5 V, 3 A Logic Controlled
High-Side Power Switch
Data Sheet ADP197
Rev. C Document Feedback
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FEATURES
Low RDSON of 12 mΩ
Low input voltage range: 1.8 V to 5.5 V
Quick output discharge (QOD) circuit (ADP197-02)
3 A continuous operating current at 70°C
1.2 V logic-compatible enable input
Low 18 μA quiescent current, VIN < 3 V
Low 31 μA quiescent current, VIN = 4.2 V
Overtemperature protection
Ultralow shutdown current: <1 μA
Ultrasmall 1.0 mm × 1.5 mm, 0.5 mm pitch, 6-ball WLCSP
Tiny 2.0 mm × 2.0 mm × 0.55 mm, 0.65 mm pitch, 6-lead LFCSP
APPLICATIONS
Mobile phones
Digital cameras and audio devices
Portable and battery-powered equipment
TYPICAL APPLICATIONS CIRCUIT
GND
EN LOAD
V
IN
V
OUT
ADP197
ADP197-02
ONLY
CHARGE PUMP
AND SLEW RATE
CONTROL
OFF
ON
09298-001
+
–
OVERTEMPERATURE
PROTECTION
Figure 1.
GENERAL DESCRIPTION
The ADP197 is a high-side load switch designed for operation
between 1.8 V and 5.5 V. This load switch provides power domain
isolation, which helps extend battery operation. The device
contains a low on-resistance, N-channel MOSFET that supports
more than 3 A of continuous current and minimizes power loss.
The low 18 µA quiescent current and ultralow shutdown current
make the ADP197 ideal for battery-operated portable equipment.
The built-in level shifter for enable logic makes the ADP197
compatible with many processors and GPIO controllers.
Overtemperature protection circuitry activates if the junction
temperature exceeds 125°C, thereby protecting itself and
downstream circuits from potential damage.
The ADP197-02 incorporates an internal quick output
discharge (QOD) circuit to discharge the output capacitance
when the ADP197-02 output is disabled
In addition to operating performance, the ADP197 WLCSP
package occupies minimal printed circuit board (PCB) space
with an area of less than 1.5 mm2 and a height of 0.60 mm.
The ADP197 is available in an ultrasmall 1.0 mm × 1.5 mm,
0.5 mm pitch, 6-ball WLCSP and a 2.0 mm × 2.0 mm ×
0.55 mm, 0.65 mm pitch, 6-lead LFCSP.
ADP197 Data Sheet
Rev. C | Page 2 of 13
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Typical Applications Circuit ............................................................ 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Diagram ........................................................................... 3
Absolute Maximum Ratings ............................................................ 4
ESD Caution .................................................................................. 4
Pin Configurations and Function Descriptions ........................... 5
Typical Performance Characteristics ..............................................6
Theory of Operation ...................................................................... 10
Applications Information .............................................................. 11
Capacitor Selection .................................................................... 11
Ground Current .......................................................................... 11
Enable Feature ............................................................................ 11
Timing ......................................................................................... 12
Outline Dimensions ....................................................................... 13
Ordering Guide .......................................................................... 13
REVISION HISTORY
10/14—Rev. B to Rev. C
Added 6-lead LFCSP .......................................................... Universal
Changes to Features Section, General Description Section,
and Figure 1 ....................................................................................... 1
Changes to Table 1 ............................................................................ 3
Changes to Table 3 ............................................................................ 4
Added Figure 4 and Table 5; Renumbered Sequentially ............. 5
Added Figure 7 .................................................................................. 6
Changes to Figure 9 .......................................................................... 6
Changes to Figure 13 ........................................................................ 7
Changes to Theory of Operation Section .................................... 10
Changes to Figure 26 Caption ....................................................... 11
Changes to Figure 29 to Figure 33 and Timing Section ............ 12
Added Figure 35, Outline Dimensions ........................................ 13
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 13
5/12—Rev. A to Rev. B
Changes to Ordering Guide .......................................................... 13
11/11—Rev. 0 to Rev. A
Changed EN to GND Rating, Table 2 ............................................ 4
4/11—Revision 0: Initial Version
Data Sheet ADP197
Rev. C | Page 3 of 13
SPECIFICATIONS
VIN = 1.8 V, VEN = VIN, IOUT = 1 A, TA = 25°C, unless otherwise noted.
