DESCRIPTION
The
µ
PD7554A is a product of the
µ
PD7554, 7564 sub-series which is a 4-bit single-chip microcomputer with a
small number of ports in a small package, which is enabled to operate even at the super-low voltage of 2.0 V so
that it is optimized for handy-type systems operating with dry cells. The
µ
PD7554A is a low-order model in the
µ
PD7500 series (
µ
PD7554A only).
This device incorporates a serial interface, and serves as the sub-CPU for a high-order model of that series or
the 8-bit microcomputer. It is optimized for distributed processing of the system.
The
µ
PD7554A has outputs to directly drive a triac and LEDs and allows selection among many types of input/
output circuits using their respective mask options, sharply reducing the number of external circuits required.
Details of functions are described in the User’s Manual shown below. Be sure to read in design.
µ
PD7554, 7564 User’s Manual: IEM-1111D
4-BIT SINGLE-CHIP MICROCOMPUTER
µ
PD7554A, 7554A(A)
MOS INTEGRATED CIRCUIT
DATA SHEET
The mark shows major revised points.
The information in this document is subject to change without notice.
FEATURES
Range of supply voltage 7554A : 2.0 to 6.0 V
7554A(A) : 2.7 to 6.0 V
Drive with two 1.5 V manganese cells
47 types of instructions
(Subset of
µ
PD7500H SET B)
Instruction cycle
External clock : 2.86
µ
s (in operation at 700 kHz, 5 V)
RC oscillation : 4
µ
s (in operation at 500 kHz, 5 V)
Program memory (ROM) capacity: 1024 × 8 bits
Data memory (RAM) capacity: 64 × 4 bits
Test source: One external source and two internal
sources
Document No. IC-2419C
(O. D. No. IC-7835C)
Date Published January 1995 P
Printed in Japan
©
1994
1989
APPLICATION
µ
PD7554A : Sub-CPU including handy-type system, PPC, printer, VCR, audio equipments, etc.
µ
PD7554A(A) : Automotive and transportation equipments, etc.
The quality level and absolute maximum ratings of the
µ
PD7554A and the
µ
PD7554A(A) differ.
Except where specifically noted, explanations here concern the
µ
PD7554A as a representative product.
If you are using the
µ
PD7554A(A), use the information presented here after checking the functional differences.
8-bit timer/event counter
16 I/O lines (Total output current of all pins: 100 mA)
Can directly drive a triac and a LED: P80 to P83
Can directly drive LEDs: P100 to P103 and P110
to P113
Mask option function provided for every port
8-bit serial interface
Standby (STOP/HALT) function
Low supply voltage data retaining function for data
memory
Built-in ceramic oscillator for system clock RC
Oscillation with an external resistor R (Incorporat-
ing capacitor C)
2
µ
PD7554A, 7554A(A)
ORDERING INFORMATION
Ordering Code Package Quality Grade
µ
PD7554ACS-××× 20-pin plastic shrink DIP (300 mil) Standard
µ
PD7554AG-××× 20-pin plastic SOP (300 mil) Standard
µ
PD7554ACS(A)-××× 20-pin plastic shrink DIP (300 mil) Special
µ
PD7554AG(A)-××× 20-pin plastic SOP (300 mil) Special
Caution Be sure to specify a mask option when ordering this device.
Remarks "×××" is a ROM code number.
Please rfer to “Quality grade on NEC Semiconductor Devices” (Document number IEI-1209) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
PIN CONFIGURATION (TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
SS
P113
P112
P111
P110
P103
P102
P101
P100
RESET
P00/INT0
P01/SCK
P02/SO
P03/SI
P80
P81
P82
CL2(P83)
CL1
V
DD
PD7554A
µ
3
µ
PD7554A, 7554A(A)
BLOCK DIAGRAM OF
µ
PD7554A
RESETV
DD
V
SS
INSTRUCTION
DECODER
STANDBY
CONTROL
SYSTEM
CLOCK
GENERATOR
PROGRAM MEMORY
1024 × 8 BITS
PROGRAM COUNTER (10)
P00/INT0
CL
CLOCK
CONTROL
TIMER/EVENT
COUNTER
TEST
CONTROL
SERIAL
INTERFACE
PORT0
BUFFER
PORT8
LATCH
BUFFER
PORT10
LATCH
BUFFER
PORT11
LATCH
BUFFER
4 P00–P03
3 P80–P82
P83 (CL2)
4 P100–P103
4 P110–P113
A (4)C
H (2) L (2)
STACK POINTER (6)
DATA MEMORY
64 × 4 BITS
ALU
INT0
P01/SCK P03/SI
P02/SO
φ
CL
CL1 CL2(P83)
CP
GENERAL REGISTERS
4
µ
PD7554A, 7554A(A)
CONTENTS
1. PIN FUNCTIONS ........................................................................................................................................... 6
1.1 PORT FUNCTIONS ................................................................................................................................................. 6
1.2 OTHER THAN PORTS ............................................................................................................................................ 6
1.3 PIN MASK OPTION ................................................................................................................................................ 7
1.4 CAUTION ON USE OF P00/INT0 PIN AND RESET PIN ..................................................................................... 8
1.5 PIN INPUT/OUTPUT CIRCUITS ............................................................................................................................ 9
1.6 RECOMMENDED CONNECTION OF UNUSED
µ
PD7554A PINS .................................................................... 12
1.7 OPERATION OF INPUT/OUTPUT PORTS.......................................................................................................... 13
2. INTERNAL BLOCK FUNCTIONS ............................................................................................................... 15
2.1 PROGRAM COUNTER (PC): 10 BITS .................................................................................................................. 15
2.2 STACK POINTER (SP): 6 BITS ............................................................................................................................ 16
2.3 PROGRAM MEMORY (ROM): 1024 WORDS × 8 BITS ..................................................................................... 17
2.4 GENERAL REGISTER ........................................................................................................................................... 17
2.5 DATA MEMORY (RAM): 64 × 4 BITS ................................................................................................................. 18
2.6 ACCUMULATOR (A): 4 BITS ............................................................................................................................... 19
2.7 ARITHMETIC LOGIC UNIT (ALU): 4 BITS .......................................................................................................... 19
2.8 PROGRAM STATUS WORD (PSW): 4 BITS ...................................................................................................... 19
2.9 SYSTEM CLOCK GENERATOR ........................................................................................................................... 20
2.10 CLOCK CONTROL CIRCUIT ................................................................................................................................. 21
2.11 TIMER/EVENT COUNTER ................................................................................................................................... 22
2.12 SERIAL INTERFACE ............................................................................................................................................. 23
2.13 TEST CONTROL CIRCUIT .................................................................................................................................... 25
3. STANDBY FUNCTIONS .............................................................................................................................. 27
3.1 STOP MODE .......................................................................................................................................................... 27
3.2 HALT MODE .......................................................................................................................................................... 27
3.3 CANCELLING THE STANDBY MODE ................................................................................................................. 28
4. RESET FUNCTIONS .................................................................................................................................... 29
4.1 DETAILS OF INITIALIZATION ............................................................................................................................. 29
5.
µ
PD7554A INSTRUCTION SET ............................................................................................................... 30
6. ELECTRICAL SPECIFICATIONS .............................................................................................................. 35
7. CHARACTERISTICS CURVES .................................................................................................................. 47
8.
µ
PD7554A APPLIED CIRCUITS ............................................................................................................... 51
9. PACKAGE INFORMATION ....................................................................................................................... 52
10. RECOMMENDED PACKAGING PATTERN OF PLASTIC SOP (REFERENCE) ..................................... 56
11. RECOMMENDED SOLDERING CONDITIONS ....................................................................................... 57
5
µ
PD7554A, 7554A(A)
APPENDIX A. COMPARISON BETWEEN SUB-SERIES PRODUCT FUNCTIONS..................................... 58
APPENDIX B. DEVELOPMENT TOOLS ........................................................................................................ 59
APPENDIX C. RELATED DOCUMENTS........................................................................................................ 61
6
µ
PD7554A, 7554A(A)
1. PIN FUNCTIONS
1.1 PORT FUNCTIONS
Pin Name Input/Output Dual-Function Function After RESET Input/Output
Pin Circuit
P00 Input INT0 S
P01 Input/output SCK Input X
P02 SO W
P03 Input SI S
P80 to P82 Output –– O
P83 Note Output CL2
P100 to P103 Input/output ––
P
P110 to P113 Input/output ––
Note Mask options are available to specify port functions only when the external clock (CL1) is used.
1.2 OTHER THAN PORTS
Pin Name Input/Output Dual-Function Function After RESET Input/Output
Pin Circuit
INT0 Input P00 Edge detection testable input pin (Rising edge) S
SCK Input/output P01 Serial clock Input/output pin Input X
SO Output P02 Serial data output pin Input W
SI Input P03 Serial data input pin Input S
CL1 Q
CL2 P83
RESET R
VDD Positive power supply pin
VSS GND potential pin
4-bit input port (Port 0)
P00 serves also as a count clock (event pulse)
input.
4-bit output port (Port 8)
High current (15 mA), middle-high voltage (9 V)
output
4-bit I/O port (Port 10)
Middle-high current (10 mA), middle-high voltage
(9 V) input/output
4-bit I/O port (Port 11)
Middle-high current (10 mA), middle-high voltage
(9 V) input/output
High
impedance
High
impedance
or
high-level
output
Connection pin for resistor R for RC oscillator
When an external clock is used, its input must be
connected to CL1, and CL2 can be used as P83
using the mask option.
System reset input pin (high-level active)
A pull-down resistor can be incorporated using
the mask option.
7
µ
PD7554A, 7554A(A)
1.3 PIN MASK OPTION
Each pin is provided with the following mask options which can be selected for each bit according to the purpose:
Pin Name Mask Options
P00 No internally provided resistor Pull-down resistor internally provided
Pull-up resistor internally provided
P01 No internally provided resistor Pull-down resistor internally provided
Pull-up resistor internally provided
P02 No internally provided resistor Pull-down resistor internally provided
Pull-up resistor internally provided
P03 No internally provided resistor Pull-down resistor internally provided
Pull-up resistor internally provided
P80 N-channel open-drain output CMOS (push-pull) output
P81 N-channel open-drain output CMOS (push-pull) output
P82 N-channel open-drain output CMOS (push-pull) output
P83/CL2 Used as CL2 or P83N-ch open-drain output pin. Used as P83 pin (push-pull output).
P100 N-channel open-drain I/O Push-pull I/O
N-channel open-drain + I/O with pull-up resistor internally provided
P101 N-channel open-drain I/O Push-pull I/O
N-channel open-drain + I/O with pull-up resistor internally provided
P102 N-channel open-drain I/O Push-pull I/O
N-channel open-drain + I/O with pull-up resistor internally provided
P103 N-channel open-drain I/O Push-pull I/O
N-channel open-drain + I/O with pull-up resistor internally provided
P110 N-channel open-drain I/O Push-pull I/O
N-channel open-drain + I/O with pull-up resistor internally provided
P111 N-channel open-drain I/O Push-pull I/O
N-channel open-drain + I/O with pull-up resistor internally provided
P112 N-channel open-drain I/O Push-pull I/O
N-channel open-drain + I/O with pull-up resistor internally provided
P113 N-channel open-drain I/O Push-pull I/O
N-channel open-drain + I/O with pull-up resistor internally provided
System clockNote RC oscillation External clock
RESET Pull-down resistor is not internally provided Pull-down resistor is internally provided
Note When using RC oscillation, switch the P83/CL2 pin to the CL2 pin.
