALLS.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
NOTES: UNLESS OTHERWISE SPECIFIED
6
5
IS OPTIONAL.
2.
4
3
1. PER ANSI Y14.5M.
1.27 BSCe
0.20
0.35
0.25
0.20
ddd
ccc
bbb
aaa
-
-
-
-
-
-
-
-
0.80
3.25
33.80
0.90
0.80
MAX.
M/N
D/E
B/C
A2
A1
A
SYMBOL
b
S0.635 BSC
31.75 BSC
35.00 BSC
0.60
29.80
0.75
31.80
1.90
0.28
0.50
MIN.
2.80
0.54
0.65
NOM.
Lattice Semiconductor Package Diagrams
66
388-Ball fpBGA Package
Dimensions in Millimeters
S
1.
2.
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
4
5
3
0.50!BSC
1.00!BSC
21.00!BSC
19.80
23.00!BSC
A
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
IS!OPTIONAL.
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
--ccc
ddd - -
aaa
bbb
e
b
S
M/N
D/E
B/C
-
-
0.50
-
-
0.60
19.30
BA
M
M
.10
3
.25
C
C
4
DIMENSIONS!AND!TOLERANCES!
PER!ANSI!Y14.5M.
C
ddd
C
bbb C
e
b
S
Y
e
AB
AA
P
V
U
T
R
W
M
L
K
J
N
N
SYMBOL
A
A2
A1
ccc C
MIN.
1.70
0.30
0.30
2.15
0.50
0.50
NOM.
6
4X
A
0.35
0.20
0.20
0.25
0.70
20.30
1
2.60
0.70
0.70
MAX.
2
A
CE
A1!BALL!I.D.
IDENTIFIER
2122 17
20 1819 14
15
16 13
M
4910
12 11 5
7
86
G
F
E
D
C
H
321
A
B
(4X)
aaa
B
D
5
B
A
Lattice Semiconductor Package Diagrams
67
416-Ball fpBGA Package
Dimensions in Millimeters
N
N
IS!OPTIONAL.
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
5
4
3
2.
1.
3
b
e
0.70
2.60
25.80
0.20
0.70
0.35
0.25
0.20
0.70
MAX.
PER!ANSI!Y14.5M.
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
--bbb
ddd
ccc
-
-
-
-
0.30
23.80
0.50
e
aaa
b
S
M/N
D/E
B/C
A2
0.60
0.50!BSC
1.00!BSC
--
0.50
25.00!BSC
24.80
27.00!BSC
ccc
BAM
.25 C
DIMENSIONS!AND!TOLERANCES!
M
.10 C
4
bbb
C
ddd
C
C
Se
AF
AE
W
AD
AC
AB
AA
Y
V
U
T
R
P
1.70
0.30
MIN.
SYMBOL
A1
A
C
2.15
0.50
NOM.
4X 6
A
C
2
A
A1
E
S
A1!BALL!I.D.
18
23
26 24
25
22 20
21 19
M
14
16
17 15
12 10
13 11
A
G
M
L
K
J
H
F
E
D
C
B
IDENTIFIER
5
86
97
4
3
2
1
5
aaa (4X)
D
B
A
B
Lattice Semiconductor Package Diagrams
68
432-Ball SBGA Package
Dimensions in Millimeters
DIMENSIONS AND TOLERANCES
PARALLEL TO PRIMARY DATUM C
CROWNS OF THE SOLDER BALLS.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
NOTES: UNLESS OTHERWISE SPECIFIED
5
6IS OPTIONAL.
3
4
2.
1. PER ANSI Y14.5M.
A-A SECTION VIEW
A4 0.10 --
0.20
0.25
0.20
ddd
bbb
aaa
-
-
-
-
-
-
1.00
1.70
0.90
0.80
MAX.
M/N
D/E
A2
A1
A
e
Q
b
S
38.10 BSC
0.00 BSC
1.27 BSC
0.25
0.60
-
0.75
40.00 BSC
0.80
0.50
-
0.90
0.65
-
SYMBOL MIN. NOM.
-
4
A
Q
2
C
ddd
4C
bbb C
A
A1A
3
b
e
A
.15
.30 MC
MC
S
B
e
M
A S
N
A
4X 6
aaa
A1 BALL I.D.
