Preliminary Data Sheet PS9505,PS9505L1,PS9505L2,PS9505L3 R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER DESCRIPTION The PS9505, PS9505L1, PS9505L2 and PS9505L3 are optically coupled isolators containing a GaAlAs LED on the input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip. The PS9505 Series is designed specifically for high common mode transient immunity (CMR), high output current and high switching speed. The PS9505 Series is suitable for driving IGBTs and MOS FETs. The PS9505 Series is in a plastic DIP (Dual In-line Package). The PS9505L1 is lead bending type for long creepage distance. The PS9505L2 is lead bending type for long creepage distance (Gull-wing) for surface mount. The PS9505L3 is lead bending type (Gull-wing) for surface mounting. FEATURES * Long creepage distance (8 mm MIN.: PS9505L1, PS9505L2) PIN CONNECTION (Top View) * Large peak output current (2.5 A MAX., 2.0 A MIN.) * High speed switching (tPLH, tPHL = 0.25 s MAX.) 8 7 6 5 1 2 3 4 * UVLO (Under Voltage Lock Out) protection with hysteresis * High common mode transient immunity (CMH, CML = 25 kV/s MIN.) SHIELD * Embossed tape product: PS9505L2-E3: 1 000 pcs/reel : PS9505L3-E3: 1 000 pcs/reel * Pb-Free product 1. NC 2. Anode 3. Cathode 4. NC 5. VEE 6. VO 7. VO 8. VCC * Safety standards * UL approved: No. E72422 * CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950) * SEMKO approved: No. 1115598 * DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option) APPLICATIONS * IGBT, Power MOS FET Gate Driver * Industrial inverter * IH (Induction Heating) R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 1 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title PACKAGE DIMENSIONS (UNIT: mm) DIP Type PS9505 9.25 +0.5 -0.25 7.62 +0.4 1.01-0.2 +0.5 3.50.2 2.8 MIN. 4.150.3 6.5-0.1 0.50.15 0.25 M 0 to 15 2.54 0.840.15 Lead Bending Type (Gull-wing) For Surface Mount PS9505L3 +0.5 9.25-0.25 8 5 1 4 3.50.2 1.01 0.50.15 0.25 M R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 0.6350.15 9.650.4 +0.4 -0.2 +0.5 6.5-0.1 2.54 0.740.25 Page 2 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title Lead Bending Type For Long Creepage Distance PS9505L1 +0.5 9.25-0.25 10.16 +0.4 +0.5 6.5-0.1 3.50.2 2.8 MIN. 3.870.4 1.01-0.2 0.50.15 0.25 M 0 to 15 2.54 0.840.15 Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount) PS9505L2 +0.5 9.25-0.25 8 5 1 4 3.50.2 0.50.15 0.25 M R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 +0.5 6.5-0.1 0.250.2 1.01 11.80.4 +0.4 -0.2 2.54 0.90.25 Page 3 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title PHOTOCOUPLER CONSTRUCTION Parameter PS9505, PS9505L3 PS9505L1, PS9505L2 Air Distance (MIN.) 7 mm 8 mm Outer Creepage Distance (MIN.) 7 mm 8 mm 0.4 mm 0.4 mm Isolation Distance (MIN.) FUNCTIONAL DIAGRAM 8 (Tr. 1) 2 7 6 (Tr. 2) 3 5 SHIELD Input LED Tr. 1 Tr. 2 Output H ON ON OFF H L OFF OFF ON L MARKING EXAMPLE No. 1 pin Mark R 9505 NT131 Company Initial Type Number Assembly Lot N T 1 31 Week Assembled Year Assembled (Last 1 Digit) In-house Code Rank Code R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 4 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title ORDERING INFORMATION Part Number Order Number Packing Style Solder Plating Specification PS9505 PS9505-AX Pb-Free PS9505L1 PS9505L1-AX (Ni/Pd/Au) PS9505L2 PS9505L3 PS9505L2-E3 PS9505L2-E3-AX 50 Magazine Cases Safety Standard Approval Application Part *1 Number Standard PS9505 products PS9505L1 PS9505L2-AX (UL, CSA, SEMKO PS9505L2 PS9505L3-AX approved) Embossed Tape PS9505L3 PS9505L2 PS9505L3-E3 PS9505L3-E3-AX 1 000 pcs/reel PS9505-V