There is no mask option for PROM products. For more information, see the
µ
PD75P54 Data Sheet (IC-2830).
8
µ
PD7554A, 7554A(A)
1.4 CAUTION ON USE OF P00/INT0 PIN AND RESET PIN
In addition to the functions shown in 1.1, 1.2 and 1.3, the P00/INT0 pin and RESET pin have a function for setting
the test mode in which the internal operation of the
µ
PD7554A is tested (IC test only).
When a potential greater than VSS is applied to either of these pins, the test mode is set. As a result, if noise
exceeding VSS is applied during normal operation, the test mode will be entered and normal operation may be
impeded.
If, for example, the routing of the wiring between the P00/INT0 pin and RESET pin is long, the above problem
may occur as the result of inter-wiring noise between these pins.
Therefore, wiring should be carried out so as to suppress inter-wiring noise as far as possible. If it is not possible
to suppress noise, anti-noise measures should be taken using external parts as shown in the figures below.
Connection of diode with small VF between P00/
INT4/RESET pin and VSS
Connection of capacitor between P00/INT0/
RESET pin and VSS
V
DD
V
DD
P00/INT0, RESET
V
SS
V
DD
V
DD
P00/INT0, RESET
V
SS
Diode
with
Small V
F
9
µ
PD7554A, 7554A(A)
1.5 PIN INPUT/OUTPUT CIRCUITS
This section presents the input/output circuit for each pin of the
µ
PD7554A in a partly simplified format:
(1) Type A (for Type W)
VDD
P–ch
N–ch
IN
Forming an input buffer conformable to the CMOS specification
(2) Type D (for Types W and X)
V
DD
P–ch
N–ch
OUT
data
output
disable
Forming a push-pull output which becomes high impedance (with both P-ch and N-ch off) in response to
RESET input
10
µ
PD7554A, 7554A(A)
(3) Type O
VDD
P–ch
N–ch
OUT
data
output
disable
Mask Option
(Middle-High Voltage,
High-Current)
(4) Type P
V
DD
P–ch
N–ch
OUT
data
output
disable
Mask Option
(Middle-High Voltage,
High-Current)
Middle-Hi
g
h In
p
ut Buffer
(5) Type Q
CL1
CL2/P83
Type 0
RC
Oscillator
Mask Option
11
µ
PD7554A, 7554A(A)
(6) Type R
Mask Option
(7) Type S
IN
Mask Option
VDD
(8) Type W
IN/OUT
V
DD
Type D
Type A
data
output
disable
Mask Option
12
µ
PD7554A, 7554A(A)
(9) Type X
IN/OUT
V
DD
Type D
data
output
disable
Mask Option
1.6 RECOMMENDED CONNECTION OF UNUSED
µ
PD7554A PINS
Pin Recommended Connection
P00/INT0 Connect to VSS.
P01 to P03 Connect to VSS or VDD.
P80 to P82 Leave open.
P100 to P103
P110 to P113
Input state : Connect to VSS or VDD.
Output state: Leave open.
13
µ
PD7554A, 7554A(A)
1.7 OPERATION OF INPUT/OUTPUT PORTS
(1) P00 to P03 (Port 0)
The port 0 is a 4-bit input port consisting of 4-bit input pins P00 to P03. In addition to being used for port input,
P00 serves as a count clock input or testable input (INT0), each of P01 to P03 serves as a serial interface input/output.
To use P00 as a count clock input, set bits 2 (CM2) and 1 (CM1) of the clock mode register to 01. (See 2.10 “CLOCK
CONTROL CIRCUIT” for details.)
To use P00 as a INT0, set bit 3 (SM3) of the shift mode register to 1.
The serial interface function to use P01 to P03 as a serial interface I/O port is determined by bits 2 and 1 (SM2
and SM1) of the shift mode register. See 2.12 “SERIAL INTERFACE” for details.
Even though this port operates using any function other than the port function, execution of the port input
instruction (IPL) permits loading data on the P00 to P03 line to the accumulator (A0 to A3) at any time.
(2) P80 to P83 (Port 8)
The port 8 is a 4-bit output port with an output latch, which consists of 4-bit output pin.
The port output instruction (OPL) latches the content of the accumulator (A0 to A3) to the output latch and outputs
it to pins P80 to P83.
The SPBL and RPBL instructionsNote allow bit-by-bit setting and resetting of pins P80 to P83.
Note that P83 is to be selected using a mask option, to serve as one of the connection pins of the resistor R for
RC oscillation (CL2) or as the bit 3 output of the port 8. Thus, the port 8 is a 3-bit output port (P80 to p82) if RC
oscillation is performed, and provides a 4-bit output (P80 to P83) only when an external clock is used.
For these ports, mask options for the output format are available to select CMOS (push-pull) output or N-ch open-
drain output.
The port specified as a N-ch open-drain output and provides an efficient interface to the circuit operating at a
different supply voltage because the output buffer has a dielectric strength of 9 V.
Contents of the output latch become undefined when the RESET signal is input, then the output becomes high
impedance.
Note RPBL and SPBL are bit-by-bit setting and resetting instructions. During setting and resetting operations, the
RPBL and SPBL instructionrs allow outputting with each (4-bit) port which contains the specified bits. (The
content of the output latch is output to any pin other than the specified pins.) The content of the output latch
must be initialized with the OPL instruction before executing the RPBL and SPBL instructions.
14
µ
PD7554A, 7554A(A)
(3) P100 to P103 (Port 10) and P110-P113 (Port 11): Quasi-bidirectional input/output
P100 to P103 are 4-bit I/O pins which form the port 10 (4-bit I/O port with an output latch). P110 to P113 are 4-
bit I/O pins which form the port 11 (4-bit I/O port with an output latch).
The port output instruction (OPL) latches the content of the accumulator to the output latch and outputs it to the
4-bit pins.
The data written once in the output latch and the output buffer state are retained until the output instruction to
operate the port 10 or 11 is executed or the RESET signal is input. Even though an input instruction is executed for
the port 10 or 11, the states of both the output latch and output buffer do not change.
The SPBL and RPBL instructions allow bit-by-bit setting and resetting of pins P100 to P103 and P110 to P113.
The input/output format of each of the ports 10 and 11 can be selected from among the N-ch open-drain input/
output, N-ch open-drain + pull-up resistor built-in input/output, and CMOS (push-pull) input/output by their
respective mask options.
The ports 10 and 11 offers the middle withstand voltage of 9 V for the N-ch open-drain input/output, so that they
are convenient for interface between circuits which has different supply voltages.
When the CMOS (push-pull) input/output is selected, the port cannot return to the input mode once the output
instruction is executed. However, the states of the pins of the port can be checked by reading via the port input
instruction (IPL).
When one of the other two formats is selected, the port can enter the input mode to load the data on the 4-bit
line to the accumulator (as a quasi-bidirectional port) when the port receives high level output. Select each type
of the input/output format to meet the use of the port:
CMOS input/output
i) Uses all 4 bits of the port as input ports.
ii) Uses pins of the port as output pins not requiring middle withstand voltage output.
N-ch open-drain input/output
i) Uses pins of the port as I/O pins requiring a middle withstand voltage dielectric strength.
ii) Uses input pins of the port which also has output pins.
iii) Uses each pin of the port for both input and output by switching them over.
N-ch open-drain + pull-up resistor built-in input/output
i) Uses input pins of the port which also has output pins, that require a pull-up resistor.
ii) Uses each pin of the port for both input and output by switching them over. This requires a pull-up resistor.
Caution Before using input pins in the case of or , write 1 in the output latch to turn the N-ch transistor off.
The content of the output latch becomes undefined when the RESET signal is input. In such a case, the output
becomes high level with the N-ch open-drain + pull-up resistor built-in, and becomes high impedance without the
resistor.
15
µ
PD7554A, 7554A(A)
2. INTERNAL BLOCK FUNCTIONS
2.1 PROGRAM COUNTER (PC): 10 BITS
The program counter is a 10-bit binaryc ounter to retain program memory (ROM) address information.
Fig. 2-1 Program Counter Configuration
PC9 PC8 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 PC
When one instruction is executed, usually the program counter is incremented by the number of bytes of the
instruction.
When the call instruction is executed, the PC is loaded with a nkew call address after the stack memory saves
the current contents (return address) of the PC. When the return instruction is executed, the content (return address)
of the stack memory is loaded onto the PC. When the jump instruction is executed, the immediate data identifying
the destination of the jump is loaded to all or some of bits of the PC.
When a skip occurs, the PC is incremented by 2 or 3 during the machine cycle depending on the number of bytes
in the next instruction.
When the RESET signal is input, all the bits of the PC are cleared to zero.
16
µ
PD7554A, 7554A(A)
2.2 STACK POINTER (SP): 6 BITS
The stack pointer is a 6-bit register which retains head address information of the stack memory (LIFO type) which
is a part of the data memory.
Fig. 2-2 Stack Pointer Configuration
SP5 SP4 SP3 SP2 SP1 SP0 SP
The stack pointer is decremented when the call instruction is executed. It is incremented when the return
instruction is executed.
To determine the stack area, initialize the SP using the TAMSP instruction. Note that bit SP0 is loaded with 0
unconditionally when the TAMSP instruction is executed. Set the SP to the value of “the highest address of the stack
area + 1” because the stack operation starts with decrementation of the SP.
When the highest address of the stack area is 3FH which is the highest address of the data memory, the initial
value of SP5-0 must be 00H. For emulation using the
µ
PD7500H (EVAKIT-7500B), set the data to be used for AM
when executing the TAMSP instruction.
Fig. 2-3 In Execution of TAMSP Instruction
A3 A2 A1 A0 (HL)
3
(HL)
2
(HL)
1
(HL)
0
0
SP5 SP4 SP3 SP2 SP1 SP0
Note that the contents of the SP cannot be read.
Caution Be sure to set the SP at the initial stage of the program execution because the SP becomes undefined
when the RESET signal is input.
Example LHLI 00H
LAI 0
ST
LAI 4
TAMSP ;SP = 40H
17
µ
PD7554A, 7554A(A)
2.3 PROGRAM MEMORY (ROM): 1024 WORDS × 8BITS
The program memory is a mask programmable ROM of 1024 word × 8 bits configuration. It is addressed by the
program counter.
The program memory stores programs.
Address 000H is the reset start address.