IDENTIFIER
5
(4X)
DA
E
B
2
18272830 2931 26 21222425 23 20 19 1017 111213141516
3456789
AG
AK
AJ
AH
AL
AF
AE
AD
AC
V
Y
AB
AA
W
P
R
T
U
J
K
L
M
N
E
F
G
H
1
A
B
C
D
Lattice Semiconductor Package Diagrams
69
484-Ball fpBGA Package
Dimensions in Millimeters
S
1.
2.
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
4
5
3
0.50!BSC
1.00!BSC
21.00!BSC
19.80
23.00!BSC
A
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
IS!OPTIONAL.
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
--ccc
ddd - -
aaa
bbb
e
b
S
M/N
D/E
B/C
-
-
0.50
-
-
0.60
19.30
BA
M
M
.10
3
.25
C
C
4
DIMENSIONS!AND!TOLERANCES!
PER!ANSI!Y14.5M.
C
ddd
C
bbb C
e
b
S
Y
e
AB
AA
P
V
U
T
R
W
M
L
K
J
N
N
SYMBOL
A
A2
A1
ccc C
MIN.
1.70
0.30
0.30
2.15
0.50
0.50
NOM.
6
4X
A
0.35
0.20
0.20
0.25
0.70
20.30
1
2.60
0.70
0.70
MAX.
2
A
CE
A1!BALL!I.D.
IDENTIFIER
2122 17
20 1819 14
15
16 13 4910
12 11 5
7
86
G
F
E
D
C
H
321
A
B
M
(4X)
aaa
B
D
5
B
A
Lattice Semiconductor Package Diagrams
70
492-Ball BGA Package
Dimensions in Millimeters
ddd
4
1
C
bbb
C
C
C
ccc
A
A2
A
NN
e
b
3
eS
M
.15
.30 MBA
C
C
AB
AF
AE
AC
AD
AA
Y
V
W
U
P
T
R
24
S
25
26
M
2123 22 19
20 18 14
17 15
16 13 11
12
M
J
L
K
H
G
E
F
D
79
10 8 4
5
6
A
C
B
31
2
E
C
4X 6
aaa
A1 BALL I.D.
IDENTIFIER
B
(4X)
D
5
A
B
DIMENSIONS AND TOLERANCES
PARALLEL TO PRIMARY DATUM C
CROWNS OF THE SOLDER BALLS.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
NOTES: UNLESS OTHERWISE SPECIFIED
6
5
IS OPTIONAL.
2.
4
3
1. PER ANSI Y14.5M.
1.27 BSCe
0.20
0.35
0.25
0.20
ddd
ccc
bbb
aaa
-
-
-
-
-
-
-
-
0.80
30.80
0.90
0.80
3.25
MAX.
M/N
D/E
B/C
A2
A1
A
SYMBOL
b
S
30.3029.80
0.635 BSC
31.75 BSC
35.00 BSC
0.60 0.75
1.90
0.28
0.50
MIN.
2.80
0.54
0.65
NOM.
Lattice Semiconductor Package Diagrams
71
516-Ball fpBGA Package
Dimensions in Millimeters
RE
C
N
.10
.25
IS!OPTIONAL.
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
5
4
3
2.
3
1.
b
e
0.70
2.60
29.30
0.20
0.70
0.35
0.25
0.20
0.70
MAX.
PER!ANSI!Y14.5M.
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
--bbb
ddd
ccc
-
-
-
-
0.30
25.80
0.50
e
aaa
b
S
M/N
D/E
B/C
A2
0.60
0.50!BSC
1.00!BSC
--
0.50
29.00!BSC
27.55
31.00!BSC
MC
DIMENSIONS!AND!TOLERANCES!
4
bbb
ddd C
C
C
AM CB
S
AF
e
AK
AJ
AH
AG
AA
AE
AD
AC
AB
Y
W
V
U
T
1.70
0.30
MIN.
SYMBOL
A1
A
C
ccc
2.15
0.50
NOM.
4X 6
A
1
A
A
2
27
S
30 28
29
IDENTIFIER
1826 24 22 20
23
25 21 19
16 14 12 10
17 15 13 11
M
C
J
P
N
M
L
K
H
G
F
E
D
8642
5
9731
A
B
A1!BALL!I.D.
aaa (4X)
B
D
5
B
A
6
OPTIONAL!FEATURE
(HEAT!SINK)
Lattice Semiconductor Package Diagrams
72
600-Ball SBGA Package
Dimensions in Millimeters
DIMENSIONS AND TOLERANCES
PARALLEL TO PRIMARY DATUM C
CROWNS OF THE SOLDER BALLS.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
NOTES: UNLESS OTHERWISE SPECIFIED
5
6IS OPTIONAL.