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
INPUT VOLTAGE RANGE VIN T
J = −40°C to +85°C 1.8 5.5 V
EN INPUT
EN Input VIH V
IN = 1.8 V to 5.5 V 1.2 V
V
IL V
IN = 1.8 V to 5.5 V, TJ = −40°C to +85°C 0.4 V
V
IN = 1.8 V to 5.5 V, TJ = −40°C to +110°C 0.35 V
EN Input Pull-Down Current IEN V
IN = 1.8 V 500 nA
CURRENT
Ground Current IGND V
IN = 1.8 V 18 μA
V
IN = 3.4 V 14 μA
V
IN = 4.2 V, TJ = −40°C to +110°C 18 31 μA
V
IN = 5.5 V 28 μA
Off State Current IOFF V
EN = GND, VOUT = 0 V, VIN = 4.2 V 0.1 μA
V
EN = GND, TJ = −40°C to +85°C, VOUT =0 V, VIN = 1.8 V to 5.5 V 20 μA
V
EN = GND, TJ = −40°C to +110°C, VOUT =0 V, VIN = 1.8 V to 5.5 V 75 μA
Continuous Operating Current1 I
OUT V
IN = 1.8 V to 5.5 V 3 A
VIN TO VOUT RESISTANCE RDSON
WLCSP VIN = 5.5 V 0.012 Ω
V
IN = 4.2 V 0.012 Ω
V
IN = 1.8 V 0.012 Ω
V
IN = 1.8 V, TJ = −40°C to +85°C 0.012 0.017 Ω
LFCSP VIN = 5.5 V 0.027 Ω
V
IN = 4.2 V 0.027 Ω
V
IN = 1.8 V 0.027 Ω
V
IN = 1.8 V, TJ = −40°C to +85°C 0.027 0.036 Ω
VOUT TURN-ON DELAY TIME See Figure 2
Turn-On Delay Time tON_DLY V
IN = 1.8 V to 5.5 V, CLOAD = 1 μF 1 ms
ACTIVE PULL-DOWN RESISTANCE
(ADP197-02 OPTION ONLY)
RPULLDOWN V
IN = 3.2 V 380 Ω
THERMAL SHUTDOWN
Thermal Shutdown Threshold TSSD T
J rising 125 °C
Thermal Shutdown Hysteresis TSSD-HYS 15 °C
1 At an ambient temperature of 85°C, the device can withstand a continuous current of 2.22 A. At a load current of 3 A, the operational lifetime derates to 2190 hours.
TIMING DIAGRAM
V
EN
V
OUT
TURN-ON
RISE
90%
10%
TURN-OFF
DELAY
TURN-OFF
FALL
TURN-ON
DELAY
09298-002
Figure 2. Timing Diagram
ADP197 Data Sheet
Rev. C | Page 4 of 13
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN to GND −0.3 V to +6.5 V
VOUT to GND −0.3 V to VIN
EN to GND −0.3 V to +6.5 V
Continuous Drain Current
TA = 25°C ±4 A
TA = 85°C ±2.22 A
Continuous Diode Current −50 mA
Storage Temperature Range −65°C to +150°C
Operating Junction Temperature Range −40°C to +105°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 3. Typical θJA and ΨJB Values
Package Type θJA Ψ
JB Unit
6-Ball, 0.5 mm Pitch WLCSP 260 58 °C/W
6-Lead, 0.65 mm Pitch LFCSP 68.9 44.1 °C/W
ESD CAUTION
Data Sheet ADP197
Rev. C | Page 5 of 13
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VIN VOUT
12
VIN
A
BVOUT
ENCGND
TOP VIEW
(Not to Scale)
ADP197
09298-003
Figure 3. 6-Ball WLCSP Pin Configuration
Table 4. 6-Ball WLCSP Pin Function Descriptions
Pin No. Mnemonic Description
A1, B1 VIN Input Voltage.
A2, B2 VOUT Output Voltage.
C1 EN Enable Input. Drive EN high to turn on the switch and drive EN low to turn off the switch.
C2 GND Ground.
