TD62S312AFM
2001-12-05
1
TOSHIBA Bipo lar Digital Integrat ed Circuit
Silicon Mo nolith ic
TD62S312AFM
1-Channel Darlington Source-Current Driver
TD62S312AFM is a 1-channel noninverting source-current driver.
The driver incorporates output clamp diodes used to clamp the
counter electromotive force which is generated when driving an
inductive load, and an input resistor which limits base current.
The driver is optimal for driving relays and LEDs. When using
the driver, pay attention to the thermal conditions.
Features
Ultra-small HSON6 package with heat sink on rear
Large output voltage: VOUT = 50 V (min)
Large output current: IOUT = 100 mA (max)
Built-in input resistor: RIN = 10 k
Input signal: High Level Active
Built-in output clamp diodes
Pin Connection (t op view) Basic Circuit Diagram
Note 1: Diodes shown using dotted lines are parasitic. Do not use them.
Note 2: W hen using the driver, connect the OUTPUT pin to the TEST pin.
Note 3: When using the driver, connect the P-GND pin to the heat sink on the rear of the package.
Weight: 0.017 g (typ.)
10 k
2.6 k
VCC
TEST
OUTPUT
P-GND
INPUT
20 k
10 k
1
2
3
INPUT
P-GND
NC
6
5
4
OUTPUT
TEST
VCC
TD62S312AFM
2001-12-05
2
Maximum Ratings (Ta =
==
= 25°C)
Characteristics Symbol Rating Unit
Supply volt age VCC 0.5~50 V
Output voltage VOUT 50 V
Collect or-em it t er volt age VCEO 50 V
Output current IOUT 100 mA
Input volt age VIN 0.5~50 V
Clamp diode revers e voltage VR 50 V
Clamp diode forward current IF 100 mA
Power dissipation PD (Note 4) 0.78 W
Rth (j-a)
(Note 4) 160
Saturated thermal resistance Rth (j-c)
(Note 5) 25 °C/W
Operating temperature Topr 40~85 °C
Storage temperature Tstg 55~150 °C
Note 4: 114.3 × 76.2 × 1.6 mm glass epoxy film substrate Cu heat dissipation pattern 100 mm2
Note 5: When an infinite heat sink is m ounte d.
Recommended Operating Condition (Ta =
==
=
40~85°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Supply volt age VCC 50 V
Output current IOUT Ta = 60°C, Tj = 105°C 100 mA
Input volt age VIN 12 V
Output ON VIN (ON) 2.0 5.0 12
Input volt age Output OFF VIN (OFF) 0 0.8 V
Clamp diode revers e voltage VR 50 V
Clamp diode forward current IF 100 mA
Electrical Characteristics (Ta =
==
= 25°C, VCC =
==
= 50 V)
Characteristics Symbol
Test
Circuit Test Condition Min Typ. Max Unit
Output leakage current ICEX 1 VIN = 0. 4 V 10 µA
VIN = 2.0 V, IOUT = 70 mA 1.3
Output saturation voltage VCE (sat) 2
VIN = 2.0 V, IOUT = 50 mA 1.1 V
VIN = 3.6 V 240 350 µA
Input current IIN ( O N) 3
VIN = 12 V 1.1 1.6 mA
VIN (ON) V
CE = 2.0 V, IOUT = 70 mA 2.0
Input volt age VIN (OFF) 4 IOUT = 500 µA 0.5 V
Power dissipation ICC (ON) 3 VIN = 5 V 0.6 mA
Clamp diode leakage current IR 5 VR = 50 V 10 µA
Clamp diode forward voltage VF 6 IF = 100mA 1.3 V
Turn-on delay tON 0.2
Turn-off delay tOFF 7 RL = 625 , CL = 15 pF 2.0 µs
TD62S312AFM
2001-12-05
3
Test Circuit
1. ICEX 2. VCE (sat)
3. IIN (ON), ICC 4. VIN (ON), VIN (OFF)
5. IR 6. VF
7. tON, tOFF
Note 6: Pulse width 50 µs, duty cycle 10%
Output impedance 50 , tr<
=
5 ns, tf<
=
10 ns
Note 7: CL includes probe and jig capacitance.
VCC
VIN
VCE
(
sat
)
IOUT
ICC
VCC
VIN
IIN
(
ON
)
VCC
VIN (ON)
VIN (OFF)
VCE
IR
VCC
VR IF
OPEN
VF
Pulse
generator
INPUT
CL (Note 7)
(Note 6)
VCC
RL
ICEX
VCC
VIN
Caution on Application
1. The device does not include protectors such as an overcurrent protector and an overvoltage protector.
Applying excessive current or voltage may damage the device.
Thus, design with great care to prevent excessive current or voltage from being applied to the device.
The device may also be damaged by short-circuits between outputs and power supply/ground.
Take care when designing output, VCC and GND line.
2. Be sure to mount the device in the correct orientation. Make sure that the positive and negative
power supply pins are connected the right way round. Otherwise, the absolute maximum current
and power dissipation ratings may be exceeded and the device may break down or undergo
performance degradation, causing it to catch fire or explode, and resulting in injury.
10%
90%90%
10% 10%
50% 50%
tON t
OFF
tf tr
5 V
0
VOH
VOL
OUTPUT
INPUT
90%
50 µs
TD62S312AFM
2001-12-05
4
Package Dimensions
Weight: 0.017 g (typ.)
TD62S312AFM
2001-12-05
5
Preliminary land pattern
Preliminary PCB trace dimension
2.2 0.6 0.6
1.6
1.6
0.7 0.7 0.7
0.25
1.3
Unit : mm
5 mm
10 mm
TD62S312AFM
2001-12-05
6
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devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. .
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
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The information contained herein is subject to change without notice.
000707EB
A
RESTRICTIONS O N PRODUCT USE