Fig. 2-4 Program Memory Map
(0) 000H
(1023) 3FFH
Reset Start
2.4 GENERAL REGISTER
General registers H (with two bits) and L (with four bits) operate individually. They also form a pair register HL
(H: high order and L: low order) to serve as a data pointer for addressing the data memory.
Fig. 2-5 General Register Configuration
10
HL
30
The L register is also used to specify I/O ports and the mode register when an input/output instruction (IPL or
OPL) is executed. It also used to specify the bits of a port when the SPBL or RPBL instruction is executed.
18
µ
PD7554A, 7554A(A)
2.5 DATA MEMORY (RAM): 64 × 4 BITS
The data memory is a static RAM of 64 word × 4 bits configuration. It is used as the area to store or stack processed
data. The data memory may be processed in 8-bit units when paired with the accumulator.
Fig. 2-6 Data Memory Map
( 0 ) 00H
(63) 3FH
64 Words × 4 Bits
The data memory is addressed in the following three ways:
Direct: Direct addressing based on immediate data of an instruction
Register indirect: Indirect addressing according to the contents of the pair register HL (including automatic
incrementation and decrementation)
Stack: Indirect addressing according to the contents of the stack pointer (SP)
An arbitrary space of the data memory is available as stack memory. The boundary of the stack area is specified
when the TAMSP instruction initializes the SP. After that, the stack area is accessed automatically by the call or return
instruction.
After the call instruction is executed, the content of the PC and PSW is stored in the order shown in the following
diagram:
0 0 PC9 PC8
30
PSWNote
PC3 – PC0
PC7 – PC4
SP – 4
SP – 3
SP – 2
SP – 1
Stack Area
Note Bit 1 is fixed at 0.
When the return instruction is executed, the content of the PSW is not restored while those of the PC are restored.
Data in the data memory is retained at a low supply voltage in the STOP mode.
19
µ
PD7554A, 7554A(A)
2.6 ACCUMULATOR (A): 4 BITS
The accumulator is a 4-bit register which plays a major role in many types of arithmetic operations. The
accumulator may be processed in 8-bit units when paired with the data memory addressed by the pair register HL.
Fig. 2-7 Accumulator Configuration
A3 A2 A1 A0 A
2.7 ARITHMETIC LOGIC UNIT (ALU): 4 BITS
The arithmetic logic unit is a 4-bit arithmetic circuit to perform arithmetic and bit processing such as binary
addition, logical operation, incrementation, decrementation, and comparison.
2.8 PROGRAM STATUS WORD (PSW): 4 BITS
The program status word consists of skip flags (SK1 and SK0) and a carry flag (C). Bit 1 of the PSW is fixed at 0.
Fig. 2-8 Program Status Word Configuration
SK1 SK0 0 C PSW
3210
(1) Skip flags (SK1 and SK0)
Skip flags store the following skip status:
Stacking by the LAI instruction
Stacking by the LHLI instruction
Skip condition establishment by any instruction other than stack instructions
The skip flags are set and reset automatically when respective instructions are executed.
(2) Carry flag (C)
The carry flag is set to 1 when a carry from bit 3 of the ALU occurs when the add instruction (ACSC) is executed.
The flag is reset to 0 when the carry does not occur. The SC and RC instructions respectively set and reset the carry
flag. The SKC instruction tests the contents of the flag.
The content of the PSW are automatically stored in the stack area when the call instruction is executed. It cannot
be restored by the return inhstruction.
When the RESET signal is input, SK1 and SK0 are both cleared to zero and C becomes undefined.
20
µ
PD7554A, 7554A(A)
2.9 SYSTEM CLOCK GENERATOR
The system clock generator contains an RC oscillator, 1/2 divider, and standby (STOP/HALT) mode control circuit.
Fig. 2-9 System Clock Generator
STANDBY RELEASE
RESET ( )
(To CPU)
CL (System Clock)
RESET (High)
HALT
Note
STOP
Note
HALT F/F
QS
R
QS
R
STOP F/F
CL2
CL1
C
R
1/2
φ
RC
Oscillator
Note Instruction execution
Oscillator
Stop
The RC oscillator oscillates with an external resistor R connected to pins CL1 and CL2. (A capacitor C is
incorporated.)
The RC oscillator serves merely as a reverse buffer if inputs an external clock through the CL1 input.
The RC oscillator outputs the system clock (CL) which is 1/2 divided to the CPU clock (
φ
).
The control circuit in the standby mode consists mainly of STOP F/F and HALT F/F.
The STOP F/F is set by the STOP instruction, blocking any clock from being supplied. The STOP F/F stops RC
oscillation during operation of the RC oscillator (STOP mode).
The STOP F/F is reset by the STANDBY RELEASE signal (which goes active when even one test request flag is
input) or at the fall of the RESET input, to cause the RC oscillator to start oscillation and supplying each clock.
The HALT F/F is set by the HALT instruction to disable the input to the 1/2 divider which generates the CPU clock
φ
, stopping only the CPU clock
φ
(HALT mode).
The HALT F/F is set and reset as in the case of the STOP F/F. Resetting the HALT F/F cause the RC oscillator to
start supplying the CPU clock
φ
.
21
µ
PD7554A, 7554A(A)
2.10 CLOCK CONTROL CIRCUIT
The clock control circuit consists of 2-bit clock mode registers (CM2 and CM1), prescalers 1, 2 and 3, and a
multiplexer. The circuit inputs the system clock generator output (CL) and the event pulse (P00). It also selects a
clock source and a prescaler according to the specifications of clock mode register and supplies a count pulse (CP)
to the timer/event counter.
Fig. 2-10 Clock Control Circuit
CP
CL
P00
PRESCALER 1
(1/4)
PRESCALER 2
(1/8)
PRESCALER 3
(1/8)
OPL
Note
CM2 CM1
Internal Bus
Note Instruction execution
Use the OPL instruction to set codes in the clock mode registers.
Fig. 2-11 Clock Mode Register Format
Clock Mode Register
Caution When setting codes in the clock mode registers using the OPL instruction, be sure to set bit 0 of the
accumulator to 0. (Bit 0 corresponds to CM0 of the
µ
PD7500 of EVAKIT-7500B in emulation.)
CM2 CM1
CM2 CM1 Count Pulse Frequency (CP)
0 0 CL ×1
256
0 1 P00
1 0 CL ×1
32
1 1 CL ×1
4
22
µ
PD7554A, 7554A(A)
2.11 TIMER/EVENT COUNTER
The timer/event counter is based on an 8-bit count register as shown in Fig. 2-12.
Fig. 2-12 Timer/Event Counter
8-BIT COUNT REG
TIMER
Note
RESET
CLR
CP
8
TCNTAM
Note
INTT
(To Test Control Circuit)
Note Instruction execution
Internal Bus
Count
Holding
Circuit
The 8-bit count register is a binary 8-bit up-counter which is incremented whenever a count pulse (CP) is input.
The register is cleared to 00H when the TIMER instruction is executed, RESET signal is input, or an overflow occurs
(FFH to 00H).
As the count pulse, the clock mode register can select one of the following four. See 2.10 “CLOCK CONTROL
CIRCUIT”.
11 1
CP : CL × ––, CL × –––, CL × ––––, P00
4 32 256
The count register continues to be incremented as long as count pulses are input. The TIMER instruction clears
the count register to 00H and triggers the timer operation.
The count register is incremented in synchronization with the CP (or the rise of the P00 input when an external
clock is used). On the count reaches 256, the register returns the count value to 00H from FFH, generates the overflow
signal INTT, and sets the INTT test flag INTT RQF.
In this way, the count register counts over from 00H.
To recognize the overflow, test the flag INTT RQF using the SKI instruction.
When the timer/event counter serves as a timer, the reference tiome is determined by the CP frequency. The
precision is determined by the RC oscillation or CL1 external input frequency when the system clock system is
selected and by the P00 input frequency when the P00 input is selected.
The content of the count register can be read at any time by the TCNTAM instruction. This function allows
checking the current time of the timer and counting event pulses input to the P00 input. This enables the number
of even pulses that have been generated so far (event counter function).
The count holding circuit ignores the change of the count pulse (CP) during execution of the TCNTAM instruction.
This is to prevent reading undefined data in the count register using the TCNTAM instruction while the counter is
being updated.
Since the timer/event counter operates the system clock system (CL) or the P00 input for count pulses, it is used
to cancel the HALT mode which stops the CPU clock
φ
as well as the STOP mode which stops the system clock CL.
(See 3 “STANDBY FUNCTIONS”.)
23
µ
PD7554A, 7554A(A)
2.12 SERIAL INTERFACE
The serial interface consists of an 8-bit shift register, 3-bit shift mode register, and 3-bit counter. It is used for
input/output of serial data.
Fig. 2-13 Serial Interface Block Diagram
INT0P00/INT0
P01/SCK
P02/SO
P03/SI
IPL
Note
TSIOAM
Note
TAMSIO
Note
LSB 8–BIT SHIFT REG MSB
3–BIT CNT
φ
RS F/F
R
SQ
INTS
SIO
Note
SM3
SHIFT MODE REG
OPL
Note
48
8
Internal Bus
Note Instruction execution
Remarks 1.
φ
indicates the internal clock signal (system clock).
2. SM3 and INT0 go to the test control circuit.
Input/output of serial data is controlled by the serial clock. The highest bit (bit 7) of the shift register is output
from the SO line at rise of the serial clock (SCK pin signal). At its fall, the contents of the shift register is shifted by
one bit (bit n -> bit n+1) and data on the SI line is loaded to the lowest bit (bit 0) of the shift register.
The 3-bit counter (octal counter) counts serial clock pulses. Wthenever it counts eight clock pulses (on completion
of 1-byte serial data transfer), the counter generates an internal test request signal INTS to set the test request flag
(INT0/S RQF).
Fig. 2-14 Shift Timing
INTS RQF
Setting Timing
SCK
SI
SO
DI
7
DO
7
MSB
DO
6
DO
5
DO
4
DO
3
DO
2
DO
1
DO
0
DI
6
DI
5
DI
4
DI
3
DI
2
DI
1
DI
0
LSB
Remarks 1. DI: Serial data input
2. DO: Serial data output
24
µ
PD7554A, 7554A(A)
The serial interface sets serial data for transmission in the shift register using the TAMSIO instruction and starts
the transfer using the SIO instruction. To recognize the termination of one-byte transfer, check the test request flag
INT0/S RQF using the corresponding instruction.
The serial interface starts serial data reception, using the SIO instruction, checks the termination of one-byte
transfer using the instruction, and then receives data from the shift register by executing the TSIOAM instruction.
Two types of serial clock sources are available: one is the system clock
φ
and the other is the external clock (SCK
input). They are selected respectively by bits 2 and 1 (SM2 and SM1) of the shift mode register.
When the system clock
φ
is selected and the SIO instruction is executed, the clock pulse is supplied to the serial
interface as a serial clock to control serial data input/output and is output from the SCK pin.
When the system clock
φ
pulse is supplied eight times, the supply to the serial interface is automatically stopped
and the SCK output remains high. Since serial data input/output stops automatically after transfer of one byte. The
programmer does not need to control the serial clock. In this case, the transfer speed is determined by the system
clock frequency.