3GND
1VOUT1
2VOUT2
4EN
6VIN1
5VIN2
09298-104
ADP197
TOP VIEW
NOTES
1. EXPOSED PAD MUST BE CONNECTED
TO GROUND.
Figure 4. 6-Lead LFCSP Pin Configuration
Table 5. 6-Lead LFCSP Pin Function Descriptions
Pin No. Mnemonic Description
1 VOUT1 Output Voltage. Connect VOUT1 and VOUT2 together.
2 VOUT2 Output Voltage. Connect VOUT1 and VOUT2 together.
3 GND Ground.
4 EN Enable Input. Drive EN high to turn on the switch and drive EN low to turn off the switch.
5 VIN2 Input Voltage. Connect VIN1 and VIN2 together.
6 VIN1 Input Voltage. Connect VIN1 and VIN2 together.
EP Exposed Pad. The exposed pad must be connected to ground.
ADP197 Data Sheet
Rev. C | Page 6 of 13
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 1.8 V, VEN = VIN, CIN = COUT = 1 µF, TA = 25°C, unless otherwise noted.
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
RDS
ON
(
Ω)
–40–30–20–100 102030405060708090
TEMPERATURE (°C)
1.8V
3.4V
4.2V
5.5V
09298-004
Figure 5. RDSON vs. Temperature, 500 mA
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
RDS
ON
(
Ω)
–40–30–20–100 102030405060708090
TEMPERATURE (°C)
1.8V
3.4V
4.2V
5.5V
09298-005
Figure 6. RDSON vs. Temperature, 3 A, Different Input Voltages (VIN)
0
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.040
–40–30–20–10 0 102030405060708090100110
RDS
ON
(Ω)
TEMPERATURE (⁰C)
1.8V
3.4V
4.2V
5.5V
09298-107
Figure 7. RDSON (LFCSP) vs. Temperature, 500 mA, Different Input Voltages (VIN)
0
0.005
0.010
0.015
0.020
0.025
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
RDS
ON
(
Ω)
V
IN
(V)
50mA
100mA
200mA
500mA
1000mA
3000mA
09298-006
Figure 8. RDSON vs. Input Voltage (VIN), Different Load Currents
0
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.040
0.045
0.050
–40–5256585
V
O
L
T
AGE DR
O
P (V)
TEMPERATURE (°C)
0
9298-007
50mA
100mA
200mA
500mA
1000mA
3000mA
Figure 9. Voltage Drop vs. Temperature, Different Load Currents
0
5
10
15
20
25
30
35
40
45
50
–40–5256585
GROUND CURRENT (µA)
TEMPERATURE (°C)
09298-016
100mA
200mA
500mA
1000mA
3000mA
Figure 10. Ground Current vs. Temperature, Different Load Currents,
VIN = 1.8 V
Data Sheet ADP197
Rev. C | Page 7 of 13
0
5
10
15
20
25
30
35
40
45
50
GROUND CURRENT (µA)
–40
–5 25 65 85
TEMPERATURE (°C)
09298-017
100mA
200mA
500mA
1000mA
3000mA
Figure 11. Ground Current vs. Temperature, Different Load Currents,
VIN = 4.2 V
0
5
10
15
20
25
30
35
40
45
50
–40 –5 25 65 85
GROUND CURRENT (µA)
TEMPERATURE (°C)
09298-018
100mA
200mA
500mA
1000mA
3000mA
Figure 12. Ground Current vs. Temperature, Different Load Currents,
VIN = 5.5 V
0
5
10
15
20
25
30
35
40
45
50
10 100 1000 10000
GROUND CURRENT (µA)
LOAD CURRENT (mA)
1.8V
1.9V
2.5V
3.0V
3.4V
3.8V
4.2V
4.6V
5.0V
5.5V
09298-019
Figure 13. Ground Current vs. Load Current, Different Input Voltages (VIN)
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
–40 –20 0 20 40 60 80 100
I
GND
SHUTDOWN CURRENT
(
µA)
TEMPERATURE (°C)
1.8V
1.9V
2.5V
3.0V
3.4V
3.8V
4.2V
4.6V
5.0V
5.5V
09298-020
Figure 14. IGND Shutdown Current vs. Temperature, Output Open,
