1. Product profile
1.1 General description
Single general-purpose switching diodes, fabricated in planar technology, and
encapsulated in small hermetically sealed glass SOD80C Surface-Mounted
Device (SMD) packages.
1.2 Features
1.3 Applications
1.4 Quick reference data
[1] Pulse test: tp≤300 µs; δ≤0.02.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] When switched from IF= 30 mA to IR= 30 mA; RL= 100 Ω; measured at IR= 3 mA.
BAV102; BAV103
Single general-purpose switching diodes
Rev. 03 — 16 August 2007 Product data sheet
Table 1. Product overview
Type number Package Configuration
NXP JEITA
BAV102 SOD80C - single
BAV103
nHigh switching speed: trr ≤50 ns nLow capacitance: Cd≤5pF
nLow leakage current nSmall hermetically sealed glass SMD
package
nHigh-speed switching nVoltage clamping
nGeneral-purpose switching nReverse polarity protection
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current [1][2] - - 250 mA
VRreverse voltage
BAV102 - - 150 V
BAV103 - - 200 V
trr reverse recovery time [3] --50ns
BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 16 August 2007 2 of 10
NXP Semiconductors BAV102; BAV103
Single general-purpose switching diodes
2. Pinning information
[1] The marking band indicates the cathode.
3. Ordering information
4. Marking
[1] green: made in Philippines
5. Limiting values
Table 3. Pinning
Pin Description Simplified outline Symbol
1 cathode [1]
2 anode ka
006aab040
2
1
Table 4. Ordering information
Type number Package
Name Description Version
BAV102 - hermetically sealed glass surface-mounted package;
2 connectors SOD80C
BAV103
Table 5. Marking codes
Type number Marking code[1]
BAV102 marking band
BAV103
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse
voltage
BAV102 - 200 V
BAV103 - 250 V
VRreverse voltage
BAV102 - 150 V
BAV103 - 200 V
IFforward current [1][2] - 250 mA
IFRM repetitive peak forward
current - 625 mA
BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 16 August 2007 3 of 10
NXP Semiconductors BAV102; BAV103
Single general-purpose switching diodes
[1] Pulse test: tp≤300 µs; δ≤0.02.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Tj=25°C prior to surge.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
[2] When switched from IF= 30 mA to IR= 30 mA; RL= 100 Ω; measured at IR= 3 mA.
IFSM non-repetitive peak
forward current square wave [3]
tp=1µs-9A
tp= 100 µs-3A
tp=1s - 1 A
Ptot total power dissipation Tamb ≤25 °C[2] - 400 mW
Tjjunction temperature - 175 °C
Tamb ambient temperature −65 +175 °C
Tstg storage temperature −65 +175 °C
Table 6. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 375 K/W
Rth(j-t) thermal resistance from
junction to tie-point - - 300 K/W
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage [1]
IF= 100 mA - - 1.0 V
IF= 200 mA - - 1.25 V
IRreverse current
BAV102 VR= 150 V - - 100 nA
VR= 150 V; Tj= 150 °C - - 100 µA
BAV103 VR= 200 V - - 100 nA
VR= 200 V; Tj= 150 °C - - 100 µA
Cddiode capacitance f = 1 MHz; VR=0V - - 5 pF
trr reverse recovery time [2] --50ns
BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 16 August 2007 4 of 10
NXP Semiconductors BAV102; BAV103
Single general-purpose switching diodes
(1) Tamb = 150 °C; typical values
(2) Tamb =25°C; typical values
(3) Tamb =25°C; maximum values
Based on square wave currents.
Tj=25°C; prior to surge
Fig 1. Forward current as a function of forward
voltage Fig 2. Non-repetitive peak forward current as a
function of pulse duration; maximum values
VR=V
Rmax
Solid line: maximum values
Dotted line: typical values
f = 1 MHz; Tamb =25°C
Fig 3. Reverse current as a function of junction
temperature Fig 4. Diode capacitance as a function of reverse
voltage; typical values
mbg459
012
600
0
200
400
VF (V)
IF
(mA)
(1) (2) (3)
mbg703
10
1
102
IFSM
(A)
10−1
tp (µs)
110
4
103
10 102
mgd009
0 100 Tj (°C) 200
103
102
10−1
10−2
10
1
IR
(µA)
mgd005
01020
1.6
1.4
1.0
0.8
1.2
VR (V)
Cd
(pF)
BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 16 August 2007 5 of 10
NXP Semiconductors BAV102; BAV103
Single general-purpose switching diodes
8. Test information
FR4 PCB, standard footprint FR4 PCB, standard footprint
(1) BAV103
(2) BAV102
Fig 5. Forward current as a function of ambient
temperature; derating curve Fig 6. Reverse voltage as a function of ambient
temperature; derating curve
mbh278
0 100 200
300
200
0
100
Tamb (°C)
IF
(mA)
mgl588
0 200
300
0
100
200
100
(1)
VR
(V)
Tamb (°C)
(2)
(1) IR=1mA
Fig 7. Reverse recovery time test circuit and waveforms
trr
(1)
+ IFt
output signal
trtpt
10 %
90 %
VR
input signal
V = VR + IF × RS
RS = 50 ΩIF
D.U.T.
Ri = 50 Ω
SAMPLING
OSCILLOSCOPE
mga881
BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 16 August 2007 6 of 10
NXP Semiconductors BAV102; BAV103
Single general-purpose switching diodes
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 8. Package outline SOD80C
06-03-16Dimensions in mm
1.60
1.45
0.3
3.7
3.3
0.3
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
2500 10000
BAV102 SOD80C 4 mm pitch, 8 mm tape and reel -115 -135
BAV103
BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 16 August 2007 7 of 10
NXP Semiconductors BAV102; BAV103
Single general-purpose switching diodes
11. Soldering
Fig 9. Reflow soldering footprint SOD80C
Fig 10. Wave soldering footprint SOD80C
sod080c
2.30
4.30
4.55
1.601.702.25
0.90
(2x)
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
sod080c
2.70
4.90
6.30
1.702.90
1.90
solder lands
tracks
solder resist
occupied area
Dimensions in mm
BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 16 August 2007 8 of 10
NXP Semiconductors BAV102; BAV103
Single general-purpose switching diodes
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAV102_BAV103_3 20070816 Product data sheet - BAV100_2
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Type numbers BAV100 and BAV101 have been removed
•Section 1.1 “General description”: amended
•Table 1 “Product overview”: added
•Table 2 “Quick reference data”: added
•Section 3 “Ordering information”: added
•Figure 7: figure title amended
•Figure 8: superseded by minimized package outline drawing
•Section 10 “Packing information”: added
•Section 11 “Soldering”: added
•Section 13 “Legal information”: updated
BAV100_2 19960917 Product specification - BAV100_1
BAV100_1 19960423 Product specification - -
BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 16 August 2007 9 of 10
NXP Semiconductors BAV102; BAV103
Single general-purpose switching diodes
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BAV102; BAV103
Single general-purpose switching diodes
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 August 2007
Document identifier: BAV102_BAV103_3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 6
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