In this mode, it is possible to read receive data (by the TSIOAM instruction) and write data (by the TAMSIO
instruction) from and to the shift register only by waiting for 6 machine cycles after execution of the SIO instrucction
on the program without waiting until the INT0/S RQF is set.
Fig. 2-15 TAMSIO/TSIOAM Instruction Execution Timing
SCK
SIO TAMSIO
TSIOAM
Wait (6 Machine Cycle)Instruction Execution
Machine Cycle
When the external clock (SCK input) is selected, the interface inputs serial clock pulses from the SCK input. When
an external serial clock pulse is input eight times, the INT0/S RQF is set and the termination of one-byte transfer
can be recognized. However, the eight serial clocks to be input must be counted on the side of the external clock
source because serial clock disable control is not performed internally. The transfer speed is determined by the
external serial clock within the range from DC to the maximum value limited by the standard.
When the external clock is used, the SIO, TAMSIO, or TSIOAM instruction the execution must be executed while
the serial clock pulse SCK is high. If such an instruction is executed while the SCK is rising or falling or is low, the
function of the instruction is not guaranteed.
25
µ
PD7554A, 7554A(A)
Fig. 2-16 Shift Mode Register Format
Shift Mode Register
Settings for serial interface operation and the associated mode of the port 0
INT0/INTS selection
SM3 Test Sources
0 INTS
1 INT0
Caution When setting a code in the shift mode register using the OPL instruction, be sure to set bit 0 of the
accumulator to 0 (Bit 0 corresponds to CM0 of the
µ
PD7500H of EVAKIT-7500B in emulation).
In the system which does not require serial interface, the 8-bit shift register can be used as a simple register and
data can be read or writtene by the TSIOAM or TAMSIO instruction when serial operation is off.
2.13 TEST CONTROL CIRCUIT
The
µ
PD7554A is provided with the following three types of test sources (one external source and two internal
sources):
The test control circuit checks consist mainly of test request flags (INTT RQF and INT0/S RQF) which are set by
three different test sources and the test request flag control circuit which checks the content of test request flags
using the SKI instruction and controls resetting the checked flags.
The INT0 and INTS are common in the request flag. Which one is selected is determined by bit 3 (SM3) of the
shift mode register.
SM3 SM2 SM1
SM2 SM1 P03/SI P02/SO P01/SCK Serial Operation
00
Port input Port input Port input Stop
01
φ
continuous output
10
SI input SO output SCK input Operation based on external clock
1 1 SCK output (
φ
× 8) Operation based on
φ
Test Sources Internal/External Request Flag
INTT (Overflow from timer/event counter) Internal INTT RQF
INT0 (Test request signal from P00 pin) External INT 0/S RQF
INTS (Transfer end signal from serial interface) Internal
SM3 Test Sources
0 INTS
1 INT0
26
µ
PD7554A, 7554A(A)
The INTT RQF is set when a timer overflow occurs and is reset by the SKI or TIMER instruction.
The INT0/S request flag functions in the following two ways according to the setting of the SM3:
(1) SM3 = 0
The INTS is validated. The request flag INT0/S RQF is set when the INTS signal to indicate the termination of 8-
bit serial data transfer is issued. The flag is reset when the SKI or SIO instruction is executed.
(2) SM3 = 1
The IN0 is validated. The request flag INT0/S RQF is set when the leading edge signal enters the INT0/P00 pin.
The flag is reset when the SKI instruction is executed.
The OR output of each test request flag is used to cancel the standby mode (STOP/HALT mode). If one or more
request flags are set in the standby mode, the standby mode is cancelled.
The RESET signal cancels every request flag and the SM3. In the reset initial status, the INTS is selected and the
INT0 input is disabled.
Fig. 2-17 Test Control Circuit Block Diagram
INTS
TEST RQF
CONTROL
SKI
Note
TIMER
Note
S
R
INTT
RQF
Q
S
R
INT0/S
RQF
Q
NONSYNC
EDGE GATE
NONSYNC
EDGE GATE
SM3
OPL
Note
SIO
Note
INT0
INTT
STANDBY
RELEASE
Internal Bus
Note Instruction execution
Remark SM3 is bit 3 of the shift mode register.
27
µ
PD7554A, 7554A(A)
3. STANDBY FUNCTIONS
The
µ
PD7554A provides two types of standby modes (STOP and HALT modes) to save power while the program
is on standby. The STOP and HALT modes are set by the STOP and HALT instructions, respectively. The standby
mode halts program execution, however, it holds the contents of all the internal registers and data memory that
have been stored.
The timer can operate even in the standby mode.
The standby mode is canceled when the test request flag (INTT RQF or INT0/S RQF) is set or by RESET input.
Note that if even one test request flag is set, the device cannot enter either the STOP or HALT mode even though
the STOP or HALT instruction is executed. Before setting the standby mode at a point where a test request flag may
be set, execute the SKI instruction to reset the test request flag.
Table 3-1 relates the STOP mode to the HALT mode. An essential difference between them is found when RC
oscillation supplies the system clock: by stopping the oscillation, the CL output stops in the STOP mode and does
not stop in the HALT mode. Thus the amount of the power consumption of the RC oscillator equals to the difference
in the amounts of the basic power consumption between the STOP mode and HALT mode.
Note that the STOP mode enables the low supply voltage data to be retained in the data memory.
Table 3-1 The Relation Between STOP and HALT Modes
3.1 STOP MODE
The STOP mode stops the RC oscillation and 1/2 divider in the system clock generator. Therefore, the operations
of requiring the system clock stubsystem (CL and
φ
) such as the CPU are stopped. Since the STOP mode allows
operation of the clock control circuit, the timer can operate if the P00 input is selected as the count pulse (CP).
Note that the STOP mode stops only the
φ
signal, allowing the CL output when system clock generation is not
drived by the RC oscillation, but drived by the external CL1 input. In such a case, the STOP mode causes the same
state as in the case of the HALT mode described below. Therefore, the STOP instruction is effective for setting the
STOP mode only during RC oscillation.
3.2 HALT MODE
The HALT mode stops only the 1/2 divider in the system clock generator (allowing operation of the system clock
CL and stopping the CPU clock
φ
). Therefore, the operations of the CPU requiring the
φ
signal is stopped in the HALT
mode. Since the HALT mode allows operation of the clock control circuit, the circuit inputs the CL signal from the
clock generator and the external count clock (P00) to supply the count pulses (CP) for both subsystems selectively
to the timer. Thus, the timer can operate depending on the both-system count pulses and continue counting time.
Setting RC Oscillation
φ
P00 CPU Timer Cancellation Factor
Instruction (CL)
STOP mode STOP ×INTT RQF
××INT0/S RQF
HALT mode HALT RESET input
: Operation enabled
: Operation enabled depending on mode selection
×: Stop
28
µ
PD7554A, 7554A(A)
3.3 CANCELLING THE STANDBY MODE
(1) Cancelling the STANDBY mode by test request flag
As well as the STOP mode and HALT mode, the STANDBY mode is canceled when the test request flag (INTT
RQF or INT0/S RQF) is set in the mode. The program starts executing the instruction that follows the HALT instruction
that follows the STOP or HALT instruction.
Cancellation of the HALT mode does not affect the content of any register or the data memory, that is retained
in the mode.
(2) Cancelling the STANDBY mode by RESET input
RESET input unconditionally cancels the STANDBY mode as well as nthe STOP mode and HALT mode.
Fig. 3-1 shows the STANDBY mode cancel timing.
Fig. 3-1 STANDBY Mode Cancel Timing by RESET Input
RESET
STOP/HALT
STOP/HALT Mode
Operating
Mode
Instruction
Cancellation
Normal Reset Operation
(Starting from address 0)
The STANDBY mode is maintained while the RESET input is being active (high). When the RESET input goes low,
the STANDBY mode is cancelled and the CPU starts to execute the program from address 0 after a normal reset
operation.
Note that RESET input does not affect the content of the data memory that is retained in the STANDBY mode,
however, the contents of the other registers become undefined on cancellation of the mode.
29
µ
PD7554A, 7554A(A)
4. RESET FUNCTIONS
The
µ
PD7554A is reset and initialized when the RESET pin inputs a high or active RESET signal as follows:
4.1 DETAILS OF INITIALIZATION
(1) The program counter (PC9-PC0) is cleared to zero.
(2) The skip flags (SK1 and SK0) in the program status word are reset to zero.
(3) The count register in the timer-event counter is cleared to 00H.
(4) The clock control circuit becomes as follows:
• Clock mode registers (CM2 and CM1) = 0
1
CP = CL × –––––
256
• Prescalers 1, 2, and 3 = 0
(5) The shift mode register (SM3 to SM1) is cleared to zero.
Shifting of the serial interface is stopped.
The port 0 enters the input mode (high impedance). Note1
INT0/S, INTS is selected.
(6) The test request flag (INTT RQF or INT0/S RQF) is reset to zero.
(7) The contents of the data memory and the following registers become undefined:
Stack pointer (SP)
Accumulator (A)
Carry flag (C)
General registers (H and L)
Output latch of each port
(8) The output buffer of every port goes off and has high impedance Note2. The I/O port enters the input mode.
Note 1. When the pull-up and pull-down resistors are selected using a mask option, the former has high level and
the latter has low level.
2. When the pull-up and pull-down resistors are selected in the port 0 using a mask option, the former has
high level and the latter has low level.
When the pull-up resistor is selected in the ports 10 and 11 using a mask option, the resistor has high level.
Caution When the STANDBY mode is cancelled by the RESET signal, the content of the data memory is retained
without becoming undefined.
When the RESET input is cancelled, the program is executed starting with address 000H. The content of each
register shall either be initialized in the process of the program or reinitialized depending on conditions.
30
µ
PD7554A, 7554A(A)
5.
µ
PD7554A INSTRUCTION SET
(1) Operand representation and description
addr 10-bit immediate data or label
caddr 10-bit immediate data or label
caddr1 100H to 107H, 140H to 147H, 180H to 187H,
IC0H to IC7H immediate data or label
mem 6-bit immediate data or label
n5 5-bit immediate data or label
n4 4-bit immediate data or label
n2 2-bit immediate data or label
bit 2-bit immediate data or label
pr HL-, HL+, HL
(2) Mnemonics for operation descriptions
A : Accumulator
H : H register
L : L register
HL : Pair register HL
pr : Pair register HL-, HL+, or HL
SP : Stack pointer
PC : Program counter
C : Carry flag
PSW : Program status word
SIO : Shift register
CT : Count register
In : Immediate data to n5, n4 or n2
Pn : Immediate data to addr, caddr, or caddr1
Bn : Immediate data to bit
Dn : Immediate data to mem
Rn : Immediate data to pr
(××) : Content addressed by ××
×H : Hexadecimal data
31
µ
PD7554A, 7554A(A)
(3) Port/mode register selection
IPL Instruction
L Port
0 Port 0
AH Port 10
BH Port 11
OPL Instruction
L Port/mode register
8 Port 8
AH Port 10
BH Port 11
CH Clock mode register
FH Shift mode register
RPBL/SPBL Instruction
LFHEHDHCHBHAH983210
Bit321032103210
Port Port 11 Port 10 Port 8
(4) Selection of pair register addressing
pr R1R0
HL– 0 0
HL+ 0 1
HL 1 0
32
µ
PD7554A, 7554A(A)
Accumulator &
Carry Flag
Manipulation
Instructions
Load/Store Instructions
Operation Instructions
Mne- Ope- Operation Code Operation Skip
monic rands B1 B2 Condition
LAI n4 0001I
3I2I1I0An4 Loads n4 to the accumulator. Stack LAI
LHI n2 001010I
1I0Hn2 Loads n2 to H register.