PS9505-V-AX 50 Magazine Cases PS9505L3 PS9505L1-V PS9505L1-V-AX (VDE0884 Part2) PS9505L1 PS9505L2-V PS9505L2-V-AX approved PS9505L2 PS9505L3-V PS9505L3-V-AX (Option) PS9505L3 PS9505L2-V-E3 PS9505L2-V-E3-AX Embossed Tape PS9505L2 PS9505L3-V-E3 PS9505L3-V-E3-AX 1 000 pcs/reel PS9505L3 DIN EN60747-5-2 PS9505 *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Symbol Ratings Unit Forward Current IF 25 mA IF (TRAN) 1.0 A VR 5 V IOH (PEAK) 2.5 A IOL (PEAK) 2.5 A (VCC - VEE) 0 to 35 V VO 0 to VCC V PC 250 mW BV 5 000 Vr.m.s. PT 300 mW f 50 kHz Operating Ambient Temperature TA -40 to +110 C Storage Temperature Tstg -55 to +125 C Diode Peak Transient Forward Current (Pulse Width < 1 s) Reverse Voltage Detector High Level Peak Output Current *1 Low Level Peak Output Current *1 Supply Voltage Output Voltage Power Dissipation Isolation Voltage *2 *3 Total Power Dissipation Operating Frequency *4 *5 *1 Maximum pulse width = 10 s, Maximum duty cycle = 0.2% *2 Reduced to 4.8 mW/C at TA = 70C or more. *3 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output. Pins 1-4 shorted together, 5-8 shorted together. *4 Reduced to 5.4 mW/C at TA = 70C or more. *5 IOH (PEAK) 2.0 A ( 0.3 s), IOL (PEAK) 2.0 A ( 0.3 s) R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 5 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. (VCC - VEE) 15 Forward Current (ON) IF (ON) 7 Forward Voltage (OFF) VF (OFF) TA Supply Voltage Operating Ambient Temperature TYP. MAX. Unit 30 V 16 mA -2 0.8 V -40 110 C 10 ELECTRICAL CHARACTERISTICS (VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS) Parameter Diode Symbol Conditions Forward Voltage VF IF = 10 mA, TA = 25C Reverse Current IR VR = 3 V, TA = 25C Input Capacitance Detector High Level Output Current CIN IOH IOL 1.2 f = 1 MHz, VF = 0 V, TA = 25C VO = (VCC - 4 V) *2 VO = (VCC - 15 V) Low Level Output Current MIN. VO = (VEE + 2.5 V) VO = (VEE + 15 V) 0.5 *3 *2 *3 *4 TYP. *1 1.56 MAX. Unit 1.8 V 10 A 30 pF 2.0 A 2.0 A 2.0 0.5 2.0 High Level Output Voltage VOH IO = -100 mA Low Level Output Voltage VOL IO = 100 mA 0.1 0.5 V High Level Supply Current ICCH VO = open, IF = 10 mA 1.4 3.0 mA Low Level Supply Current ICCL VO = open, VF = 0 to +0.8 V 1.3 3.0 mA 10.8 12.3 13.4 V 9.5 11.0 12.5 0.4 1.3 UVLO Threshold VUVLO+ VO > 5 V, IF = 10 mA VUVLO- UVLO Hysteresis Coupled Threshold Input Current UVLOHYS VO > 5 V, IF = 10 mA IFLH IO = 0 mA, VO > 5 V VFHL IO = 0 mA, VO < 5 V VCC - 3.0 VCC - 1.5 2.0 V V 5.0 mA (L H) Threshold Input Voltage 0.8 V (H L) *1 Typical values at TA = 25C. *2 Maximum pulse width = 50 s, Maximum duty cycle = 0.5%. *3 Maximum pulse width = 10 s, Maximum duty cycle = 0.2% *4 VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle = 20%). R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 6 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title SWITCHING CHARACTERISTICS (VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS) Parameter Propagation Delay Time (L H) Propagation Delay Time (H L) Symbol tPLH tPHL Pulse Width Distortion (PWD) |tPHL-tPLH| Propagation Delay Time (Difference tPHL-tPLH Conditions MIN. Rg = 10 , Cg = 10 nF, f = 10 kHz, *2 Duty Cycle = 50% , IF = 10 mA TYP. *1 MAX. Unit 0.07 0.25 s 0.10 0.25 s 0.03 0.1 s 0.1 s -0.1 Between Any Two Products) Rise Time tr 50 ns Fall Time tf 50 ns UVLO (Turn On Delay) tUVLO ON VO > 5 V, IF = 10 mA 0.8 s UVLO (Turn Off Delay) tUVLO OFF VO < 5 V, IF = 10 mA 0.6 s Common Mode Transient Immunity at |CMH| Common Mode Transient Immunity at Low Level Output TA = 25C, IF = 10 to 16 mA, VCC = 30 V, 25 kV/s 25 kV/s VO (MIN.) = 26 V, VCM = 1.5 kV