Different Input Voltages (VIN)
TEMPERATURE (°C)
0.01
0.1
1
10
–40 –20 0 20 40 60 80 100
I
GND
SHUTDOWN CURRENT
(
µA)
0
9298-021
1.8V
1.9V
2.5V
3.0V
3.4V
3.8V
4.2V
4.6V
5.0V
5.5V
Figure 15. IGND Shutdown Current vs. Temperature, VOUT = 0 V,
Different Input Voltages (VIN)
3
2
1
CH1 AMPL
204mA
CH1 100mA
CH3 2V
CH2 1V M1.00ms A CH3 1.28V
T 10.20%
BWBW
Ω
BW
09298-008
I
LOAD
V
OUT
V
EN
Figure 16. Typical Turn-On Time and Inrush Current, VIN = 1.9 V,
200 mA Load
ADP197 Data Sheet
Rev. C | Page 8 of 13
3
2
1
CH1 AMPL
1.92A
CH1 1A
CH3 2V
CH2 1V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-009
I
LOAD
V
OUT
V
EN
Figure 17. Typical Turn-On Time and Inrush Current, VIN = 1.9 V,
2 A Load
3
2
1
CH1 AMPL
266mA
CH1 100mA
CH3 2V
CH2 2V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-010
I
LOAD
V
OUT
V
EN
Figure 18. Typical Turn-On Time and Inrush Current, VIN = 1.9 V,
200 mA Load, COUT = 100 μF
3
2
1
CH1 AMPL
1.92A
CH1 1A
CH3 2V
CH2 2V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-011
I
LOAD
V
OUT
V
EN
Figure 19. Typical Turn-On Time and Inrush Current, VIN = 1.9 V,
2 A Load, COUT = 100 μF
3
2
1
CH1 AMPL
222mA
CH1 100mA
CH3 2V
CH2 2V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-012
I
LOAD
V
OUT
V
EN
Figure 20. Typical Turn-On Time and Inrush Current, VIN = 5.5 V,
200 mA Load
3
2
1
CH1 AMPL
2.14A
CH1 1A
CH3 2V
CH2 2V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-013
I
LOAD
V
OUT
V
EN
Figure 21. Typical Turn-On Time and Inrush Current, VIN = 5.5 V,
2 A Load
3
2
1
CH1 AMPL
352mA
CH1 200mA
CH3 2V
CH2 2V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-014
I
LOAD
V
OUT
V
EN
Figure 22. Typical Turn-On Time and Inrush Current, VIN = 5.5 V,
200 mA Load, COUT = 100 μF
Data Sheet ADP197
Rev. C | Page 9 of 13
3
2
1CH1 AMPL
2.12A
CH1 1A
CH3 2V
CH2 2V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-015
I
LOAD
V
OUT
V
EN
Figure 23. Typical Turn-On Time and Inrush Current, VIN = 5.5 V,
2 A Load, COUT = 100 μF
0.0001
0.001
0.01
0.1
1
10
–40 –20 0 20 40 60 80 100
I
OUT
SHUTDOWN CURRENT
(
µA)
TEMPERATURE (°C)
1.8V
1.9V
2.5V
3.0V
3.4V
3.8V
4.2V
4.6V
5.0V
5.5V
09298-022
Figure 24. IOUT Shutdown Current vs. Temperature, VOUT = 0 V, Different Input
Voltages (VIN)
ADP197 Data Sheet
Rev. C | Page 10 of 13
THEORY OF OPERATION
GND
EN
VIN VOUT
ADP197
ADP197-02
ONLY
CHARGE PUMP
AND SLEW RATE
CONTROL
09298-023
OVERTEMPERATURE
PROTECTION
Figure 25. Functional Block Diagram
The ADP197 is a high-side NMOS load switch, controlled by an
internal charge pump. The ADP197 is designed to operate with
power supply voltages between 1.8 V and 5.5 V.
An internal charge pump biases the NMOS switch to achieve a
relatively constant, ultralow on resistance of 12 mΩ across the
entire input voltage range. The use of the internal charge pump
also allows for controlled turn-on times. Turning the NMOS
switch on and off is controlled by the enable input pin (EN), which
is capable of interfacing directly with 1.8 V logic signals.