LAM pr 010100R
1R0A(pr) pr = HL –, HL +, HL Loads the contents of the memory L = FH(HL –)
address by pr to the accumulator. L = 0 (HL +)
LHLI n5 1 1 0 I4I3I2I1I0H0I4, LI30Loads n5 to the pair register HL. Stack LHLI
ST 01010111 (HL)AStores the contents of the accumulator
in the memory addressed by HL.
STII n4 0100I
3I2I1I0(HL)n4, LL+1 Stores n4 in the memory addressed by
HL and increments the L register.
XAL 01111011 ALExchanges the contents of the accumu-
lator and the L register.
XAM pr 010101R
1R0A(pr) pr = HL – , HL + , HL Exchanges the contents of the accumu- L = FH(HL–)
lator and the memory addressed by pr. L = 0 (HL+)
AISC n4 0000I
3I2I1I0AA + n4 Adds the accumulator to n4. Carry
ASC 01111101 AA + (HL) Adds the contents of the accumulator Carry
and the memory addressed by HL.
Adds the contents of the accumulator,
ACSC 01111100 A, CA + (HL) + C the memory addressed by HL, and of Carry
the carry flag.
Calculate the exclusive OR of the
EXL 01111110 AA (HL) contents of the accumulator and the
memory addressed by HL.
CMA 01111111 AA
–– Complements the accumulator.
RC 01111000 C0 Resets the carry flag.
SC 01111001 C1 Sets the carry flag.
ILS 01011001 LL + 1 Increments the L register. L = 0
IDRS mem 0011110100D
5D4D3D2D1D
0(mem)(mem) + 1 Increments the contents of the memory (mem) = 0
addressed by mem.
DLS 01011000 LL – 1 Decrements the L register. L = FH
DDRS mem 0011110000D
5D4D3D2D1D
0(mem)(mem) – 1 Decrements the contents of the memory (mem) = FH
addressed by mem.
RMB bit 011010B
1B0(HL)bit0Resets the bits specified by B1–0, of the
memory addressed by HL.
SMB bit 011011B
1B0(HL)bit1Sets the bits specified by B1–0, of the
memory addressed by HL.
Increment/Decre-
ment Instructions
Memory Bit
Manipulation
Instructions
Note Instruction Group
Note
33
µ
PD7554A, 7554A(A)
Mne- Ope- Operation Code Operation Skip
monic rands B1 B2 Condition
JMP addr 001000P
9P8P7P6P5P4P3P2P
1P0PC9–0P9–0 Jumps to the address specified by P9–0.
JCP addr 1 0 P5P4P3P2P1P0PC5–0P5–0
Jumps to the address specified by
replacing PC5–0 with P5–0.
(SP–1)(SP–2)(SP–4)PC9–0 Saves the contents of PC and PSW to the
CALL caddr 001100P
9P8P7P6P5P4P3P2P
1P0(SP–3)PSW, SPSP – 4 stacxk memory, decrements SP by 4, and
PC9–0P9–0 calls the address specified by caddr.
(SP–1)(SP–2)(SP–4)PC9–0 Saves the contents of PC and PSW to the
CAL caddr1 1 1 1 P4P3P2P1P0(SP–3)PSW, SPSP – 4 stacxk memory, decrements SP by 4, and
PC9–00 1 P4 P3 0 0 0 P2 P1 P0calls the address specified by caddr1.
RT 01010011 PC9–0(SP)(SP+2)(SP+3) Restores the contents of the stack
SPSP + 4 memory to PC, and increments SP by 4.
PC9–0(SP)(SP+2)(SP+3) Restores the contents of the stack
RTS 01011011 SPSP + 4 memory to PC, increments SP by 4,
then skip unconditionally and causes unconditional skipping.
Transfers the two low-order bits of the
TAMSP 0011111100110001 PC5–4A1–0 accumulator to SP5–4 and the three high-
SP3–1(HL)3–1, SP00 order bits of the memory addressed by
HL to SP3–1.
SKC 01011010 Skip if C = 1 Causes skipping if the carry flag is 1. C = 1
SKABT bit 011101B
1B0Skip if Abit = 1 Causes skipping of the bit of the accumu- Abit = 1
lator, which is specified by B1-0 is 1.
Causes skipping of the bit of the memory
SKMBT bit 011001B
1B0Skip if (HL)bit = 1 addressed by HL, which is specified by (HL)bit = 1
B1–0 is 1.
Causes skipping of the bit of the memory
SKMBF bit 011000B
1B0Skip if (HL)bit = 0 addressed by HL, which is specified by (HL)bit = 0
B1–0 is 0.
Causes skipping if the contents are the
SKAEM 01011111 Skip if A = (HL) same between the accumulator and the A = (HL)
memory addressed by HL.
SKAEI n4 001111110110I
3I2I
1I0Skip if A = n4 Skips if the accumulator is equal to n4. A = n4
SKI n2 00111101010000I
1I0
Skip if INT RQF = 1 Skips if INT RQF is 1, and then sets INT RQF = 1
Then reset INT RQF INT RQF to 0.
Note
Jump
Instructions
Subroutine/stack control instructions
Skip Instructions
Note Instruction Group
Uncondition-
ally
34
µ
PD7554A, 7554A(A)
Mne- Ope- Operation Code Operation Skip
monic rands B1 B2 Condition
Transfers the contents of the accumulator
SIO7–4A to the four high-order bits of the shift
TAMSIO 0011111100111110 SIO3–0(HL) register and the contents of the memory
addressed by HL to the four low-order bits.
Transfers the four high-order bits of the
TSIOAM 0011111100111010 ASIO7–4 shift register to the accumulator and the
(HL)SIO3–0 four low-order bits to the memory
addressed by HL.
SIO 0011111100110011 Start SIO Starts shifting.
TIMER 0011111100110010 Start Timer Starts timer operation.
Transfers the four high-order bits of
ACT7–4 the count register to the accumulator
TCNTAM 0011111100111011 (HL)CT3–0 and the four low-order bits to the
memory addressed by HL.
IPL 01110000 APort (L) Loads the contents of the port specified
by the L register to the accumulator.
Outputs the contents of the accumu-
OPL 01110010 Port/Mode reg. (L)A lator to the port specified by the L
register or the mode register.
RPBLNote2 01011100 Port bit (L)0Resets the bits of ports 8, 10, and 11,
that are specified by the L register.
SPBLNote2 01011101 Port bit (L)1Sets the bits of ports 8, 10, and 11,
that are specified by the L register.
HALT 0011111100110110 Set Halt Mode Sets the HALT mode.
STOP 0011111100110111 Set Stop Mode Sets the STOP mode.
NOP 00000000 No operation Performs no operation for one
machine cycle.
Note1
SIO control instructions
Timer control
instructions
Input/output instructions
CPU control
Instructions
Note 1. Instruction Group
2. SPBL and RPBL are bit-wise set/reset instructions. They perform output to each 4-bit port including the specified bits as well as set and reset operation
(They output the contents of the output latch to bits other than the specified bits.). Before executing these instructions, intialize the contents of the
output latch using the OPL instruction.
35
µ
PD7554A, 7554A(A)
6. ELECTRICAL SPECIFICATIONS
µ
PD7554A: ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C)
Parameter Symbol Test Conditions Rating Unit
Supply voltage VDD –0.3 to +7.0 V
Except ports 10 and 11 –0.3 to VDD + 0.3 V
Input voltage VI
Ports 10 and 11 Note 1 –0.3 to VDD + 0.3 V
Note 2 –0.3 to +11 V
Except ports 8, 10, 11 –0.3 to VDD + 0.3 V
Output voltage VO
Ports 8, 10 and 11 Note 1 –0.3 to VDD + 0.3 V
Note 2 –0.3 to +11 V
Output current high IOH
1 pin –5 mA
All pins in total –15 mA
P01, P02 5 mA
Output current low IOL
1 pin Port 8 30 mA
Others 15 mA
All pins in total 100 mA
Operating temperature Topt –10 to +70 °C
Storage temperature Tstg –65 to +150 °C
Power consumption PdTa = 70 °CShrink DIP 480 mW
Mini flat 250
Note 1. CMOS input/output or N-ch open-drain output + pull-up resistor built-in input/output
2. N-ch open-drain input/output
Caution Even if one of the parameters exceeds its absolute maximum rating even momentarily, the quality
of the product may be degraded. The absolute maximum rating therefore specifies the upper or
lower limit of the value at which the product can be used without physical damages. Be sure not
to exceed or fall below this value when using the product.
36
µ
PD7554A, 7554A(A)
µ
PD7554A(A): ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C)
Parameter Symbol Test Conditions Rating Unit
Supply voltage VDD –0.3 to +7.0 V
Except ports 10 and 11 –0.3 to VDD + 0.3 V
Input voltage VI
Ports 10 and 11 Note 1 –0.3 to VDD + 0.3 V
Note 2 –0.3 to +11 V
Except ports 8, 10, 11 –0.3 to VDD + 0.3 V
Output voltage VO
Ports 8, 10 and 11 Note 1 –0.3 to VDD + 0.3 V
Note 2 –0.3 to +11 V
Output current high IOH
1 pin –5 mA
All pins in total –15 mA
P01, P02 5 mA
Output current low IOL
1 pin Port 8 30 mA
Others 15 mA
All pins in total 100 mA
Operating temperature Topt –40 to +85 °C
Storage temperature Tstg –65 to +150 °C
Power consumption PdTa = 85 °CShrink DIP 350 mW
Mini flat 195
Note 1. CMOS input/output or N-ch open-drain output + pull-up resistor built-in input/output
2. N-ch open-drain input/output
Caution Even if one of the parameters exceeds its absolute maximum rating even momentarily, the quality
of the product may be degraded. The absolute maximum rating therefore specifies the upper or
lower limit of the value at which the product can be used without physical damages. Be sure not
to exceed or fall below this value when using the product.
CAPACITY (Ta = 25 °C, VDD = 0 V)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Input capacity CIN P00, P03 15 pF
Output capacity COUT Port 8 35 pF
I/O capacity CIO
P01, P02 15 pF
Ports 10 and 11 35 pF
f = 1 MHz
Unmeasured pins
returned to 0 V.