High Level Output |CML| TA = 25C, IF = 0 mA, VCC = 30 V, VO (MAX.) = 1 V, VCM = 1.5 kV *1 Typical values at TA = 25C. *2 This load condition is equivalent to the IGBT load at 1 200 V/75 A. R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 7 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title TEST CIRCUIT Fig. 1 IOH Test Circuit 1 8 2 7 0.1 F 3 6 IF = 7 to 16 mA 4 5 Fig. 2 IOL Test Circuit 4V IOH 1 8 2 7 0.1 F 3 6 4 5 VCC = 15 to 30 V VCC = 15 to 30 V SHIELD 1 8 2 7 0.1 F 3 6 4 5 Fig. 4 VOL Test Circuit VOH 100 mA VCC = 15 to 30 V 1 8 2 7 0.1 F 3 6 VOL 4 5 VCC = 15 to 30 V 100 mA SHIELD SHIELD Fig. 5 IFLH Test Circuit IF 2.5 V SHIELD Fig. 3 VOH Test Circuit IF = 7 to 16 mA IOL 1 8 2 7 3 6 4 5 SHIELD R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Fig. 6 UVLO Test Circuit 0.1 F VO > 5 V VCC = 15 to 30 V 1 8 IF = 10 mA 2 7 3 6 4 5 0.1 F VCC VO > 5 V SHIELD Page 8 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms IF = 10 mA 10 kHz 50% DUTY CYCLE 1 8 2 7 500 3 6 4 5 IF 0.1 F VO 10 10 nF tf 90% 50% 10% VOUT tPLH SHIELD tr VCC = 15 to 30 V tPHL Fig. 8 CMR Test Circuit and Wave Forms IF A B 1 8 2 7 3 6 4 5 SHIELD VCM = 1.5 kV R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 VCM VCM V = t t 0.1 F VO VCC = 30 V 0V VO (Switch A: IF = 10 to 16 mA) VO (Switch B: IF = 0 mA) t VOH 26 V 1V VOL Page 9 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 350 Total Power Dissipation PT (mW) Detector Power Dissipation PC (mW) 300 250 200 150 100 50 0 20 40 60 100 80 100 50 20 40 60 80 5.0 TA = +100C +85C +50C +25C 0C -40C 0.01 1.0 100 120 THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE Threshold Input Current IFLH (mA) Forward Current IF (mA) 150 FORWARD CURRENT vs. FORWARD VOLTAGE 0.1 1.2 1.4 1.6 1.8 2.0 2.2 VCC = 30 V, VEE = GND, VO > 5 V 4.0 3.0 2.0 1.0 0 -40 2.4 -20 0 20 40 60 80 100 Forward Voltage VF (V) Ambient Temperature TA (C) OUTPUT VOLTAGE vs. FORWARD CURRENT HIGH LEVEL OUTPUT VOLTAGE - SUPPLY VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT 0 High Level Output Voltage - Supply Voltage VOH - VCC (V) VCC = 30 V, VEE = GND 25 20 15 10 5 0 200 Ambient Temperature TA (C) 1.0 30 250 Ambient Temperature TA (C) 10 35 300 0 120 100 Output Voltage VO (V) Chapter Title 1 2 3 4 5 Forward Current IF (mA) VCC = 30 V, VEE = GND, IF = 10 mA -40C -2 -4 TA = +110C -6 -8 0 +25C 0.5 1.0 1.5 2.0 2.5 High Level Output Current IOH (A) Remark The graphs indicate nominal characteristics. R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 10 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title VCC = 30 V, VEE = GND, IF = 0 mA 2 -40C 0.5 1 1.5 2 2.5 VCC = 30 V, VEE = GND, Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 200 150 tPHL 100 tPLH 50 PWD 0 6 8 10 12 14 16 18 Forward Current IF (mA) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. SUPPLY VOLTAGE PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD CAPACITANCE 250 VEE = GND, IF = 10 mA, Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 200 150 tPHL 100 tPLH 50 PWD 0 15 20 25 30 250 VCC = 30 V, VEE = GND, IF = 10 mA, Rg = 10 , f = 10 kHz, Duty cycle = 50% 200 150 tPHL 100 tPLH 50 PWD 0 10 30 20 40 50 Supply Voltage VCC (V) Load Capacitance Cg (nF) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD RESISTANCE PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. AMBIENT TEMPERATURE 250 VCC = 30 V, VEE = GND, IF = 10 mA, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 200 150 tPHL 100 tPLH 50 PWD 0 0 250 Low Level Output Current IOL (A) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) +25C 4 0 Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) TA = +110C 6 10 20 30 40 50 Load Resistance Rg () Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) Low Level Output Voltage VOL (V) 8 PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. FORWARD CURRENT Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) LOW LEVEL OUTPUT VOLTAGE vs. LOW LEVEL OUTPUT CURRENT 250 VCC = 30 V, VEE = GND, IF = 10 mA, Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 200 150 tPHL 100 tPLH 50 PWD 0 -40 -20 0 20 40 60 80 100 Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 11 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title SUPPLY CURRENT vs. AMBIENT TEMPERATURE SUPPLY CURRENT vs. SUPPLY VOLTAGE 1.5 ICCH (IF = 10 mA) ICCL (IF = 0 mA) 1.0 0.5 -40 20 0 20 60 80 VEE = GND, VO = OPEN 1.5 ICCH (IF = 10 mA) ICCL (IF = 0 mA) 1.0 0.5 15 100 25 30 Supply Voltage VCC (V) HIGH LEVEL OUTPUT VOLTAGE - SUPPLY VOLTAGE vs. AMBIENT TEMPERATURE LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE VCC = 30 V, VEE = GND, IF = 10 mA, IO = -100 mA -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -40 -20 0 20 40 60 80 0.30 VCC = 30 V, VEE = GND, IF = 10 mA, IO = 100 mA 0.25 0.20 0.15 0.10 0.05 0.00 -40 -20 100 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature TA (C) 3.0 Low Level Output Current IOL (A) VCC = 30 V, VEE = GND, IF = 10 mA, VCC-VO = 4 V 2.5 20 40 60 80 100 LOW LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 3.0 0 Ambient Temperature TA (C) Ambient Temperature TA (C) High Level Output Current IOH (A) 20 Ambient Temperature TA (C) 0.0 High Level Output Voltage - Supply Voltage VOH - VCC (V) 40 High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) 2.0 VCC = 30 V, VEE = GND, VO = OPEN Low Level Output Voltage VOL (V) High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) 2.0 VCC = 30 V, VEE = GND, IF = 10 mA, VO = 2.5 V 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 12 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title OUTPUT VOLTAGE vs. SUPPLY VOLTAGE 14 Output Voltage VO (V) 12 10 8 UVLOHYS 6 4 2 0 0 VUVLO+ (12.3 V) VUVLO- (11.0 V) 5 10 15 20 Supply Voltage VCC - VEE (V) Remark The graph indicates nominal characteristics. R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 13 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title TAPING SPECIFICATIONS (UNIT: mm) 4.5 MAX. 12.80.1 11.50.1 1.5 +0.1 -0 24.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.10.1 10.70.1 2.050.05 12.00.1 0.30.05 Tape Direction PS9505L2-E3 Outline and Dimensions (Reel) R 1.0 1001.0 2.00.5 13.00.2 3302.0 2.00.5 21.00.8 25.51.0 29.51.0 Packing: 1 000 pcs/reel R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 23.9 to 27.4 Outer edge of flange Page 14 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 5.3 MAX. 10.40.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.750.1 10.30.1 1.550.1 12.00.1 0.350.05 Tape Direction PS9505L3-E3 Outline and Dimensions (Reel) 2.00.5 21.00.8 1001.0 R 1.0 3302.0 2.00.5 13.00.2 17.51.0 21.51.0 Packing: 1 000 pcs/reel R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 15.9 to 19.4 Outer edge of flange Page 15 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) C D B Chapter Title A Part Number Lead Bending PS9505L2 lead bending type (Gull-wing) for long creepage distance (surface mount) PS9505L3 lead bending type (Gull-wing) for surface mount R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 A B C D 10.2 2.54 1.7 2.2 9.0 2.54 1.7 2.0 Page 16 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature 260C or below (package surface temperature) * Time of peak reflow temperature 