REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor 07263. Change PD max from 275 mW to 303 mW. Change ICC from 50 mA to 55 mA. Change footnote 2, page 5. 87-05-26 N. A. Hauck B Changes IAW NOR 5962-R153-93. Table I, add footnote 3/ in maximum clock frequency, symbol column. Table I, add footnote at the end of table, "3/ fMAX, if not tested, shall be guaranteed to the specified limits." Editorial changes throughout. - tvn 93-05-05 Monica L. Poelking C Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 02-02-27 Raymond Monnin D Update drawing to current requirements. Editorial changes throughout. - gap 09-04-02 Joseph D. Rodenbeck CURRENT CAGE CODE IS 67268 The original first sheet of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY David W. Queenan STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY D. A. DiCenzo APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A Charles Reusing DRAWING APPROVAL DATE 87-02-04 REVISION LEVEL D MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, SHIFT REGISTER, MONOLITHIC SILICON SIZE CAGE CODE A 14933 SHEET DSCC FORM 2233 APR 97 5962-86071 1 OF 9 5962-E054-09 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86071 01 C X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Generic number Device type 01 Circuit function 54F164 8-bit serial-in parallel-out shift register 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter C D 2 Descriptive designator Terminals GDIP1-T14 or GDIP2-T14 GDFP1-F14 or GDFP2-F14 CQCC1-N20 Package style 14 14 20 Dual-in-line package Flat package Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range .......................................................................... Input voltage range ............................................................................ Storage temperature range.................................................................. Maximum power dissipation (PD) per device 1/ ................................ Lead temperature (soldering, 10 seconds) ........................................ Thermal resistance, junction-to-case (JC) ........................................ Junction temperature (TJ) .................................................................. -0.5 V dc to +7.0 V dc -1.2 V dc at -18 mA to +7.0 V dc -65C to +150C 303 mW +300C See MIL-STD-1835 +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) ................................................................ Minimum high level input voltage (VIH) ............................................... Maximum low level input voltage (VIL) ............................................... Case operating temperature range (TC) ............................................ Setup time, high or low, A or B to CP ............................................... Hold time, high or low, A or B to CP .................................................. Clock pulse width high ....................................................................... Clock pulse width low ........................................................................ +4.5 V dc minimum to +5.5 V dc maximum 2.0 V dc 0.8 V dc -55C to +125C 7 ns minimum 1 ns minimum 4 ns minimum 7 ns minimum MR pulse width low .......................................................................... 7 ns minimum Recovery time, MR to CP ................................................................. 9 ns minimum __________ 1/ Must withstand the added PD due to short circuit test (e.g. IOS). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86071 A REVISION LEVEL D SHEET 2 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86071 A REVISION LEVEL D SHEET 3 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator "C" shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator "C" shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86071 A REVISION LEVEL D SHEET 4 TABLE I. Electrical performance characteristics. Test High level output voltage Symbol VOH Conditions -55C TC +125C unless otherwise specified VCC = 4.5 V, IOH = -1 mA, Group A subgroups Limits Min 1, 2, 3 Unit Max 2.4 V VIN = 0.8 V or 2.0 V Low level output voltage VOL VCC = 4.5 V, IOL = 20 mA, 1, 2, 3 0.5 V 1, 2, 3 -1.2 V VIN = 0.8 V or 2.0 V Input clamp voltage VI C VCC = 4.5 V, IIH = -18 mA, TC = +25C II H1 VCC = 5.5 V, VIN = 7.0 V 1, 2, 3 100 A II H2 VCC = 5.5 V, VIN = 2.7 V 1, 2, 3 20 A Low level input current IIL VCC = 5.5 V, VIN = 0.5 V 1, 2, 3 -0.6 mA Short circuit output current IOS VCC = 5.5 V, 1, 2, 3 -150 mA 55 mA High level input current VOUTS = 0.0 V Supply current ICC Functional tests Maximum clock frequency fMAX 3/ VCC = 5.5 V, All outputs open 2/ 1, 2, 3 See 4.3.1c 7 VCC = 5.0 V, 9 80 MHz 10, 11 60 MHz RL = 500 5%, CL = 50 pF 10% Propagation delay time, -60 1/ tPLH1 9 8 ns 10, 11 11 ns 9 11 ns 10, 11 13 ns 9 13 ns 10, 11 17 ns CP to Qn tPHL1 Propagation delay time, tPHL2 MR to Qn 1/ Not more than one output should be shorted at a time, and the duration of the short circuit condition should not exceed one second. 2/ ICC is measured with inputs conditioned so that outputs should remain low. 3/ fMAX if not tested, shall be guaranteed to the specified limits in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86071 A REVISION LEVEL D SHEET 5 Device type 01 Case outlines Terminal number C and D 2 Terminal symbols 1 Dsa 2 Dsb NC Dsa 3 Q0 Dsb 4 Q1 Q0 5 Q2 6 Q3 NC Q1 7 GND 8 CP 9 10 MR Q4 GND 11 Q5 NC 12 Q6 CP 13 Q7 14 VCC MR Q4 NC Q2 Q3 15 NC Q5 16 17 18 NC Q6 19 Q7 20 VCC FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86071 A REVISION LEVEL D SHEET 6 Operating Mode Reset (Clear) Shift H h L l q Inputs Dsa MR CP Dsb Q0 Outputs Q1 Q7 L X X X L H l l L L q0 - L q6 H l h L q0 - q6 H h l L q0 - q6 H h h H q0 - q6 = = = = = HIGH voltage level. HIGH voltage level one setup time prior to the LOW to HIGH clock transition. LOW voltage level. LOW voltage level one setup time prior to the LOW to HIGH clock transition. Lower case letters indicate the state of the referenced input (or output) one setup time prior to the LOW to HIGH clock transition. X = Don't care. = LOW to HIGH clock transition. FIGURE 2. Truth table. FIGURE 3. Logic diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86071 A REVISION LEVEL D SHEET 7 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) Subgroups (in accordance with MIL-STD-883, method 5005, table I) --1*, 2, 3, 7, 9 1, 2, 3, 7, 9, 10, 11 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86071 A REVISION LEVEL D SHEET 8 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCCVA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86071 A REVISION LEVEL D SHEET 9 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 09-04-02 Approved sources of supply for SMD 5962-86071 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8607101CA 0C7V7 5962-8607101DA 5962-86071012A Vendor similar PIN 2/ 54F164ADMQB 3/ 54F164BCA 3/ 54F164DMQB 0C7V7 54F164AFMQB 3/ 54F164/BDA 3/ 54F164FMQB 0C7V7 54F164ALMQB 3/ 54F164/B2X 3/ 54F164L1MQB 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number 0C7V7 Vendor name and address QP Semiconductor 2945 Oakmead Village Court Santa Clara, CA 95051 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.