37
µ
PD7554A, 7554A(A)
RESONATOR CHARACTERISTICS
µ
PD7554A : Ta = –10 to +70 °C, VDD = 2.7 to 6.0 V
µ
PD7554A(A) : Ta = –40 to +85 °C, VDD = 2.7 to 6.0 V
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
VDD = 5 V ± 10% 400 500 600 kHz
fCC
R = 56 k ± 2 %
VDD = 3 V ± 10% 200 250 300 kHz
R = 100 k ± 2%
fCDuty = 50% VDD = 4.5 to 6.0 V 10 710 kHz
10 350 kHz
tCR, tCF 0.2
µ
s
tCH, tCL
VDD = 4.5 to 6.0 V 0.7 50
µ
s
1.45 50
µ
s
RESONATOR CHARACTERISTICS (Ta = –10 to +70 °C, VDD = 2.5 to 3.3 V)Note
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
fCC
R = 150 k ± 2% 140 180 220 kHz
R = 150 k ± 2% 140 175 210 kHz
VDD = 2.5 V
System clock input fCDuty = 50 % 10 250 kHz
frequency (CL1)
CL1 input rising tCR, tCF 0.2
µ
s
and falling time
CL1 input high/low tCH, tCL 250
µ
s
level duration
RESONATOR CHARACTERISTICS (Ta = –10 to +70 °C, VDD = 2.0 to 3.3 V)Note
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
fCC
R = 240 k ± 2% 65 120 145 kHz
R = 240 k ± 2% 65 100 130 kHz
VDD = 2.0 V
System clock input fCDuty = 50 % 10 150 kHz
frequency (CL1)
CL1 input rising tCR, tCF 0.2
µ
s
and falling time
CL1 input high/low tCH, tCL 3.3 50
µ
s
level duration
Note
µ
PD7554A only
The following circuits are recommended:
RC oscillation External clock
CL1 CL2
PD7554A
µ
CL1 CL2
PD7554A
µ
R CMOS
Leave Open
System clock oscilla-
tor frequency (CL1 and
CL2)
System clock oscilla-
tor frequency (CL1 and
CL2)
System clock oscilla-
tor frequency (CL1 and
CL2)
System clock input fre-
quency (CL1)
CL1 input rising and
falling time
CL1 input high/low
level duration
38
µ
PD7554A, 7554A(A)
DC CHARACTERISTICS
µ
PD7554A : Ta = –10 to +70 °C, VDD = 2.7 to 6.0 V
µ
PD7554A(A) : Ta = –40 to +85 °C, VDD = 2.7 to 6.0 V
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
VIH1 Except CL1 0.7VDD VDD V
Input voltage high VIH2 CL1 VDD – 0.5 VDD V
VIH3 Ports 10 and 11 Note1 0.7VDD 9V
Input voltage low VIL1 Except CL1 0 0.3VDD V
VIL2 CL1 0 0.5 V
VDD = 4.5 to 6.0 V VDD – 2.0 V
Output voltage high VOH IOH = –1 mA
IOH = –100
µ
AVDD – 1.0 V
VDD = 4.5 to 6.0 V 0.4 V
P01, P02 IOL = 1.6 mA
IOL = 400
µ
A 0.5 V
VDD = 4.5 to 6.0 V 0.4 V
IOL = 1.6 mA
Output voltage low VOL Ports 10 and 11 VDD = 4.5 to 6.0 V 2.0 V
IOL = 10 mA
IOL = 400
µ
A 0.5 V
VDD = 4.5 to 6.0 V 2.0 V
Port 8 IOL = 15 mA
IOL = 600
µ
A 0.5 V
ILIH1
VIN = VDD
Except CL1 3
µ
A
Input leak current high ILIH2 CL1 10
µ
A
ILIH3 VIN = 9 V, ports 10 and 11 Note1 10
µ
A
Input leak current low ILIL1
VIN = 0 V Except CL1 –3
µ
A
ILIL2 CL1 –10
µ
A
Output leak current high ILOH1 VOUT = VDD 3
µ
A
ILOH2 VOUT = 9 V, ports 8, 10, and 11 Note1 10
µ
A
Output leak current low ILOL VOUT = 0 V –3
µ
A
Input pin built-in resistor Port 0, RESET 23.5 47 70.5 K
(pull-up/down resistor)
Output pin built-in resistor Ports 10 and 11 7.5 15 22.5 K
(pull-up resistor)
VDD = 5 V ± 10 % 270 900
µ
A
IDD1 Operating mode R = 56 k ± 2 %
VDD = 3 V ± 10 % 80 240
µ
A
R = 100 k ± 2 %
Supply current Note2 VDD = 5 V ± 10 % 120 400
µ
A
IDD2 HALT mode R = 56 k ± 2 %
VDD = 3 V ± 10 % 35 110
µ
A
R = 100 k ± 2 %
IDD3 STOP mode VDD = 5 V ± 10 % 0.1 10
µ
A
VDD = 3 V ± 10 % 0.1 5
µ
A
Note 1. For N-ch open-drain input/output selection
2. The current flowing in built-in pull-up and pull-down resistors is excluded.
39
µ
PD7554A, 7554A(A)
AC CHARACTERISTICS
µ
PD7554A : Ta = –10 to +70 °C, VDD = 2.7 to 6.0 V
µ
PD7554A(A) : Ta = –40 to +85 °C, VDD = 2.7 to 6.0 V
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Internal clock cycle time tCY Note VDD = 4.5 to 6.0 V 2.8 200
µ
s
5.7 200
µ
s
P00 event input frequency fPO Duty = 50% VDD = 4.5 to 6.0 V 0 710 kHz
0 350 kHz
P00 input rise/fall time tPOR, tPOF 0.2
µ
s
tPOH, tPOL
VDD = 4.5 to 6.0 V 0.7
µ
s
1.45
µ
s
Input VDD = 4.5 to 6.0 V 2.0
µ
s
SCK cycle time tKCY
Output 2.5
µ
s
Input 5.0
µ
s
Output 5.7
µ
s
Input VDD = 4.5 to 6.0 V 1.0
µ
s
SCK high/low level width tKH, tKL
Output 1.25
µ
s
Input 2.5
µ
s
Output 2.85
µ
s
SI setup time (to SCK)tSIK 100 ns
SI hold time (from SCK)tKSI 100 ns
SCK↓→ SO output delay time tKSO
VDD = 4.5 to 6.0 V 850 ns
1200 ns
INT0 high/low level width tIOH, tIOL 10
µ
s
RESET high/low level tRSH, tRSL 10
µ
s
width
Note tCY = 2/fCC or 2/fC
AC Timing Test Point (Except CL1 Input)
0.7 V
DD
0.3 V
DD
0.7 V
DD
0.3 V
DD
Test
Points
P00 input high/low level
width
40
µ
PD7554A, 7554A(A)
DC CHARACTERISTICS (Ta = –10 to +70 °C, VDD = 2.5 to 3.3 V)Note1
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
VIH1 Except CL1 0.8 VDD VDD V
Input voltage high VIH2 CL1 VDD – 0.3 VDD V
VIH3 Ports 10 and 11 Note2 0.8 VDD 9V
VIL1 Except CL1 0 0.2VDD V
Input voltage low VIL2 CL1 0 0.3 V
VIL3 Ports 10 and 11 0 0.2VDD V
Output voltage high VOH IOH = –80
µ
AVDD – 1.0 V
P01, P02 IOL = 350
µ
A 0.5 V
Output voltage low VOL Ports 10 and 11 IOL = 350
µ
A 0.5 V
Port 8 IOL = 500
µ
A 0.5 V
ILIH1
VIN = VDD
Except CL1 3
µ
A
Input leak current high ILIH2 CL1 10
µ
A
ILIH3 VIN = 9 V, ports 10 and 11 Note2 10
µ
A
Input leak current low ILIL1
VIN = 0 V Except CL1 –3
µ
A
ILIL2 CL1 –10
µ
A
Output leak current high ILOH1 VOUT = VDD 3
µ
A
ILOH2 VOUT = 9 V, ports 8, 10, and 11 Note2 10
µ
A
Output leak current low ILOL VOUT = 0 V –3
µ
A
Input pin built-in resistor Port 0, RESET 23.5 47 70.5 K
(pull-up/down resistor)
Output pin built-in resistor Ports 10 and 11 7.5 15 22.5 K
(pull-up resistor)
IDD1
VDD = 3 V ± 10% 55 180
µ
A
VDD = 2.5 V 40 150
µ
A
Supply current Note3
IDD2 HALT mode VDD = 3 V ± 10% 25 80
µ
A
VDD = 2.5 V 18 60
µ
A
IDD3 STOP mode 0.1 5
µ
A
Note 1.
µ
PD7554A only
2. For N-ch open-drain input/output selection
3. The current flowing in built-in pull-up and pull-down resistors is excluded.
R =
150 k
± 2%
Operating
mode
41
µ
PD7554A, 7554A(A)
AC CHARACTERISTICS (Ta = –10 to +70 °C, VDD = 2.5 to 3.3 V)Note1
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Internal clock cycle time tCYNote2 8.0 200
µ
s
P00 event input frequency fPO 0 250 kHz
P00 input rise/fall time tPOR, tPOF 0.2
µ
s
P00 input high/low level tPOH, tPOL 2.0
µ
s
width
SCK cycle time tKCY
Input 8.0
µ
s
Output 10.0
µ
s
SCK high/low level width tKH, tKL
Input 4.0
µ
s
Output 5.0
µ
s
SI setup time (to SCK)tSIK 300 ns
SI hold time (from SCK)tKSI 300 ns
SCK↓→SO output delay time tKSO CL = 100 pF 2000 ns
INT0 high/low level width tIOH, tIOL 30
µ
s
RESET high/low level tRSH, tRSL 30
µ
s
width
Note 1.
µ
PD7554A only
2. tCY = 2/fCC or 2/fC
AC Timing Test Point (Except CL1 Input)
0.8 V
DD
0.2 V
DD
0.8 V
DD
0.2 V
DD
Test
Points
42
µ
PD7554A, 7554A(A)
DC CHARACTERISTICS (Ta = –10 to +70 °C, VDD = 2.0 to 3.3 V)Note1
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
VIH1 Except CL1 0.85VDD VDD V
Input voltage high VIH2 CL1 VDD – 0.2 VDD V
VIH3 Ports 10 and 11 Note2 0.85VDD 9V
VIL1 Except CL1 0 0.15VDD V
Input voltage low VIL2 CL1 0 0.2 V
VIL3 Ports 10 and 11 0 0.2VDD V
Output voltage high VOH IOH = –70
µ
AVDD – 1.0 V
P01, P02 IOL = 270
µ
A 0.5 V
Output voltage low VOL Ports 10 and 11 IOL = 300
µ
A 0.5 V
Port 8 IOL = 400
µ
A 0.5 V
ILIH1
VIN = VDD
Except CL1 3
µ
A
Input leak current high ILIH2 CL1 10
µ
A
ILIH3 VIN = 9 V, ports 10 and 11 Note2 10
µ
A
Input leak current low ILIL1
VIN = 0 V Except CL1 –3
µ
A
ILIL2 CL1 –10
µ
A
Output leak current high ILOH1 VOUT = VDD 3
µ
A
ILOH2 VOUT = 9 V, ports 8, 10, and 11 Note2 10
µ
A
Output leak current low ILOL VOUT = 0 V –3
µ
A
Input pin built-in resistor Port 0, RESET 23.5 47 70.5 K
(pull-up/ down resistor)
Output pin built-in resistor Ports 10 and 11 7.5 15 22.5 K
(pull-up resistor)
IDD1
VDD = 3 V ± 10% 38 130
µ
A
VDD = 2.0 V 20 70
µ
A
Supply current Note3
IDD2 HALT mode VDD = 3 V ± 10% 17 60
µ
A
VDD = 2.0 V 8 25
µ
A
IDD3 STOP mode 0.1 5
µ
A
Note 1.