3
4
2.
1. PER ANSI Y14.5M.
A-A SECTION VIEW
A4 0.10 --
0.20
0.25
0.20
ddd
bbb
aaa
-
-
-
-
-
-
1.00
1.70
0.90
0.80
MAX.
M/N
D/E
A2
A1
A
e
Q
b
S
43.18 BSC
0.00 BSC
1.27 BSC
0.25
0.60
-
0.75
45.00 BSC
0.80
0.50
-
0.90
0.65
-
SYMBOL MIN. NOM.
-
4
A
Q
2
C
ddd
4C
bbb C
A
A1A
3
b
e
A
.15
.30 MC
MC
S
B
e
M
A
S
N
A
4X 6
aaa
A1 BALL I.D.
IDENTIFIER 5
(4X)
DA
E
B
2
18272830 2931 26 21222425 23 20 19 1017 111213141516
3456789
AG
AK
AJ
AH
AL
AF
AE
AD
AC
V
Y
AB
AA
W
P
R
T
U
J
K
L
M
N
E
F
G
H
1
A
B
C
D
32333435
AM
AN
AP
AR
Lattice Semiconductor Package Diagrams
73
672-Ball fpBGA Package
Dimensions in Millimeters
N
N
IS!OPTIONAL.
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
5
4
3
2.
1.
3
b
e
0.70
2.60
25.80
0.20
0.70
0.35
0.25
0.20
0.70
MAX.
PER!ANSI!Y14.5M.
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
--bbb
ddd
ccc
-
-
-
-
0.30
23.80
0.50
e
aaa
b
S
M/N
D/E
B/C
A2
0.60
0.50!BSC
1.00!BSC
--
0.50
25.00!BSC
24.80
27.00!BSC
ccc
BAM
.25 C
DIMENSIONS!AND!TOLERANCES!
M
.10 C
4
bbb
C
ddd
C
C
Se
AF
AE
W
AD
AC
AB
AA
Y
V
U
T
R
P
1.70
0.30
MIN.
SYMBOL
A1
A
C
2.15
0.50
NOM.
4X 6
A
C
2
A
A1
E
S
A1!BALL!I.D.
18
23
26 24
25
22 20
21 19
M
14
16
17 15
12 10
13 11
A
G
M
L
K
J
H
F
E
D
C
B
IDENTIFIER
5
86
97
4
3
2
1
5
aaa (4X)
D
B
A
B
OPTIONAL!FEATURE
6
(HEAT!SINK)
Lattice Semiconductor Package Diagrams
74
676-Ball fpBGA Package
Dimensions in Millimeters
AC
MIN.
0.30
1.70
0.30
25.80
0.50
.25
.10
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
4
5
3
2.
1.
b
3
e
A
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
DIMENSIONS!AND!TOLERANCES!
IS!OPTIONAL.
PER!ANSI!Y14.5M.
S
bbb
ccc
ddd
e
b
aaa
B/C
D/E
M/N
A1
A2
4
C
ddd
B
C
MA
C
M
S
C
bbb
C
ccc
SYMBOL
C
e
AD
AE
AG
AH
AJ
AK
AF
6
4X
2.602.15
0.50!BSC
1.00!BSC
-
-
-
-
-
-
-
0.60
-
0.25
0.35
0.20
0.70
0.20
31.00!BSC
29.00!BSC
27.55
0.50
0.50
29.30
0.70
0.70
A2
A
NOM. MAX.
1
A
(HEAT!SINK)
OPTIONAL!FEATURE
28
S
29
30
5
IDENTIFIER
A1!BALL!I.D.
15
22
25 23
24
26
27 17
16
19
21
20 18
M
8
9
11
13
10
12
14
3
75
2
46
F
P
T
U
V
W
Y
AB
AA
N
R
G
H
K
L
M
N
J
6
B
A
1
D
E
C
aaa (4X)
B
E
C
B
DA
Lattice Semiconductor Package Diagrams
75
680-Ball fpBGA Package
(with or without Internal Heat Spreader)
Dimensions in Millimeters
DIMENSIONS!AND!TOLERANCES!