The ADP197 is capable of 3 A of continuous operating current
as long as TJ is less than 70°C. At 85°C, the rated current drops
to 2.22 A.
The overtemperature protection circuit activates if the load cur-
rent causes the junction temperature to exceed 125°C. When
this occurs, the overtemperature protection circuitry disables
the output until the junction temperature falls below approximately
110°C, at which point the output is reenabled. If the fault condition
persists, the output cycles off and on until the fault is removed.
The ADP197-02 incorporates a QOD circuit to discharge the
output capacitance when the ADP197-02 output is disabled.
ESD protection structures are shown in the block diagram as Zener
diodes.
The ADP197 is a low quiescent current device with a nominal
4 MΩ pull-down resistor on its EN pin. The package is a space-
saving 1.0 mm × 1.5 mm, 0.5 mm pitch, 6-ball WLCSP and a
tiny 2.0 mm × 2.0 mm × 0.55 mm, 0.65 mm pitch, 6-lead LFCSP.
Data Sheet ADP197
Rev. C | Page 11 of 13
APPLICATIONS INFORMATION
CAPACITOR SELECTION
Output Capacitor
The ADP197 is designed for operation with small, space-saving
ceramic capacitors but functions with most commonly used capa-
citors when the effective series resistance (ESR) value is carefully
considered. The ESR of the output capacitor affects the response
to load transients. A typical 1 µF capacitor with an ESR of 0.1 Ω
or less is recommended for good transient response. Using a larger
value of output capacitance improves the transient response to
large changes in load current.
Input Bypass Capacitor
Connecting at least 1 µF of capacitance from VIN to GND reduces
the circuit sensitivity to the printed circuit board (PCB) layout,
especially when high source impedance or long input traces are
encountered. When greater than 1 µF of output capacitance is
required, increase the input capacitor to match it.
GROUND CURRENT
The major source for ground current in the ADP197 is the internal
charge pump for the FET drive circuitry. Figure 26 shows the
typical ground current when VEN = VIN, and varies from 1.8 V
to 5.5 V.
0
5
10
15
20
25
30
35
40
45
50
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
GROUND CURRENT (µA)
V
IN
(V)
09298-024
50mA
100mA
200mA
500mA
1000mA
3000mA
Figure 26. Ground Current vs. Input Voltage (VIN), Different Load Currents
ENABLE FEATURE
The ADP197 uses the EN pin to enable and disable the VOUT
pin under normal operating conditions. As shown in Figure 27,
when a rising voltage (VEN) on the EN pin crosses the active
threshold, VOUT turns on. When a falling voltage (VEN) on
the EN pin crosses the inactive threshold, VOUT turns off.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 0.2 0.4 0.6 0.8 1.0 1.2
V
OUT
(V)
ENABLE VOLTAGE (V)
V
EN
FALLING V
EN
RISING
V
OUT
AT 3.6V
09298-025
Figure 27. Typical EN Operation
As shown in Figure 27, the EN pin has hysteresis built into it.
This built-in hysteresis prevents on/off oscillations that can
occur due to noise on the EN pin as it passes through the
threshold points.
The EN pin active and inactive thresholds derive from the VIN
voltage; therefore, these thresholds vary with the changing input
voltage. Figure 28 shows the typical EN active and inactive
thresholds when the input voltage varies from 1.8 V to 5.5 V.
0
0.2
0.4
0.6
0.8
1.0
1.2
1.82.22.63.03.43.84.24.65.05.4
ENABLE TH
R
ESHOLD (V)
INPUT VOLTAGE (V)
EN RISE
EN FALL
09298-026
Figure 28. Typical EN Threshold vs. Input Voltage (VIN)
ADP197 Data Sheet
Rev. C | Page 12 of 13
TIMING
Turn-on delay is defined as the interval between the time that
VEN exceeds the rising threshold voltage and when VOUT rises to
~10% of its final value. The ADP197 includes circuitry that has a
typical 1 ms turn-on delay and a controlled rise time to limit the
VIN inrush current. As shown in Figure 29 and Figure 30, the turn-
on delay is nearly independent of the input voltage.