µ
PD7554A only
2. For N-ch open-drain input/output selection
3. The current flowing in built-in pull-up and pull-down resistors is excluded.
R =
240 k
± 2%
Operating
mode
43
µ
PD7554A, 7554A(A)
AC CHARACTERISTICS (Ta = –10 to +70 °C, VDD = 2.0 to 3.3 V)Note1
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Internal clock cycle time tCY Note2 13.4 200
µ
s
P00 event input frequency fPO 0 150 kHz
P00 input rise/fall time tPOR, tPOF 0.2
µ
s
P00 input high/low level tPOH, tPOL 3.3
µ
s
width
SCK cycle time tKCY
Input 13.4
µ
s
Output 16.6
µ
s
SCK high/low level width tKH, tKL
Input 6.7
µ
s
Output 8.3
µ
s
SI setup time (to SCK)tSIK 500 ns
SI hold time (to SCK)tKSI 500 ns
SCK↓→SO output delay time tKSO CL = 100 pF 3500 ns
INT0 high/low level width tIOH, tIOL 50
µ
s
RESET high/low level tRSH, tRSL 50
µ
s
width
Note 1.
µ
PD7554A only
2. tCY = 2/fCC or 2/fC
AC Timing Test Point (Except CL1 Input)
0.85 V
DD
0.15 V
DD
0.85 V
DD
0.15 V
DD
Test
Points
44
µ
PD7554A, 7554A(A)
CHARACTERISTICS OF DATA MEMORY DATA RETENTION AT LOW SUPPLY VOLTAGE IN STOP MODE
µ
PD7554A : Ta = –10 to +70 °C
µ
PD7554A(A) : Ta = –40 to +85 °C
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Data retention supply voltage VDDDR 2.0 6.0 V
Data retention supply current IDDDR VDDDR = 2.0 V 0.1 5
µ
A
Data retention high RESET VIHDR 0.9 VDDDR
VDDDR +0.2
V
input voltage
RESET setup time tSRS 0
µ
s
RESET hold time tHRS 0
µ
s
Data Retention Timing
1
3
2
4
2
4
VDD
RESET
STOP Instruction
Execution
STOP
tSRS tHRS
Data Retention Mode
Operating Mode
1 VDDDR
2 VIH1
3 VIHDR
4 IL1
Caution In the data retention mode, every input must be below VDDDR.
45
µ
PD7554A, 7554A(A)
Clock Timing
1/f
P0
t
POL
t
POH
P00 Input
t
POR
t
POF
1/f
C
t
CL
t
CH
CL1 Input
t
CR
t
CF
Serial Transfer Timing
tKCY
tKL tKH
SCK
tSIK tKSI
tKSO
SI
SO Output Data
Input Data
46
µ
PD7554A, 7554A(A)
Test Input Timing
t
IOL
t
IOH
INT0
RESET Input Timing
t
RSL
t
RSH
RESET
47
µ
PD7554A, 7554A(A)
7. CHARACTERISTIC CURVES
t
1
t
2
CL1
t
1
>t
2
: f
C
= 1
2t
2
t
1
<t
2
: f
C
= 1
2t
1
1000
500
100
10
0123456
10
0123456
CL1 CL2
R
50
100
500
t
1
t
2
t
1
>t
2
: f
X
= 1
2t
2
t
1
<t
2
: f
X
= 1
2t
1
1000
500
100
10 0123456
: T
a
= –10 to +70 °C
: T
a
= –40 to +85 °C
f
C
vs. V
DD
Operating Guarantee Range
Operating
Guarantee
Range
Clock Input Frequency f
C
[kHz]
Operating
Guarantee
Range
Operating
Guarantee
Range
External Resistor R [k]
Supply Voltage V
DD
[V]
R vs. V
DD
Operating Guarantee Range
P00 Event Input Frequency f
P0
[kHz]
Supply Voltage V
DD
[V]
f
P0
vs. V
DD
Operating Guarantee Range
Supply Voltage V
DD
[V]
µ
PD7554A
PD7554A(A)
µ
: T
a
= –10 to +70 °C
: T
a
= –40 to +85 °C
µ
PD7554A
PD7554A(A)
µ
: T
a
= –10 to +70 °C
: T
a
= –40 to +85 °C
µ
PD7554A
PD7554A(A)
µ
: PD7554A
: PD7554A(A)
µ
µ
: PD7554A
: PD7554A(A)
µ
µ
: PD7554A
: PD7554A(A)
µ
µ
48
µ
PD7554A, 7554A(A)
f
CC
vs. V
DD
Characteristics Example (Reference Value) (T
a
=25°C)
700
600
500
400
300
200
100
01234567
R=56k
R=100k
R=240k
Note1
Supply Voltage V
DD
[V]
Clock Oscillation Frequency f
CC
[kHz]
f
CC
vs. T
a
Characteristics Example (Reference Value)
700
600
500
400
300
200
100
0–40 0 25 50
70
85
Note1
Ambient Tem
p
erature T
a
[°C]
Clock Oscillation Frequency f
CC
[kHz]
Note2
R=56k, V
DD
=5.0V
R=100k, V
DD
=3.0V
R=240k, V
DD
=2.0V
–25 –10
75
Note 1.
µ
PD7554A only
2.
µ
PD7554A only operates within this range
49
µ
PD7554A, 7554A(A)
V
DD
=5.0V
V
DD
=2.5V
V
DD
=2.0V
f
CC
vs. R Characteristics Example (Reference Value) (T
a
=25°C)
Clock Oscillation Frequency f
CC
[kHz]
1000
800
600
400
200
90
70
50
30
10
Note
External Resistor Value [k]
10 30 50 70 90 200 400 600
800
1000
CL1 CL2
R
1
10
50
100
500
IDD vs. VDD Characteristic Example (Reference Value)
0123456
R = 56 k Operation
R = 56 k, HALTNote
R = 100 k Operation
R = 150 k Operation
R = 100 k, HALTNote
R = 150 k, HALTNote
Supply Current IDD (A)
µ
Supply Voltage VDD [V]
1000 (Ta = 25 °C)
Note
µ
PD7554A only
50
µ
PD7554A, 7554A(A)
Caution The absolute maximum rating is 30 mA per pin.
Caution The absolute maximum rating is 15 mA per pin.
.
Caution The absolute maximum rating is -5 mA per pin.
Note
µ
PD7554A only
0123456
0
5
10
15
20
25
30
V
DD
= 2.5 V
Note
(T
a
= 25 °C)
0123456
0
5
10
15
20
25
30
V
DD
= 2.5 V
Note
(T
a
= 25 °C)
0123456
0
–1
–2
–3
–4
–5
V
DD
= 2.5 V
Note
(T
a
= 25 °C)
V
DD
= 3 V
V
DD
= 3 V
V
DD
= 5 V
V
DD
= 5 V
V
DD
= 3 V
V
DD
= 5 V
I
OL
vs. V
OL
Characteristic Example (Port 8)
(Reference Value)
Output Current Low I
OL
[mA]
Output Voltage Low V
OL
[V]
I
OL
vs. V
OL
Characteristic Example (Port 10, 11)
(Reference Value)
Output Current Low I
OL
[mA]
Output Voltage Low V
OL
[V]
I
OH
vs. V
OH
Characteristic Example
(Reference Value)
Output Current High I
OH
[mA]
V
DD
– V
OH
[V]
51
µ
PD7554A, 7554A(A)
8.
µ
PD7554A APPLIED CIRCUITS
(1) Tape counter (VTR, deck)
PCL
SCK
SO
SI
PD75008
µ
PD75108
µ
CL1
SCK
SI
SO
RESET
P00/INT0
P113
P100 ~ P112P83P82P81P80
PA80C
µ
7-Se
g
ment LED
UP/DOWN Signal
Mechanical
Control
Microcomputer
Tape Counter
Microcomputer
PD7554A
µ
Count Pulse
Driver
etc.
(2) Remote control reception + key entry + LED display
PD7554A
µ
PCL
SCK
SO
SI
PD75008
µ
PD75108
µ
PCL
SCK
SO
SI
P110
P111
P112
CMOS Output
P113
RESET
P80
P81
P82
P83
P100
P101
P102
P103
P00
PC2800AHA(MS) etc.
µ
LED
12
PA80C
µ
Driver
(Chip
Selector
Transfer
Request)
Open-Drain Output
On-Chip Pull-Up
Resistor Input
Key Input 4 × 4
Master
Microcomputer
etc.
Remote
Control
Signal
Amplifier
Circuit
52
µ
PD7554A, 7554A(A)
9. PACKAGE INFORMATION
DRAWINGS OF MASS-PRODUCTION PRODUCT PACKAGES (1/2)
Caution Dimentions of ES products are different from those of mass-production products. Refer to DRAWINGS
OF ES PRODUCT PACKAGES (1/2).
53
µ
PD7554A, 7554A(A)
DRAWINGS OF MASS-PRODUCTION PRODUCT PACKAGES (2/2)
20 PIN PLASTIC SOP (300 mil)
ITEM MILLIMETERS INCHES
A
B
C
E
F
G
H
I
J
13.00 MAX.
1.27 (T.P.)
1.8 MAX.
1.55
7.7±0.3
0.78 MAX.
0.12
1.1
5.6
M
0.1±0.1
N
0.512 MAX.
0.031 MAX.
0.004±0.004
0.071 MAX.
0.061
0.303±0.012
0.220
0.043
0.005
0.050 (T.P.)
P20GM-50-300B, C-4
P3°3°
+7°
NOTE
Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
D 0.40 0.016
+0.10
–0.05
K 0.20 0.008
+0.10
–0.05
L 0.6±0.2 0.024
0.10
–3°+7°
–3°
0.004
+0.008
–0.009
+0.004
–0.002
+0.004
–0.003
A
C
D
G
P
detail of lead end
F
E
B
H
I
L
K
M
J
N
M
110
1120
Caution Dimentions and materials of ES products are different from those of mass-production products. Refer
to DRAWINGS OF ES PRODUCT PACKAGES (2/2).