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
5
IS!OPTIONAL.
2.
4
3
1.
PER!ANSI!Y14.5M.
1.00!BSCe
0.20
0.35
0.25
0.20
ddd
ccc
bbb
aaa
-
-
-
-
-
-
-
-
0.80
30.80
0.70
0.70
2.60
MAX.
M/N
D/E
B/C
A2
A1
A
SYMBOL
b
S
30.3029.80
0.50!BSC
33.00!BSC
35.00!BSC
0.50 0.60
1.90
0.40
0.30
MIN.
2.25
0.60
0.50
NOM.
ddd
4
1
C
bbb
C
C
C
ccc
A
A2
A
N
e
b
3
e
S
M
.15
.30
M
BA
C
C
S
M
AB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
CD
EF
GH
JK
LM
NP
RT
UV
WY
AAAB
ACAD
AEAF
AGAH
AJAK
ALAM
ANAP
E
C
4X 6
aaa
A1!BALL!I.D.
IDENTIFIER
B
(4X)
D
5
A
B
OPTIONAL!FEATURE
6
(HEAT!SINK)
Lattice Semiconductor Package Diagrams
76
680-Ball fpSBGA Package
Dimensions in Millimeters
A-A SECTION VIEW
SEATING PLANE
C
bbb C
ddd
AA
DIMENSIONS AND TOLERANCES
IS OPTIONAL.
PARALLEL TO PRIMARY DATUM C
PER ANSI Y14.5M.
CROWNS OF THE SOLDER BALLS.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
NOTES: UNLESS OTHERWISE SPECIFIED
5
6
4
1.
3
2.
b
3C
C
.10
.25 M
MBA
A
e
0.00 BSC
S
1.00 BSC
0.10A4
bbb
ddd
aaa
-
-
-
e
Q
b
0.25
0.50
--
-
-
-
0.25
0.20
0.20
-
0.65
-
0.80
38.00 BSC
40.00 BSC
0.45A1
D/E
M/N
A2 0.90
SYMBOL
A-
MIN.
0.600.53
0.98 1.05
NOM.
-1.70
MAX.
Q
4
A
A
1
A
A2
A
4X
S
AN
AW AV
e
AU
AR AT
AP
AG
AL
AJ
AM
AK
AH
AE
AC
AF
AD
AB
6
4
22
38 36 34 32 30 28 26 24
S
3139 37 35 33 27
29 25 23
aaa
20 18 16 14 12 10 8 6 4 2
13
17
21 19 15 11 975
JK
R
W
U
Y
V
T
N
N
L
P
M
D
G
E
H
F
C
A
31
B
A1 BALL I.D.
IDENTIFIER
M
(4X) 5
DB
E
A
Lattice Semiconductor Package Diagrams
77
900-Ball fpBGA Package
Dimensions in Millimeters
RE
C
N
.10
.25
IS!OPTIONAL.
ALL!DIMENSIONS!ARE!IN!MILLIMETERS.
EXACT!SHAPE!AND!SIZE!OF!THIS!FEATURE
NOTES:!UNLESS!OTHERWISE!SPECIFIED
6
5
4
3
2.
3
1.
b
e
0.70
2.60
29.30
0.20
0.70
0.35
0.25
0.20
0.70
MAX.
PER!ANSI!Y14.5M.
PARALLEL!TO!PRIMARY!DATUM!!C
CROWNS!OF!THE!SOLDER!BALLS.
BILATERAL!TOLERANCE!ZONE!IS!APPLIED
PLANE!ARE!DEFINED!BY!THE!SPHERICAL
PRIMARY!DATUM!!C!!AND!SEATING
MAXIMUM!SOLDER!BALL!DIAMETER,
DIMENSION!"b"!IS!MEASURED!AT!THE
TO!EACH!SIDE!OF!THE!PACKAGE!BODY.
--bbb
ddd
ccc
-
-
-
-
0.30
25.80
0.50
e
aaa
b
S
M/N
D/E
B/C
A2
0.60
0.50!BSC
1.00!BSC
--
0.50
29.00!BSC
27.55
31.00!BSC
MC
DIMENSIONS!AND!TOLERANCES!