CH1 100mA
CH3 2V
CH2 1V M1.00ms A CH3 1.28V
3
1
2
T 10.20%
BWBW
Ω
BW
CH1 AMPL
204mA
09298-027
I
LOAD
V
OUT
V
EN
Figure 29. Typical Turn-On Delay Time with VIN = 1.9 V, ILOAD = 200 mA
3
2
1
CH1 AMPL
222mA
CH1 100mA
CH3 2V
CH2 2V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-028
I
LOAD
V
OUT
V
EN
Figure 30. Typical Turn-On Delay Time with VIN = 5.5 V, ILOAD = 220 mA
The rise time is defined as the time it takes the output voltage to
rise from 10% to 90% of VOUT reaching its final value. It is depen-
dent on the rise time of the internal charge pump.
For very large values of output capacitance, the RC time constant
(where C is the load capacitance (CLOAD) and R is the RDSON||RLOAD)
can become a factor in the rise time of the output voltage. Because
RDSON is much smaller than RLOAD, an adequate approximation
for RC is RDSON × CLOAD. An input or load capacitor is not
required for the ADP197 although capacitors can be used to
suppress noise on the board. Figure 31 and Figure 32 show the
inrush current when CLOAD is 100 µF.
3
2
1
CH1 AMPL
266mA
CH1 100mA
CH3 2V
CH2 2V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-029
I
LOAD
V
OUT
V
EN
Figure 31. Typical Rise Time and Inrush Current,
CLOAD = 100 μF, VIN = 1.9 V, ILOAD = 270 mA
3
2
1
CH1 AMPL
352mA
CH1 200mA
CH3 2V
CH2 2V M1.00ms A CH3 1.28V
T 10.00%
BWBW
Ω
BW
09298-030
I
LOAD
V
OUT
V
EN
Figure 32. Typical Rise Time and Inrush Current,
CLOAD = 100 μF, VIN = 5.5 V, ILOAD = 350 mA
The turn-off time is defined as the time it takes for the output
voltage to fall from 90% to 10% of VOUT reaching its final value. It
is also dependent on the RC time constant of the output capacit-
ance and load resistance. Figure 33 shows the typical turn-off
time with VIN = 3.6 V, COUT = 1 µF, and RLOAD = 18 .
CH1 1V CH2 1V M20µs A CH1 240mV
1
2
T 20.20%
BWBW
09298-031
V
EN
V
OUT
Figure 33. Typical Turn-Off Time
Data Sheet ADP197
Rev. C | Page 13 of 13
OUTLINE DIMENSIONS
11-08-2012-B
A
B
C
0.675
0.595
0.515
0.380
0.355
0.330
0.270
0.240
0.210
1.000
0.950
0.900
1.500
1.450
1.400
12
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
0.345
0.295
0.245
1.00
REF
0.50
BSC
BALL A1
IDENTIFIE
R
SEATING
PLANE
0.50 BSC
COPLANARITY
0.075
Figure 34. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-2)
Dimensions shown in millimeters
1.70
1.60
1.50
0.425
0.350
0.275
TOP VIEW
6
1
4
3
0.35
0.30
0.25
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.60
0.55
0.50
1.10
1.00
0.90
0.20 REF
0.05 MAX
0.02 NOM
0.65 BSC
EXPOSED
PAD
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
02-06-2013-D
0.15 REF
2.10
2.00 SQ
1.90
0.20 MIN
Figure 35. 6-Lead Lead Frame Chip Scale Package [LFCSP_UD]
2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead
(CP-6-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature
Range Package Description
Package
Option Branding
On/Off
Time (μs)
ADP197ACBZ-R7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-2 87 300
ADP197ACBZ-01-R7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-2 AP 20
ADP197ACPZN-01-R7 −40°C to +85°C 6-Lead Lead Frame Chip Scale Package [LFCSP_UD] CP-6-3 AP 20
ADP197ACPZN-02-R7 −40°C to +85°C 6-Lead Lead Frame Chip Scale Package [LFCSP_UD] CP-6-3 D8 20
ADP197CB-EVALZ Evaluation Board
ADP197CP-EVALZ Evaluation Board
1 Z = RoHS Compliant Part.
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D09298-0-10/14(C)