54
µ
PD7554A, 7554A(A)
DRAWINGS OF ES PRODUCT PACKAGES (1/2)
20 PIN SHRINK DIP FOR ES (REFERENCE) (UNIT: mm)
55
µ
PD7554A, 7554A(A)
DRAWINGS OF ES PRODUCT PACKAGES (2/2)
20 PIN CERAMIC SOP FOR ES (REFERENCE) (UNIT: mm)
56
µ
PD7554A, 7554A(A)
10. RECOMMENDED PACKAGING PATTERN OF PLASTIC SOP (REFERENCE) (UNIT: mm)
7.62
1.270.76
0.51
1.27
This recommended pattern conforms to the General Rules for Integrated Citrcuit Outer Shape (IC-74-2) specified
by the Electronic Industries Association of Japan (EIAJ).
The above pattern dimensions are applicable to all the products designated as EIAJ flat DIP (mini flat) of “Form
A 300 mil type”.
If there is any possibility of causing a solder bridge, adjust the width (0.76) of each pad while maintaining the
same length (1.27).
57
µ
PD7554A, 7554A(A)
11. RECOMMENDED SOLDERING CONDITIONS
Solder
µ
PD7554A on the following recommended conditions.
For details of recommended soldering conditions, refer to the information document “Semiconductor device
mounting technology manual” (IEI-1207).
For details on the soldering method and soldering conditions other than the recommended conditions, call the
NEC salesman.
Table 11-1 Surface Mounting Type Soldering Conditions
µ
PD7554AG-××× : 20-pin plastic SOP (300 mil)
µ
PD7554AG(A)-×××: 20-pin plastic SOP (300 mil)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow IR30-00-1
VPS VP15-00-1
Wave soldering WS60-00-1
Pin part heating Pin temperature: 300 °C or below, Duration: 3 sec. max. (per device side) ––
Caution Use of more than one soldering method should be avoided (except in the case of pin part heating).
Table 11-2 Insertion Type Soldering Conditions
µ
PD7554ACS-××× : 20-pin plastic shrink DIP (300 mil)
µ
PD7554ACS(A)-××× : 20-pin plastic shrink DIP (300 mil)
Soldering Method Soldering Conditions
Wave soldering Solder bath temperatures: 260 °C or below, Duration: 10 sec. max.
(pin only)
Pin part heating Pin temperature: 300 °C or below, Duration: 3 sec. max. (Per pin)
Caution Ensure that the application of wave soldering is limited to the pins and no solder touches the main unit
directly.
Package peak temperature: 230 °C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Once
Package peak temperature: 215 °C, Duration: 40 sec. max. (at 200 °C or above),
Number of times: Once
Solder bath temperature: 260 °C or below, Duration: 10 sec. max.,
Number of times: once, Preparatory heating tempererature: 120 °C max.
(Package surface temperature)
µ
PD7554A, 7554A(A)
Product Name
µ
PD7554
µ
PD75P54
µ
PD7554A
µ
PD7554A(A)
µ
PD7564
µ
PD75P64
µ
PD7564A
µ
PD7564A(A)
Item
RC 4
µ
s/500 kHz
Instruction cycle/ Outside 2.86
µ
s/700 kHz
system clock (5 V)
Ceramic 2.86
µ
s/700 kHz
Instruction set 47 types (SET B)
ROM 1024 × 8
RAM 64 × 4
Total 16 15
Port 0 P00-P03
Port 8 P80-P82, P83 (CL2) P80-P82
I/O Ports
Withstand voltage 12 V 9 V 12 V 9 V
Port 10 and 11 P100-P103, P110-P113
Withstand voltage 12 V 9 V 12 V 9 V
Timer/Event Counter 8 bits
Serial Interface 4 channels
Supply Voltage Range 2.5-6.0 V 4.5-6.0 V 2.0-6.0 V 2.7-6.0 V 2.7-6.0 V 4.5-6.0 V 2.7-6.0 V 2.7-6.0 V
Package 20-pin plastic shrink DIP
20-pin plastic SOP
APPENDIX A. COMPARISON BETWEEN SERIES PRODUCTS FUNCTIONS
– – – –– – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – –
– – – –– – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – –
58
59
µ
PD7554A, 7554A(A)
APPENDIX B. DEVELOPMENT TOOLS
The following development tools are available for developing systems that use
µ
PD7554A.
Language Processor
Host Machine OS Supply Medium
Ordering Code
(Product Name)
MS-DOS™ 3.5-inch 2HD
µ
S5A13AS7554
PC-9800 series (Ver.3.10 to
Ver.5.00ANote) 5-inch 2HD
µ
S5A10AS7554
IBM PC/AT™ PC DOS™ 5-inch 2HC
µ
S7B10AS7554
(Ver. 3.1)
PROM Write Tools
Note A task swap function is provided in Ver. 5.00/5.00A, but the task swap function cannot be used with this
software.
Remark Operation of the assembler and PG-1500 controller is only guaranteed on the host machines and OSs
shown above.
µ
PD7550/7560 series
absolute assembler
PROM programmer which allows programming of single-chip microcomputer with
typical PROM of 256K to 4M bits by stand-alone or from a host machine by
connecting the accessory board and optional programmer adapter.
µ
PD75P54/75P64 PROM programmer adapter. Used by connecting it to the PG-1500.
Connects the PG-1500 and host machine by serial and parallel interface and controls
the PG-1500 on the host machine.
Hardware
PG-1500
PA-75P54CS
Ordering Code
Host Machine OS Supply Medium (Product Name)
MS-DOS 3.5-inch 2HD
µ
S5A13PG1500
PC-9800 series (Ver.3.10 to
Ver.5.00ANote)
IBM PC/AT PC DOS 5-inch 2HC
µ
S7B10PG1500
(Ver.3.1)
5-inch 2HD
µ
S5A10PG1500
Software
PG-1500 controller
60
µ
PD7554A, 7554A(A)
Debugging Tools
Note A task swap function is provided in Ver. 5.00/5.00A, but the task swap function cannot be used with this
software.
Caution It is not possible to internally mount a pull-up resistor in a port in the EVAKIT-7500B. When
evaluating, arrange to have a pull-up resistor mounted in the user system.
Remark Operation of the assembler and PG-1500 controller is only guaranteed on the host machines and OSs
shown above.
EVAKIT-7500B is an evaluation board that can be used for
µ
PD7500 series models.
For
µ
PD7544A, EVAKIT-7500B and option board EV-7554A are combined and used
for system development.
EVAKIT-7500B can operate alone. EVAKIT-7500B has a built-in serial interface on
the board, so it enables debugging when it is connected to a TTY, TYPUTER, or RS-
232-C console.
EVAKIT-7500B works as is a real-time tracer and traces state of the program counter
and output port in real time. EVAKIT-7500B has a built-in PROM writer and improves
debugging efficiency considerably.
EV-7554A is an adapter board which is connected to EVAKIT-7500B and evaluates
µ
PD7554A.
SE-7554A is a simulation board that has the programs developed by EVAKIT-7500B.
SE-7554A evaluates a system in place of
µ
PD7554A.
EVAKIT-7500 Control Program connects EVAKIT-7500B and the host machine with
RC-232-C and controls EVAKIT-7500B on the host machine.
Hardware
EV-7554A
SE-7554A
EVAKIT-7500B
Software
Ordering Code
Host Machine OS Supply Medium (Product Name)
PC-9800 MS-DOS 3.5-inch 2HD
µ
S5A13EV7500-P01
series (Ver.3.10 to
Ver.5.00ANote)
IBM PC PC DOS 5-inch 2HC
µ
S7B11EV7500-P01
series (Ver.3.1)
5-inch 2HD
µ
S5A10EV7500-P01
EVAKIT-7500
control program
(EVAKIT controller)
61
µ
PD7554A, 7554A(A)
APPENDIX C. RELATED DOCUMENTS
DOCUMENT RELATED TO DEVICE
Document Name Document No.
User's Manual IEU-1111D
µ
PD7500-series Selection Guide IF-1027G
DOCUMENT RELATED TO DEVELOPMENT TOOL
Document Name Document No.
EVAKIT-7500B User's Manual EEU-1017C
Hardware EV-7554A User's Manual EEU-1034A
PG-1500 User's Manual EEU-1335B
µ
PD7550, 7560-series Absolute Assembler User's Manual EEM-1006
Software EVAKIT-7500 Control Program User's Manual MS-DOS base EEM-1356
PC DOS base EEM-1049
PG-1500 Controller User's Manual EEU-1291B
OTHER RELATED DOCUMENT
Document Name Document No.
Package Manual IEI-1213
Semiconductor Device Mounting Technology Manual IEI-1207
Quality Grade on NEC Semiconductor Devices IEI-1209A
NEC Semiconductor Device Reliability/Quality Control System IEI-1203A
Static Electricity Discharge (ESD) Test IEI-1201
Semiconductor Device Quality Guarantee Guide MEI-1202
Microcomputer-Related Product Guide-Third Party Product Note
Remark These documents above are subject to change without notice. Be sure to use the latest document
for designing.
Note To be published.
62
µ
PD7554A, 7554A(A)
[MEMO]
63
µ
PD7554A, 7554A(A)
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of
the gate oxide and ultimately degrade the device operation. Steps must be
taken to stop generation of static electricity as much as possible, and quickly
dissipate it once, when it has occurred. Environmental control must be
adequate. When it is dry, humidifier should be used. It is recommended to
avoid using insulators that easily build static electricity. Semiconductor
devices must be stored and transported in an anti-static container, static
shielding bag or conductive material. All test and measurement tools including
work bench and floor should be grounded. The operator should be grounded
using wrist strap. Semiconductor devices must not be touched with bare
hands. Similar precautions need to be taken for PW boards with semiconductor
devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input
level may be generated due to noise, etc., hence causing malfunction. CMOS
device behave differently than Bipolar or NMOS devices. Input levels of CMOS
devices must be fixed high or low by using a pull-up or pull-down circuitry. Each
unused pin should be connected to VDD or GND with a resistor, if it is considered
to have a possibility of being an output pin. All handling related to the unused
pins must be judged device by device and related specifications governing the
devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production
process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been initialized. Hence, power-on does not guarantee
out-pin levels, I/O settings or contents of registers. Device is not initialized
until the reset signal is received. Reset operation must be executed immedi-
ately after power-on for devices having reset function.
µ
PD7554A, 7554A(A)
M4 92.6
[MEMO]
MS-DOS is a trademark of MicroSoft Corporation.
PC DOS and PC/AT are trademarks of IBM Corporation.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights
or other intellectual property rights of NEC Corporation or others.
The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear
reactor control systems and life support systems. If customers intend to use NEC devices for above applications
or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact
our sales people in advance.
Application examples recommended by NEC Corporation
Standard : Computer, Office equipment, Communication equipment, Test and Measurement equipment,
Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc.
Special : Automotive and Transportation equipment, Traffic control systems, Antidisaster systems,
Anticrime systems, etc.
The application circuits and their parameters are for references only and are not intended for use in actual design-in's.