4
bbb
ddd C
C
C
AM CB
S
AF
e
AK
AJ
AH
AG
AA
AE
AD
AC
AB
Y
W
V
U
T
1.70
0.30
MIN.
SYMBOL
A1
A
C
ccc
2.15
0.50
NOM.
4X 6
A
1
A
A
2
27
S
30 28
29
IDENTIFIER
1826 24 22 20
23
25 21 19
16 14 12 10
17 15 13 11
M
C
J
P
N
M
L
K
H
G
F
E
D
8642
5
9731
A
B
A1!BALL!I.D.
aaa (4X)
B
D
5
B
A
6
OPTIONAL!FEATURE
(HEAT!SINK)
Lattice Semiconductor Package Diagrams
78
1036-Ball fpSBGA Package
Dimensions in Millimeters
NOTES: UNLESS OTHERWISE SPECIFIED
TO EACH SIDE OF THE PACKAGE BODY.
DIMENSION "b" IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
EXACT SHAPE AND SIZE OF THIS FEATURE
PRIMARY DATUM C AND SEATING
PLANE ARE DEFINED BY THE SPHERICAL
BILATERAL TOLERANCE ZONE IS APPLIED
ALL DIMENSIONS ARE IN MILLIMETERS.
CROWNS OF THE SOLDER BALLS.
PARALLEL TO PRIMARY DATUM C
DIMENSIONS AND TOLERANCES
6
5
IS OPTIONAL.
4
3
2.
1. PER ANSI Y14.5M.
A-A SECTION VIEW
--0.25Q
ddd
aaa
bbb
A4
--0.20
-
-
0.10
-0.20
-0.35
--
-
A2.70
M/N
b
e
S
A2
D/E
A1
43.00 BSC
0.65
1.00 BSC
0.50 BSC
0.50 0.80
0.55
1.90
45.00 BSC
1.50
0.40
2.30
0.70
SYMBOL NOM.MIN. MAX.
2.00
C
bbb
Q
4
A4
C
ddd C
A12
AA
3
b
e
S
C
M
.30 A
.10 C
MB
A
S
M
e
A
N
4X 6
E
A
aaa
IDENTIFIER
A1 BALL I.D. 5
(4X)
DB
A
13579111315171921232527293133
246810121416182022242628303234
3537394143
3638404244
C
E
G
J
L
N
R
U
W
AA
AC
AE
AG
AJ
AL
AN
AR
AU
AW
BA
BC
B
D
F
H
K
M
P
T
V
Y
AB
AD
AF
AH
AK
AM
AP
AT
AV
AY
BB
BD
Lattice Semiconductor Package Diagrams
79
1156-Ball fpBGA Package
Dimensions in Millimeters
DIMENSIONS AND TOLERANCES
PARALLEL TO PRIMARY DATUM C
CROWNS OF THE SOLDER BALLS.
ALL DIMENSIONS ARE IN MILLIMETERS.
BILATERAL TOLERANCE ZONE IS APPLIED
PLANE ARE DEFINED BY THE SPHERICAL
PRIMARY DATUM C AND SEATING
EXACT SHAPE AND SIZE OF THIS FEATURE
MAXIMUM SOLDER BALL DIAMETER,
DIMENSION "b" IS MEASURED AT THE
TO EACH SIDE OF THE PACKAGE BODY.
NOTES: UNLESS OTHERWISE SPECIFIED
6
5
IS OPTIONAL.
2.
4
3
1. PER ANSI Y14.5M.
1.00 BSCe
0.20
0.35
0.25
0.20
ddd
ccc
bbb
aaa
-
-
-
-
-
-
-
-
0.80
30.80
0.70
0.70
2.60
MAX.
M/N
D/E
B/C
A2
A1
A
SYMBOL
b
S
30.3029.80
0.50 BSC
33.00 BSC
35.00 BSC
0.50 0.60
1.90
0.40
0.30
MIN.
2.25
0.60
0.50
NOM.
ddd
4
1
C
bbb
C
C
C
ccc
A
A2
A
N
e
b
3
eS
M
.10
.25 MBA
C
C
S
M
A
B
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
E
C
4X 6
aaa
A1 BALL I.D.
IDENTIFIER
B
(4X)
D
5
A
B
OPTIONAL FEATURE
6
(HEAT SINK)