10 seconds or less * Time of temperature higher than 220C 60 seconds or less * Time to preheat temperature from 120 to 180C 12030 s * Number of reflows Three * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature 260C or below (molten solder temperature) * Time 10 seconds or less * Preheating conditions 120C or below (package surface temperature) * Number of times One (Allowed to be dipped in solder including plastic mold portion.) * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 17 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 0.1 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close to the input block pattern of the photocoupler. If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT output side might affect the photocoupler's LED input, leading to malfunction or degradation of characteristics. (If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the range of the recommended operating conditions, and be sure to thoroughly evaluate operation.) (3) Pins 1, 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open. Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. *1 NC: Non-Connection (No Connection) 3. Make sure the rise/fall time of the forward current is 0.5 s or less. 4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/s or less. 5. Avoid storage at a high temperature and high humidity. R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 18 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Symbol Climatic test class (IEC 60068-1/DIN EN 60068-1) Spec. Unit 40/110/21 Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.6 x UIORM, Pd < 5 pC Test voltage (partial discharge test, procedure b for all devices) UIORM Upr 1 130 1 808 Vpeak Vpeak Upr 2 119 Vpeak UTR 8 000 Vpeak Upr = 1.875 x UIORM, Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) 2 CTI Material group (DIN EN 60664-1 VDE0110 Part 1) 175 III a Storage temperature range Tstg -55 to +125 C Operating temperature range TA -40 to +110 C Ris MIN. Ris MIN. 10 11 10 Package temperature Tsi 175 C Current (input current IF, Psi = 0) Isi 400 mA Power (output or total power dissipation) Psi 700 mW Ris MIN. 10 Isolation resistance, minimum value VIO = 500 V dc at TA = 25C VIO = 500 V dc at TA MAX. at least 100C 12 Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Isolation resistance VIO = 500 V dc at TA = Tsi R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 9 Page 19 of 20 PS9505,PS9505L1,PS9505L2,PS9505L3 Caution GaAs Products Chapter Title This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 Page 20 of 20 Revision History PS9505,PS9505L1,PS9505L2,PS9505L3 Data Sheet Rev. Date Page Description Summary 0.01 1.00 May 12, 2010 Jan 06, 2012 - Throughout Throughout p.1 p.4 p.5 p.6 p.7 p.9 pp.10 to 13 p.16 p.18 p.19 First Edition issued Preliminary Data Sheet -> Data Sheet Safety standards approved Addition of Pb-Free product Modification of MARKING EXAMPLE Addition of ORDERING INFORMATION Modification of ELECTRICAL CHARACTERISTICS Modification of SWITCHING CHARACTERISTICS Modification of TEST CIRCUIT Addition of TYPICAL CHARACTERISTICS Modification of RECOMMENDED MOUNT PAD DIMENSIONS Modification of USAGE CAUTIONS 2. (2) Addition of SPECIFICATION OF VDE MARKS LICENSE DOCUMENT All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. 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Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. 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You may not use any Renesas Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. 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